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MBR150, MBR160
MBR160 is a Preferred Device
Axial Lead Rectifiers
The MBR150/160 series employs the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlap contact. Ideally suited for use as rectifiers in low-voltage, high-frequency inverters, free wheeling diodes, and polarity protection diodes.
Features
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* * * * *
Low Reverse Current Low Stored Charge, Majority Carrier Conduction Low Power Loss/High Efficiency Highly Stable Oxide Passivated Junction These are Pb-Free Devices*
SCHOTTKY BARRIER RECTIFIERS 1.0 AMPERE - 50 AND 60 VOLTS
Mechanical Characteristics:
* Case: Epoxy, Molded * Weight: 0.4 Gram (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * Lead Temperature for Soldering Purposes: *
260C Max. for 10 Seconds Polarity: Cathode Indicated by Polarity Band
DO-41 AXIAL LEAD CASE 59 STYLE 1 Value 50 60 VRWM VR MBR150 MBR160 VR(RMS) IO 35 42 1.0 V A A MBR1x0 YYWW G G Unit V
Leads are Readily Solderable
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage MBR150 MBR160 Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Symbol VRRM
MARKING DIAGRAM
Average Rectified Forward Current (Note 1) (VR(equiv) v 0.2 VR(dc), TL = 90C, RqJA = 80C/W, P.C. Board Mounting, TA = 55C) Nonrepetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz, TL = 70C) Operating and Storage Junction Temperature Range (Reverse Voltage Applied)
IFSM
25 (for one cycle) - 65 to +150
A
TJ, Tstg
C A = Assembly Location MBR1x0 = Device Code x = 5 or 6 Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
THERMAL CHARACTERISTICS (Notes 1 and 2)
Characteristic Thermal Resistance, Junction-to-Ambient Symbol RqJA Max 80 Unit C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Lead Temperature reference is cathode lead 1/32 from case. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
Preferred devices are recommended choices for future use and best overall value.
1
June, 2006 - Rev. 8
Publication Order Number: MBR150/D
MBR150, MBR160
ELECTRICAL CHARACTERISTICS (TL = 25C unless otherwise noted) (Note 1)
Characteristic Maximum Instantaneous Forward Voltage (Note 2) (iF = 0.1 A) (iF = 1.0 A) (iF = 3.0 A) Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 2) (TL = 25C) (TL = 100C) Symbol vF 0.550 0.750 1.000 iR 0.5 5.0 mA Max Unit V
10 7.0 5.0 3.0 2.0 i F, INSTANTANEOUS FORWARD CURRENT (AMPS) TJ = 150C 100C 25C
10 5.0 I R , REVERSE CURRENT (mA) 2.0 1.0 0.5 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 0 10 20 30 40 50 VR, REVERSE VOLTAGE (VOLTS) 60 70 25C TJ = 150C 125C 100C 75C
1.0 0.7 0.5 0.3 0.2
Figure 2. Typical Reverse Current*
*The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 5.0 PF(AV) , AVERAGE FORWARD POWER DISSIPATION (WATTS) 0.1 0.07 0.05 0.03 0.02 SQUARE WAVE
4.0
3.0 p 5 10 1.0 IPK/IAV = 20
dc
2.0
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 1.0 2.0 3.0 4.0 5.0 vF, INSTANTANEOUS VOLTAGE (VOLTS) IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 1. Typical Forward Voltage
Figure 3. Forward Power Dissipation
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MBR150, MBR160
THERMAL CHARACTERISTICS
1.0 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 0.7 0.5 0.3 0.2 Ppk 0.1 0.07 0.05 0.03 0.02 0.01 0.1 0.2 0.5 1.0 2.0 5.0 10 20 t, TIME (ms) 50 tp TIME t1 Ppk DUTY CYCLE, D = tp/t1 PEAK POWER, Ppk, is peak of an equivalent square power pulse. ZqJL(t) = ZqJL * r(t)
DTJL = Ppk * RqJL [D + (1 - D) * r(t1 + tp) + r(tp) - r(t1)] where DTJL = the increase in junction temperature above the lead temperature r(t) = normalized value of transient thermal resistance at time, t, from Figure 4, i.e.: r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp. 100 200 500 1k 2k 5k 10 k
Figure 4. Thermal Response
.
90 80 R qJL , THERMAL RESISTANCE, JUNCTION-TO-LEAD ( C/W) 70 60 MAXIMUM 50 TYPICAL 40 30 20 10 0 1/8 1/4 3/8 1/2 5/8 3/4 7/8 1.0 L, LEAD LENGTH (INCHES) BOTH LEADS TO HEATSINK, EQUAL LENGTH C, CAPACITANCE (pF) 100 80 70 60 50 40 30 20 0 10 20 30 40 50 60 70 80 90 100 VR, REVERSE VOLTAGE (VOLTS) 200 TJ = 25C f = 1 MHz
Figure 5. Steady-State Thermal Resistance NOTE 1. -- MOUNTING DATA:
Figure 6. Typical Capacitance NOTE 2. -- THERMAL CIRCUIT MODEL: (For heat conduction through the leads)
RqS(A) TA(A) TL(A) TC(A) TJ RqL(A) RqJ(A) RqJ(K
)
Data shown for thermal resistance junction-to-ambient (RqJA) for the mounting shown is to be used as a typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured.
Typical Values for RqJA in Still Air
Mounting Method 1 2 3 Lead Length, L (in) 1/8 52 67 -- 1/4 65 80 1/2 72 87 50 3/4 85 100 RqJA C/W C/W C/W
RqL(K)
RqS(K) TA(K)
PD TC(K) TL(K)
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MBR150, MBR160
Use of the above model permits junction to lead thermal resistance for any mounting configuration to be found. For a given total lead length, lowest values occur when one side of the rectifier is brought as close as possible to the heatsink. Terms in the model signify: TA = Ambient Temperature TC = Case Temperature TL = Lead Temperature TJ = Junction Temperature RqS = Thermal Resistance, Heatsink-to-Ambient RqL = Thermal Resistance, Lead-to-Heatsink RqJ = Thermal Resistance, Junction-to-Case PD = Power Dissipation
Mounting Method 1 P.C. Board with 1-1/2 x 1-1/2 copper surface. Mounting Method 3 P.C. Board with 1-1/2 x 1-1/2 copper surface.
(Subscripts A and K refer to anode and cathode sides, respectively.) Values for thermal resistance components are: RqL = 100C/W/in typically and 120C/W/in maximum. RqJ = 36C/W typically and 46C/W maximum.
NOTE 3. -- HIGH FREQUENCY OPERATION:
L
L
L = 3/8
Mounting Method 2
BOARD GROUND PLANE
L
L
Since current flow in a Schottky rectifier is the result of majority carrier conduction, it is not subject to junction diode forward and reverse recovery transients due to minority carrier injection and stored charge. Satisfactory circuit analysis work may be performed by using a model consisting of an ideal diode in parallel with a variable capacitance. (See Figure 6) Rectification efficiency measurements show that operation will be satisfactory up to several megahertz. For example, relative waveform rectification efficiency is approximately 70 percent at 2 MHz, e.g., the ratio of dc power to RMS power in the load is 0.28 at this frequency, whereas perfect rectification would yield 0.406 for sine wave inputs. However, in contrast to ordinary junction diodes, the loss in waveform efficiency is not indicative of power loss: it is simply a result of reverse current flow through the diode capacitance, which lowers the dc output voltage.
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VECTOR PIN MOUNTING
ORDERING INFORMATION
Device MBR150 MBR150G MBR150RL MBR150RLG MBR160 MBR160G MBR160RL MBR160RLG Package Axial Lead* Axial Lead* Axial Lead* Axial Lead* Axial Lead* Axial Lead* Axial Lead* Axial Lead* Shipping 1000 Units / Bag 1000 Units / Bag 5000 / Tape & Reel 5000 / Tape & Reel 1000 Units / Bag 1000 Units / Bag 5000 / Tape & Reel 5000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
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MBR150, MBR160
PACKAGE DIMENSIONS
AXIAL LEAD CASE 59-10 ISSUE U
B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. ALL RULES AND NOTES ASSOCIATED WITH JEDEC DO-41 OUTLINE SHALL APPLY 4. POLARITY DENOTED BY CATHODE BAND. 5. LEAD DIAMETER NOT CONTROLLED WITHIN F DIMENSION. INCHES MIN MAX 0.161 0.205 0.079 0.106 0.028 0.034 --- 0.050 1.000 --- MILLIMETERS MIN MAX 4.10 5.20 2.00 2.70 0.71 0.86 --- 1.27 25.40 ---
K F
D
DIM A B D F K
A
POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES)
F K
STYLE 1: PIN 1. CATHODE (POLARITY BAND) 2. ANODE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MBR150/D

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