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| ML501 Product Features * High dynamic range mixer with integrated LO driver * +30 dBm Input IP3 * 8 dB Conversion Loss * RF: 1900 - 2700 MHz * LO: 1600 - 2500 MHz * IF: 50 - 500 MHz * 0 dBm Drive Level * RoHS-compliant SOIC-8 pkg The Communications Edge TM Product Information 1.9-2.7 GHz High IP3 Mixer with Integrated LO Amp Product Description The ML501 high linearity upconverter or downconverter combines a passive GaAs MESFET mixer with an integrated HBT LO driver in a low-cost leadfree/green/RoHS-compliant SOIC-8 package. WJ's ML501 uses patented techniques to realize +30 dBm Input IP3 with 8 dB conversion loss using an LO drive level of 0 dBm in a downconverting application. The on-chip diplexer in the mixers allows for good matching on the RF and IF ports. The dual-stage LO driver provides a stable input power level into the mixer to allow for consistent performance over a wide range of LO power levels. Typical applications include frequency up/down conversion, modulation and demodulation for receivers and transmitters used in 2.5G and 3G GSM/CDMA/WCDMA systems in the PCS, or UMTS frequency bands. They can also be used for WiBro/WiLAN/WiMAX infrastructure requiring high linearity frequency conversion. Functional Diagram LO 1 8 RF 7 GND 6 GND 5 IF The backside paddle is Ground. GND 2 Vcc1 3 Vcc2 4 Applications * 2.5/3G GSM/CDMA/WCDMA * PCS/UMTS-band Mobile Infrastructure * WiBro / WiLAN / WiMAX Specifications (1) Parameter RF Frequency Range LO Frequency Range IF Frequency Range SSB Conversion Loss Input IP3 (2) Input P1dB LO - RF Isolation (3) LO - IF Isolation (3) RF - IF Isolation Return Loss: RF Port Return Loss: IF Port Return Loss: LO Port LO Drive Level Supply Voltage Operating Current (4) 1. 2. 3. 4. Units MHz MHz MHz dB dBm dBm dB dB dB dB dB dB dBm V mA Min Typ 1900 - 2200 1600 - 2150 50 - 300 8 +30 +21 9 27 20 16 20 15 0 +5 110 Max Min Typ 2200 - 2400 1900 - 2350 50 - 300 8.1 +30 +20 8 27 21 17 20 12 0 +5 120 Max Min Typ 2400 - 2700 1900 - 2500 200 - 500 8.4 +28 +20 7 25 21 17 20 11 0 +5 130 Max 9 +28 -2.5 85 2.5 135 -2.5 2.5 -2.5 2.5 Min / max limits are tested for the mixer in downconverting application with a low-side LO at 0 dBm at 25 C with RF/IF = 1900/50, 2200/50, and 1900/300 MHz. IIP3 is measured with f = 1 MHz with RFin = 0 dBm / tone. LO is injected with 0 dBm. This refers to the operating current under LO drive. The current can be reduced by increasing the value of the R2 resistor slightly. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature DC Voltage LO Power Input IF / RF Power -40 to +85 C -55 to +150 C +5.5 V +10 dBm +20 dBm Rating Ordering Information Part No. ML501-G ML501-PCB Description 1.9-2.7 GHz High IP3 Mixer w/ Integrated LO Amp (lead-free/green/RoHS-compliant SOIC-8 package) Full Assembled Evaluation Board Specifications and information are subject to change without notice Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 1 of 4 June 2006 ML501 The Communications Edge TM Product Information 1.9-2.7 GHz High IP3 Mixer with Integrated LO Amp Typical Downconversion Performance Plots Performance using the circuitry on the ML501-PCB Evaluation Board R1 is shown in the silkscreen but is not required for the ML501. A 0 jumper is placed in this spot on the PCB. Conversion Loss vs RF Frequency vs IF Frequency +25 C, LO = 0 dBm, low-side LO Input IP3 vs RF Frequency vs IF Frequency +25 C, LO = 0 dBm, low-side LO 10 Conversion Loss (dB) 34 Input IP3 (dBm) 32 30 28 26 24 1800 IF=50MHz IF=150MHz IF=250MHz IF=100MHz IF=200MHz IF=300MHz 9 8 7 6 5 1800 IF=50MHz IF=150MHz IF=250MHz 1900 2000 2100 IF=100MHz IF=200MHz IF=300MHz 2200 2300 1900 2000 2100 2200 2300 RF Frequency (MHz) Conversion Loss vs RF Frequency vs Temperature LO = 0 dBm, IF = 50 MHz, low-side LO RF Frequency (MHz) Conversion Loss vs RF Frequency vs Temperature LO = 0 dBm, IF = 250 MHz, low-side LO Conversion Loss vs RF Frequency vs Temperature LO = 0 dBm, IF = 150 MHz, low-side LO 10 Conversion Loss (dB) Conversion Loss (dB) 9 8 7 6 -40 C +25 C +85 C 10 10 Conversion Loss (dB) 9 8 7 6 -40 C +25 C +85 C 9 8 7 6 -40 C +25 C +85 C 5 1800 1900 2000 2100 2200 2300 5 1800 1900 2000 2100 2200 2300 5 1800 1900 2000 2100 2200 2300 RF Frequency (MHz) Conversion Loss vs RF Frequency vs LO Power +25 C, IF = 50 MHz, low-side LO RF Frequency (MHz) Conversion Loss vs RF Frequency vs LO Power +25 C, IF = 150 MHz, low-side LO RF Frequency (MHz) Conversion Loss vs RF Frequency vs LO Power +25 C, IF = 250 MHz, low-side LO 10 Conversion Loss (dB) Conversion Loss (dB) 9 8 7 6 5 1800 LO = -3 dBm LO = 0 dBm LO = 3 dBm 10 10 Conversion Loss (dB) 9 8 7 6 5 1800 LO = -3 dBm LO = 0 dBm LO = 3 dBm 9 8 7 6 5 1800 LO = -3 dBm LO = 0 dBm LO = 3 dBm 1900 2000 2100 2200 2300 1900 2000 2100 2200 2300 1900 2000 2100 2200 2300 RF Frequency (MHz) RF Frequency (MHz) RF Frequency (MHz) Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 2 of 4 June 2006 ML501 LO = 0 dBm, IF = 50 MHz, low-side LO The Communications Edge TM Product Information 1.9-2.7 GHz High IP3 Mixer with Integrated LO Amp Typical Downconversion Performance Plots (cont'd) Performance using the circuitry on the ML501-PCB Evaluation Board Input IP3 vs RF Frequency vs Temperature Input IP3 vs RF Frequency vs Temperature LO = 0 dBm, IF = 150 MHz, low-side LO Input IP3 vs RF Frequency vs Temperature LO = 0 dBm, IF = 250 MHz, low-side LO 34 Input IP3 (dBm) Input IP3 (dBm) 32 30 28 26 -40 C +25 C +85 C 34 34 Input IP3 (dBm) 32 30 28 26 -40 C +25 C +85 C 32 30 28 26 -40 C +25 C +85 C 24 1800 1900 2000 2100 2200 2300 24 1800 1900 2000 2100 2200 2300 24 1800 1900 2000 2100 2200 2300 RF Frequency (MHz) Input IP3 vs RF Frequency vs LO Power +25 C, IF = 50 MHz, low-side LO RF Frequency (MHz) Input IP3 vs RF Frequency vs LO Power +25 C, IF = 150 MHz, low-side LO RF Frequency (MHz) Input IP3 vs RF Frequency vs LO Power +25 C, IF = 250 MHz, low-side LO 34 Input IP3 (dBm) Input IP3 (dBm) 32 30 28 26 24 1800 LO = -3 dBm LO = 0 dBm LO = 3 dBm 34 34 Input IP3 (dBm) 32 30 28 26 24 1800 LO = -3 dBm LO = 0 dBm LO = 3 dBm 32 30 28 26 24 1800 LO = -3 dBm LO = 0 dBm LO = 3 dBm 1900 2000 2100 2200 2300 1900 2000 2100 2200 2300 1900 2000 2100 2200 2300 RF Frequency (MHz) RF Return Loss vs LO Frequency +25 C, LO = 0 dBm RF Frequency (MHz) IF Return Loss vs IF Frequency +25 C, LO = 0 dBm RF Frequency (MHz) LO Return Loss vs LO Frequency +25 C 0 RF Return Loss (dB) -5 -10 -15 -20 -25 1800 IF Return Loss (dB) IF = 50 MHz IF = 150 MHz IF = 300 MHz 0 -5 -10 -15 -20 -25 1900 2000 2100 2200 2300 50 100 150 200 LO Return Loss (dB) LO = 1750 MHz LO = 1850 MHz LO = 1950 MHz 0 -5 -10 -15 -20 -25 1500 250 300 1700 1900 2100 2300 RF Frequency (MHz) L-R Isolation vs LO Frequency Referenced with LO = 0 dBm IF Frequency (MHz) L-I Isolation vs LO Frequency Referenced with LO = 0 dBm LO Frequency (MHz) R-I Isolation vs RF Frequency 25 L-R Isolation (dB) 20 15 10 5 -40 C +25 C +85 C 35 30 25 20 15 -40 C +25 C +85 C 25 R-I Isolation (dB) 20 15 10 5 -40 C +25 C +85 C 0 1500 L-I Isolation (dB) 1700 1900 2100 2300 10 1500 1700 1900 2100 2300 0 1800 1900 2000 2100 2200 2300 LO Frequency (MHz) LO Frequency (MHz) Input P1dB vs RF Frequency IF = 100 MHz, low-side LO at 0 dBm RF Frequency (MHz) 22 Input P1dB (dBm) 20 18 16 14 12 1900 -40 C +25 C +85 C 2100 2300 2500 2700 RF Frequency (MHz) Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 3 of 4 June 2006 ML501 The Communications Edge TM Product Information 1.9-2.7 GHz High IP3 Mixer with Integrated LO Amp ML501-G Mechanical Information This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260 C reflow temperature) and lead (maximum 245 C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be lasermarked with a "ML501-G" product label with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part will be located on the website in the "Application Notes" section. ESD / MSL Information ESD Rating: Value: Test: Standard: ESD Rating: Value: Test: Standard: Class 1B Passes 500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes 1000V Charged Device Model (CDM) JEDEC Standard JESD22-C101 MSL Rating: Level 2 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Functional Pin Layout Mounting Configuration / Land Pattern LO 1 8 RF 7 GND 6 GND 5 IF The backside paddle is Ground. GND 2 Vcc1 3 Vcc2 4 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. All dimensions are in millimeters (inches). Angles are in degrees. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. Pin 1 2 3 4 5 6 7 8 Function LO GND Vcc1 Vcc2 IF GND GND RF Backside paddle is RF and DC ground. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth Rating -40 to +85 C 104 C / W Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 4 of 4 June 2006 |
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