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FOD816 Series 4-Pin Phototransistor Optocouplers July 2005 FOD816 Series 4-Pin Phototransistor Optocouplers Features AC input response Applicable to Pb-free IR reflow soldering Compact 4-pin package High current transfer ratio: 600% minimum Safety agency approvals pending High input-output isolation voltage of 5000Vrms Applications Power supply regulators Digital logic inputs Microprocessor inputs Description The FOD816 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a silicon photodarlington output in a 4-pin dual in-line package. Functional Block Diagram ANODE, CATHODE 1 4 COLLECTOR 4 CATHODE, ANODE 2 3 EMITTER 1 Absolute Maximum Ratings (TA = 25C Unless otherwise specified.) Parameter TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Total Power Dissipation INPUT Forward Current Power Dissipation OUTPUT Collector-Emitter Voltage Emitter-Collector Voltage Collector Current Collector Power Dissipation VCEO VECO IC PC 35 6 80 150 V V mA mW IF P 50 70 mA mW TSTG TOPR TSOL PTOT -55 to +125 -30 to +100 260 for 10 sec 200 C C C mW Symbol Value Units (c)2005 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FOD816 Series Rev. 1.0.3 FOD816 Series 4-Pin Phototransistor Optocouplers Electrical/Characteristics (TA = 25C Unless otherwise specified.) Individual Component Characteristics Parameter INPUT Forward Voltage Terminal Capacitance OUTPUT Collector Dark Current Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage (VCE = 10 V, IF = 0) (IC = 0.1 mA, IF = 0) (IE = 10 A, IF = 0) ICEO BVCEO BVECO -- 35 6 -- -- -- 1 -- -- A V V (IF = 20 mA) (V = 0, f = 1 kHz) VF Ct -- -- 1.2 50 1.4 250 V pF Test Conditions Symbol Min Typ Max Unit Transfer Characteristics (TA = 25C Unless otherwise specified.) DC Characteristic Collector Current Current Transfer Ratio1 Collector-Emitter Saturation Voltage Isolation Resistance Floating Capacitance Cut-Off Frequency Response Time (Rise) Response Time (Fall) Test Conditions (IF = 1 mA, VCE = 2 V) (IF = 20 mA, IC = 5 mA) (DC500V 40~60% R.H.) (V = 0, f = 1 MHz) (VCE = 5 V, IC = 2 mA, RL = 100 , -3dB) (VCE = 2 V, IC = 10 mA, RL = 100 Symbol IC CTR VCE (sat) Riso Cf fC tr tf Min 6 600 -- 5x1010 -- 1 -- -- Typ -- -- 0.8 1x1011 0.6 6 60 53 Max 75 7,500 1 -- 1 -- 300 250 Unit mA % V pF KHz s s Isolation Characteristics Characteristic Input-Output Isolation Voltage (note 3) Isolation Resistance Isolation Capacitance Test Conditions f = 60Hz, t = 1 min (VI-O = 500 VDC) (VI-O = 0, f = 1 MHz) Symbol VISO RISO CISO Min 5000 5x 1010 Typ 1011 0.6 Max Units Vac(rms) 1.0 pf NOTES 1. Current Transfer Ratio (CTR) = IC/IF x 100%. 2 FOD816 Series Rev. 1.0.3 www.fairchildsemi.com FOD816 Series 4-Pin Phototransistor Optocouplers Typical Electrical/Optical Characteristic Curves (TA = 25C Unless otherwise specified.) 60 FORWARD CURRENT IF (mA) 50 40 30 20 10 0 -30 COLLECTOR POWER DISSIPATION PC (mW) Fig. 1 Forward Current vs. Ambient Temperature Fig. 2 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 -30 0 25 50 75 100 125 AMBIENT TEMPERATURE TA (C) 100 125 AMBIENT TEMPERATURE TA (C) 0 25 50 75 Fig. 3 Collector-Emitted Saturation Voltage vs. Forward Current 8 COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) 5mA 7mA Fig. 4 Forward Current vs. Forward Voltage 500 FORWARD CURRENT IF (mA) 7 6 5 4 3 2 1 0 0 30mA 50mA Ta = 25C 200 100 50 20 10 5 2 1 Ta = 75C 50C 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 FORWARD CURRENT IF (mA) Ic = 0.5mA 1mA 3mA 25C 0C - 25C 0 0.5 1.0 1.5 2.0 2.5 3.0 FORWARD VOLTAGE VF (V) CURRENT TRANSFER RATIO CTR ( %) 2000 Fig. 5 Current Transfer Ratio vs. Forward Current 100 VCE = 2V Ta = 25C COLLECTOR CURRENT IC (mA) Fig. 6 Collector Current vs. Collector-Emitter Voltage Ta = 25C 80 IF = 10 mA Pc(MAX.) 5mA 40 2mA 20 1mA 1600 1200 60 800 400 0 0.1 0.2 0.5 1 2 5 10 0 0 1 2 3 4 5 FORWARD CURRENT IF (mA) COLLECTOR-EMITTER VOLTAGE VCE (V) 3 FOD816 Series Rev. 1.0.3 www.fairchildsemi.com FOD816 Series 4-Pin Phototransistor Optocouplers Typical Electrical/Optical Characteristic Curves (TA = 25C Unless otherwise specified.) Fig. 7. Relative Current Transfer Ratio vs. Ambient Temperature COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) 150 RELATIVE CURRENT TRANSFER RATIO (%) Fig. 8 Collector-Emitter Saturation Voltage vs. Ambient Temperature 1.0 0.8 0.6 0.4 0.2 0 -25 0 25 50 75 100 AMBIENT TEMPERATURE TA (C) IF = 5mA VCE = 2V 100 IF = 20mA IC = 5mA 50 0 -30 0 25 50 75 100 AMBIENT TEMPERATURE TA (C) COLLECTOR DARK CURRENT ICEO (A) Fig. 9 Collector Dark Current vs. Ambient Temperature 10-5 500 Fig. 10. Response Time vs. Load Resistance VCE = 2V 200 IC = 10mA RESPONSE TIME (s) tr tf VCE = 20V 10-6 10-7 10-8 10-9 10-10 10-11 -25 Ta = 25C 100 50 20 10 5 2 1 0.5 td ts 0 25 50 75 100 AMBIENT TEMPERATURE TA (C) 0.2 0.05 0.1 0.2 0.5 1 2 5 10 LOAD RESISTANCE RL (k) Fig. 11. Frequency Response VCE = 2V IC = 2mA Ta = 25C Test Circuit for Response Time Vcc Input RD RL VOLTAGE GAIN AV (dB) 0 Input Output 10% Output 90% td ts tr tf -10 RL=10k 1k 100 Test Circuit for Frequency Response Vcc -20 0.02 0.1 1 10 100 RD RL FREQUENCY f (kHz) Output 4 FOD816 Series Rev. 1.0.3 www.fairchildsemi.com FOD816 Series 4-Pin Phototransistor Optocouplers Package Dimensions (Through Hole) 0.312 (7.92) 0.288 (7.32) Package Dimensions (Surface Mount) SEATING PLANE 0.157 (4.00) 0.118 (3.00) SEATING PLANE 0.200 (5.10) 0.161 (4.10) 0.276 (7.00) 0.236 (6.00) 0.200 (5.10) 0.161 (4.10) 0.312 (7.92) 0.288 (7.32) 0.276 (7.00) 0.236 (6.00) 0.157 (4.00) 0.118 (3.00) 0.010 (0.26) 0.130 (3.30) 0.091 (2.30) 0.020 (0.51) TYP 0.051 (1.30) 0.043 (1.10) 0.024 (0.60) 0.004 (0.10) 0.049 (1.25) 0.030 (0.76) 0.412 (10.46) 0.388 (9.86) 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.010 (0.26) 0.300 (7.62) typ 0.110 (2.79) 0.090 (2.29) Lead Coplanarity 0.004 (0.10) MAX 0.110 (2.79) 0.090 (2.29) Package Dimensions (0.4" Lead Spacing) 0.200 (5.10) 0.161 (4.10) 0.312 (7.92) 0.288 (7.32) 0.157 (4.00) 0.118 (3.00) 0.276 (7.00) 0.236 (6.00) Footprint Dimensions (Surface Mount) 1.5 1.3 SEATING PLANE 0.130 (3.30) 0.091 (2.30) 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.110 (2.79) 0.090 (2.29) 0.42 (10.66) 0.38 (9.66) 0.110 (2.80) 0.011 (1.80) 0.291 (7.40) 0.252 (6.40) 9 0.010 (0.26) 2.54 NOTE All dimensions are in inches (millimeters) 5 FOD816 Series Rev. 1.0.3 www.fairchildsemi.com FOD816 Series 4-Pin Phototransistor Optocouplers Ordering Information Option S SD W 300 300W 3S 3SD Order Entry Identifier .S .SD .W .300 .300W .3S .3SD Description Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE Approved VDE Approved, 0.4" Lead Spacing VDE Approved, Surface Mount VDE Approved, Surface Mount, Tape & Reel Marking Information 4 5 V X ZZ Y 3 6 816 1 2 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code Two digit work week ranging from `01' to `53' Assembly package code 6 FOD816 Series Rev. 1.0.3 www.fairchildsemi.com FOD816 Series 4-Pin Phototransistor Optocouplers Carrier Tape Specifications O1.550.05 P2 P0 1.750.1 F W B0 A0 P1 0.30.05 K0 NOTE All dimensions are in millimeters Description Tape wide Pitch of sprocket holes Distance of compartment Distance of compartment to compartment Compartment Symbol W P0 F P2 P1 A0 B0 K0 Dimensions in mm (inches) 16 0.3 (.63) 4 0.1 (.15) 7.5 0.1 (.295) 2 0.1 (.079) 12 0.1 (.472) 10.45 0.1 (.411) 5.30 0.1 (.209) 4.25 0.1 (.167) 7 FOD816 Series Rev. 1.0.3 www.fairchildsemi.com FOD816 Series 4-Pin Phototransistor Optocouplers Lead Free recommended IR Reflow condition Tp Temperature (C) Tsmax Ramp-down Tsmin 25C ts (Preheat) Time (sec) Profile Feature Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone Peak temperature (Tp) Ramp-down rate Soldering zon Pb-Sn solder assembly 100C ~ 150C 60 ~ 120 sec 183C 60 ~ 120 sec 240 +0/-5C 6C/sec max. Lead Free assembly 150C ~ 200C 60 ~120 sec 217C 30 ~ 90 sec 250 +0/-5C 6C/sec max. Recommended Wave Soldering condition Profile Feature Peak temperature (Tp) For all solder assembly Max 260C for 10 sec 8 FOD816 Series Rev. 1.0.3 www.fairchildsemi.com FOD816 Series 4-Pin Phototransistor Optocouplers The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM E2CMOSTM i-LoTM EnSignaTM ImpliedDisconnectTM FACTTM IntelliMAXTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise Programmable Active DroopTM DISCLAIMER ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench QFET QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic TINYOPTOTM TruTranslationTM UHCTM UltraFET UniFETTM VCXTM WireTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I16 9 FOD816 Series Rev. 1.0.3 www.fairchildsemi.com |
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