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Transistors
2SD0968A (2SD968A)
Silicon NPN epitaxial planar type
Unit: mm
For low-frequency driver amplification Complementary to 2SB0789A (2SB789A) Features
* High collector to emitter voltage VCEO * Large collector power dissipation PC * Mini Power type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing
4.50.1 1.60.2 1.50.1
4.0+0.25 -0.20
2.50.1 3
0.40.04
0.40.08 1.50.1 3
1.0+0.1 -0.2
1
3 2 0.50.08
45
Absolute Maximum Ratings Ta = 25C
Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Peak collector current Collector current Collector power dissipation Junction temperature Storage temperature
*
3.00.15
Symbol VCBO VCEO VEBO ICP IC PC Tj Tstg
Rating 120 120 5 1 0.5 1 150 -55 to +150 cm2
Unit V V V A A W C C
1: Base 2: Collector 3: Emitter MiniP3-F1 Package
Marking symbol V
Note) *: Printed circuit board: Copper foil area of 1 or more, and the board thickness of 1.7 mm for the collector portion
Electrical Characteristics Ta = 25C
Parameter Collector to emitter voltage Emitter to base voltage Forward current transfer ratio
*1
Symbol VCEO VEBO hFE1
*2
Conditions IC = 100 A, IB = 0 IE = 10 A, IC = 0 VCE = 10 V, IC = 150 mA VCE = 5 V, IC = 500 mA IC = 500 mA, IB = 50 mA IC = 500 mA, IB = 50 mA VCB = 10 V, IE = -50 mA, f = 200 MHz VCB = 10 V, IE = 0, f = 1 MHz
Min 120 5 130 50
Typ
Max
Unit V V
330 100 0.2 0.85 120 11 20 0.6 1.2 V V MHz pF
hFE2 Collector to emitter saturation voltage *1 Base to emitter saturation voltage *1 Transition frequency Collector output capacitance Note) *1: Pulse measurement *2: hFE Rank classification Rank hFE1 Marking symbol R 130 to 220 VR VCE(sat) VBE(sat) fT Cob
S 185 to 330 VS
Note) The part number in the parenthesis shows conventional part number.
Publication date: June 2002 SJC00202BED
0.4 max.
2.60.1
1
2SD0968A
PC Ta
IB = 20 mA
IC VCE
1.2
18 mA 16 mA 14 mA
IC I B
Ta = 25C 12 mA 10 mA 8 mA 6 mA 4 mA 1.2 VCE = 10 V Ta = 25C 1.0
1.4
Collector power dissipation PC (W)
1.2 1.0 0.8 0.6 0.4 0.2 0
Printed circut board: Copper foil area of 1 cm2 or more, and the board thickness of 1.7 mm for the collector portion
1.0
Collector current IC (A)
0.8
Collector current IC (A)
0.8
0.6
0.6
0.4
2 mA
0.4
0.2
0.2
0
0
20
40
60
80 100 120 140 160
0
2
4
6
8
10
12
0
0
5
10
15
Ambient temperature Ta (C)
Collector to emitter voltage VCE (V)
Base current IB (mA)
VCE(sat) IC
Collector to emitter saturation voltage VCE(sat) (V)
10 3 1 0.3 0.1 0.03 0.01 0.003 0.001 25C -25C Ta = 75C
VBE(sat) IC
100
hFE IC
300 VCE = 10 V
Base to emitter saturation voltage VBE(sat) (V)
IC / IB = 10
IC / IB = 10
Forward current transfer ratio hFE
30 10 3 25C 1 0.3 0.1 0.03 0.01 Ta = -25C 75C
250 Ta = 75C 200 25C -25C
150
100
50
0 1 3 10 30 100 300 1 000
1
3
10
30
100
300
1 000
1
3
10
30
100
300
1 000
Collector current IC (mA)
Collector current IC (mA)
Collector current IC (mA)
fT I E
200 180 VCB = 10 V Ta = 25C 50
Cob VCB
Collector output capacitance Cob (pF)
IE = 0 f = 1 MHz Ta = 25C
Transition frequency fT (MHz)
160 140 120 100 80 60 40 20 0 -1 -2 -3 -5 -10 -20 -30 -50 -100
40
30
20
10
0
1
23
5
10
20 30 50
100
Emitter current IE (mA)
Collector to base voltage VCB (V)
2
SJC00202BED
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL

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