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HiPerFAST TM IGBT with Diode Preliminary Data Sheet IXGK 50N60C2D1 VCES IXGX 50N60C2D1 IC25 VCE(sat) C2-Class High Speed IGBTs tfi(typ) = 600 V = 75 A = 2.5 V = 48 ns Symbol V CES VCGR VGES VGEM IC25 IC110 IF110 ICM SSOA (RBSOA) PC TJ TJM Tstg Md Weight Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGE = 1 M Continuous Transient TC = 25C (limited by leads) TC = 110C TC = 110C TC = 25C, 1 ms VGE = 15 V, TVJ = 125C, RG = 10 Clamped inductive load @ VCE 600 V TC = 25C Maximum Ratings 600 600 20 30 75 50 48 300 ICM = 100 480 -55 ... +150 150 -55 ... +150 V V V V A A A A A TO-264 AA (IXGK) G C (TAB) E PLUS247 (IXGX) G (TAB) E C G = Gate E = Emitter C = Collector Tab = Collector W C C C Mounting torque, TO-264 TO-264 PLUS247 Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s 1.13/10 Nm/lb.in. 10 6 300 g g C Features * Very high frequency IGBT and anti-parallel FRED in one package * Square RBSOA * High current handling capability * MOS Gate turn-on for drive simplicity * Fast Recovery Epitaxial Diode (FRED) with soft recovery and low IRM Applications * Switch-mode and resonant-mode power supplies * Uninterruptible power supplies (UPS) * DC choppers * AC motor speed control * DC servo and robot drives Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) Min. Typ. Max. 3.0 TJ = 25C TJ = 125C 5.0 650 5 100 TJ = 25C TJ = 125C 2.1 1.8 2.5 V A mA nA V V VGE(th) ICES IGES VCE(sat) IC = 250 A, VCE = VGE VCE = VCES VGE = 0 V VCE = 0 V, VGE = 20 V IC = 40 A, VGE = 15 V Note 1 Advantages * Space savings (two devices in one package) * Easy to mount with 1 screw (c) 2004 IXYS All rights reserved DS99148A(05/04) IXGK 50N60C2D1 IXGX 50N60C2D1 Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) Min. Typ. Max. 40 51 3700 290 50 138 25 40 18 Inductive load, TJ = 25C IC = 40 A, VGE = 15 V VCE = 480 V, RG = Roff = 2.0 25 115 150 48 0.38 18 25 1.4 170 60 0.74 0.15 S pF pF pF nC nC nC Dim. Millimeter Min. Max. 4.82 5.13 2.54 2.89 2.00 2.10 1.12 1.42 2.39 2.69 2.90 3.09 0.53 0.83 25.91 26.16 19.81 19.96 5.46 BSC 0.00 0.25 0.00 0.25 20.32 20.83 2.29 2.59 3.17 3.66 6.07 6.27 8.38 8.69 3.81 4.32 1.78 2.29 6.04 6.30 1.57 1.83 Min. Inches Max. TO-264 AA Outline gfs Cies Coes Cres Qg Qge Qgc td(on) tri td(off) tfi Eoff td(on) tri Eon td(off) tfi Eoff RthJC RthCK IC = 40 A; VCE = 10 V, Note 1 VCE = 25 V, VGE = 0 V, f = 1 MHz IC = 40 A, VGE = 15 V, VCE = 0.5 VCES ns ns ns ns 0.7 mJ ns ns mJ ns ns mJ 0.31 K/W K/W Inductive load, TJ = 125C IC = 40 A, VGE = 15 V VCE = 480 V, RG = Roff = 2.0 A A1 A2 b b1 b2 c D E e J K L L1 P Q Q1 R R1 S T .190 .202 .100 .114 .079 .083 .044 .056 .094 .106 .114 .122 .021 .033 1.020 1.030 .780 .786 .215 BSC .000 .010 .000 .010 .800 .820 .090 .102 .125 .144 .239 .247 .330 .342 .150 .170 .070 .090 .238 .248 .062 .072 PLUS247 Outline Reverse Diode (FRED) Symbol VF IRM t rr RthJC Test Conditions IF = 60 A, VGE = 0 V, Note 1 Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. TJ = 150C 2.1 1.4 8.3 35 V A ns 0.65 K/W Terminals: 1 - Gate 2 - Drain (Collector) 3 - Source (Emitter) 4 - Drain (Collector) IF = 60 A, VGE = 0 V, -diF/dt = 100 A/ TJ = 100C VR = 100 V IF = 1 A; -di/dt = 200 A/ms; VR = 30 V Note 1: Pulse test, t 300 s, duty cycle 2 % Dim. A A1 A2 b b1 b2 C D E e L L1 Q R Millimeter Min. Max. 4.83 5.21 2.29 2.54 1.91 2.16 1.14 1.40 1.91 2.13 2.92 3.12 0.61 0.80 20.80 21.34 15.75 16.13 5.45 BSC 19.81 20.32 3.81 4.32 5.59 6.20 4.32 4.83 Inches Min. Max. .190 .205 .090 .100 .075 .085 .045 .055 .075 .084 .115 .123 .024 .031 .819 .840 .620 .635 .215 BSC .780 .800 .150 .170 .220 0.244 .170 .190 IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343 6,583,505 IXGK 50N60C2D1 IXGX 50N60C2D1 Fig. 1. Output Characte ristics @ 25 Deg. C 80 70 60 VGE = 15V 13V 11V 9V 320 280 240 VGE = 15V 13V 11V Fig. 2. Extended Output Characte ristics @ 25 de g. C 7V I C - Amperes I C - Amperes 50 40 30 20 10 0 0.5 1 1.5 2 2.5 3 3.5 4 5V 6V 200 160 120 9V 7V 80 40 0 0 1 2 3 5V 4 5 6 7 8 9 10 V C E - Volts Fig. 3. Output Characteristics @ 125 Deg. C 80 70 60 VGE = 15V 13V 11V 9V 7V 1.2 1.1 V C E - Volts Fig. 4. De pende nce of V CE(sat) on Tem perature V GE = 15V VC E ( s a t )- Normalized 1.0 0.9 0.8 0.7 0.6 I C = 40A I C - Amperes 50 40 30 20 10 5V 0 0.5 1 1.5 2 2.5 3 3.5 4 6V I C = 80A I C = 20A 0.5 25 50 75 100 125 150 V CE - Volts Fig. 5. Collector-to-Em itter Voltage vs. Gate-to-Em itter voltage 4.8 4.5 4.2 TJ = 25C 200 180 160 TJ - Degrees Centigrade Fig. 6. Input Adm ittance VC E - Volts 3.9 3.6 3.3 3 2.7 2.4 5 6 7 8 I C - Amperes I C = 80A 40A 20A 140 120 100 80 60 40 20 0 TJ = 125C 25C 9 10 11 12 13 14 15 16 17 4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9 V G E - Volts (c) 2004 IXYS All rights reserved V G E - Volts IXGK 50N60C2D1 IXGX 50N60C2D1 Fig. 7. Transconductance 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 140 160 180 200 TJ = 25C 125C 3 2.7 2.4 TJ = 125C VGE = 15V VCE = 480V I C = 80A Fig. 8. Dependence of Turn-Off Energy on RG E o f f - milliJoules g f s - Siemens 2.1 1.8 1.5 1.2 0.9 0.6 0.3 0 2 4 6 8 10 12 14 16 18 I C = 20A I C = 40A I C - Amperes Fig. 9. Dependence of Turn-Off Energy on Ic 2.2 2 1.8 R G = 2 R G = 10 - - - VGE = 15V VCE = 480V 2.4 2.1 1.8 R G - Ohms Fig. 10. Dependence of Turn-Off Energy on Tem perature R G = 2 R G = 10 - - - VGE = 15V VCE = 480V I C = 80A E o f f - MilliJoules 1.4 1.2 1 0.8 0.6 0.4 0.2 0 20 30 40 50 60 70 80 TJ = 25C TJ = 125C E o f f - milliJoules 1.6 1.5 1.2 0.9 0.6 0.3 0 25 35 45 55 65 75 85 I C = 40A I C = 20A 95 105 115 125 I C - Amperes Fig. 11. Dependence of Turn-Off Sw itching Tim e on RG 450 200 TJ - Degrees Centigrade Fig. 12. Dependence of Turn-Off Sw itching Tim e on Ic 180 160 140 120 100 80 60 40 TJ = 25C Switching Time - nanoseconds 350 300 250 200 TJ = 125C VGE = 15V VCE = 480V Switching Time - nanoseconds 400 td(off) tfi - - - - - - td(off) tfi - - - - - R G = 2 VGE = 15V VCE = 480V TJ = 125C I C = 40A 150 100 50 2 4 6 8 10 12 14 I C = 80A I C = 20A 16 18 R G - Ohms IXYS reserves the right to change limits, test conditions, and dimensions. 20 30 40 50 60 70 80 I C - Amperes IXGK 50N60C2D1 IXGX 50N60C2D1 Fig. 13. Dependence of Turn-Off Sw itching Tim e on Tem perature 200 110 180 160 140 120 100 80 60 40 20 25 35 45 I C = 20A 55 65 75 85 95 105 115 125 I C = 40A Fig. 14. Reverse-Bias Safe Operating Area 100 Switching Time - nanoseconds td(off) tfi - - - - - R G = 2 VGE = 15V VCE = 480V I C = 20A 90 80 I C - Amperes 70 60 50 40 30 20 10 0 TJ = 125 C R G = 10 dV/dT < 10V/ns I C = 80A TJ - Degrees Centigrade 100 200 300 400 CE 500 600 V - Volts Fig. 15. Gate Charge 16 14 12 10 8 6 4 2 0 0 30 60 90 120 150 10 0 5 VCE = 300V I C = 40A I G = 10mA 10000 Fig. 16. Capacitance f = 1 MHz Capacitance - picoFarrads C ies 1000 VG E - Volts 100 C oes C res 10 15 Q G - nanoCoulombs V C E - Volts 20 25 30 35 40 Fig. 16. Maxim um Transient The rm al Resistance 0.35 0.30 R ( t h ) J C - C / W 0.25 0.20 0.15 0.10 0.05 0.00 1 10 Pulse Width - milliseconds 100 1000 (c) 2004 IXYS All rights reserved IXGK 50N60C2D1 IXGX 50N60C2D1 160 A 140 IF 120 100 80 60 40 20 0 0 1 VF 2 V 0 100 A/s 1000 -diF/dt 0 0 200 400 600 A/s 1000 800 -diF/dt 4000 nC TVJ= 100C VR = 300V 80 A TVJ= 100C VR = 300V TVJ= 25C TVJ=100C 3000 Qr 2000 IF=120A IF= 60A IF= 30A 60 IRM 40 TVJ=150C 1000 20 IF=120A IF= 60A IF= 30A Fig. 17. Forward current IF versus VF Fig. 18. Reverse recovery charge Qr versus -diF/dt 140 ns 130 Fig. 19. Peak reverse current IRM versus -diF/dt 20 V VFR 15 1.6 s tfr 2.0 TVJ= 100C VR = 300V 1.5 Kf 1.0 trr 120 110 tfr 1.2 IRM 100 0.5 IF=120A IF= 60A IF= 30A VFR 0.8 10 Qr 5 90 80 0 0.4 0.0 TVJ= 100C IF = 60A 0 200 400 0 40 80 120 C 160 TVJ 0 200 400 600 -diF/dt 800 A/s 1000 0.0 600 A/s 1000 800 diF/dt Fig. 20. Dynamic parameters Qr, IRM versus TVJ 1 K/W 0.1 ZthJC 0.01 Fig. 21. Recovery time trr versus -diF/dt Fig. 22. Peak forward voltage VFR and tfr versus diF/dt Constants for ZthJC calculation: i 1 2 3 Rthi (K/W) 0.324 0.125 0.201 ti (s) 0.0052 0.0003 0.0385 Note: Fig. 2 through Fig. 6 show typical values 0.001 0.0001 0.00001 DSEP 60-06A 0.0001 0.001 0.01 0.1 s t 1 Fig. 23. Transient thermal resistance junction to case IXYS reserves the right to change limits, test conditions, and dimensions. |
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