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Surface Mount PIN Diodes Technical Data
HSMP-386x Series
Features
* Unique Configurations in Surface Mount Packages - Add Flexibility - Save Board Space - Reduce Cost * Switching - Low Distortion Switching - Low Capacitance * Attenuating - Low Current Attenuating for Less Power Consumption * Matched Diodes for Consistent Performance * Better Thermal Conductivity for Higher Power Dissipation * Low Failure in Time (FIT) Rate[1] * Lead-free Option Available
Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet.
Pin Connections and Package Marking, SOT-363
1 2 3 6 5 4
Description/Applications
The HSMP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance (CT) and Total Resistance (RT) are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime.
Notes: 1. Package marking provides orientation, identification, and date code. 2. See "Electrical Specifications" for appropriate package marking.
LUx
2
Package Lead Code Identification, SOT-23 (Top View)
SINGLE SERIES
Package Lead Code Identification, SOT-323 (Top View)
SINGLE SERIES
Package Lead Code Identification, SOT-363 (Top View)
UNCONNECTED TRIO
6 5 4
#0 COMMON ANODE
#2 COMMON CATHODE
B COMMON ANODE
C
1 2 3
COMMON CATHODE
L
#3
#4
E
F
Absolute Maximum Ratings[1] TC = +25C
Symbol If PIV Tj Tstg jc Parameter Forward Current (1 s Pulse) Peak Inverse Voltage Junction Temperature Storage Temperature Thermal Resistance[2] Unit Amp V C C C/W SOT-23 1 50 150 -65 to 150 500 SOT-323 1 50 150 -65 to 150 150 ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board.
Electrical Specifications TC = 25C, each diode
PIN General Purpose Diodes, Typical Specifications TA = 25C
Part Number HSMP3860 3862 3863 3864 386B 386C 386E 386F 386L Test Conditions Package Marking Code L0 L2 [1] L3 [1] L4 [1] L0 [2] L2 [2] L3 [2] L4 [2] LL [2]
[1]
Lead Code 0 2 3 4 B C E F L
Configuration Single Series Common Anode Common Cathode Single Series Common Anode Common Cathode Unconnected Trio
Minimum Typical Typical Breakdown Series Resistance Total Capacitance Voltage VBR (V) RS () CT (pF) 50 3.0/1.5* 0.20
VR = VBR Measure IR 10 A
IF = 10 mA
f = 100 MHz
IF = 100 mA*
VR = 50 V f = 1 MHz
Notes: 1. Package marking code is laser marked.
3
HSMP-386x Typical Parameters at TC = 25C
Part Number HSMP386x Test Conditions Total Resistance RT () 22 IF = 1 mA f = 100 MHz Carrier Lifetime (ns) 500 IF = 50 mA TR = 250 mA Reverse Recovery Time Trr (ns) 80 VR = 10 V IF = 20 mA 90% Recovery Total Capacitance CT (pF) 0.20 VR = 50 V f = 1 MHz
Typical Performance, TC = 25C, each diode
0.35
1000
INPUT INTERCEPT POINT (dBm)
TA = +85C TA = +25C TA = -55C
120 115 110 105 100 95 90 85
TOTAL CAPACITANCE (pF)
0.30 1 MHz 0.25 100 MHz 0.20 1 GHz
RESISTANCE (OHMS)
Diode Mounted as a Series Switch in a 50 Microstrip and Tested at 123 MHz
100
10
0.15
0
2
4
6
8
10 12 14 16 18 20
1 0.01
0.1
1
10
100
1
10
30
REVERSE VOLTAGE (V)
BIAS CURRENT (mA)
IF - FORWARD BIAS CURRENT (mA)
Figure 1. RF Capacitance vs. Reverse Bias.
Figure 2. Typical RF Resistance vs. Forward Bias Current.
Figure 3. 2nd Harmonic Input Intercept Point vs. Forward Bias Current for Switch Diodes.
Trr - REVERSE RECOVERY TIME (ns)
1000
100
IF - FORWARD CURRENT (mA)
10
VR = 5 V 100 VR = 10 V VR = 20 V
1
0.1 125C 25C -50C
10 10
0.01 20 FORWARD CURRENT (mA) 30 0 0.2 0.4 0.6 0.8 1.0 1.2 VF - FORWARD VOLTAGE (mA)
Figure 4. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages.
Figure 5. Forward Current vs. Forward Voltage.
Equivalent Circuit Model
HSMP-386x Chip*
Rs Rj
1.5 Cj 0.12 pF
RT = 1.5 + R j CT = C P + C j 12 R j = 0.9 I I = Forward Bias Current in mA * See AN1124 for package models
4
Typical Applications for Multiple Diode Products
RF COMMON
RF COMMON
RF 1
RF 2
RF 1
RF 2
BIAS 1
BIAS 2
BIAS
BIAS
Figure 6. Simple SPDT Switch, Using Only Positive Current.
Figure 7. High Isolation SPDT Switch, Dual Bias.
RF COMMON BIAS
RF COMMON
RF 1
RF 2 RF 1 BIAS RF 2
Figure 8. Switch Using Both Positive and Negative Current.
Figure 9. Very High Isolation SPDT Switch, Dual Bias.
VARIABLE BIAS
INPUT
RF IN/OUT
FIXED BIAS VOLTAGE
Figure 10. Four Diode Attenuator. See AN1048 for details.
5
Typical Applications for Multiple Diode Products (continued)
BIAS
"ON" "OFF" 1 6 5 4 1
1 +V 0
2 0 +V
1 RF in
2
3 RF out 2
Figure 11. High Isolation SPST Switch (Repeat Cells as Required).
Figure 12. HSMP-386L Unconnected Trio used in a Positive Voltage, High Isolation Switch.
1 2 3 3 2 1
2 "ON" "OFF" 1 0 0 2 +V -V
0
4
5
6 b1 b2 b3
1
3
2
1
1
4 RF in
5
6 RF out
Figure 13. HSMP-386L used in a SP3T Switch.
Figure 14. HSMP-386L Unconnected Trio used in a Dual Voltage, High Isolation Switch.
Ordering Information
Specify part number followed by option. For example: HSMP - 386x - XXX Bulk or Tape and Reel Option Part Number; x = Lead Code Surface Mount PIN
Option Descriptions
-BLK = Bulk, 100 pcs. per antistatic bag -TR1 = Tape and Reel, 3000 devices per 7" reel -TR2 = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, "Taping of Surface Mounted Components for Automated Placement." For lead-free option, the part number will have the character "G" at the end, eg. -TR2G for a 10K pc lead-free reel.
6
Assembly Information
SOT-323 PCB Footprint Recommended PCB pad layouts for the miniature SOT packages are shown in Figures 15, 16, 17. These layouts provide ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance.
0.026
0.07 0.035
SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT package, will reach solder reflow temperatures faster than those with a greater mass. Agilent's diodes have been qualified to the time-temperature profile shown in Figure 18. This profile is representative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste)
passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 235C. These parameters are typical for a surface mount assembly process for Agilent diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder.
0.016
Figure 15. PCB Pad Layout, SOT-323. (dimensions in inches).
0.026
0.075
250
0.035
TMAX 200
0.016
TEMPERATURE (C)
150 Reflow Zone 100 Preheat Zone 50 0 0 60 120 180 240 300 Cool Down Zone
Figure 16. PCB Pad Layout, SOT-363. (dimensions in inches).
0.037 0.95
0.037 0.95
0.079 2.0
TIME (seconds)
0.035 0.9 0.031 0.8
DIMENSIONS IN inches mm
Figure 18. Surface Mount Assembly Profile.
Figure 17. PCB Pad Layout, SOT-23.
7
Package Dimensions
Outline SOT-323 (SC-70, 3 Lead)
PACKAGE MARKING CODE (XX) 1.30 (0.051) REF. DATE CODE (X)
Outline 23 (SOT-23)
1.02 (0.040) 0.89 (0.035) 0.54 (0.021) 0.37 (0.015) 3 1.40 (0.055) 1.20 (0.047) 2 2.04 (0.080) 1.78 (0.070) TOP VIEW 2.65 (0.104) 2.10 (0.083)
DATE CODE (X)
2.20 (0.087) 2.00 (0.079)
XXX
1.35 (0.053) 1.15 (0.045)
PACKAGE MARKING CODE (XX)
XXX
1
0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.425 (0.017) TYP.
0.60 (0.024) 0.45 (0.018)
0.30 REF.
3.06 (0.120) 2.80 (0.110)
0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004)
0.152 (0.006) 0.066 (0.003) 1.02 (0.041) 0.85 (0.033)
10
0.30 (0.012) 0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.10 (0.004) 0.013 (0.0005) SIDE VIEW DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.69 (0.027) 0.45 (0.018) END VIEW
Outline 363 (SC-70, 6 Lead)
PACKAGE MARKING CODE (XX) 1.30 (0.051) REF. DATE CODE (X)
2.20 (0.087) 2.00 (0.079)
XXX
1.35 (0.053) 1.15 (0.045)
0.650 BSC (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.425 (0.017) TYP.
0.30 REF.
1.00 (0.039) 0.80 (0.031) 0.25 (0.010) 0.15 (0.006)
10
0.30 (0.012) 0.10 (0.004)
0.20 (0.008) 0.10 (0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Package Characteristics
Lead Material ............................ Copper (SOT-323/363); Alloy 42 (SOT-23) Lead Finish ............................................................................ Tin-Lead 85-15% Maximum Soldering Temperature .............................. 260C for 5 seconds Minimum Lead Strength .......................................................... 2 pounds pull Typical Package Inductance .................................................................. 2 nH Typical Package Capacitance .............................. 0.08 pF (opposite leads)
8
Device Orientation
REEL
CARRIER TAPE USER FEED DIRECTION COVER TAPE
For Outlines SOT-23, -323
TOP VIEW 4 mm END VIEW
For Outline SOT-363
TOP VIEW 4 mm END VIEW
8 mm
ABC
ABC
ABC
ABC
8 mm
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code. "C" represents date code.
Note: "AB" represents package marking code. "C" represents date code.
Tape Dimensions and Product Orientation
For Outline SOT-23
P D
P2
E
P0
F W
t1
D1
9 MAX
Ko
8 MAX
13.5 MAX
A0
B0
DESCRIPTION CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER DIAMETER PITCH POSITION WIDTH THICKNESS CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION)
SYMBOL A0 B0 K0 P D1 D P0 E W t1 F P2
SIZE (mm) 3.15 0.10 2.77 0.10 1.22 0.10 4.00 0.10 1.00 + 0.05 1.50 + 0.10 4.00 0.10 1.75 0.10 8.00 +0.30 -0.10 0.229 0.013 3.50 0.05 2.00 0.05
SIZE (INCHES) 0.124 0.004 0.109 0.004 0.048 0.004 0.157 0.004 0.039 0.002 0.059 + 0.004 0.157 0.004 0.069 0.004 0.315 +0.012 -0.004 0.009 0.0005 0.138 0.002 0.079 0.002
PERFORATION
CARRIER TAPE
DISTANCE BETWEEN CENTERLINE
Tape Dimensions and Product Orientation
For Outlines SOT-323, -363
P P0 D P2
E
F W C
D1 t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS)
An
K0
An
A0
B0
DESCRIPTION CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER DIAMETER PITCH POSITION WIDTH THICKNESS WIDTH TAPE THICKNESS CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) ANGLE FOR SOT-323 (SC70-3 LEAD) FOR SOT-363 (SC70-6 LEAD)
SYMBOL A0 B0 K0 P D1 D P0 E W t1 C Tt F P2 An
SIZE (mm) 2.40 0.10 2.40 0.10 1.20 0.10 4.00 0.10 1.00 + 0.25 1.55 0.05 4.00 0.10 1.75 0.10 8.00 0.30 0.254 0.02 5.4 0.10 0.062 0.001 3.50 0.05 2.00 0.05 8C MAX 10C MAX
SIZE (INCHES) 0.094 0.004 0.094 0.004 0.047 0.004 0.157 0.004 0.039 + 0.010 0.061 0.002 0.157 0.004 0.069 0.004 0.315 0.012 0.0100 0.0008 0.205 0.004 0.0025 0.00004 0.138 0.002 0.079 0.002
PERFORATION
CARRIER TAPE COVER TAPE DISTANCE
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (65) 6756 2394 India, Australia, New Zealand: (65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (65) 6755 2044 Taiwan: (65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. Obsoletes 5988-7917EN March 24, 2004 5989-0485EN

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