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| PD -94305D IRG4MC40U INSULATED GATE BIPOLAR TRANSISTOR Features Electrically Isolated and Hermetically Sealed Simple Drive Requirements Latch-proof UltraFast Speed Operation 8kHz - 40kHz, > 200kHz in Resonent Mode * High Operating Frequency * Switching-loss Rating includes all "tail" Losses * Ceramic Eyelets * * * * C UltraFast Speed IGBT VCES = 600V G E VCE(on) max = 2.1V @VGE = 15V, IC = 20A n-channel Benefits * Generation 4 IGBT's offer highest efficiency available * IGBT's optimized for specified application conditions * Designed to be a "drop-in" replacement for equivalent IR Hi-Rel Generation 3 IGBT's Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors, while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, highcurrent applications. TO-254AA Absolute Maximum Ratings Parameter VCES IC @ TC = 25C IC @ TC = 100C ICM ILM VGE PD @ TC = 25C PD @ T C = 100C TJ TSTG Collector-to-Emitter Breakdown Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Gate-to-Emitter Voltage Maximum Power Dissipation Maximum Power Dissipation Operating Junction and Storage Temperature Range Lead Temperature Weight Max. 600 35* 20 140 140 20 125 50 -55 to + 150 300 (0.063in./1.6mm from case for 10s) 9.3 (typical) Units V A V W C g Thermal Resistance Parameter R thJC Junction-to-Case Min Typ Max Units -- -- 1.1 C/W Test Conditions www.irf.com 1 02/08/02 IRG4MC40U Electrical Characteristics @ TJ = 25C (unless otherwise specified) V(BR)CES V(BR)ECS Parameter Min. Typ. Collector-to-Emitter Breakdown Voltage 600 --- Emitter-to-Collector Breakdown Voltage S 17 --- V(BR)CES/TJ Temperature Coeff. of Breakdown Voltage --- 0.5 --- --- VCE(ON) Collector-to-Emitter Saturation Voltage --- --- --- --- VGE(th) Gate Threshold Voltage 3.0 --- VGE(th)/TJ Temperature Coeff. of Threshold Voltage --- -12 gfe Forward Transconductance T 11 --- --- --- ICES Zero Gate Voltage Collector Current --- --- IGES Gate-to-Emitter Leakage Current --- --- Max. Units Conditions --- V VGE = 0V, IC = 1.0 mA --- V VGE = 0V, IC = 1.0 A --- V/C VGE = 0V, IC = 1.0 mA VGE = 15V 2.1 IC = 20A 2.5 V IC = 35A See Fig.2, 5 2.0 IC = 20A , TJ = 125C 6.0 VCE = VGE, IC = 1.0 mA --- mV/C VCE = VGE, IC = 250 A --- S VCE 15V, IC = 20A 50 VGE = 0V, VCE = 480V A 2000 VGE = 0V, VCE = 480V, TJ = 125C 100 nA VGE = 20V Switching Characteristics @ TJ = 25C (unless otherwise specified) Qg Qge Qgc td(on) tr td(off) tf Ets td(on) tr td(off) tr Ets LC+LE Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Rise Time Total Switching Loss Total Inductance Min. --- --- --- --- --- --- --- --- --- --- --- --- --- --- Typ. --- --- --- --- --- --- --- --- --- --- --- --- --- 6.8 Max. Units Conditions 150 IC = 20A 25 nC VCC = 300V See Fig. 8 60 VGE = 15V 50 TJ = 25C 42 IC = 20A, VCC = 480V ns 190 VGE = 15V, RG = 9.1 120 Energy losses include "tail" 1.0 mJ See Fig. 10, 11, 13, 14 40 TJ = 125C, 40 ns IC = 20A, VCC = 480V 300 VGE = 15V, RG = 9.1 250 Energy losses include "tail" 1.8 mJ See Fig. 13, 14 --- nH Measured from Collector lead (6mm/ 0.25in. from package) to Emitter lead (6mm / 0.25in. from package) 2215 --- VGE = 0V 135 --- pF VCC = 30V See Fig. 7 25 --- = 1.0MHz Cies Coes Cres Notes: Input Capacitance Output Capacitance Reverse Transfer Capacitance --- --- --- Q Repetitive rating; VGE = 20V, pulse width limited by max. junction temperature. ( See fig. 13b ) S Pulse width 80s; duty factor 0.1%. T Pulse width 5.0s, single shot. R VCC = 80%(VCES), VGE = 20V, L = 100H, RG = 9.1, (See fig. 13a) 2 www.irf.com IRG4MC40U 60 Square wave: 60% of rated voltage Triangular wave: 50 Clamp voltage: 80% of rated Load Current ( A ) 40 Ideal diodes 30 20 10 For both: Duty cycle : 50% Tj = 125C Tsink = 90C Gate drive as specified Power Dissipation = 29W 0.1 1 10 100 0 f , Frequency ( kHz ) Fig. 1 - Typical Load Current vs. Frequency (For square wave, I=IRMS of fundamental; for triangular wave, I=IPK) 1000 1000 I C , Collector-to-Emitter Current (A) 100 I C , Collector-to-Emitter Current (A) 100 TJ = 150 C TJ = 25 C 10 10 TJ = 150 C GE TJ = 25 C V = 15V 20s PULSE WIDTH 1 10 1 0.1 1 4 6 8 V = 50V 5s PULSE WIDTH CC 10 12 VCE , Collector-to-Emitter Voltage (V) VGE , Gate-to-Emitter Voltage (V) Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics www.irf.com 3 IRG4MC40U 50 VGE = 15V 3.0 VGE = 15V 80s PULSE WIDTH VCE , Collector-to Emitter Voltage (V) Maximum DC Collector Current ( ) 40 LIMITED BY PACKAGE IC = 40A 30 2.0 IC = 20A 20 IC = 10A 10 0 25 50 75 100 125 150 T J , Junction Temperature (C ) 1.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 T J , Junction Temperature (C) Fig. 4 - Maximum Collector Current vs. Case Temperature Fig. 5 - Collector-to-Emitter Voltage vs. Junction Temperature 10 Thermal Response (Z thJC ) 1 D = 0.50 0.20 0.10 0.1 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) 0.01 0.00001 Notes: 1. Duty factor D = t 1 / t2 2. Peak T = PDM x Z thJC + TC J 0.1 0.001 0.01 1 P DM t1 t2 0.0001 t1 , Rectangular Pulse Duration (sec) Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case 4 www.irf.com IRG4MC40U 4000 VGE , Gate-to-Emitter Voltage (V) C, Capacitance (pF) 3000 VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc 20 VCC = 300V 400V I C = 20A 16 Cies 2000 12 8 1000 C oes C res 4 0 1 10 100 0 0 20 40 60 80 100 120 VCE , Collector-to-Emitter Voltage (V) QG , Total Gate Charge (nC) Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage 1.00 VCC = 480V VGE = 15V TJ = 25C I C = 20A 10 RG = 9.1 VGE = 15V Total Switching Losses (mJ) Total Switching Losses (mJ) VCC = 480V IC = 40A IC = 20A 1 IC = 10A 0.75 0.50 0 10 20 30 40 50 0.1 -60 -40 -20 0 20 40 60 80 100 120 140 160 R G, Gate Resistance ( ) T J, Junction Temperature (C) Fig. 9 - Typical Switching Losses vs. Gate Resistance Fig. 10 - Typical Switching Losses vs. Junction Temperature www.irf.com 5 IRG4MC40U 4.0 RG = 9.1 TJ = 125C 150C VGE = 15V VCC = 480V 1000 3.0 IC , Collector-to-Emitter Current (A) VGE = 20V T J = 125 Total Switching Losses (mJ) 100 SAFE OPERATING AREA 2.0 10 1.0 0.0 10 20 30 40 1 0.1 1 10 100 1000 IC , Collector Current (A) VDS , Drain-to-Source Voltage (V) Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current Fig. 12 - Turn-Off SOA 6 www.irf.com IRG4MC40U L 50V 1 00 0V VC * D .U .T. RL = 0 - 720V 720V 4 X IC@25C 480F 960V R Q * Driver s am e ty pe as D .U .T.; Vc = 80% of V ce (m ax ) * Note: D ue to the 50V pow er s upply, pulse w idth a nd inductor w ill inc rea se to obta in ra ted Id. Fig. 13a - Clamped Inductive Load Test Circuit Fig. 13b - Pulsed Collector Current Test Circuit IC L D river* 50V 1000V Q R S * Driver same type as D.U.T., VC = 720V D .U .T. VC Fig. 14a - Switching Loss Test Circuit Q R 9 0% S 1 0% 90 % VC t d (o ff) Fig. 14b - Switching Loss Waveforms 10 % IC 5% t d (o n ) tr E on E ts = ( Eo n +E o ff ) tf t=5 s E o ff www.irf.com 7 IRG4MC40U Case Outline and Dimensions -- TO-254AA 0.12 [.005] 3.78 [.149] 3.53 [.139] A 13.84 [.545] 13.59 [.535] 6.60 [.260] 6.32 [.249] 1.27 [.050] 1.02 [.040] 3.78 [.149] 3.53 [.139] A 13.84 [.545] 13.59 [.535] 6.60 [.260] 6.32 [.249] 1.27 [.050] 1.02 [.040] 0.12 [.005] 17.40 [.685] 16.89 [.665] 1 2 3 20.32 [.800] 20.07 [.790] 13.84 [.545] 13.59 [.535] B 22.73 [.895] 21.21 [.835] 17.40 [.685] 16.89 [.665] 1 2 3 20.32 [.800] 20.07 [.790] 13.84 [.545] 13.59 [.535] B R 1.52 [.060] C 17.40 [.685] 16.89 [.665] 0.84 [.033] MAX. 4.82 [.190] 3.81 [.150] 3.81 [.150] 4.06 [.160] 3.56 [.140] 3X 1.14 [.045] 0.89 [.035] 0.36 [.014] B A 3X 3.81 [.150] 2X 1.14 [.045] 0.89 [.035] 0.36 [.014] BA 3.81 [.150] 2X NOTES : 1. 2. 3. 4. DIMENS IONING & T OLERANCING PER ASME Y14.5M-1994. ALL DIMENS IONS ARE S HOWN IN MILLIMETERS [INCHES ]. CONTROLLING DIMENS ION: INCH. CONFORMS TO JEDEC OUTLINE TO-254AA. PIN ASSIGNMENTS 1 = COLLECTOR 2 = EMITTER 3 = GATE CAUTION BERYLLIA WARNING PER MIL-PRF-19500 Packages containing beryllia shall not be ground, sandblasted, machined, or have other operations performed on them which will produce beryllia or beryllium dust. Furthermore, beryllium oxide packages shall not be placed in acids that will produce fumes containing beryllium. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 02/02 8 www.irf.com |
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