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Preliminary Technical Data FEATURES Tri-axis gyroscope +320 degrees/second measurement range 14-bit resolution Tri-axis accelerometer +10g measurement range 14-bit resolution 350Hz Bandwidth Factory calibrated sensitivity and bias Digitally controlled sensitivity and bias Digitally controlled sample rate Digitally controlled filtering Programmable condition monitoring, alarms Auxiliary digital I/O Digitally activated self-test Programmable power management Embedded Temperature Sensor SPI(R)-compatible serial interface Auxiliary 12-bit ADC input and DAC output Single-supply operation: +4.75V to +5.25 V 2000 g powered shock survivability Tri Axis Gyroscope & Accelerometer ADIS16350 GENERAL DESCRIPTION The ADIS16350 iSensorTM provides complete tri axis inertial sensing (both angular and linear motion) in a compact module fully ready for system integration. With Analog Devices' iMEMSTM sensor technology at its core, the ADIS16350 includes embedded processing for sensor calibration and tuning. An SPI interface allows for simple system interface and programming. The SPI port provides access to the following embedded sensors: X, Y, and Z axis angular rate; X, Y, and Z axis linear acceleration; Internal Temperature; Power Supply; and an Auxiliary analog input. The inertial sensors are precision aligned across axis', and are calibrated for offset and sensitivity. System interfacing is simplified with the following additional programmable features: In-system Bias Auto Calibration Digital Filtering and Sample Rate Self Test Power Management Condition Monitoring Auxiliary Digital I/O APPLICATIONS Guidance and control Platform control and stabilization Motion control and analysis Inertial Measurement Units General Navigation Image stabilization Robotics The ultra compact module measures 22.7mmx23.2mmx22.9mm, plus mounting extensions. FUNCTIONAL BLOCK DIAGRAM Rev. PrA 11/10/2006 10:59 AM One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2006 Analog Devices, Inc. All rights reserved. Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. ADIS16350 Preliminary Technical Data REVISION HISTORY 9/06--Revision PSD1: Initial Version Rev. PrA | Page 2 of 10 Preliminary Technical Data SPECIFICATIONS TA = -40oC to +85C, VCC = 5.0 V, Angular Rate = 0/s, Dynamic Range 320/sec, +1g, unless otherwise noted. Table 1. Parameter GYRO SENSITIVITY Dynamic Range Initial Conditions Each axis Full-scale range over specifications range 25C, Dynamic range = +320/sec 25C, Dynamic range = +160/sec 25C, Dynamic range = +80/sec -20C to 75C 25C, difference from 90 degrees ideal 25C, relative to base-plate & guide pins Best fit straight line 25C, 1 25C, 1 25C -20C to 75C Any Axis VCC = 4.75 V to 5.25 V At 25C, +320 o/s Dynamic range, no filtering At 25C, +160 o/s Dynamic range, minimum 4 tap filter setting At 25C, +80 o/s Dynamic range, minimum 16 tap filter setting At 25C, f= 25Hz, no average Min 320 0.07233 Typ Max ADIS16350 Unit /s /s/LSB o /s/LSB o /s/LSB ppm/oC degree degree % of FS o o o o Sensitivity Drift over Temp Axis Non-orthogonality Axis Misalignment Non-Linearity GYRO BIAS In Run Bias Stability Turn on - Turn on Bias Stability Angular Random Walk Zero Rate Bias Drift over Temp g Sensitivity Voltage Sensitivity GYRO NOISE PERFORMANCE Output Noise 0.07326 0.03663 0.01832 +500 TBD TBD +0.1 0.016 0.035 3.6 +0.06 0.2 1.0 TBD TBD TBD 0.05 350 14 TBD 0.07400 /s /s o /hr o /s/C o /s/g o /s /V o /s rms /s rms /s rms /s/Hz rms o o Rate Noise Density GYRO FREQUENCY RESPONSE Sensor Bandwidth Sensor Resonant Frequency Turn-on Time GYRO SELF-TEST STATE Change for positive stimulus Change for negative stimulus ACCELEROMETER SENSITIVITY Dynamic Range Initial Sensitivity Drift Over Temperature Axis Non-orthogonality Axis Misalignment Nonlinearity ACCELEROMETER BIAS 0g Offset 0g Offset Over Temperature Axis Non-orthogonality Axis Misalignment o Power on from Sleep Mode to +2o/s of final, no averaging, min sample period Relative to nominal output Relative to nominal output Each axis @25C 25C, difference from 90 degrees ideal 25C, relative to base-plate & guide pins Best Fit Straight Line @25C 25C, difference from 90 degrees ideal 25C, relative to base-plate & guide pins TBD 439 -439 10 TBD Hz kHz ms 721 -721 1092 -1092 LSB LSB g mg/LSB ppm/C degree degree % of FS mg mg/C degree degree 2.78 TBD TBD TBD 0.2 TBD TBD TBD TBD TBD Rev. PrA | Page 3 of 10 ADIS16350 Table 2. (Continued) Parameter ACCELEROMETER NOISE PERFORMANCE Output Noise Noise Density ACCELEROMETER FREQUENCY RESPONSE Sensor Bandwidth Sensor Resonant Frequency ACCELEROMETER SELF-TEST STATE Output Change When Active TEMPERATURE SENSOR Output at 25C Scale Factor ADC INPUT Resolution Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error Input Range Input Capacitance DAC OUTPUT Resolution Relative Accuracy Differential Nonlinearity Offset Error Gain Error Output Range Output Impedance Output Settling Time LOGIC INPUTS Input High Voltage, VINH Input Low Voltage, VINL Conditions @25C, no filtering @25C, no filtering Min Preliminary Technical Data Typ TBD 0.072 Max Unit LSB rms LSB/Hz rms 350 10 @25C 44 80 1278 -2.13 12 2 1 4 2 0 During acquisition 5 k/100 pF to GND For Code 101 to Code 4095 20 12 4 1 5 0.5 0 to 2.5 2 10 2.0 0.8 For -CS signal when used to wake up from SLEEP mode VIH = 3.3 V VIL = 0 V 0.55 0.2 -40 10 2.4 0.4 0.5 20,000 20 128 10 -60 2.5 120 Hz kHz LSB LSB LSB/C Bits LSB LSB LSB LSB V pF Bits LSB LSB mV % V s V V V A A pF V V Sec Cycles Years Logic 1 Input Current, IINH Logic 0 Input Current, IINL Input Capacitance, CIN DIGITAL OUTPUTS Output High Voltage, VOH Output Low Voltage, VOL SLEEP TIMER Timeout Period1 FLASH MEMORY Endurance2 Data Retention3 ISOURCE = 1.6 mA ISINK = 1.6 mA TJ = 55C Rev. PrA | Page 4 of 10 Preliminary Technical Data Table 3. (Continued) CONVERSION RATE Minimum Conversion Time Maximum Conversion Time Maximum Throughput Rate Minimum Throughput Rate POWER SUPPLY Operating Voltage Range VCC Power Supply Current 0.9766 1.937 1024 0.516 4.75 Normal mode at 25C Fast mode at 25C Sleep mode at 25C 5.0 48 77 500 5.25 ADIS16350 ms Sec SPS SPS V mA mA A 1 2 Guaranteed by design Endurance is qualified as per JEDEC Standard 22 Method A117 and measured at -40C, +25C, +85C, and +125C. 3 Retention lifetime equivalent at junction temperature (TJ) 55C as per JEDEC Standard 22 Method A117. Retention lifetime decreases with junction temperature. Rev. PrA | Page 5 of 10 ADIS16350 TIMING SPECIFICATIONS TA = +25C, VCC = +5.0 V, angular rate = 0/sec, unless otherwise noted. Table 4. Parameter fSCLK tDATARATE tCS tDAV tDSU tDHD tDF tDR tSFS 1 2 Preliminary Technical Data Description Fast mode, SMPL_TIME 0x07 (fS 256 Hz) Normal mode, SMPL_TIME 0x08 (fS 228 Hz) Chip select period, fast mode, SMPL_TIME 0x07 (fS 256 Hz) Chip select period, normal mode, SMPL_TIME 0x08 (fS 228 Hz) Chip select to clock edge Data output valid after SCLK falling edge2 Data input setup time before SCLK rising edge Data input hold time after SCLK rising edge Data output fall time Data output rise time CS high after SCLK edge3 Min1 0.01 0.01 40 100 48.8 24.4 48.8 Typ Max 2.5 1.0 100 5 5 5 12.5 12.5 Unit MHz MHz s s ns ns ns ns ns ns ns Guaranteed by design, not production tested. The MSB presents an exception to this parameter. The MSB clocks out on the falling edge of CS. The rest of the DOUT bits are clocked after the falling edge of SCLK and are governed by this specification. 3 This parameter may need to be expanded to allow for proper capture of the LSB. After CS goes high, the DOUT line goes into a high impedance state. TIMING DIAGRAMS tDATARATE tSTALL CS tSTALL = tDATARATE - 16/fSCLK Figure 1. SPI Chip Select Timing CS tCS 1 SCLK 2 3 4 5 6 15 16 06108-002 SCLK tSFS tDAV DOUT MSB DB14 DB13 DB12 DB11 DB10 DB2 DB1 LSB tDSU DIN W/R A5 tDHD A4 A3 A2 D2 D1 LSB 06108-003 Figure 2. SPI Timing, Utilizing SPI Settings Typically Identified as Phase = 1, Polarity = 1 Rev. PrA | Page 6 of 10 Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Acceleration (Any Axis, Unpowered) Acceleration (Any Axis, Powered) VDD to COM Digital Input/Output Voltage to COM Analog Inputs to COM Operating Temperature Range Storage Temperature Range 1 ADIS16350 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 6. Package Characteristics Package Type TBD JA TBD JC TBD Device Weight TBD Rating 2000 g 2000 g -0.3 V to +7.0 V -0.3 V to +5.5 V -0.3 V to VCC + 0.3 V -40C to +105C -65C to +150C1 Extended exposure to temperatures outside of the specified temperature range of -40C to +85C can adversely affect the accuracy of the factory calibration. For best accuracy, store the parts within the specified operating range of -40C to +85C. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. PrA | Page 7 of 10 ADIS16350 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 3 5 7 9 11 13 15 17 19 21 23 o o o o o o o o o o o o o o o o o o o o o o o o 2 4 6 8 10 12 14 16 18 20 22 24 Figure 3. Pin Configuration, Bottom, Pin View Preliminary Technical Data Table 7. Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 1 Mnemonic DNC DNC SCLK DOUT DIN ~CS DIO0 ~RST DIO1 VCC VCC VCC GND GND GND DNC DNC DNC DNC AUX_DAC AUX_ADC Y_ACCL X_ACCL Z_ACCL Type1 I O I I I/O I I/O S S S S S S N/A N/A N/A N/A O I O O O Description Do not connect Do not connect SPI, Serial clock SPI, Data output SPI, Data input SPI, Chip Select Digital I/O Reset Digital I/O Power supply Power supply Power supply Power ground Power ground Power ground Do not connect Do not connect Do not connect Do not connect Auxiliary, 12-bit digital-to-analog converter output Auxiliary, 12-bit, analog-to-digital converter in put Y-Axis acceleration X-Axis acceleration Z-Axis acceleration S = supply, O = output, I = input. Rev. PrA | Page 8 of 10 Preliminary Technical Data OUTLINE DIMENSIONS ADIS16350 Figure 4. Dimensions shown in millimeters ORDERING GUIDE Model ADIS16350AML ADIS16350/PCBZ Temperature Range -40C to +85C Package Description Package Option Rev. PrA | Page 9 of 10 ADIS16350 Preliminary Technical Data NOTES Rev. PrA | Page 10 of 10 PR06522-0-11/06(PrA) |
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