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| Precision Thick Film Chip Resistors Precision Thick Film Chip Resistors ERJ G: 0201 ERJ R : 0402, 0603, 0805 ERJ E : 0603, 0805, 1206, 1210, 1812, 2010, 2512 Type: ERJ 1G ERJ 2R, 3R, 6R ERJ 3E, 6E, 8E, 14, 12, 1T n Features l Small size and lightweight For PCB size reduction and lightweight products l High reliability Metal glaze thick film resistive element and three layered electrode results in high reliability. l Matching with placement machines Bulk, Taping and magazine packagings for automatic placement machines l Solderability Suitable for both reflow soldering and flow soldering l Low Resistance Tolerance ERJ1G, 2R, 3E, 6E, 8E, 14, 12, 1T Series ... 1% ERJ2R, 3R, 6R Series ............................ 0.5% l Reference Standards IEC 60115-8, JIS C 5201-8 n Explanation of Part Numbers l ERJ2R, 3R, 6R Series, 0.5 % type 1 2 3 4 5 E R J 3 R Product Code Thick Film Chip Resistors Size, Power Rating Type: inches 2R : 0402 3R : 0603 6R : 0805 Power R. 0.063 W 0.063 W 0.1 W w w w .D Code H B K E t a S a 6 B e h 7 t e 8 U 4 9 .c 10 m o 11 12 D 1 0 2 V T.C.R. Marking T.C.R. (2R) Resistance Tolerance Code D Tolerance Code X V Packaging Methods Packaging Punched Carrier Taping 2 mm pitch (2R) Punched Carrier Taping (3R, 6R) 50 10 6 /uC(ppm/uC) 50 10 /uC(ppm/uC) 6 0.5 % (3R, 6R) 100 10 6 /uC(ppm/uC) (2R) Resistance Value The first two or three digits are significant figures of resistance and the last one denotes number of zeros following. Example: 103 1002 100 10 6 /uC(ppm/uC) (3R, 6R) (R) 10 k W (R) 10 k W Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or us Should a safety concern arise regarding this product, please be sure to contact us immediately. w w w .D at Sh a et e 4U . om c e. Precision Thick Film Chip Resistors l ERJ1G Series, 1 % type 1 2 3 4 5 6 7 8 9 10 11 12 E R J 1 G E F 1 0 0 2 C Product Code Thick Film Chip Resistors Size, Power Rating Type : inches 1GE : 0201 Power R. 0.05 W Resistance Tolerance Code F Tolerance Resistance Value The first two or three digits are significant figures of resistance and the last one denotes number of zeros following. Code C Packaging Methods Packaging Pressed Carrier Taping 2 mm pitch, 15000 pcs. 1% l ERJ2R, 3E, 6E, 8E, 14, 12, 1T Series, 1 % type 1 2 3 4 5 6 7 8 9 10 11 12 E R J 8 E N F 1 0 0 2 V Product Code Thick Film Chip Resistors Size, Power Rating Type: inches 2R : 0402 3E : 0603 6E : 0805 8E : 1206 14 : 1210 12 : 1812 12 : 2010 1T : 2512 Power R. 0.063 W 0.1 W 0.125 W 0.25 W 0.25 W 0.5 W 0.5 W 1W Code K N S Marking Marking No marking (2R, 3E) 4 digit marking (6E, 8E, 14, 12, 1T) 4 digit marking [12(2010 inches)] Resistance Tolerance Code F Tolerance 1 % Code X V U Resistance Value Packaging Methods Packaging Punched Carrier Taping 2 mm pitch (2R) Punched Carrier Taping (3E, 6E, 8E) Embossed Carrier Taping (14, 12, 1T) The first three digits are significant figures of resistance and the 4th one denotes number of zeros following. n Construction Protective coating n Dimensions in mm (not to scale) L a W Alumina substrate Electrode (Inner) t b Type (inches) Electrode (Between) Dimensions (mm) L W a b t 0.60 0.03 0.30 0.03 0.100.05 0.150.05 0.23 0.03 1.00 1.60 2.00 0.05 Mass (Weight) [g/1000 pcs.] 0.15 0.8 2 4 2 4 10 16 27 27 45 Thick film resistive element Electrode (Outer) ERJ1G (0201) ERJ2R1 (0402) ERJ3R1 (0603) ERJ6R1 (0805) ERJ3EK (0603) ERJ6EN (0805) ERJ8EN (1206) ERJ14N (1210) ERJ12N (1812) ERJ12S (2010) ERJ1TN (2512) 0.50 0.80 1.25 0.05 0.20 0.30 0.40 0.10 0.25 0.30 0.40 0.05 0.35 0.45 0.60 0.05 0.15 +0.15 0.05 0.10 0.20 0.15 0.10 0.20 0.20 0.20 0.10 1.60 0.15 0.80 +0.15 0.300.20 0.300.15 0.45 0.10 0.05 2.00 0.20 1.25 0.10 0.400.20 0.400.20 0.60 0.10 3.20 +0.05 1.60 +0.05 0.500.20 0.500.20 0.60 0.10 0.15 0.20 3.20 0.20 2.50 0.20 0.500.20 0.500.20 0.60 0.10 4.50 0.20 3.20 0.20 0.500.20 0.500.20 0.60 0.10 5.00 0.20 2.50 0.20 0.600.20 0.600.20 0.60 0.10 6.40 0.20 3.20 0.20 0.650.20 0.600.20 0.60 0.10 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or us e. Should a safety concern arise regarding this product, please be sure to contact us immediately. Precision Thick Film Chip Resistors n Ratings <0.5 %> Type (inches) ERJ2RH (0402) ERJ2RK (0402) ERJ3RB (0603) ERJ3RE (0603) ERJ6RB (0805) ERJ6RE (0805) Power Rating Limiting Element Maximum Overload Resistance Voltage (Maximum at 70 C (W) Voltage(2) (V) Tolerance (%) RCWV)(1) (V) 0.063 0.063 0.063 0.063 0.1 0.1 50 50 50 50 150 150 100 100 100 100 200 200 0.5 0.5 0.5 0.5 0.5 0.5 Resistance Ranges (W) 100 to 100 K (E24, E96) 10 to 97.6 102 k to 1 M (E24, E96) 100 to 100 K (E24, E96) 10 to 97.6 102 k to 1 M (E24, E96) 100 to 100 K (E24, E96) 10 to 97.6 102 k to 1 M (E24, E96) T.C.R. [10-6/uC (ppm/uC)] 50 100 50 100 50 100 Category Temperature Range (Operating Temperature Range) (C) -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 -55 to +125 <1 %> Type (inches) ERJ1G (0201) ERJ2RK (0402) ERJ3EK (0603) ERJ6EN (0805) ERJ8EN (1206) ERJ14N (1210) ERJ12N (1812) ERJ12S (2010) ERJ1TN (2512) (1) (2) Power Rating Limiting Element Maximum Overload Resistance Voltage (Maximum Voltage(2) (V) at 70 C (W) Tolerance (%) RCWV)(1) (V) 0.05 0.063 0.1 0.125 0.25 0.25 0.5 0.5 1 15 50 50 150 200 200 200 200 200 30 100 100 200 400 400 400 400 400 1 1 1 1 1 1 1 1 1 Resistance Ranges (W) 10 to 1 M (E24, E96) 10 to 1 M (E24, E96) 10 to 1 M (E24, E96) 10 to 2.2 M (E24, E96) 10 to 2.2 M (E24, E96) 10 to 1 M (E24, E96) 10 to 1 M (E24, E96) 10 to 1 M (E24, E96) 10 to 1 M (E24, E96) T.C.R. [10-6/uC (ppm/uC)] 200 100 100 100 100 100 100 100 100 Category Temperature Range (Operating Temperature Range) (C) -55 to +125 -55 to +125 -55 to +155 -55 to +155 -55 to +155 -55 to +125 -55 to +125 -55 to +125 -55 to +125 Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= OPower Rating Resistance Values, or Limiting Element Voltage (max. RCWV) listed above, whichever less. Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 Power Rating or max. Overload Voltage listed above whichever less. Rated Load (%) Power Derating Curve For resistors operated in ambient temperatures above 70 C, power rating shall be derated in accordance with the right figure. 55 C 100 80 60 40 20 70 C 3E, 6E, 8E 1G, 2R, 3R, 6R 14, 12, 1T 155 C 125 C 0 40 20 0 20 40 60 80 100 120 140 160 60 180 Ambient Temperature (C) Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or us e. Should a safety concern arise regarding this product, please be sure to contact us immediately. Precision Thick Film Chip Resistors n Packaging Methods (Taping) l Standard Quantity Type ERJ1G ERJ2RH, ERJ2RK ERJ3R1, ERJ3EK ERJ6R1, ERJ6EN ERJ8EN ERJ14N ERJ12N ERJ12S ERJ1TN Embossed Carrier Taping 4000 pcs./reel 4 mm Punched Carrier Taping 5000 pcs./reel Kind of Taping Pressed Carrier Taping Pitch (P1) 2 mm Quantity 15000 pcs./reel 10000 pcs./reel l Carrier Tape P1 P2 P0 (Unit : mm) Pressed Carrier Punched Carrier Embossed Carrier BD 0 F E B T T T A P1 (2 mm pitch) BD 1 (Only Emboss) Type ERJ1G ERJ2RH, ERJ2RK A 0.380.05 0.700.05 0.10 0.15 0.15 B 0.680.05 1.200.05 1.90 2.50 3.60 0.10 0.20 0.20 W F E P1 2.00 0.10 P2 P0 fD0 W T 0.420.05 0.520.05 0.70 0.05 fD1 _ _ _ _ _ 1.0+0.10 -0 ERJ3R1, ERJ3EK 1.10 ERJ6R1, ERJ6EN 1.65 ERJ8EN ERJ14N ERJ12N ERJ12S ERJ1TN 2.00 8.00 0.20 3.500.05 1.75 0.10 2.00 4.000.10 0.05 4.00 0.10 1.50 +0.10 -0 0.840.05 2.800.20 3.500.20 2.800.20 3.600.20 3.500.20 4.800.20 5.300.20 6.900.20 8.000.30 12.000.30 5.500.20 1.000.10 1.5 min. l Taping Reel 6 (Unit : mm) B+ B* B) 9 Type fA ERJ1G ERJ2RH, ERJ2RK ERJ3R1, ERJ3EK ERJ6R1, ERJ6EN ERJ8EN 180.0+0 -3.0 ERJ14N ERJ12N ERJ12S ERJ1TN fB fC W T 9.01.0 60 min. 13.01.0 11.41.0 13.01.0 15.42.0 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or us e. Should a safety concern arise regarding this product, please be sure to contact us immediately. Precision Thick Film Chip Resistors n Recommended Land Pattern In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly. Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In the case of reflow soldering, solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (W). Chip Resistor Type (inches) ERJ1G ERJ2R ERJ3R, 3EK ERJ6R, 6EN ERJ8EN ERJ14N ERJ12N ERJ12S ERJ1TN (0201) (0402) (0603) (0805) (1206) (1210) (1812) (2010) (2512) a b Dimensions (mm) a b c 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 0.7 to 0.9 2 to 2.2 0.8 to 1 1 to 1.4 3.2 to 3.8 0.9 to 1.4 2 to 2.4 4.4 to 5 1.2 to 1.8 2 to 2.4 4.4 to 5 1.8 to 2.8 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 3.6 to 4 6.2 to 7 1.8 to 2.8 5 to 5.4 7.6 to 8.6 2.3 to 3.5 n Recommended Soldering Conditions Recommendations and precautions are described below. l Recommended soldering conditions for reflow aReflow soldering shall be two times maximum. aPlease contact us for additional information when you use in conditions other than those specified. aPlease measure a temperature of terminations and study solderability every kind of solder and board, before actual use. Peak Temperature c For solder (Example : Sn/Pb) Temperature Preheating Main heating Peak 140 C to 160 C Above 200 C 235 5 C Time 60 s to 120 s 30 s to 40 s max. 10 s Preheating Heating For lead-free solder (Example : Sn/Ag/Cu) Temperature Time Preheating Main heating Peak Time 150 C to 180 C Above 230 C max. 260 C 60 s to 120 s 30 s to 40 s max. 10 s l Recommended soldering conditions for flow For solder Temperature Preheating Soldering 140 C to 160 C 2455 C Time 60 s to 120 s 20 s to 30 s For lead-free solder Temperature 150 C to 180 C max. 260 C Time 60 s to 120 s max. 10 s Cautions for Safety The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors shown on page ER3 of this catalog. 1. Take measures against mechanical stress during and after mounting of Precision Thick Film Chip Resistors (hereafter called the Resistors) so as not to damage their electrodes and protective coatings. 2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the Resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the Resistors may be impaired. 3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the Resistors' performance and/or reliability. 4. When soldering with a soldering iron, never touch the Resistors' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish the soldering as quickly as possible (within three seconds at 350 C max.). 5. As the amount of applied solder becomes larger, the mechanical stress applied to the Resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder. 6. Do not apply a shock to the Resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the Resistors' protective coatings and bodies may be chipped, affecting their performance. 7. Avoid excessive bend of printed circuit boards in order to protect the Resistors from abnormal stress. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or us e. Should a safety concern arise regarding this product, please be sure to contact us immediately. Caution for Safety (Common precautions for Fixed Resistors) When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. Do not use the products beyond the specifications described in this catalog. This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ] Systems equipped with a protection circuit and a protection device ] Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use These products are designed and manufactured for general purpose and standard use in general electronic equip ment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. In an environment where strong static electricity or electromagnetic waves exist 5. In an environment where these products cause dew condensation 6. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products . Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the perfor mance or reliability of the products. Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 C to 35 C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight - ER3 - |
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