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| HIGH-SPEED 2.5V PRELIMINARY 512/256/128K X 18 IDT70T3339/19/99S SYNCHRONOUS DUAL-PORT STATIC RAM WITH 3.3V OR 2.5V INTERFACE Features: True Dual-Port memory cells which allow simultaneous access of the same memory location High-speed data access - Commercial: 3.4 (200MHz)/3.6ns (166MHz)/ 4.2ns (133MHz)(max.) - Industrial: 3.6ns (166MHz)/4.2ns (133MHz) (max.) Selectable Pipelined or Flow-Through output mode Counter enable and repeat features Dual chip enables allow for depth expansion without additional logic Interrupt and Collision Detection Flags Full synchronous operation on both ports - 5ns cycle time, 200MHz operation (14Gbps bandwidth) - Fast 3.4ns clock to data out - 1.5ns setup to clock and 0.5ns hold on all control, data, and address inputs @ 200MHz - Data input, address, byte enable and control registers - Self-timed write allows fast cycle time Separate byte controls for multiplexed bus and bus matching compatibility Dual Cycle Deselect (DCD) for Pipelined Output Mode 2.5V (100mV) power supply for core LVTTL compatible, selectable 3.3V (150mV) or 2.5V (100mV) power supply for I/Os and control signals on each port Industrial temperature range (-40C to +85C) is available at 166MHz and 133MHz Available in a 256-pin Ball Grid Array (BGA), a 144-pin Thin Quad Flatpack (TQFP) and 208-pin fine pitch Ball Grid Array (fpBGA) Supports JTAG features compliant with IEEE 1149.1 Due to limited pin count JTAG, Collision Detection and Interrupt are not supported on the 144-pin TQFP package Functional Block Diagram UBL LBL UBR LBR FT/PIPEL 1/0 0a 1a a 0b 1b b 1b 0b b 1a 0a a 1/0 FT/PIPER R/WL CE0L CE1L 1 0 1/0 BB WW 01 LL BB WW 10 RR 1 0 1/0 R/WR CE0R CE1R OEL Dout0-8_L Dout9-17_L Dout0-8_R Dout9-17_R OER 1b 0b 1a 0a FT/PIPEL 0/1 0a 1a 0b 1b , 0/1 FT/PIPER ab 512/256/128K x 18 MEMORY ARRAY ba I/O0L - I/O17L Din_L Din_R I/O0R - I/O17R CLKL A18L(1) A0L REPEATL ADSL CNTENL A18R(1) CLKR , Counter/ Address Reg. ADDR_L ADDR_R Counter/ Address Reg. A0R REPEATR ADSR CNTENR TDI TCK TMS TRST CE 0 L CE1L R/W L INTERRUPT COLLISION DETECTION LOGIC CE0 R CE1 R R/W R JTAG TDO COL L INTL COLR INTR ZZL (2) ZZ CONTROL LOGIC ZZR (2) 5652 drw 01 NOTES: 1. Address A18 is a NC for the IDT70T3319. Also, Addresses A18 and A17 are NC's for the IDT70T3399. 2. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when asserted. All static inputs, i.e., PL/FTx and OPTx and the sleep mode pins themselves (ZZx) are not affected during sleep mode. NOVEMBER 2003 DSC-5652/3 1 (c)2003 Integrated Device Technology, Inc. IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Description: The IDT70T3339/19/99 is a high-speed 512/256/128k x 18 bit synchronous Dual-Port RAM. The memory array utilizes Dual-Port memory cells to allow simultaneous access of any address from both ports. Registers on control, data, and address inputs provide minimal setup and hold times. The timing latitude provided by this approach allows systems to be designed with very short cycle times. With an input data register, the IDT70T3339/19/99 has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The IDT70T3339/19/99 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V. 6.42 2 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Pin Configuration (3,4,5,6,9) 70T3339/19/99BC BC-256(8) 01/13/03 A1 A2 A3 A4 A5 A6 A7 256-Pin BGA Top View(9) A8 A9 A10 A11 A12 A13 A14 A15 A16 NC B1 TDI B2 NC B3 A17L(2) A14L B4 B5 A11L B6 A8L B7 NC B8 CE1L B9 OEL CNTENL A5L B10 B11 B12 A2L B13 A0L B14 NC B15 NC B16 INTL C1 NC C2 TDO A18L(1) A15L C3 C4 C5 A12L C6 A9L C7 UBL C8 CE0L R/WL REPEATL C9 C10 C11 A4L C12 A1L C13 VDD C14 NC C15 NC C16 COLL I/O9L D1 D2 VSS D3 A16L D4 A13L D5 A10L D6 A7L D7 NC D8 LBL D9 CLKL ADSL D10 D11 A6L D12 A3L D13 OPTL D14 NC D15 I/O8L D16 NC E1 I/O9R E2 NC E3 PIPE/FTL VDDQL VDDQL VDDQR VDDQR VDDQL VDDQL VDDQR VDDQR VDD E4 E5 E6 E7 E8 E9 E10 E11 E12 E13 NC E14 NC E15 I/O8R E16 I/O10R I/O10L F1 F2 NC F3 VDDQL VDD F4 F5 VDD F6 NC F7 VSS F8 VSS F9 VSS F10 VDD F11 VDD VDDQR F12 F13 NC F14 I/O7L I/O7R F15 F16 I/O11L G1 NC G2 I/O11R VDDQL VDD G3 G4 G5 NC G6 NC G7 VSS G8 VSS G9 VSS G10 VSS G11 VDD VDDQR I/O6R G12 G13 G14 NC G15 I/O6L G16 NC H1 NC H2 I/O12L VDDQR H3 H4 VSS H5 VSS H6 VSS H7 VSS H8 VSS H9 VSS H10 VSS H11 VSS H12 VDDQL I/O5L H13 H14 NC H15 NC H16 NC J1 I/O12R J2 NC VDDQR VSS J3 J4 J5 VSS J6 VSS J7 VSS J8 VSS J9 VSS J10 VSS J11 VSS J12 VDDQL J13 NC J14 NC J15 I/O5R J16 I/O13L I/O14R I/O13R VDDQL ZZR K1 K2 K3 K4 K5 VSS K6 VSS K7 VSS K8 VSS K9 VSS K10 VSS K11 ZZL VDDQR I/O4R I/O3R I/O4L K12 K13 K14 K15 K16 NC L1 NC L2 I/O14L VDDQL VSS L3 L4 L5 VSS L6 VSS L7 VSS L8 VSS L9 VSS L10 VSS L11 VSS L12 VDDQR NC L13 L14 NC L15 I/O3L L16 I/O15L M1 NC M2 I/O15R VDDQR VDD M3 M4 M5 NC M6 NC M7 VSS M8 VSS M9 VSS M10 VSS M11 VDD M12 VDDQL I/O2L M13 M14 NC M15 I/O2R M16 I/O16R I/O16L N1 N2 NC VDDQR N3 N4 VDD N5 VDD N6 NC N7 VSS N8 VSS N9 VSS N10 VDD N11 VDD N12 VDDQL I/O1R N13 N14 I/O1L N15 NC N16 NC P1 I/O17R P2 NC PIPE/FTR VDDQR VDDQR VDDQL VDDQL VDDQR VDDQR VDDQL VDDQL P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 VDD P13 NC P14 I/O0R P15 NC P16 COLR I/O17L TMS R1 R2 R3 A16R R4 A13R R5 A10R R6 A7R R7 NC R8 LBR R9 CLKR ADSR R10 R11 A6R R12 A3R R13 NC R14 NC R15 I/O0L R16 INTR T1 NC T2 TRST A18R(1) A15R T3 T4 T5 A12R T6 A9R T7 UBR T8 CE0R R/WR REPEATR A4R T9 T10 T11 T12 A1R T13 OPTR T14 NC T15 NC T16 , NC TCK NC A17R(2) A14R A11R A8R NC CE1R OER CNTENR A5R A2R A0R NC NC 5652 drw 02d NOTES: 1. Pin is a NC for IDT70T3319 and IDT70T3399. 2. Pin is a NC for IDT70T3399. 3. All VDD pins must be connected to 2.5V power supply. 4. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VDD (2.5V), and 2.5V if OPT pin for that port is set to VSS (0V). 5. All VSS pins must be connected to ground supply. 6. Package body is approximately 17mm x 17mm x 1.4mm, with 1.0mm ball-pitch. 7. This package code is used to reference the package diagram. 8. This text does not indicate orientation of the actual part-marking. 9. Pins A15 and T15 will be VREFL and VREFR respectively for future HSTL device. , 6.42 3 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Pin Configuration(con't)(3,4,5,6,9,10) PL/FTL NC NC A18L(1) A17L(2) A16L A15L A14L A13L A12L A11L A10L A9L A8L A7L UBL LBL CE1L CE0L VDD VSS CLKL OEL R/WL ADSL CNTENL REPEATL A6L A5L A4L A3L A2L A1L A0L VDD NC 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 01/07/03 VSS VDDQR VSS I/O9L I/O9R I/O10L I/O10R I/O11L I/O11R VDDQL VSS I/O12L I/O12R VDDQR ZZR VDD VDD VSS VSS VDDQL VSS I/O13R I/O13L I/O14R I/O14L VDDQR VSS I/O15R I/O15L I/O16R I/O16L I/O17R I/O17L VSS VDDQL NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 70T3339/19/99DD DD-144(7) 144-Pin TQFP Top View(8) 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 OPTL VDDQR VSS I/O8L I/O8R I/O7L I/O7R I/O6L I/O6R VSS VDDQL I/O5L I/O5R VSS VDDQR VDD VDD VSS VSS ZZL VDDQL I/O4R I/O4L I/O3R I/O3L VSS VDDQR I/O2R I/O2L I/O1R I/O1L I/O0R I/O0L VSS VDDQL OPTR , 5652 drw 02a NOTES: 1. Pin is a NC for IDT70T3319 and IDT70T3399. 2. Pin is a NC for IDT70T3399. 3. All VDD pins must be connected to 2.5V power supply. 4. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VDD (2.5V), and 2.5V if OPT pin for that port is set to VSS (0V). 5. All VSS pins must be connected to ground supply. 6. Package body is approximately 20mm x 20mm x 1.4mm. 7. This package code is used to reference the package diagram. 8. This text does not indicate orientation of the actual part-marking. 9. Due to limited pin count, JTAG, Collison Detection and Interrupt are not supported in the DD-144 package. 10. Pins 109 and 72 will be VREFL and VREFR respectively for future HSTL device. PL/FTR NC NC A18R(1) A17R(2) A16R A15R A14R A13R A12R A11R A10R A9R A8R A7R UBR LBR CE1R CE0R VDD VSS CLKR OER R/WR ADSR CNTENR REPEATR A6R A5R A4R A3R A2R A1R A0R VDD NC 6.42 4 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Pin Configurations(con't)(3,4,5,6,9) 01/13/03 1 I/O9L 2 INTL 3 VSS 4 TDO 5 NC 6 A16L 7 A12L 8 A8L 9 NC 10 11 VDD CLKL 12 CNTENL 13 14 A4L A0L 15 OPTL 16 17 NC VSS A B C D E F G H J K L M N P R T U NC VSS COLL TDI A17L(2) A13L A9L NC CE0L VSS ADSL A5L A1L NC VDDQR I/O8L NC VDDQL I/O9R VDDQR PIPE/FTL A18L(1) A14L A10L UBL CE1L VSS R/WL A6L A2L VDD I/O8R NC VSS NC VSS I/O10L NC A15L A11L A7L LBL VDD OEL REPEATL A3L VDD NC VDDQL I/O7L I/O7R I/O11L NC VDDQR I/O10R I/O6L NC VSS NC VDDQL I/O11R NC VSS VSS I/O6R NC VDDQR NC VSS I/O12L NC NC VDDQL I/O5L NC VDD NC VDDQR I/O12R 70T3339/19/99BF BF-208(7) 208-Pin fpBGA Top View(8) VDD NC VSS I/O5R VDDQL VDD VSS ZZR ZZL VDD VSS VDDQR I/O14R VSS I/O13R VSS I/O3R VDDQL I/O4R VSS NC I/O14L VDDQR I/O13L NC I/O3L VSS I/O4L VDDQL NC I/O15R VSS VSS NC I/O2R VDDQR NC VSS NC I/O15L I/O1R VDDQL NC I/O2L I/O16R I/O16L VDDQR COLR TRST A16R A12R A8R NC VDD CLKR CNTENR A4R NC I/O1L VSS NC VSS NC I/O17R TCK A17R(2) A13R A9R NC CE0R VSS ADSR A5R A1R NC VDDQL I/O0R VDDQR NC I/O17L VDDQL TMS A18R(1) A14R A10R UBR CE1R VSS R/WR A6R A2R VSS NC VSS NC VSS INTR PIPE/FTR NC A15R A11R A7R LBR VDD OER REPEATR A3R A0R VDD OPTR NC I/O0L 5652 drw 02c NOTES: 1. Pin is a NC for IDT70T3319 and IDT70T3399. 2. Pin is a NC for IDT70T3399. 3. All VDD pins must be connected to 2.5V power supply. 4. All VDDQ pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to VDD (2.5V), and 2.5V if OPT pin for that port is set to VSS (0V). 5. All VSS pins must be connected to ground supply. 6. Package body is approximately 15mm x 15mm x 1.4mm with 0.8mm ball pitch. 7. This package code is used to reference the package diagram. 8. This text does not indicate orientation of the actual part-marking. 9. Pins B14 and R14 will be VREFL and VREFR respectively for future HSTL device. 6.42 5 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Pin Names Left Port CE0L, CE1L R/WL OEL A0L - A18L (6) Right Port CE0R, CE1R R/WR OER A0R - A18R (6) Names Chip Enables (Input)(7) Read/Write Enable (Input) Output Enable (Input) Address (Input) Data Input/Output Clock (Input) Pipeline/Flow-Through (Input) Address Strobe Enable (Input) Counter Enable (Input) Counter Repeat(3) Upper Byte Enable (I/O9 - I/O17)(7) Lower Byte Enable (I/O0 - I/O8)(7) I/O0L - I/O17L CLKL PL/FTL ADSL CNTENL REPEATL UBL LBL VDDQL OPTL ZZL I/O0R - I/O17R CLKR PL/FTR ADSR CNTENR REPEATR UBR LBR VDDQR OPTR ZZR VDD VSS TDI (5) Power (I/O Bus) (3.3V or 2.5V)(1) (Input) Option for selecting VDDQX(1,2) (Input) Sleep Mode pin(4) (Input) Power (2.5V)(1) (Input) Ground (0V) (Input) Test Data Input Test Data Output Test Logic Clock (10MHz) (Input) Test Mode Select (Input) Reset (Initialize TAP Controller) (Input) TDO(5) TCK (5) TMS (5) TRST(5) INTL(5) COLL(5) INTR(5) COLR(5) Interrupt Flag (Output) Collision Alert (Output) 5652 tbl 01 NOTES: 1. VDD, OPTX, and VDDQX must be set to appropriate operating levels prior to applying inputs on the I/Os and controls for that port. 2. OPTX selects the operating voltage levels for the I/Os and controls on that port. If OPTX is set to VDD (2.5V), then that port's I/Os and controls will operate at 3.3V levels and VDDQX must be supplied at 3.3V. If OPTX is set to VSS (0V), then that port's I/Os and address controls will operate at 2.5V levels and VDDQX must be supplied at 2.5V. The OPT pins are independent of one another--both ports can operate at 3.3V levels, both can operate at 2.5V levels, or either can operate at 3.3V with the other at 2.5V. 3. When REPEATX is asserted, the counter will reset to the last valid address loaded via ADSX. 4. The sleep mode pin shuts off all dynamic inputs, except JTAG inputs, when asserted. All static inputs, i.e., PL/FTx and OPTx and the sleep mode pins themselves (ZZx) are not affected during sleep mode. 5. Due to limited pin count, JTAG, Collision Detection and Interrupt are not supported in the DD-144 package. 6. Address A18x is a NC for the IDT70T3319. Also, Addresses A18x and A17x are NC's for the IDT70T3399. 7. Chip Enables and Byte Enables are double buffered when PL/FT = VIH, i.e., the signals take two cycles to deselect. 6.42 6 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Truth Table I--Read/Write and Enable Control OE X X X X X X L L L H X CLK X CE0 H X L L L L L L L L X CE1 X L H H H H H H H H X UB X X H H L L H L L L X LB X X H L H L L H L L X R/W X X X L L L H H H X X ZZ L L L L L L L L L L H Upper Byte I/O9-17 High-Z High-Z High-Z High-Z DIN DIN High-Z DOUT DOUT High-Z High-Z (1,2,3,4) Lower Byte I/O0-8 High-Z High-Z High-Z DIN High-Z DIN DOUT High-Z DOUT High-Z High-Z MODE Deselected-Power Down Deselected-Power Down Both Bytes Deselected Write to Lower Byte Only Write to Upper Byte Only Write to Both Bytes Read Lower Byte Only Read Upper Byte Only Read Both Bytes Outputs Disabled Sleep Mode 5652 tbl 02 NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. ADS, CNTEN, REPEAT = VIH. 3. OE and ZZ are asynchronous input signals. 4. It is possible to read or write any combination of bytes during a given access. A few representative samples have been illustrated here. Truth Table II--Address Counter Control Address An X X X Previous Internal Address X An An + 1 X Internal Address Used An An + 1 An + 1 An CLK ADS L(4) H H X CNTEN X L (5) (1,2) REPEAT(6) H H H L (4) I/O(3) DI/O (n) DI/O(n+1) DI/O(n+1) DI/O(n) External Address Used MODE Counter Enabled--Internal Address generation External Address Blocked--Counter disabled (An + 1 reused) Counter Set to last valid ADS load 5652 tbl 03 H X NOTES: 1. "H" = VIH, "L" = VIL, "X" = Don't Care. 2. Read and write operations are controlled by the appropriate setting of R/W, CE0, CE1, UB, LB and OE. 3. Outputs configured in flow-through output mode: if outputs are in pipelined mode the data out will be delayed by one cycle. 4. ADS and REPEAT are independent of all other memory control signals including CE0, CE1, UB and LB. 5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other memory control signals including CE0, CE1, UB and LB. 6. When REPEAT is asserted, the counter will reset to the last valid address loaded via ADS. This value is not set at power-up: a known location should be loaded via ADS during initialization if desired. Any subsequent ADS access during operations will update the REPEAT address location. 6.42 7 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Maximum Operating Temperature and Supply Voltage(1) Grade Commercial Industrial Ambient Temperature 0OC to +70OC -40OC to +85OC GND 0V 0V VDD 2.5V + 100mV 2.5V + 100mV 5652 tbl 04 NOTES: 1. This is the parameter TA. This is the "instant on" case temperature. Recommended DC Operating Conditions with VDDQ at 2.5V Symbol VDD VDDQ VSS VIH Parameter Core Supply Voltage I/O Supply Voltage (3) Ground Input High Volltage (Address, Control & Data I/O Inputs)(3) Input High Voltage JTAG _ Min. 2.4 2.4 0 1.7 Typ. 2.5 2.5 0 ____ Max. 2.6 2.6 0 VDDQ + 100mV (2) Unit V V V V VIH VIH VIL VIL 1.7 VDD - 0.2V -0.3 (1) ____ VDD + 100mV (2) VDD + 100mV (2) 0.7 0.2 V V V V 5652 tbl 05a Input High Voltage ZZ, OPT, PIPE/FT Input Low Voltage Input Low Voltage ZZ, OPT, PIPE/FT ____ ____ -0.3(1) ____ NOTES: 1. VIL (min.) = -1.0V for pulse width less than tCYC/2 or 5ns, whichever is less. 2. VIH (max.) = VDDQ + 1.0V for pulse width less than tCYC/2 or 5ns, whichever is less. 3. To select operation at 2.5V levels on the I/Os and controls of a given port, the OPT pin for that port must be set to Vss(0V), and VDDQX for that port must be supplied as indicated above. Recommended DC Operating Conditions with VDDQ at 3.3V Symbol VDD VDDQ VSS VIH Parameter Core Supply Voltage I/O Supply Voltage Ground Input High Voltage (Address, Control &Data I/O Inputs)(3) Input High Voltage JTAG _ (3) Min. 2.4 3.15 0 2.0 Typ. 2.5 3.3 0 ____ Max. 2.6 3.45 0 VDDQ + 150mV(2) Unit V V V V VIH VIH VIL VIL 1.7 VDD - 0.2V -0.3(1) -0.3(1) ____ VDD + 100mV(2) VDD + 100mV(2) 0.8 0.2 V V V V Input High Voltage ZZ, OPT, PIPE/FT Input Low Voltage Input Low Voltage ZZ, OPT, PIPE/FT ____ ____ ____ 5652 tbl 05b NOTES: 1. VIL (min.) = -1.0V for pulse width less than tCYC/2, or 5ns, whichever is less. 2. VIH (max.) = VDDQ + 1.0V for pulse width less than tCYC/2 or 5ns, whichever is less. 3. To select operation at 3.3V levels on the I/Os and controls of a given port, the OPT pin for that port must be set to VDD (2.5V), and VDDQX for that port must be supplied as indicated above. 6.42 8 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Absolute Maximum Ratings(1) Symbol VTERM (VDD) VTERM(2) (VDDQ) VTERM(2) (INPUTS and I/O's) TBIAS(3) TSTG TJN Rating VDD Terminal Voltage with Respect to GND VDDQ Terminal Voltage with Respect to GND Input and I/O Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature Junction Temperature Commercial & Industrial -0.5 to 3.6 -0.3 to VDDQ + 0.3 -0.3 to VDDQ + 0.3 -55 to +125 -65 to +150 +150 50 40 Unit V V V o C C C o o IOUT(For VDDQ = 3.3V) DC Output Current IOUT(For VDDQ = 2.5V) DC Output Current mA mA 5652 tbl 06 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. This is a steady-state DC parameter that applies after the power supply has reached its nominal operating value. Power sequencing is not necessary; however, the voltage on any Input or I/O pin cannot exceed VDDQ during power supply ramp up. 3. Ambient Temperature under DC Bias. No AC Conditions. Chip Deselected. Capacitance(1) (TA = +25C, f = 1.0MHz) PQFP ONLY Symbol CIN COUT (3) Parameter Input Capacitance Output Capacitance Conditions(2) VIN = 3dV VOUT = 3dV Max. 8 10.5 Unit pF pF 5652 tbl 07 NOTES: 1. These parameters are determined by device characterization, but are not production tested. 2. 3dV references the interpolated capacitance when the input and output switch from 0V to 3V or from 3V to 0V. 3. COUT also references CI/O. DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 2.5V 100mV) 70T3339/19/99S Symbol |ILI| |ILI| |ILO| VOL (3.3V) VOH (3.3V) VOL (2.5V) VOH (2.5V) Parameter Input Leakage Current(1) JTAG & ZZ Input Leakage Current Output Leakage Current Output Low Voltage (1) (1) (1,3) (1,2) Test Conditions VDDQ = Max., VIN = 0V to VDDQ VDD = Max., VIN = 0V to VDD CE0 = VIH or CE1 = VIL, VOUT = 0V to VDDQ IOL = +4mA, VDDQ = Min. IOH = -4mA, VDDQ = Min. IOL = +2mA, VDDQ = Min. IOH = -2mA, VDDQ = Min. Min. ___ Max. 10 30 10 0.4 ___ Unit A A A V V V V 5652 tbl 08 ___ ___ ___ Output High Voltage Output Low Voltage 2.4 ___ (1) 0.4 ___ Output High Voltage (1) 2.0 NOTES: 1. VDDQ is selectable (3.3V/2.5V) via OPT pins. Refer to p.6 for details. 2. Applicable only for TMS, TDI and TRST inputs. 3. Outputs tested in tri-state mode. 6.42 9 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (3)(VDD = 2.5V 100mV) 70T3339/19/99 S200 Com'l Only(8) Symbol IDD Parameter Dynamic Operating Current (Both Ports Active) Standby Current (Both Ports - TTL Level Inputs) Standby Current (One Port - TTL Level Inputs) Full Standby Current (Both Ports - CMOS Level Inputs) Full Standby Current (One Port - CMOS Level Inputs) Sleep Mode Current (Both Ports - TTL Level Inputs) CEL and CER= VIL, Outputs Disabled, f = fMAX(1) CEL = CER = VIH f = fMAX(1) CE"A" = VIL and CE"B" = VIH(5) Active Port Outputs Disabled, f=fMAX(1) Both Ports CEL and CER > VDDQ - 0.2V, VIN > VDDQ - 0.2V or VIN < 0.2V, f = 0(2) CE"A" < 0.2V and CE"B" > VDDQ - 0.2V(5) VIN > VDDQ - 0.2V or VIN < 0.2V Active Port, Outputs Disabled, f = fMAX(1) ZZL = ZZR = VIH f=fMAX(1) Test Condition Version COM'L IND COM'L IND COM'L IND COM'L IND COM'L IND COM'L IND S S S S S S S S S S S S Typ.(4) 375 ___ 70T3339/19/99 S166 Com'l & Ind(7) Typ.(4) 320 320 175 175 250 250 5 5 250 250 5 5 Max. 450 510 230 275 325 365 15 20 325 365 15 20 70T3339/19/99 S133 Com'l & Ind Typ.(4) 260 260 140 140 200 200 5 5 200 200 5 5 Max. 370 mA 450 190 mA 235 250 mA 310 15 mA 20 250 mA 310 15 mA 20 5652 tbl 09 Max. 525 ___ Unit ISB1(6) 205 ___ 270 ___ ISB2(6) 300 ___ 375 ___ ISB3 5 ___ 15 ___ ISB4(6) 300 ___ 375 ___ Izz 5 ___ 15 ___ NOTES: 1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS". 2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby. 3. Port "A" may be either left or right port. Port "B" is the opposite from port "A". 4. VDD = 2.5V, TA = 25C for Typ, and are not production tested. IDD DC(f=0) = 15mA (Typ). 5. CEX = VIL means CE0X = VIL and CE1X = VIH CEX = VIH means CE0X = VIH or CE1X = VIL CEX < 0.2V means CE0X < 0.2V and CE1X > VDD - 0.2V CEX > VDD - 0.2V means CE0X > VDD - 0.2V or CE1X - 0.2V "X" represents "L" for left port or "R" for right port. 6. ISB1, ISB2 and ISB4 will all reach full standby levels (ISB3) on the appropriate port(s) if ZZL and/or ZZR = VIH. 7. 166MHz I-Temp is not available in the BF-208 package. 8. 200Mhz is not available in the BF-208 and DD-144 packages. 6.42 10 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges AC Test Conditions (VDDQ - 3.3V/2.5V) Input Pulse Levels (Address & Controls) Input Pulse Levels (I/Os) Input Rise/Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3.0V/GND to 2.4V GND to 3.0V/GND to 2.4V 2ns 1.5V/1.25V 1.5V/1.25V Figures 1 and 2 5652 tbl 10 50 DATAOUT 50 1.5V/1.25 10pF (Tester) , 5652 drw 03 Figure 1. AC Output Test load. tCD (Typical, ns) Capacitance (pF) from AC Test Load 5652 drw 04 6.42 11 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature Range (Read and Write Cycle Timing) (2,3) (VDD = 2.5V 100mV, TA = 0C to +70C) 70T3339/19/99 S200 Com'l Only(5) Symbol tCYC1 tCYC2 tCH1 tCL1 tCH2 tCL2 tSA tHA tSC tHC tSB tHB tSW tHW tSD tHD tSAD tHAD tSCN tHCN tSRPT tHRPT tOE tOLZ(6) tOHZ tCD1 tCD2 tDC tCKHZ(6) tCKLZ(6) tINS tINR tCOLS tCOLR tZZSC tZZRC (6) 70T3339/19/99 S166 Com'l & Ind(4) Min. 20 6 8 8 2.4 2.4 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 1.7 0.5 ____ 70T3339/19/99 S133 Com'l & Ind Min. 25 7.5 10 10 3 3 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 1.8 0.5 ____ Parameter Clock Cycle Time (Flow-Through)(1) Clock Cycle Time (Pipelined)(1) Clock High Time (Flow-Through) (1) Min. 15 5 6 6 2 2 1.5 0.5 1.5 0.5 1.5 0.5 1.5 0.5 1.5 0.5 1.5 0.5 1.5 0.5 1.5 0.5 ____ Max. ____ Max. ____ Max. ____ Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns cycles cycles ____ ____ ____ ____ ____ ____ ____ ____ ____ Clock Low Time (Flow-Through)(1) Clock High Time (Pipelined)(2) Clock Low Time (Pipelined)(1) Address Setup Time Address Hold Time Chip Enable Setup Time Chip Enable Hold Time Byte Enable Setup Time Byte Enable Hold Time R/W Setup Time R/W Hold Time Input Data Setup Time Input Data Hold Time ADS Setup Time ADS Hold Time CNTEN Setup Time CNTEN Hold Time REPEAT Setup Time REPEAT Hold Time Output Enable to Data Valid Output Enable to Output Low-Z Output Enable to Output High-Z Clock to Data Valid (Flow-Through)(1) Clock to Data Valid (Pipelined)(1) Data Output Hold After Clock High Clock High to Output High-Z Clock High to Output Low-Z Interrupt Flag Set Time Interrupt Flag Reset Time Collision Flag Set Time Collision Flag Reset Time Sleep Mode Set Cycles Sleep Mode Recovery Cycles ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ 4.4 ____ 4.4 ____ 4.6 ____ 1 1 ____ 1 1 ____ 1 1 ____ 3.4 10 3.4 ____ 3.6 12 3.6 ____ 4.2 15 4.2 ____ ____ ____ ____ 1 1 1 ____ 1 1 1 ____ 1 1 1 ____ 3.4 ____ 3.6 ____ 4.2 ____ 7 7 3.4 3.4 ____ 7 7 3.6 3.6 ____ 7 7 4.2 4.2 ____ ____ ____ ____ ____ ____ ____ ____ ____ ____ 2 3 2 3 2 3 ____ ____ ____ Port-to-Port Delay tCO tOFS Clock-to-Clock Offset Clock-to-Clock Offset for Collision Detection 4 ____ 5 ____ 6 ____ ns Please refer to Collision Detection Timing Table on Page 21 5652 tbl 11 NOTES: 1. The Pipelined output parameters (tCYC2, tCD2) apply to either or both left and right ports when FT/PIPEX = VDD (2.5V). Flow-through parameters (tCYC1, tCD1) apply when FT/PIPE = Vss (0V) for that port. 2. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE), FT/PIPE and OPT. FT/PIPE and OPT should be treated as DC signals, i.e. steady state during operation. 3. These values are valid for either level of VDDQ (3.3V/2.5V). See page 6 for details on selecting the desired operating voltage levels for each port. 4. 166MHz I-Temp is not available in the BF-208 package. 5. 200Mhz is not available in the BF-208 and DD-144 packages. 6. Guaranteed by design (not production tested). 6.42 12 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Timing Waveform of Read Cycle for Pipelined Operation (FT/PIPE'X' = VIH)(2) tCYC2 tCH2 CLK CE0 tCL2 tSC CE1 tSB UB, LB tHC tSC (3) tHC tHB tSB (5) tHB R/W tSW tHW tSA tHA An + 1 (1 Latency) tCD2 Qn tCKLZ (1) ADDRESS (4) An An + 2 tDC Qn + 1 An + 3 DATAOUT Qn + 2 tOLZ (5) tOHZ OE (1) tOE 5652 drw 05 , Timing Waveform of Read Cycle for Flow-through Output (FT/PIPE"X" = VIL)(2,6) tCYC1 tCH1 CLK CE0 tCL1 tSC CE1 tSB UB, LB tHC tSC (3) tHC tHB tSB tHB R/W tSW tHW tSA tHA An + 1 tCD1 tDC Qn tCKLZ (1) ADDRESS (4) An An + 2 An + 3 tCKHZ DATAOUT Qn + 1 tOHZ tOLZ Qn + 2(5) tDC OE tOE , 5652 drw 06 NOTES: 1. OE is asynchronously controlled; all other inputs depicted in the above waveforms are synchronous to the rising clock edge. 2. ADS = VIL, CNTEN and REPEAT = VIH. 3. The output is disabled (High-Impedance state) by CE0 = VIH, CE1 = VIL, UB, LB = VIH following the next rising edge of the clock. Refer to Truth Table 1. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. If UB, LB was HIGH, then the appropriate Byte of DATAOUT for Qn + 2 would be disabled (High-Impedance state). 6. "x" denotes Left or Right port. The diagram is with respect to that port. 6.42 13 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Timing Waveform of a Multi-Device Pipelined Read(1,2) tCYC2 tCH2 CLK tSA ADDRESS(B1) tSC CE0(B1) tCL2 tHA A0 tHC tSC tCD2 tHC tCD2 Q0 tDC Q1 tDC A4 tCKLZ A5 tCKHZ tCD2 Q3 tCKHZ A6 A1 A2 A3 A4 A5 A6 DATAOUT(B1) tSA ADDRESS(B2) tHA A0 A1 A2 A3 tSC CE0(B2) tHC tSC tHC tCD2 tCKHZ Q2 tCKLZ tCKLZ 5652 drw 07 tCD2 , DATAOUT(B2) Q4 Timing Waveform of a Multi-Device Flow-Through Read(1,2) tCH1 CLK tSA ADDRESS(B1) tH A tCYC1 tCL1 A0 tSC tHC A1 A2 A3 A4 A5 A6 CE0(B1) tSC tHC tCD1 tCD1 D0 tDC tSA tHA A0 A1 A2 A3 A4 A5 A6 tCKHZ D1 tDC (1) tCD1 D3 tCKLZ (1) tCD1 D5 tCKHZ(1) tCKLZ (1) DATAOUT(B1) ADDRESS(B2) tSC tHC CE0(B2) tSC tHC tCD1 DATAOUT(B2) tCKLZ (1) tCKHZ D2 (1) tCD1 tCKLZ (1) tCKHZ D4 (1) , 5652 drw 08 NOTES: 1. B1 Represents Device #1; B2 Represents Device #2. Each Device consists of one IDT70T3339/19/99 for this waveform, and are setup for depth expansion in this example. ADDRESS(B1) = ADDRESS(B2) in this situation. 2. UB, LB, OE, and ADS = VIL; CE1(B1), CE1(B2), R/W, CNTEN, and REPEAT = VIH. 6.42 14 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Timing Waveform of Left Port Write to Pipelined Right Port Read(1,2,4) CLK"A" tSW R/W"A " tHW tSA ADDRESS"A" tHA NO MATC H MATC H tSD DATAIN"A" tHD VALID tCO(3) CLK"B" tCD2 R/W"B" tSW tSA ADDRESS"B" tHW tHA NO MATCH MATC H DATAOUT"B" VALID 5652 drw 09 NOTES: 1. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and REPEAT = VIH. 2. OE = VIL for Port "B", which is being read from. OE = VIH for Port "A", which is being written to. 3. If tCO < minimum specified, then data from Port "B" read is not valid until following Port "B" clock cycle (ie, time from write to valid read on opposite port will be tCO + 2 tCYC2 + tCD2). If tCO > minimum, then data from Port "B" read is available on first Port "B" clock cycle (ie, time from write to valid read on opposite port will be tCO + tCYC2 + tCD2). 4. All timing is the same for Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite of Port "A" tDC , Timing Waveform with Port-to-Port Flow-Through Read(1,2,4) CLK "A" tSW tHW R/W "A" tSA ADDRESS "A" tHA NO MATCH MATCH tSD DATAIN "A" tHD VALID tCO CLK "B" (3) tCD1 R/W "B" tSW tSA ADDRESS "B" tHW tHA NO MATCH MATCH tCD1 DATAOUT "B" tDC VALID VALID tDC 5652 drw 10 , NOTES: 1. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and REPEAT = VIH. 2. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to. 3. If tCO < minimum specified, then data from Port "B" read is not valid until following Port "B" clock cycle (i.e., time from write to valid read on opposite port will be tCO + tCYC + tCD1). If tCO > minimum, then data from Port "B" read is available on first Port "B" clock cycle (i.e., time from write to valid read on opposite port will be tCO + tCD1). 4. All timing is the same for both left and right ports. Port "A" may be either left or right port. Port "B" is the opposite of Port "A". 6.42 15 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Timing Waveform of Pipelined Read-to-Write-to-Read tCYC2 (OE = VIL)(2) tCH2 tCL2 CLK CE0 tSC tHC CE1 tSB UB, LB tHB tSW tHW R/W tSW tHW ADDRESS (3) An tSA tHA An +1 An + 2 An + 2 tSD tHD Dn + 2 An + 3 An + 4 DATAIN (1) tCD2 Qn tCKHZ tCKLZ tCD2 Qn + 3 DATAOUT READ NOP (4) WRITE READ 5652 drw 11 NOTES: 1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 2. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and REPEAT = VIH. "NOP" is "No Operation". 3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 4. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity. , Timing Waveform of Pipelined Read-to-Write-to-Read (OE Controlled)(2) tCH2 CLK CE0 tCYC2 tCL2 tSC tHC CE1 tSB UB, LB tHB tSW tHW R/W tSW tHW ADDRESS (3) An tSA tHA An +1 An + 2 tSD tHD An + 3 An + 4 An + 5 DATAIN (1) tCD2 Qn tOHZ (4) Dn + 2 Dn + 3 tCKLZ tCD2 Qn + 4 DATAOUT OE , NOTES: 5652 drw 12 1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 2. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and REPEAT = VIH. 3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 4. This timing does not meet requirements for fastest speed grade. This waveform indicates how logically it could be done if timing so allows. READ WRITE READ 6.42 16 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Timing Waveform of Flow-Through Read-to-Write-to-Read (OE = VIL)(2) tCH1 CLK tCYC1 tCL1 CE0 tSC tHC CE1 tSB UB, LB tHB tSW tHW R/W tSW tHW ADDRESS (3) tSA DATAIN (1) An tHA An +1 An + 2 An + 2 tSD tHD Dn + 2 An + 3 An + 4 tCD1 Qn tDC READ tCD1 Qn + 1 tCKHZ NOP (4) tCD1 tCD1 Qn + 3 tDC READ , 5652 drw 13 DATAOUT tCKLZ WRITE Timing Waveform of Flow-Through Read-to-Write-to-Read (OE Controlled)(2) tCYC1 tCH1 tCL1 CLK CE0 tSC tHC CE1 tSB UB, LB tHB tSW tHW R/W ADDRESS (3) tSW tHW An tSA tHA An +1 An + 2 tSD tHD Dn + 2 (1) An + 3 An + 4 An + 5 DATAIN tCD1 Qn tOHZ OE Dn + 3 tDC tOE tCD1 tCKLZ tCD1 Qn + 4 tDC DATAOUT READ WRITE READ , 5652 drw 14 NOTES: 1. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 2. CE0, UB, LB, and ADS = VIL; CE1, CNTEN, and REPEAT = VIH. 3. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 4. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity. 6.42 17 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Timing Waveform of Pipelined Read with Address Counter Advance(1) tCH2 CLK tSA tHA ADDRESS An tSAD tHAD ADS tCYC2 tCL2 tSAD tHAD CNTEN tSCN tHCN tCD2 DATAOUT Qx - 1(2) Qx tDC Qn Qn + 1 Qn + 2(2) , Qn + 3 READ EXTERNAL ADDRESS READ WITH COUNTER COUNTER HOLD READ WITH COUNTER 5652 drw 15 Timing Waveform of Flow-Through Read with Address Counter Advance(1) tCYC1 tCH1 tCL1 CLK tSA ADDRESS tHA An tSAD tHAD ADS tSAD tHAD tSCN tHCN CNTEN tCD1 DATAOUT Qx(2) tDC READ EXTERNAL ADDRESS READ WITH COUNTER COUNTER HOLD READ WITH COUNTER 5652 drw 16 Qn Qn + 1 Qn + 2 Qn + 3(2) , Qn + 4 NOTES: 1. CE0, OE, UB, LB = VIL; CE1, R/W, and REPEAT = VIH. 2. If there is no address change via ADS = VIL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output remains constant for subsequent clocks. 6.42 18 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Timing Waveform of Write with Address Counter Advance (Flow-through or Pipelined Inputs)(1) tCH2 CLK tSA ADDRESS tHA tCYC2 tCL2 An INTERNAL(3) ADDRESS tSAD tHAD ADS An(7) An + 1 An + 2 An + 3 An + 4 tSCN tHC CNTEN N tSD tHD DATAIN Dn WRITE EXTERNAL ADDRESS Dn + 1 Dn + 1 Dn + 2 Dn + 3 Dn + 4 WRITE WRITE WITH COUNTER COUNTER HOLD WRITE WITH COUNTER 5652 drw 17 , Timing Waveform of Counter Repeat(2) tCH2 CLK tSA tHA (4) tCYC2 tCL2 ADDRESS INTERNAL(3) ADDRESS Ax LAST ADS LOAD tSW tHW R/W ADS CNTEN An LAST ADS +1 An + 1 An + 2 An An + 1 tSAD tHAD tSCN tHCN tSRPT tHRPT REPEAT tSD tHD D0 DATAIN (5) DATAOUT EXECUTE REPEAT (6) QLAST WRITE LAST ADS ADDRESS READ LAST ADS ADDRESS READ LAST ADS ADDRESS + 1 QLAST+1 READ ADDRESS n+1 Qn , READ ADDRESS n NOTES: 5652 drw 18 1. CE0, UB, LB, and R/W = VIL; CE1 and REPEAT = VIH. 2. CE0, UB, LB = VIL; CE1 = VIH. 3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH. 4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only. 5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals. 6. No dead cycle exists during REPEAT operation. A READ or WRITE cycle may be coincidental with the counter REPEAT cycle: Address loaded by last valid ADS load will be accessed. Extra cycles are shown here simply for clarification. For more information on REPEAT function refer to Truth Table II. 7. CNTEN = VIL advances Internal Address from `An' to `An +1'. The transition shown indicates the time required for the counter to advance. The `An +1'Address is written to during this cycle. 6.42 19 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Waveform of Interrupt Timing CLKL tSW R/WL tSA ADDRESSL (3) (2) tHW tHA 7FFFF tSC CEL (1) tHC tINS INTR tINR tSC CER(1) tHC CLKR R/WR tSW tSA ADDRESSR(3) tHW tHA 7FFFF 5652 drw 19 NOTES: 1. CE0 = VIL and CE1 = VIH 2. All timing is the same for Left and Right ports. 3. Address is for internal register, not the external bus, i.e., address needs to be qualified by one of the Address counter control signals. Truth Table III -- Interrupt Flag (1) Left Port CLKL R/WL L X X H (2) Right Port A18L-A0L (3,4,5) CEL L X X L (2) INTL X X L H CLKR R/WR X H L X (2) CER(2) X L L X A18R-A0R(3,4,5) X 7FFFF 7FFFE X INTR L H X X Function Set Right INTR Flag Reset Right INTR Flag Set Left INTL Flag Reset Left INTL Flag 5652 tbl 12 7FFFF X X 7FFFE NOTES: 1. INTL and INTR must be initialized at power-up by Resetting the flags. 2. CE0 = VIL and CE1 = VIH. R/W and CE are synchronous with respect to the clock and need valid set-up and hold times. 3. A18X is a NC for IDT70T3319, therefore Interrupt Addresses are 3FFFF and 3FFFE. 4. A18X and A17X are NC's for IDT70T3399, therefore Interrupt Addresses are 1FFFF and 1FFFE. 5. Address is for internal register, not the external bus, i.e., address needs to be qualified by one of the Address counter control signals. 6.42 20 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Waveform of Collision Timing (1,2) Both Ports Writing with Left Port Clock Leading CLKL tOFS tSA ADDRESSL (4) tHA A0 A1 A2 A3 tCOLS COLL (3) tCOLR tOFS CLKR tSA ADDRESSR (4) tHA A0 A1 A2 A3 tCOLS COLR tCOLR 5652 drw 20 NOTES: 1. CE0 = VIL, CE1 = VIH. 2. For reading port, OE is a Don't care on the Collision Detection Logic. Please refer to Truth Table IV for specific cases. 3. Leading Port Output flag might output 3tCYC2 + tCOLS after Address match. 4. Address is for internal register, not the external bus, i.e., address needs to be qualified by one of the Address counter control signals. Collision Detection Timing(3,4) Cycle Time Region 1 (ns) 5ns 6ns 7.5ns 0 - 2.8 0 - 3.8 0 - 5.3 (1) tOFS (ns) Region 2 (ns) 2.81 - 4.6 3.81 - 5.6 5.31 - 7.1 5652 tbl 13 (2) NOTES: 1. Region 1 Both ports show collision after 2nd cycle for Addresses 0, 2, 4 etc. 2. Region 2 Leading port shows collision after 3rd cycle for addresses 0, 3, 6, etc. while trailing port shows collision after 2nd cycle for addresses 0, 2, 4 etc. 3. All the production units are tested to midpoint of each region. 4. These ranges are based on characterization of a typical device. Truth Table IV -- Collision Detection Flag Left Port CLKL R/WL(1) H H L L CEL(1) L L L L A18L-A0L(2) MATCH MATCH MATCH MATCH COLL H L H L CLKR R/WR(1) H L H L Right Port CER(1) L L L L A18R-A0R(2) MATCH MATCH MATCH MATCH COLR H H L L Function Both ports reading. Not a valid collision. No flag output on either port. Left port reading, Right port writing. Valid collision, flag output on Left port. Right port reading, Left port writing. Valid collision, flag output on Right port. Both ports writing. Valid collision. Flag output on both ports. 5652 tbl 14 NOTES: 1. CE0 = VIL and CE1 = VIH. R/W and CE are synchronous with respect to the clock and need valid set-up and hold times. 2. Address is for internal register, not the external bus, i.e., address needs to be qualified by one of the Address counter control signals. 6.42 21 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM Timing Waveform of Sleep Mode (1,2) 6.42 22 (3) (4) PRELIMINARY Industrial and Commercial Temperature Ranges NOTES: 1. CE1 = VIH. 2. All timing is same for Left and Right ports. 3. CE0 has to be deactivated (CE0 = VIH) three cycles prior to asserting ZZ (ZZx = VIH) and held for two cycles after asserting ZZ (ZZx = VIH). 4. CE0 has to be deactivated (CE0 = VIH) two cycles prior to de-asserting ZZ (ZZx = VIL) and held for three cycles after de-asserting ZZ (ZZx = VIL). IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Functional Description The IDT70T3339/19/99 provides a true synchronous Dual-Port Static RAM interface. Registered inputs provide minimal set-up and hold times on address, data, and all critical control inputs. All internal registers are clocked on the rising edge of the clock signal, however, the self-timed internal write pulse width is independent of the cycle time. An asynchronous output enable is provided to ease asynchronous bus interfacing. Counter enable inputs are also provided to stall the operation of the address counters for fast interleaved memory applications. A HIGH on CE0 or a LOW on CE1 for one clock cycle will power down the internal circuitry to reduce static power consumption. Multiple chip enables allow easier banking of multiple IDT70T3339/19/99s for depth expansion configurations. Two cycles are required with CE0 LOW and CE1 HIGH to re-activate the outputs. Interrupts If the user chooses the interrupt function, a memory location (mail box or message center) is assigned to each port. The left port interrupt flag (INTL) is asserted when the right port writes to memory location 7FFFE (HEX), where a write is defined as CER = R/WR = VIL per the Truth Table. The left port clears the interrupt through access of address location 7FFFE when CEL = VIL and R/WL = VIH. Likewise, the right port interrupt flag (INTR) is asserted when the left port writes to memory location 7FFFF (HEX) and to clear the interrupt flag (INTR), the right port must read the memory location 7FFFF (3FFFF or 3FFFE for IDT70T3319 and 1FFFF or 1FFFE for IDT70T3399). The message (18 bits) at 7FFFE or 7FFFF (3FFFF or 3FFFE for IDT70T3319 and 1FFFF or 1FFFE for IDT70T3399) is user-defined since it is an addressable SRAM location. If the interrupt function is not used, address locations 7FFFE and 7FFFF (3FFFF or 3FFFE for IDT70T3319 and 1FFFF or 1FFFE for IDT70T3399) are not used as mail boxes, but as part of the random access memory. Refer to Truth Table III for the interrupt operation. flag. A third collision will generate the alert flag as appropriate. In the event that a user initiates a burst access on both ports with the same starting address on both ports and one or both ports writing during each access (i.e., imposes a long string of collisions on contiguous clock cycles), the alert flag will be asserted and cleared every other cycle. Please refer to the Collision Detection timing waveform on page 21. Collision detection on the IDT70T3339/19/99 represents a significant advance in functionality over current sync multi-ports, which have no such capability. In addition to this functionality the IDT70T3339/19/99 sustains the key features of bandwidth and flexibility. The collision detection function is very useful in the case of bursting data, or a string of accesses made to sequential addresses, in that it indicates a problem within the burst, giving the user the option of either repeating the burst or continuing to watch the alert flag to see whether the number of collisions increases above an acceptable threshold value. Offering this function on chip also allows users to reduce their need for arbitration circuits, typically done in CPLD's or FPGA's. This reduces board space and design complexity, and gives the user more flexibility in developing a solution. Sleep Mode The IDT70T3339/19/99 is equipped with an optional sleep or low power mode on both ports. The sleep mode pin on both ports is asynchronous and active high. During normal operation, the ZZ pin is pulled low. When ZZ is pulled high, the port will enter sleep mode where it will meet lowest possible power conditions. The sleep mode timing diagram shows the modes of operation: Normal Operation, No Read/Write Allowed and Sleep Mode. For normal operation all inputs must meet setup and hold times prior to sleep and after recovering from sleep. Clocks must also meet cycle high and low times during these periods. Three cycles prior to asserting ZZ (ZZx = VIH) and three cycles after de-asserting ZZ (ZZx = VIL), new reads or writes are not allowed. If a write or read operation occurs during these periods, the memory array may be corrupted. Validity of data out from the RAM cannot be guaranteed immediately after ZZ is asserted (prior to being in sleep). During sleep mode the RAM automatically deselects itself. The RAM disconnects its internal clock buffer. The external clock may continue to run without impacting the RAMs sleep current (IZZ). All outputs will remain in high-Z state while in sleep mode. All inputs are allowed to toggle. The RAM will not be selected and will not perform any reads or writes. Collision Detection Collision is defined as an overlap in access between the two ports resulting in the potential for either reading or writing incorrect data to a specific address. For the specific cases: (a) Both ports reading - no data is corrupted, lost, or incorrectly output, so no collision flag is output on either port. (b) One port writing, the other port reading - the end result of the write will still be valid. However, the reading port might capture data that is in a state of transition and hence the reading port's collision flag is output. (c) Both ports writing - there is a risk that the two ports will interfere with each other, and the data stored in memory will not be a valid write from either port (it may essentially be a random combination of the two). Therefore, the collision flag is output on both ports. Please refer to Truth Table IV for all of the above cases. The alert flag (COLX) is asserted on the 2nd or 3rd rising clock edge of the affected port following the collision, and remains low for one cycle. Please refer to Collision DetectionTiming table on Page 21. During that next cycle, the internal arbitration is engaged in resetting the alert flag (this avoids a specific requirement on the part of the user to reset the alert flag). If two collisions occur on subsequent clock cycles, the second collision may not generate the appropriate alert 6.42 23 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Depth and Width Expansion The IDT70T3339/19/99 features dual chip enables (refer to Truth Table I) in order to facilitate rapid and simple depth expansion with no requirements for external logic. Figure 4 illustrates how to control the various chip enables in order to expand two devices in depth. The IDT70T3339/19/99 can also be used in applications requiring expanded width, as indicated in Figure 4. Through combining the control signals, the devices can be grouped as necessary to accommodate applications needing 36-bits or wider. A19/A18/A17(1) IDT70T3339/19/99 CE0 CE1 VDD IDT70T3339/19/99 CE0 CE1 VDD Control Inputs Control Inputs IDT70T3339/19/99 CE1 CE0 IDT70T3339/19/99 CE1 CE0 UB, LB, R/W, OE, CLK, ADS, REPEAT, CNTEN Control Inputs Control Inputs Figure 4. Depth and Width Expansion with IDT70T3339/19/99 5652 drw 22 NOTE: 1. A19 is for IDT70T3339, A18 is for IDT70T3319, A17 is for IDT70T3399. 6.42 24 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges JTAG Timing Specifications tJF TCK tJCYC tJR tJCL tJCH Device Inputs(1)/ TDI/TMS tJS Device Outputs(2)/ TDO TRST 5652 drw 23 tJH tJDC tJRSR tJCD , tJRST NOTES: 1. Device inputs = All device inputs except TDI, TMS, and TRST. 2. Device outputs = All device outputs except TDO. JTAG AC Electrical Characteristics (1,2,3,4) 70T3339/19/99 Symbol tJCYC tJCH tJCL tJR tJF tJRST tJRSR tJCD tJDC tJS tJH Parameter JTAG Clock Input Period JTAG Clock HIGH JTAG Clock Low JTAG Clock Rise Time JTAG Clock Fall Time JTAG Reset JTAG Reset Recovery JTAG Data Output JTAG Data Output Hold JTAG Setup JTAG Hold Min. 100 40 40 ____ ____ Max. ____ ____ Units ns ns ns ns ns ns ns ns ns ns ns 5652 tbl 15 ____ 3 3 (1) (1) 50 50 ____ ____ ____ 25 ____ ____ 0 15 15 ____ NOTES: 1. Guaranteed by design. 2. 30pF loading on external output signals. 3. Refer to AC Electrical Test Conditions stated earlier in this document. 4. JTAG operations occur at one speed (10MHz). The base device may run at any speed specified in this datasheet. 6.42 25 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Identification Register Definitions Instruction Field Revision Number (31:28) IDT Device ID (27:12) IDT JEDEC ID (11:1) ID Register Indicator Bit (Bit 0) Value 0x0 0x333(1) 0x33 1 Reserved for version number Defines IDT part number Allows unique identification of device vendor as IDT Indicates the presence of an ID register 5652 tbl 16 Description NOTE: 1. Device ID for IDT70T3319 is 0x334. Device ID for IDT70T3399 is 0x335. Scan Register Sizes Register Name Instruction (IR) Bypass (BYR) Identification (IDR) Boundary Scan (BSR) Bit Size 4 1 32 Note (3) 5652 tbl 17 System Interface Parameters Instruction EXTEST BYPASS IDCODE Code 0000 1111 0010 0100 Description Forces contents of the boundary scan cells onto the device outputs (1). Places the boundary scan register (BSR) between TDI and TDO. Places the bypass register (BYR) between TDI and TDO. Loads the ID register (IDR) with the vendor ID code and places the register between TDI and TDO. Places the bypass register (BYR) between TDI and TDO. Forces all device output drivers to a High-Z state except COLx & INTx outputs. Uses BYR. Forces contents of the boundary scan cells onto the device outputs. Places the bypass register (BYR) between TDI and TDO. Places the boundary scan register (BSR) between TDI and TDO. SAMPLE allows data from device inputs (2) to be captured in the boundary scan cells and shifted serially through TDO. PRELOAD allows data to be input serially into the boundary scan cells via the TDI. Several combinations are reserved. Do not use codes other than those identified above. For internal use only. 5652 tbl 18 HIGHZ CLAMP SAMPLE/PRELOAD 0011 0001 RESERVED PRIVATE 0101, 0111, 1000, 1001, 1010, 1011, 1100 0110,1110,1101 NOTES: 1. Device outputs = All device outputs except TDO. 2. Device inputs = All device inputs except TDI, TMS, and TRST. 3. The Boundary Scan Descriptive Language (BSDL) file for this device is available on the IDT website (www.idt.com), or by contacting your local IDT sales representative. 6.42 26 IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Ordering Information IDT XXXXX Device Type A Power 999 Speed A Package A Process/ Temperature Range Blank I BC DD BF Commercial (0C to +70C) Industrial (-40C to +85C) 256-pin BGA (BC-256) 144-pin TQFP (DD-144) 208-pin fpBGA (BF-208) 200 166 133 Commercial Only(2) Commercial & Industrial(1) Commercial & Industrial Speed in Megahertz S Standard Power , 70T3339 9Mbit (512K x 18-Bit) Synchronous Dual-Port RAM 70T3319 4Mbit (256K x 18-Bit) Synchronous Dual-Port RAM 70T3399 2Mbit (128K x 18-Bit) Synchronous Dual-Port RAM NOTES: 1. 166MHz I-Temp is not available in the BF-208 package. 2. 200Mhz is not available in the BF-208 and DD-144 packages. 5652 drw 24 IDT Clock Solution for IDT70T3339/19/99 Dual-Port Dual-Port I/O Specitications IDT Dual-Port Part Number Voltage I/O Input Capacitance Clock Specifications Input Duty Cycle Requirement 40% Maximum Frequency Jitter Tolerance IDT PLL Clock Device IDT Non-PLL Clock Device 5T9010 5T905, 5T9050 5T907, 5T9070 5652 tbl 19 70T3339/19/99 2.5 LVTTL 8pF 200 75ps 5T2010 Preliminary Datasheet: Definition "PRELIMINARY' datasheets contain descriptions for products that are in early release. CORPORATE HEADQUARTERS 2975 Stender Way Santa Clara, CA 95054 for SALES: 800-345-7015 or 408-727-5166 fax: 408-492-8674 www.idt.com 6.42 27 for Tech Support: 831-754-4613 DualPortHelp@idt.com The IDT logo is a registered trademark of Integrated Device Technology, Inc. IDT70T3339/19/99S High-Speed 2.5V 512/256/128K x 18 Dual-Port Static RAM PRELIMINARY Industrial and Commercial Temperature Ranges Datasheet Document History: 01/20/03: 04/25/03: 11/11/03: Initial Datasheet Page 11 Added Capacitance Derating drawing Page 12 Changed tINS and tINR specs in AC Electrical Characteristics table Page 10 Updated power numbers in DC Electrical Characteristics table Page 12 Added tOFS symbol and parameter to AC Electrical Characteristics table Page 21 Updated Collision Timing waveform Page 22 Added Collision Detection Timing table and footnotes Page 26 Updated HIGHZ function in System Interface Parameters table Page 27 Added IDT Clock Solution table 6.42 28 |
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