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PIC12C5XX
8-Pin, 8-Bit CMOS Microcontroller
Devices included in this Data Sheet:
* PIC12C508 * PIC12C509 Note: * PIC12C508A * PIC12C509A - EXTRC: External low-cost RC oscillator - XT: Standard crystal/resonator - LP: Power saving, low frequency crystal
Throughout this data sheet PIC12C508(A) refers to the PIC12C508 and PIC12C508A. PIC12C509(A) refers to the PIC12C509 and PIC12C509A. PIC12C5XX refers to the PIC12C508, PIC12C508A, PIC12C509 and PIC12C509A.
CMOS Technology:
* Low power, high speed CMOS EPROM technology * Fully static design * Wide operating voltage range * Wide temperature range: - Commercial: 0C to +70C - Industrial: -40C to +85C - Extended: -40C to +125C * Low power consumption - < 2 mA @ 5V, 4 MHz - 15 A typical @ 3V, 32 KHz - < 1 A typical standby current
High-Performance RISC CPU:
* Only 33 single word instructions to learn * All instructions are single cycle (1 s) except for program branches which are two-cycle * Operating speed: DC - 4 MHz clock input DC - 1 s instruction cycle Device EPROM RAM
PIC12C508 512 x 12 25 PIC12C508A 512 x 12 25 PIC12C509 1024 x 12 41 PIC12C509A 1024 x 12 41 * 12-bit wide instructions * 8-bit wide data path * Seven special function hardware registers * Two-level deep hardware stack * Direct, indirect and relative addressing modes for data and instructions * Internal 4 MHz RC oscillator with programmable calibration * In-circuit serial programming
Pin Diagram
PDIP, SOIC, Windowed Ceramic Side Brazed
VDD GP5/OSC1/CLKIN GP4/OSC2 GP3/MCLR/VPP
1 2 3 4
8 7 6 5
VSS GP0 GP1 GP2/T0CKI
PIC12C508(A) PIC12C509(A)
Peripheral Features:
* 8-bit real time clock/counter (TMR0) with 8-bit programmable prescaler * Power-On Reset (POR) * Device Reset Timer (DRT) * Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation * Programmable code-protection * Power saving SLEEP mode * Wake-up from SLEEP on pin change * Internal weak pull-ups on I/O pins * Internal pull-up on MCLR pin * Selectable oscillator options: - INTRC: Internal 4 MHz RC oscillator
(c) 1998 Microchip Technology Inc.
DS40139D-page 1
PIC12C5XX
Device Differences
Device PIC12C508A PIC12LC508A PIC12C508 PIC12C509A PIC12LC509A PIC12C509 Voltage Range 3.0-5.5 2.5-5.5 2.5-5.5 3.0-5.5 2.5-5.5 2.5-5.5 Oscillator See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 See Note 1 Oscillator Calibration2 (Bits) 6 6 4 6 6 4 Process Technology (Microns) 0.7 0.7 0.9 0.7 0.7 0.9
Note 1: If you change from the PIC12C50X to the PIC12C50XA, please verify oscillator characteristics in your application. Note 2: See Section 7.2.5 for OSCCAL implementation differences.
DS40139D-page 2
(c) 1998 Microchip Technology Inc.
PIC12C5XX
TABLE OF CONTENTS
1.0 General Description......................................................................................................................................................................4 2.0 PIC12C5XX Device Varieties .......................................................................................................................................................7 3.0 Architectural Overview .................................................................................................................................................................9 4.0 Memory Organization ................................................................................................................................................................ 13 5.0 I/O Port ...................................................................................................................................................................................... 21 6.0 Timer0 Module and TMR0 Register .......................................................................................................................................... 23 7.0 Special Features of the CPU..................................................................................................................................................... 27 8.0 Instruction Set Summary ........................................................................................................................................................... 39 9.0 Development Support................................................................................................................................................................ 51 10.0 Electrical Characteristics - PIC12C508/PIC12C509/PIC12LC508/PIC12LC509 ...................................................................... 57 11.0 DC and AC Characteristics - PIC12C508/PIC12C509/PIC12LC508/PIC12LC509................................................................... 73 12.0 Electrical Characteristics - PIC12C508A/PIC12C509A/PIC12LC508A/PIC12LC509A............................................................. 77 13.0 DC and AC Characteristics - PIC12C508A/PIC12C509A/PIC12LC508A/PIC12LC509A ......................................................... 91 14.0 Packaging Information............................................................................................................................................................... 95 INDEX ................................................................................................................................................................................................ 101 PIC12C5XX Product Identification System ........................................................................................................................................ 105
To Our Valued Customers
Most Current Data Sheet
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Errata
An errata sheet may exist for current devices, describing minor operational differences (from the data sheet) and recommended workarounds. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following:
* Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) * The Microchip Corporate Literature Center; U.S. FAX: (602) 786-7277
When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using.
Corrections to this Data Sheet
We constantly strive to improve the quality of all our products and documentation. We have spent a great deal of time to ensure that this document is correct. However, we realize that we may have missed a few things. If you find any information that is missing or appears in error, please:
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We appreciate your assistance in making this a better document.
(c) 1998 Microchip Technology Inc.
DS40139D-page 3
PIC12C5XX
1.0 GENERAL DESCRIPTION
1.1 Applications
The PIC12C5XX from Microchip Technology is a family of low-cost, high performance, 8-bit, fully static, EPROM/ROM-based CMOS microcontrollers. It employs a RISC architecture with only 33 single word/ single cycle instructions. All instructions are single cycle (1 s) except for program branches which take two cycles. The PIC12C5XX delivers performance an order of magnitude higher than its competitors in the same price category. The 12-bit wide instructions are highly symmetrical resulting in 2:1 code compression over other 8-bit microcontrollers in its class. The easy to use and easy to remember instruction set reduces development time significantly. The PIC12C5XX products are equipped with special features that reduce system cost and power requirements. The Power-On Reset (POR) and Device Reset Timer (DRT) eliminate the need for external reset circuitry. There are four oscillator configurations to choose from, including INTRC internal oscillator mode and the power-saving LP (Low Power) oscillator mode. Power saving SLEEP mode, Watchdog Timer and code protection features also improve system cost, power and reliability. The PIC12C5XX are available in the cost-effective One-Time-Programmable (OTP) versions which are suitable for production in any volume. The customer can take full advantage of Microchip's price leadership in OTP microcontrollers while benefiting from the OTP's flexibility. The PIC12C5XX products are supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a `C' compiler, fuzzy logic support tools, a low-cost development programmer, and a full featured programmer. All the tools are supported on IBM(R) PC and compatible machines. The PIC12C5XX series fits perfectly in applications ranging from personal care appliances and security systems to low-power remote transmitters/receivers. The EPROM technology makes customizing application programs (transmitter codes, appliance settings, receiver frequencies, etc.) extremely fast and convenient. The small footprint packages, for through hole or surface mounting, make this microcontroller series perfect for applications with space limitations. Low-cost, low-power, high performance, ease of use and I/O flexibility make the PIC12C5XX series very versatile even in areas where no microcontroller use has been considered before (e.g., timer functions, replacement of "glue" logic and PLD's in larger systems, coprocessor applications).
DS40139D-page 4
(c) 1998 Microchip Technology Inc.
PIC12C5XX
TABLE 1-1: PIC12CXXX & PIC12CEXXX FAMILY OF DEVICES
PIC12C508(A) PIC12C509(A) PIC12CE518 PIC12CE519 PIC12C671 Maximum Frequency of Operation (MHz) EPROM Program Memory RAM Data Memory (bytes) 4 4 4 4 10 PIC12C672 PIC12CE673 PIC12CE674 10 10 10
Clock
512 x 12
1024 x 12
512 x 12
1024 x 12
1024 x 14
2048 x 14
1024 x 14
2048 x 14
Memory
25
41
25
41
128
128
128
128
EEPROM -- Data Memory (bytes) Peripherals Timer Module(s) A/D Converter (8-bit) Channels Wake-up from SLEEP on pin change Interrupt Sources Features I/O Pins Input Pins Internal Pull-ups TMR0 --
--
16
16
--
--
16
16
TMR0 --
TMR0 --
TMR0 --
TMR0 4
TMR0 4
TMR0 4
TMR0 4
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
-- 5 1 Yes
-- 5 1 Yes Yes 5 1 Yes Yes 5 1 Yes Yes
4 5 1 Yes Yes
4 5 1 Yes Yes
4 5 1 Yes Yes
4 5 1 Yes Yes
In-Circuit Yes Serial Programming Number of Instructions Packages 33 8-pin DIP, JW, SOIC
33 8-pin DIP, JW, SOIC
33 8-pin DIP, JW, SOIC
33 8-pin DIP, JW, SOIC
35 8-pin DIP, JW, SOIC
35 8-pin DIP, JW, SOIC
35 8-pin DIP, JW
35 8-pin DIP, JW
All PIC12CXXX & PIC12CEXXX devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability. All PIC12CXXX & PIC12CEXXX devices use serial programming with data pin GP0 and clock pin GP1.
(c) 1998 Microchip Technology Inc.
DS40139D-page 5
PIC12C5XX
NOTES:
DS40139D-page 6
(c) 1998 Microchip Technology Inc.
PIC12C5XX
2.0 PIC12C5XX DEVICE VARIETIES
2.3
A variety of packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in this section. When placing orders, please use the PIC12C5XX Product Identification System at the back of this data sheet to specify the correct part number.
Quick-Turnaround-Production (QTP) Devices
2.1
UV Erasable Devices
The UV erasable version, offered in ceramic side brazed package, is optimal for prototype development and pilot programs. The UV erasable version can be erased and reprogrammed to any of the configuration modes. Note: Please note that erasing the device will also erase the pre-programmed internal calibration value for the internal oscillator. The calibration value must be saved prior to erasing the part.
Microchip offers a QTP Programming Service for factory production orders. This service is made available for users who choose not to program a medium to high quantity of units and whose code patterns have stabilized. The devices are identical to the OTP devices but with all EPROM locations and fuse options already programmed by the factory. Certain code and prototype verification procedures do apply before production shipments are available. Please contact your local Microchip Technology sales office for more details.
2.4
Serialized Quick-Turnaround Production (SQTPSM) Devices
Microchip's PICSTART(R) PLUS and PRO MATE(R) programmers all support programming of the PIC12C5XX. Third party programmers also are available; refer to the Microchip Third Party Guide for a list of sources.
Microchip offers a unique programming service where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random or sequential. Serial programming allows each device to have a unique number which can serve as an entry-code, password or ID number.
2.2
One-Time-Programmable (OTP) Devices
The availability of OTP devices is especially useful for customers who need the flexibility for frequent code updates or small volume applications. The OTP devices, packaged in plastic packages permit the user to program them once. In addition to the program memory, the configuration bits must also be programmed.
(c) 1998 Microchip Technology Inc.
DS40139D-page 7
PIC12C5XX
NOTES:
DS40139D-page 8
(c) 1998 Microchip Technology Inc.
PIC12C5XX
3.0 ARCHITECTURAL OVERVIEW
The high performance of the PIC12C5XX family can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC12C5XX uses a Harvard architecture in which program and data are accessed on separate buses. This improves bandwidth over traditional von Neumann architecture where program and data are fetched on the same bus. Separating program and data memory further allows instructions to be sized differently than the 8-bit wide data word. Instruction opcodes are 12-bits wide making it possible to have all single word instructions. A 12-bit wide program memory access bus fetches a 12-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions. Consequently, all instructions (33) execute in a single cycle (1s @ 4MHz) except for program branches. The table below lists program memory (EPROM) and data memory (RAM) for each PIC12C5XX device. Device PIC12C508 PIC12C508A PIC12C509 PIC12C509A EPROM 512 x 12 512 x 12 1024 x 12 1024 x 12 RAM 25 25 41 41 The PIC12C5XX device contains an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register file. The ALU is 8-bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two's complement in nature. In two-operand instructions, typically one operand is the W (working) register. The other operand is either a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC), and Zero (Z) bits in the STATUS register. The C and DC bits operate as a borrow and digit borrow out bit, respectively, in subtraction. See the SUBWF and ADDWF instructions for examples. A simplified block diagram is shown in Figure 3-1, with the corresponding device pins described in Table 3-1.
The PIC12C5XX can directly or indirectly address its register files and data memory. All special function registers including the program counter are mapped in the data memory. The PIC12C5XX has a highly orthogonal (symmetrical) instruction set that makes it possible to carry out any operation on any register using any addressing mode. This symmetrical nature and lack of `special optimal situations' make programming with the PIC12C5XX simple yet efficient. In addition, the learning curve is reduced significantly.
(c) 1998 Microchip Technology Inc.
DS40139D-page 9
PIC12C5XX
FIGURE 3-1: PIC12C5XX BLOCK DIAGRAM
12 EPROM 512 x 12 or 1024 x 12 Program Memory Program 12 Bus Instruction reg Direct Addr 5 Program Counter 8 GPIO GP0 GP1 GP2/T0CKI GP3/MCLR/Vpp GP4/OSC2 GP5/OSC1/CLKIN
Data Bus
STACK1 STACK2
RAM 25 x 8 or 41 x 8 File Registers RAM Addr 9 Addr MUX 5-7 Indirect Addr
FSR reg 8 3 Device Reset Timer Instruction Decode & Control OSC1/CLKIN OSC2 Timing Generation Power-on Reset Watchdog Timer ALU 8 W reg STATUS reg
MUX
Internal RC OSC
MCLR Vdd, Vss
Timer0
DS40139D-page 10
(c) 1998 Microchip Technology Inc.
PIC12C5XX
TABLE 3-1:
Name GP0
PIC12C5XX PINOUT DESCRIPTION
DIP Pin # 7 SOIC Pin # 7 I/O/P Type I/O Buffer Type Description
TTL/ST Bi-directional I/O port/ serial programming data. Can be software programmed for internal weak pull-up and wake-up from SLEEP on pin change. This buffer is a Schmitt Trigger input when used in serial programming mode. TTL/ST Bi-directional I/O port/ serial programming clock. Can be software programmed for internal weak pull-up and wake-up from SLEEP on pin change. This buffer is a Schmitt Trigger input when used in serial programming mode. ST Bi-directional I/O port. Can be configured as T0CKI. TTL/ST Input port/master clear (reset) input/programming voltage input. When configured as MCLR, this pin is an active low reset to the device. Voltage on MCLR/VPP must not exceed VDD during normal device operation or the device will enter programming mode. Can be software programmed for internal weak pull-up and wake-up from SLEEP on pin change. Weak pull-up always on if configured as MCLR. ST when in MCLR mode. TTL Bi-directional I/O port/oscillator crystal output. Connections to crystal or resonator in crystal oscillator mode (XT and LP modes only, GPIO in other modes).
GP1
6
6
I/O
GP2/T0CKI GP3/MCLR/VPP
5 4
5 4
I/O I
GP4/OSC2
3
3
I/O
GP5/OSC1/CLKIN
2
2
I/O
TTL/ST Bidirectional IO port/oscillator crystal input/external clock source input (GPIO in Internal RC mode only, OSC1 in all other oscillator modes). TTL input when GPIO, ST input in external RC oscillator mode. -- -- Positive supply for logic and I/O pins Ground reference for logic and I/O pins
VDD VSS
1 8
1 8
P P
Legend: I = input, O = output, I/O = input/output, P = power, -- = not used, TTL = TTL input, ST = Schmitt Trigger input
(c) 1998 Microchip Technology Inc.
DS40139D-page 11
PIC12C5XX
3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining
The clock input (OSC1/CLKIN pin) is internally divided by four to generate four non-overlapping quadrature clocks namely Q1, Q2, Q3 and Q4. Internally, the program counter is incremented every Q1, and the instruction is fetched from program memory and latched into instruction register in Q4. It is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow is shown in Figure 3-2 and Example 3-1. An Instruction Cycle consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle while decode and execute takes another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO) then two cycles are required to complete the instruction (Example 3-1). A fetch cycle begins with the program counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3, and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write).
FIGURE 3-2:
CLOCK/INSTRUCTION CYCLE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1 Q1 Q2 Q3 Q4 PC
PC Fetch INST (PC) Execute INST (PC-1) PC+1 PC+2
Internal phase clock
Fetch INST (PC+1) Execute INST (PC)
Fetch INST (PC+2) Execute INST (PC+1)
EXAMPLE 3-1:
1. MOVLW 03H 2. MOVWF GPIO 3. CALL 4. BSF SUB_1
INSTRUCTION PIPELINE FLOW
Fetch 1 Execute 1 Fetch 2 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush Fetch SUB_1 Execute SUB_1
GPIO, BIT1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is "flushed" from the pipeline while the new instruction is being fetched and then executed.
DS40139D-page 12
(c) 1998 Microchip Technology Inc.
PIC12C5XX
4.0 MEMORY ORGANIZATION
FIGURE 4-1:
PIC12C5XX memory is organized into program memory and data memory. For devices with more than 512 bytes of program memory, a paging scheme is used. Program memory pages are accessed using one STATUS register bit. For the PIC12C509(A) with a data memory register file of more than 32 registers, a banking scheme is used. Data memory banks are accessed using the File Select Register (FSR).
PROGRAM MEMORY MAP AND STACK FOR THE PIC12C5XX
PC<11:0> 12 Stack Level 1 Stack Level 2
CALL, RETLW
4.1
Program Memory Organization
Reset Vector (note 1)
0000h
The PIC12C5XX devices have a 12-bit Program Counter (PC) capable of addressing a 2K x 12 program memory space. Only the first 512 x 12 (0000h-01FFh) for the PIC12C508(A) and 1K x 12 (0000h-03FFh) for the PIC12C509(A) are physically implemented. Refer to Figure 4-1. Accessing a location above these boundaries will cause a wrap-around within the first 512 x 12 space (PIC12C508(A)) or 1K x 12 space (PIC12C509(A)). The effective reset vector is at 000h, (see Figure 4-1). Location 01FFh (PIC12C508(A)) or location 03FFh (PIC12C509(A)) contains the internal clock oscillator calibration value. This value should never be overwritten.
User Memory Space
On-chip Program Memory
512 Word (PIC12C508(A))
01FFh 0200h
On-chip Program Memory
1024 Word (PIC12C509(A)) 03FFh
0400h
7FFh
Note 1: Address 0000h becomes the effective reset vector. Location 01FFh (PIC12C508(A)) or location 03FFh (PIC12C509(A)) contains the MOVLW XX INTERNAL RC oscillator calibration value.
(c) 1998 Microchip Technology Inc.
DS40139D-page 13
PIC12C5XX
4.2 Data Memory Organization FIGURE 4-2:
Data memory is composed of registers, or bytes of RAM. Therefore, data memory for a device is specified by its register file. The register file is divided into two functional groups: special function registers and general purpose registers. The special function registers include the TMR0 register, the Program Counter (PC), the Status Register, the I/O registers (ports), and the File Select Register (FSR). In addition, special purpose registers are used to control the I/O port configuration and prescaler options. The general purpose registers are used for data and control information under command of the instructions. For the PIC12C508(A), the register file is composed of 7 special function registers and 25 general purpose registers (Figure 4-2). For the PIC12C509(A), the register file is composed of 7 special function registers, 25 general purpose registers, and 16 general purpose registers that may be addressed using a banking scheme (Figure 4-3). 4.2.1 GENERAL PURPOSE REGISTER FILE
Note 1:
PIC12C508(A) REGISTER FILE MAP
File Address 00h 01h 02h 03h 04h 05h 06h 07h INDF(1) TMR0 PCL STATUS FSR OSCCAL GPIO
General Purpose Registers
1Fh
Not a physical register. See Section 4.8
The general purpose register file is accessed either directly or indirectly through the file select register FSR (Section 4.8).
FIGURE 4-3:
PIC12C509(A) REGISTER FILE MAP
FSR<6:5> File Address 00h 01h 02h 03h 04h 05h 06h 07h General Purpose Registers 0Fh 10h General Purpose Registers 1Fh Bank 0
Note 1:
00 INDF(1) TMR0 PCL STATUS FSR OSCCAL GPIO 20h
01
Addresses map back to addresses in Bank 0.
2Fh 30h General Purpose Registers 3Fh Bank 1
Not a physical register. See Section 4.8
DS40139D-page 14
(c) 1998 Microchip Technology Inc.
PIC12C5XX
4.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers (SFRs) are registers used by the CPU and peripheral functions to control the operation of the device (Table 4-1). The special registers can be classified into two sets. The special function registers associated with the "core" functions are described in this section. Those related to the operation of the peripheral features are described in the section for each peripheral feature.
TABLE 4-1:
SPECIAL FUNCTION REGISTER (SFR) SUMMARY
Value on Power-On Reset --11 1111 1111 1111 xxxx xxxx xxxx xxxx 1111 1111
PA0 TO PD Z DC C
Address
N/A N/A 00h 01h 02h 03h
(1)
Name
TRIS OPTION INDF TMR0 PCL STATUS FSR (12C508/ 12C508A) FSR (12C509/ 12C509A) OSCCAL (12C508/ 12C509) OSCCAL (12C508A/ 12C509A)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on All Other Resets(2) --11 1111 1111 1111 uuuu uuuu uuuu uuuu 1111 1111 q00q quuu(3)
I/O control registers Contains control bits to configure Timer0, Timer0/WDT prescaler, wake-up on change, and weak pull-ups Uses contents of FSR to address data memory (not a physical register) 8-bit real-time clock/counter Low order 8 bits of PC GPWUF --
0001 1xxx
04h
Indirect data memory address pointer
111x xxxx
111u uuuu
04h
Indirect data memory address pointer
110x xxxx
11uu uuuu
05h
CAL3
CAL2
CAL1
CAL0
--
--
--
--
0111 ----
uuuu ----
05h 06h GPIO
CAL5 --
CAL4 --
CAL3 GP5
CAL2 GP4
CAL1 GP3
CAL0 GP2
-- GP1
-- GP0
1000 00---xx xxxx
uuuu uu---uu uuuu
Legend: Shaded boxes = unimplemented or unused, -- = unimplemented, read as '0' (if applicable) x = unknown, u = unchanged, q = see the tables in Section 7.7 for possible values. Note 1: The upper byte of the Program Counter is not directly accessible. See Section 4.6 for an explanation of how to access these bits. 2: Other (non power-up) resets include external reset through MCLR, watchdog timer and wake-up on pin change reset. 3: If reset was due to wake-up on pin change then bit 7 = 1. All other resets will cause bit 7 = 0.
(c) 1998 Microchip Technology Inc.
DS40139D-page 15
PIC12C5XX
4.3 STATUS Register
This register contains the arithmetic status of the ALU, the RESET status, and the page preselect bit for program memories larger than 512 words. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). It is recommended, therefore, that only BCF, BSF and MOVWF instructions be used to alter the STATUS register because these instructions do not affect the Z, DC or C bits from the STATUS register. For other instructions, which do affect STATUS bits, see Instruction Set Summary.
FIGURE 4-4:
R/W-0 GPWUF bit7 bit 7:
STATUS REGISTER (ADDRESS:03h)
R/W-0 PA0 5 R-1 TO 4 R-1 PD 3 R/W-x Z 2 R/W-x DC 1 R/W-x C bit0
R/W-0
--
6
R = Readable bit W = Writable bit - n = Value at POR reset
GPWUF: GPIO reset bit 1 = Reset due to wake-up from SLEEP on pin change 0 = After power up or other reset Unimplemented PA0: Program page preselect bits 1 = Page 1 (200h - 3FFh) - PIC12C509(A) 0 = Page 0 (000h - 1FFh) - PIC12C508(A) and PIC12C509(A) Each page is 512 bytes. Using the PA0 bit as a general purpose read/write bit in devices which do not use it for program page preselect is not recommended since this may affect upward compatibility with future products. TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero DC: Digit carry/borrow bit (for ADDWF and SUBWF instructions) ADDWF 1 = A carry from the 4th low order bit of the result occurred 0 = A carry from the 4th low order bit of the result did not occur SUBWF 1 = A borrow from the 4th low order bit of the result did not occur 0 = A borrow from the 4th low order bit of the result occurred C: Carry/borrow bit (for ADDWF, SUBWF and RRF, RLF instructions) ADDWF SUBWF 1 = A carry occurred 1 = A borrow did not occur 0 = A carry did not occur 0 = A borrow occurred RRF or RLF Load bit with LSB or MSB, respectively
bit 6: bit 5:
bit 4:
bit 3:
bit 2:
bit 1:
bit 0:
DS40139D-page 16
(c) 1998 Microchip Technology Inc.
PIC12C5XX
4.4 OPTION Register
Note: The OPTION register is a 8-bit wide, write-only register which contains various control bits to configure the Timer0/WDT prescaler and Timer0. By executing the OPTION instruction, the contents of the W register will be transferred to the OPTION register. A RESET sets the OPTION<7:0> bits. Note: If TRIS bit is set to `0', the wake-up on change and pull-up functions are disabled for that pin; i.e., note that TRIS overrides OPTION control of GPPU and GPWU. If the T0CS bit is set to `1', GP2 is forced to be an input even if TRIS GP2 = `0'.
FIGURE 4-5:
W-1 GPWU bit7
OPTION REGISTER
W-1 T0CS 5 W-1 T0SE 4 W-1 PSA 3 W-1 PS2 2 W-1 PS1 1 W-1 PS0 bit0
W-1 GPPU 6
W = Writable bit U = Unimplemented bit - n = Value at POR reset Reference Table 4-1 for other resets.
bit 7:
GPWU: Enable wake-up on pin change (GP0, GP1, GP3) 1 = Disabled 0 = Enabled GPPU: Enable weak pull-ups (GP0, GP1, GP3) 1 = Disabled 0 = Enabled T0CS: Timer0 clock source select bit 1 = Transition on T0CKI pin 0 = Transition on internal instruction cycle clock, Fosc/4 T0SE: Timer0 source edge select bit 1 = Increment on high to low transition on the T0CKI pin 0 = Increment on low to high transition on the T0CKI pin PSA: Prescaler assignment bit 1 = Prescaler assigned to the WDT 0 = Prescaler assigned to Timer0 PS2:PS0: Prescaler rate select bits Bit Value 000 001 010 011 100 101 110 111 Timer0 Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 WDT Rate 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128
bit 6:
bit 5:
bit 4:
bit 3:
bit 2-0:
(c) 1998 Microchip Technology Inc.
DS40139D-page 17
PIC12C5XX
4.5 OSCCAL Register
The Oscillator Calibration (OSCCAL) register is used to calibrate the internal 4 MHz oscillator. It contains four to six bits for calibration. Increasing the cal value increases the frequency. See Section 7.2.5 for more information on the internal oscillator.
FIGURE 4-6:
R/W-0 CAL3 bit7
OSCCAL REGISTER (ADDRESS 8Fh)
R/W-1 CAL1 R/W-1 CAL0 R/W-0 -- R/W-0 -- U-0 -- U-0 -- bit0
R/W-1 CAL2
R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset
bit 7-4: CAL<3:0>: Calibration bit 3-0: Unimplemented: Read as '0'
FIGURE 4-7:
R/W-1 CAL5 bit7
OSCCAL REGISTER (ADDRESS 8Fh)PIC12C508A/C509A
R/W-0 CAL3 R/W-0 CAL2 R/W-0 CAL1 R/W-0 CAL0 U-0 -- U-0 -- bit0
R/W-0 CAL4
R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR reset
bit 7-2: CAL<5:0>: Calibration bit 1-0: Unimplemented: Read as '0'
DS40139D-page 18
(c) 1998 Microchip Technology Inc.
PIC12C5XX
4.6 Program Counter
4.6.1 EFFECTS OF RESET As a program instruction is executed, the Program Counter (PC) will contain the address of the next program instruction to be executed. The PC value is increased by one every instruction cycle, unless an instruction changes the PC. For a GOTO instruction, bits 8:0 of the PC are provided by the GOTO instruction word. The PC Latch (PCL) is mapped to PC<7:0>. Bit 5 of the STATUS register provides page information to bit 9 of the PC (Figure 48). For a CALL instruction, or any instruction where the PCL is the destination, bits 7:0 of the PC again are provided by the instruction word. However, PC<8> does not come from the instruction word, but is always cleared (Figure 4-8). Instructions where the PCL is the destination, or Modify PCL instructions, include MOVWF PC, ADDWF PC, and BSF PC,5. Note: Because PC<8> is cleared in the CALL instruction, or any Modify PCL instruction, all subroutine calls or computed jumps are limited to the first 256 locations of any program memory page (512 words long). The Program Counter is set upon a RESET, which means that the PC addresses the last location in the last page i.e., the oscillator calibration instruction. After executing MOVLW XX, the PC will roll over to location 00h, and begin executing user code. The STATUS register page preselect bits are cleared upon a RESET, which means that page 0 is preselected. Therefore, upon a RESET, a GOTO instruction will automatically cause the program to jump to page 0 until the value of the page bits is altered.
4.7
Stack
PIC12C5XX devices have a 12-bit wide L.I.F.O. hardware push/pop stack. A CALL instruction will push the current value of stack 1 into stack 2 and then push the current program counter value, incremented by one, into stack level 1. If more than two sequential CALL are executed, only 's the most recent two return addresses are stored. A RETLW instruction will pop the contents of stack level 1 into the program counter and then copy stack level 2 contents into level 1. If more than two sequential RETLW's are executed, the stack will be filled with the address previously stored in level 2. Note that the W register will be loaded with the literal value specified in the instruction. This is particularly useful for the implementation of data look-up tables within the program memory. Upon any reset, the contents of the stack remain unchanged, however the program counter (PCL) will also be reset to 0. Note 1: There are no STATUS bits to indicate stack overflows or stack underflow conditions. Note 2: There are no instructions mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL and RETLW instructions.
FIGURE 4-8:
LOADING OF PC BRANCH INSTRUCTIONS PIC12C5XX
GOTO Instruction
11 10 PC 9 87 PCL 0
Instruction Word PA0 7 0
STATUS
CALL or Modify PCL Instruction
11 10 PC 9 87 PCL 0
Instruction Word Reset to `0' PA0 7 0
STATUS
(c) 1998 Microchip Technology Inc.
DS40139D-page 19
PIC12C5XX
4.8 Indirect Data Addressing; INDF and FSR Registers EXAMPLE 4-2: HOW TO CLEAR RAM USING INDIRECT ADDRESSING
0x10 FSR INDF FSR,F FSR,4 NEXT ;initialize pointer ; to RAM ;clear INDF register ;inc pointer ;all done? ;NO, clear next ;YES, continue
The INDF register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR register (FSR is a pointer). This is indirect addressing.
NEXT
EXAMPLE 4-1:
* * * *
INDIRECT ADDRESSING
movlw movwf clrf incf btfsc goto :
Register file 07 contains the value 10h Register file 08 contains the value 0Ah Load the value 07 into the FSR register A read of the INDF register will return the value of 10h * Increment the value of the FSR register by one (FSR = 08) * A read of the INDR register now will return the value of 0Ah. Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF register indirectly results in a no-operation (although STATUS bits may be affected). A simple program to clear RAM locations 10h-1Fh using indirect addressing is shown in Example 4-2.
CONTINUE
The FSR is a 5-bit wide register. It is used in conjunction with the INDF register to indirectly address the data memory area. The FSR<4:0> bits are used to select data memory addresses 00h to 1Fh. PIC12C508(A): Does not use banking. FSR<7:5> are unimplemented and read as '1's. PIC12C509(A): Uses FSR<5>. Selects between bank 0 and bank 1. FSR<7:6> is unimplemented, read as '1' .
FIGURE 4-9:
DIRECT/INDIRECT ADDRESSING
Direct Addressing (FSR) 65 4 (opcode) 0 6 Indirect Addressing 5 4 (FSR) 0
bank select
location select 00 00h Addresses map back to addresses in Bank 0. Data Memory(1) 0Fh 10h 01
bank
location select
1Fh Bank 0
3Fh Bank 1(2)
Note 1: For register map detail see Section 4.2. Note 2: PIC12C509(A) only
DS40139D-page 20
(c) 1998 Microchip Technology Inc.
PIC12C5XX
5.0 I/O PORT
5.3 I/O Interfacing
As with any other register, the I/O register can be written and read under program control. However, read instructions (e.g., MOVF GPIO,W) always read the I/O pins independent of the pin's input/output modes. On RESET, all I/O ports are defined as input (inputs are at hi-impedance) since the I/O control registers are all set. The equivalent circuit for an I/O port pin is shown in Figure 5-1. All port pins, except GP3 which is input only, may be used for both input and output operations. For input operations these ports are nonlatching. Any input must be present until read by an input instruction (e.g., MOVF GPIO,W). The outputs are latched and remain unchanged until the output latch is rewritten. To use a port pin as output, the corresponding direction control bit in TRIS must be cleared (= 0). For use as an input, the corresponding TRIS bit must be set. Any I/O pin (except GP3) can be programmed individually as input or output.
5.1
GPIO
GPIO is an 8-bit I/O register. Only the low order 6 bits are used (GP5:GP0). Bits 7 and 6 are unimplemented and read as '0's. Please note that GP3 is an input only pin. The configuration word can set several I/O's to alternate functions. When acting as alternate functions the pins will read as `0' during port read. Pins GP0, GP1, and GP3 can be configured with weak pull-ups and also with wake-up on change. The wake-up on change and weak pull-up functions are not pin selectable. If pin 4 is configured as MCLR, weak pullup is always on and wake-up on change for this pin is not enabled.
FIGURE 5-1:
Data Bus D WR Port
EQUIVALENT CIRCUIT FOR A SINGLE I/O PIN
Q Data Latch CK Q VDD P
5.2
TRIS Register
The output driver control register is loaded with the contents of the W register by executing the TRIS f instruction. A '1' from a TRIS register bit puts the corresponding output driver in a hi-impedance mode. A '0' puts the contents of the output data latch on the selected pins, enabling the output buffer. The exceptions are GP3 which is input only and GP2 which may be controlled by the option register, see Figure 45. Note: A read of the ports reads the pins, not the output data latches. That is, if an output driver on a pin is enabled and driven high, but the external system is holding it low, a read of the port will indicate that the pin is low.
W Reg
N D TRIS Latch Q VSS Q
I/O pin(1)
TRIS `f'
CK
Reset
(2)
RD Port Note 1: I/O pins have protection diodes to VDD and VSS. 2: See Table 3-1 for buffer type.
The TRIS registers are "write-only" and are set (output drivers disabled) upon RESET.
TABLE 5-1:
SUMMARY OF PORT REGISTERS
Value on Power-On Reset --11 1111 T0CS PAO GP5 T0SE TO GP4 PSA PD GP3 PS2 Z GP2 PS1 DC GP1 PS0 C GP0 1111 1111 0001 1xxx --xx xxxx
Address N/A N/A 03H 06h
Name TRIS OPTION STATUS GPIO
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on All Other Resets --11 1111 1111 1111 q00q quuu(1) --uu uuuu
I/O control registers GPWU GPWUF -- GPPU -- --
Legend: Shaded cells not used by Port Registers, read as `0', -- = unimplemented, read as '0', x = unknown, u = unchanged, q = see tables in Section 7.7 for possible values. Note 1: If reset was due to wake-up on change, then bit 7 = 1. All other resets will cause bit 7 = 0.
(c) 1998 Microchip Technology Inc.
DS40139D-page 21
PIC12C5XX
5.4
5.4.1
I/O Programming Considerations
BI-DIRECTIONAL I/O PORTS
EXAMPLE 5-1:
READ-MODIFY-WRITE INSTRUCTIONS ON AN I/O PORT
Some instructions operate internally as read followed by write operations. The BCF and BSF instructions, for example, read the entire port into the CPU, execute the bit operation and re-write the result. Caution must be used when these instructions are applied to a port where one or more pins are used as input/outputs. For example, a BSF operation on bit5 of GPIO will cause all eight bits of GPIO to be read into the CPU, bit5 to be set and the GPIO value to be written to the output latches. If another bit of GPIO is used as a bidirectional I/O pin (say bit0) and it is defined as an input at this time, the input signal present on the pin itself would be read into the CPU and rewritten to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the input mode, no problem occurs. However, if bit0 is switched into output mode later on, the content of the data latch may now be unknown. Example 5-1 shows the effect of two sequential readmodify-write instructions (e.g., BCF, BSF, etc.) on an I/ O port. A pin actively outputting a high or a low should not be driven from external devices at the same time in order to change the level on this pin ("wired-or", "wired-and"). The resulting high output currents may damage the chip.
;Initial GPIO Settings ; GPIO<5:3> Inputs ; GPIO<2:0> Outputs ; ; GPIO latch GPIO pins ; ---------- ---------BCF GPIO, 5 ;--01 -ppp --11 pppp BCF GPIO, 4 ;--10 -ppp --11 pppp MOVLW 007h ; TRIS GPIO ;--10 -ppp --11 pppp ; ;Note that the user may have expected the pin ;values to be --00 pppp. The 2nd BCF caused ;GP5 to be latched as the pin value (High).
5.4.2
SUCCESSIVE OPERATIONS ON I/O PORTS
The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 5-2). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should allow the pin voltage to stabilize (load dependent) before the next instruction, which causes that file to be read into the CPU, is executed. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port.
FIGURE 5-2:
SUCCESSIVE I/O OPERATION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC Instruction fetched GP5:GP0 Port pin written here Instruction executed MOVWF GPIO (Write to GPIO) Port pin sampled here MOVF GPIO,W (Read GPIO) NOP MOVWF GPIO PC + 1 MOVF GPIO,W PC + 2 NOP PC + 3 NOP
This example shows a write to GPIO followed by a read from GPIO. Data setup time = (0.25 TCY - TPD) where: TCY = instruction cycle. TPD = propagation delay Therefore, at higher clock frequencies, a write followed by a read may be problematic.
DS40139D-page 22
(c) 1998 Microchip Technology Inc.
PIC12C5XX
6.0 TIMER0 MODULE AND TMR0 REGISTER
Counter mode is selected by setting the T0CS bit (OPTION<5>). In this mode, Timer0 will increment either on every rising or falling edge of pin T0CKI. The T0SE bit (OPTION<4>) determines the source edge. Clearing the T0SE bit selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 6.1. The prescaler may be used by either the Timer0 module or the Watchdog Timer, but not both. The prescaler assignment is controlled in software by the control bit PSA (OPTION<3>). Clearing the PSA bit will assign the prescaler to Timer0. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4,..., 1:256 are selectable. Section 6.2 details the operation of the prescaler. A summary of registers associated with the Timer0 module is found in Table 6-1.
The Timer0 module has the following features: * 8-bit timer/counter register, TMR0 - Readable and writable * 8-bit software programmable prescaler * Internal or external clock select - Edge select for external clock Figure 6-1 is a simplified block diagram of the Timer0 module. Timer mode is selected by clearing the T0CS bit (OPTION<5>). In timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If TMR0 register is written, the increment is inhibited for the following two instruction cycles (Figure 6-2 and Figure 6-3). The user can work around this by writing an adjusted value to the TMR0 register.
FIGURE 6-1:
GP2/T0CKI Pin
TIMER0 BLOCK DIAGRAM
Data bus FOSC/4 0 1 1 Programmable Prescaler(2) 0 PSout Sync with Internal Clocks 8 TMR0 reg
T0SE 3 T0CS(1) PS2, PS1, PS0(1) PSA(1)
PSout (2 TCY delay) Sync
Note 1: Bits T0CS, T0SE, PSA, PS2, PS1 and PS0 are located in the OPTION register. 2: The prescaler is shared with the Watchdog Timer (Figure 6-5).
(c) 1998 Microchip Technology Inc.
DS40139D-page 23
PIC12C5XX
FIGURE 6-2:
PC (Program Counter) Instruction Fetch
TIMER0 TIMING: INTERNAL CLOCK/NO PRESCALE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC-1 PC MOVWF TMR0 PC+1 MOVF TMR0,W PC+2 MOVF TMR0,W PC+3 MOVF TMR0,W PC+4 MOVF TMR0,W PC+5 MOVF TMR0,W PC+6
Timer0 Instruction Executed
T0
T0+1
T0+2
NT0
NT0+1
NT0+2
Write TMR0 executed
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0 + 1
Read TMR0 reads NT0 + 2
FIGURE 6-3:
PC (Program Counter) Instruction Fetch Timer0 T0
TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC-1 PC MOVWF TMR0 PC+1 MOVF TMR0,W PC+2 MOVF TMR0,W PC+3 MOVF TMR0,W PC+4 MOVF TMR0,W PC+5 MOVF TMR0,W PC+6
T0+1
NT0
NT0+1
T0
Instruction Execute
Write TMR0 executed
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0
Read TMR0 reads NT0 + 1
TABLE 6-1:
REGISTERS ASSOCIATED WITH TIMER0
Value on Power-On Reset Value on All Other Resets
Address 01h N/A N/A
Name TMR0 OPTION TRIS
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Timer0 - 8-bit real-time clock/counter GPWU -- GPPU -- T0CS GP5 T0SE GP4 PSA GP3 PS2 GP2 PS1 GP1 PS0 GP0
xxxx xxxx 1111 1111 --11 1111
uuuu uuuu 1111 1111 --11 1111
Legend: Shaded cells not used by Timer0, - = unimplemented, x = unknown, u = unchanged,
DS40139D-page 24
(c) 1998 Microchip Technology Inc.
PIC12C5XX
6.1 Using Timer0 with an External Clock
When an external clock input is used for Timer0, it must meet certain requirements. The external clock requirement is due to internal phase clock (TOSC) synchronization. Also, there is a delay in the actual incrementing of Timer0 after synchronization. 6.1.1 EXTERNAL CLOCK SYNCHRONIZATION When a prescaler is used, the external clock input is divided by the asynchronous ripple counter-type prescaler so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4TOSC (and a small RC delay of 40 ns) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of 10 ns. Refer to parameters 40, 41 and 42 in the electrical specification of the desired device. 6.1.2 TIMER0 INCREMENT DELAY
When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 6-4). Therefore, it is necessary for T0CKI to be high for at least 2TOSC (and a small RC delay of 20 ns) and low for at least 2TOSC (and a small RC delay of 20 ns). Refer to the electrical specification of the desired device.
Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the Timer0 module is actually incremented. Figure 6-4 shows the delay from the external clock edge to the timer incrementing. 6.1.3 OPTION REGISTER EFFECT ON GP2 TRIS
If the option register is set to read TIMER0 from the pin, the port is forced to an input regardless of the TRIS register setting.
FIGURE 6-4:
TIMER0 TIMING WITH EXTERNAL CLOCK
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Small pulse misses sampling
External Clock Input or Prescaler Output (2) (1) External Clock/Prescaler Output After Sampling Increment Timer0 (Q4) Timer0 T0 T0 + 1 (3)
T0 + 2
Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc). Therefore, the error in measuring the interval between two edges on Timer0 input = 4Tosc max. 2: External clock if no prescaler selected, Prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs.
(c) 1998 Microchip Technology Inc.
DS40139D-page 25
PIC12C5XX
6.2 Prescaler EXAMPLE 6-1:
An 8-bit counter is available as a prescaler for the Timer0 module, or as a postscaler for the Watchdog Timer (WDT), respectively (Section 7.6). For simplicity, this counter is being referred to as "prescaler" throughout this data sheet. Note that the prescaler may be used by either the Timer0 module or the WDT, but not both. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the WDT, and vice-versa. The PSA and PS2:PS0 bits (OPTION<3:0>) determine prescaler assignment and prescale ratio. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1,x, etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. The prescaler is neither readable nor writable. On a RESET, the prescaler contains all '0's. 6.2.1 SWITCHING PRESCALER ASSIGNMENT
OPTION
CHANGING PRESCALER (TIMER0WDT)
;Clear WDT ;Clear TMR0 & Prescaler ;These 3 lines (5, 6, 7) ; are required only if ; desired 5.CLRWDT ;PS<2:0> are 000 or 001 6.MOVLW '00xx1xxx'b ;Set Postscaler to 7.OPTION ; desired WDT rate
1.CLRWDT 2.CLRF TMR0 3.MOVLW '00xx1111'b 4.OPTION
To change prescaler from the WDT to the Timer0 module, use the sequence shown in Example 6-2. This sequence must be used even if the WDT is disabled. A CLRWDT instruction should be executed before switching the prescaler.
EXAMPLE 6-2:
CLRWDT MOVLW
CHANGING PRESCALER (WDTTIMER0)
;Clear WDT and ;prescaler ;Select TMR0, new ;prescale value and ;clock source
'xxxx0xxx'
The prescaler assignment is fully under software control (i.e., it can be changed "on the fly" during program execution). To avoid an unintended device RESET, the following instruction sequence (Example 6-1) must be executed when changing the prescaler assignment from Timer0 to the WDT.
FIGURE 6-5:
BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
Data Bus
TCY ( = Fosc/4) 0 1 M U X 1 0 T0SE M U X Sync 2 Cycles TMR0 reg 8
GP2/T0CKI Pin
T0CS
PSA
0 M U X
8-bit Prescaler 8 8 - to - 1MUX PS2:PS0
Watchdog Timer
1
PSA WDT Enable bit 0 MUX 1 PSA
WDT Time-Out Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register.
DS40139D-page 26
(c) 1998 Microchip Technology Inc.
PIC12C5XX
7.0 SPECIAL FEATURES OF THE CPU
The PIC12C5XX has a Watchdog Timer which can be shut off only through configuration bit WDTE. It runs off of its own RC oscillator for added reliability. If using XT or LP selectable oscillator options, there is always an 18 ms (nominal) delay provided by the Device Reset Timer (DRT), intended to keep the chip in reset until the crystal oscillator is stable. If using INTRC or EXTRC there is an 18 ms delay only on VDD power-up. With this timer on-chip, most applications need no external reset circuitry. The SLEEP mode is designed to offer a very low current power-down mode. The user can wake-up from SLEEP through a change on input pins or through a Watchdog Timer time-out. Several oscillator options are also made available to allow the part to fit the application, including an internal 4 MHz oscillator. The EXTRC oscillator option saves system cost while the LP crystal option saves power. A set of configuration bits are used to select various options.
What sets a microcontroller apart from other processors are special circuits to deal with the needs of real-time applications. The PIC12C5XX family of microcontrollers has a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide power saving operating modes and offer code protection. These features are: * Oscillator selection * Reset - Power-On Reset (POR) - Device Reset Timer (DRT) - Wake-up from SLEEP on pin change * Watchdog Timer (WDT) * SLEEP * Code protection * ID locations * In-circuit Serial Programming
7.1
Configuration Bits
The PIC12C5XX configuration word consists of 12 bits. Configuration bits can be programmed to select various device configurations. Two bits are for the selection of the oscillator type, one bit is the Watchdog Timer enable bit, and one bit is the MCLR enable bit.
FIGURE 7-1:
-- bit11 bit 4: -- 10
CONFIGURATION WORD FOR PIC12C5XX
-- 9 -- 8 -- 7 -- 6 -- 5 MCLRE 4 CP 3 WDTE FOSC1 FOSC0 2 1 bit0 Register: Address(1): CONFIG FFFh
bit 11-5: Unimplemented MCLRE: MCLR enable bit. 1 = MCLR pin enabled 0 = MCLR tied to VDD, (Internally) CP: Code protection bit. 1 = Code protection off 0 = Code protection on WDTE: Watchdog timer enable bit 1 = WDT enabled 0 = WDT disabled FOSC1:FOSC0: Oscillator selection bits 11 = EXTRC - external RC oscillator 10 = INTRC - internal RC oscillator 01 = XT oscillator 00 = LP oscillator
bit 3:
bit 2:
bit 1-0:
Note 1: Refer to the PIC12C5XX Programming Specifications to determine how to access the configuration word. This register is not user addressable during device operation.
(c) 1998 Microchip Technology Inc.
DS40139D-page 27
PIC12C5XX
7.2
7.2.1
Oscillator Configurations
OSCILLATOR TYPES
TABLE 7-1:
CAPACITOR SELECTION FOR CERAMIC RESONATORS - PIC12C5XX
Cap. Range C1 Cap. Range C2
The PIC12C5XX can be operated in four different oscillator modes. The user can program two configuration bits (FOSC1:FOSC0) to select one of these four modes: * * * * LP: XT: INTRC: EXTRC: Low Power Crystal Crystal/Resonator Internal 4 MHz Oscillator External Resistor/Capacitor
Osc Type
Resonator Freq
XT 4.0 MHz 30 pF 30 pF These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components.
TABLE 7-2:
7.2.2
CRYSTAL OSCILLATOR / CERAMIC RESONATORS Osc Type LP XT
CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR - PIC12C5XX
Cap.Range C1 Cap. Range C2
In XT or LP modes, a crystal or ceramic resonator is connected to the GP5/OSC1/CLKIN and GP4/OSC2 pins to establish oscillation (Figure 7-2). The PIC12C5XX oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in XT or LP modes, the device can have an external clock source drive the GP5/ OSC1/CLKIN pin (Figure 7-3).
Resonator Freq
FIGURE 7-2:
CRYSTAL OPERATION (OR CERAMIC RESONATOR) (XT OR LP OSC CONFIGURATION)
OSC1
15 pF 15 pF 32 kHz(1) 200 kHz 47-68 pF 47-68 pF 1 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF Note 1: For VDD > 4.5V, C1 = C2 30 pF is recommended. These values are for design guidance only. Rs may be required to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components.
C1(1)
PIC12C5XX
SLEEP
XTAL RS(2) C2(1) OSC2
RF(3)
To internal logic
Note 1: See Capacitor Selection tables for recommended values of C1 and C2. 2: A series resistor (RS) may be required for AT strip cut crystals. 3: RF approximate value = 10 M.
FIGURE 7-3:
EXTERNAL CLOCK INPUT OPERATION (XT OR LP OSC CONFIGURATION)
OSC1 PIC12C5XX
Clock from ext. system Open
OSC2
DS40139D-page 28
(c) 1998 Microchip Technology Inc.
PIC12C5XX
7.2.3 EXTERNAL CRYSTAL OSCILLATOR CIRCUIT 7.2.4 EXTERNAL RC OSCILLATOR For timing insensitive applications, the RC device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (Rext) and capacitor (Cext) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low Cext values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 7-6 shows how the R/C combination is connected to the PIC12C5XX. For Rext values below 2.2 k, the oscillator operation may become unstable, or stop completely. For very high Rext values (e.g., 1 M) the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend keeping Rext between 3 k and 100 k. Although the oscillator will operate with no external capacitor (Cext = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no or small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or package lead frame capacitance. The Electrical Specifications sections show RC frequency variation from part to part due to normal process variation. The variation is larger for larger R (since leakage current variation will affect RC frequency more for large R) and for smaller C (since variation of input capacitance will affect RC frequency more). Also, see the Electrical Specifications sections for variation of oscillator frequency due to VDD for given Rext/Cext values as well as frequency variation due to operating temperature for given R, C, and VDD values.
Either a prepackaged oscillator or a simple oscillator circuit with TTL gates can be used as an external crystal oscillator circuit. Prepackaged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used: one with parallel resonance, or one with series resonance. Figure 7-4 shows implementation of a parallel resonant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180-degree phase shift that a parallel oscillator requires. The 4.7 k resistor provides the negative feedback for stability. The 10 k potentiometers bias the 74AS04 in the linear region. This circuit could be used for external oscillator designs.
FIGURE 7-4:
EXTERNAL PARALLEL RESONANT CRYSTAL OSCILLATOR CIRCUIT
To Other Devices
+5V 10k 4.7k 74AS04 74AS04 PIC12C5XX CLKIN
10k XTAL 10k 20 pF 20 pF
Figure 7-5 shows a series resonant oscillator circuit. This circuit is also designed to use the fundamental frequency of the crystal. The inverter performs a 180degree phase shift in a series resonant oscillator circuit. The 330 resistors provide the negative feedback to bias the inverters in their linear region.
FIGURE 7-6:
VDD Rext
EXTERNAL RC OSCILLATOR MODE
FIGURE 7-5:
EXTERNAL SERIES RESONANT CRYSTAL OSCILLATOR CIRCUIT
330 74AS04 74AS04 CLKIN To Other Devices PIC12C5XX
OSC1 N
Internal clock
Cext VSS
330 74AS04 0.1 F XTAL
PIC12C5XX
(c) 1998 Microchip Technology Inc.
DS40139D-page 29
PIC12C5XX
7.2.5 INTERNAL 4 MHz RC OSCILLATOR The internal RC oscillator provides a fixed 4 MHz (nominal) system clock at VDD = 5V and 25C, see "Electrical Specifications" section for information on variation over voltage and temperature.. In addition, a calibration instruction is programmed into the top of memory which contains the calibration value for the internal RC oscillator. This location is never code protected regardless of the code protect settings. This value is programmed as a MOVLW XX instruction where XX is the calibration value, and is placed at the reset vector. This will load the W register with the calibration value upon reset and the PC will then roll over to the users program at address 0x000. The user then has the option of writing the value to the OSCCAL Register (05h) or ignoring it. OSCCAL, when written to with the calibration value, will "trim" the internal oscillator to remove process variation from the oscillator frequency. . Note: Please note that erasing the device will also erase the pre-programmed internal calibration value for the internal oscillator. The calibration value must be read prior to erasing the part. so it can be reprogrammed correctly later. are TO, PD, and GPWUF bits. They are set or cleared differently in different reset situations. These bits are used in software to determine the nature of reset. See Table 7-3 for a full description of reset states of all registers.
For the PIC12C508A and PIC12C509A, bits <7:2>, CAL5-CAL0 are used for calibration. Adjusting CAL50 from 000000 to 111111 yields a higher clock speed. Note that bits 1 and 0 of OSCCAL are unimplemented and should be written as 0 when modifying OSCCAL for compatibility with future devices. For the PIC12C508 and PIC12C509, the lower 4 bits of the register are used. Writing a larger value in this location yields a higher clock speed.
7.3
RESET
The device differentiates between various kinds of reset: a) Power on reset (POR) b) MCLR reset during normal operation c) MCLR reset during SLEEP d) WDT time-out reset during normal operation e) WDT time-out reset during SLEEP f) Wake-up from SLEEP on pin change Some registers are not reset in any way; they are unknown on POR and unchanged in any other reset. Most other registers are reset to "reset state" on poweron reset (POR), MCLR, WDT or wake-up on pin change reset during normal operation. They are not affected by a WDT reset during SLEEP or MCLR reset during SLEEP, since these resets are viewed as resumption of normal operation. The exceptions to this
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(c) 1998 Microchip Technology Inc.
PIC12C5XX
TABLE 7-3: RESET CONDITIONS FOR REGISTERS
Address -- -- 00h 01h 02h 03h 04h 04h 05h 05h 06h -- -- Power-on Reset qqqq xxxx (1) qqqq qqxx (1) xxxx xxxx xxxx xxxx 1111 1111 0001 1xxx 111x xxxx 110x xxxx 0111 ---1000 00---xx xxxx 1111 1111 --11 1111 MCLR Reset WDT time-out Wake-up on Pin Change qqqq uuuu (1) qqqq qquu (1) uuuu uuuu uuuu uuuu 1111 1111 q00q quuu (2,3) 111u uuuu 11uu uuuu uuuu ---uuuu uu---uu uuuu 1111 1111 --11 1111
Register W (PIC12C508/509) W (PIC12C508A/509A) INDF TMR0 PC STATUS FSR (12C508/12C508A) FSR (12C509/12C509A) OSCCAL(12C508/509) OSCCAL(12C508A/509A) GPIO OPTION TRIS Note 1: Note 2: Note 3:
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0', q = value depends on condition. Bits <7:2> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory. See Table 7-7 for reset value for specific conditions If reset was due to wake-up on pin change, then bit 7 = 1. All other resets will cause bit 7 = 0.
TABLE 7-4:
RESET CONDITION FOR SPECIAL REGISTERS
STATUS Addr: 03h PCL Addr: 02h 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111 1111
Power on reset MCLR reset during normal operation MCLR reset during SLEEP WDT reset during SLEEP WDT reset normal operation Wake-up from SLEEP on pin change
0001 1xxx 000u uuuu 0001 0uuu 0000 0uuu 0000 uuuu 1001 0uuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as `0'.
(c) 1998 Microchip Technology Inc.
DS40139D-page 31
PIC12C5XX
7.3.1 MCLR ENABLE This configuration bit when unprogrammed (left in the `1' state) enables the external MCLR function. When programmed, the MCLR function is tied to the internal VDD, and the pin is assigned to be a GPIO. See Figure 7-7. When pin GP3/MCLR/VPP is configured as MCLR, the internal pull-up is always on. The Power-On Reset circuit and the Device Reset Timer (Section 7.5) circuit are closely related. On power-up, the reset latch is set and the DRT is reset. The DRT timer begins counting once it detects MCLR to be high. After the time-out period, which is typically 18 ms, it will reset the reset latch and thus end the onchip reset signal. A power-up example where MCLR is held low is shown in Figure 7-9. VDD is allowed to rise and stabilize before bringing MCLR high. The chip will actually come out of reset TDRT msec after MCLR goes high. In Figure 7-10, the on-chip Power-On Reset feature is being used (MCLR and VDD are tied together or the pin is programmed to be GP3.). The VDD is stable before the start-up timer times out and there is no problem in getting a proper reset. However, Figure 711 depicts a problem situation where VDD rises too slowly. The time between when the DRT senses that MCLR is high and when MCLR (and VDD) actually reach their full value, is too long. In this situation, when the start-up timer times out, VDD has not reached the VDD (min) value and the chip is, therefore, not guaranteed to function correctly. For such situations, we recommend that external RC circuits be used to achieve longer POR delay times (Figure 7-10). Note: When the device starts normal operation (exits the reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be meet to ensure operation. If these conditions are not met, the device must be held in reset until the operating conditions are met.
FIGURE 7-7:
MCLR SELECT
MCLRE WEAK PULL-UP GP3/MCLR/VPP INTERNAL MCLR
7.4
Power-On Reset (POR)
The PIC12C5XX family incorporates on-chip PowerOn Reset (POR) circuitry which provides an internal chip reset for most power-up situations. The on-chip POR circuit holds the chip in reset until VDD has reached a high enough level for proper operation. To take advantage of the internal POR, program the GP3/MCLR/VPP pin as MCLR and tie thru a resistor to VDD or program the pin as GP3. An internal weak pull-up resistor is implemented using a transistor. Refer to Table 10-1 for the pull-up resistor ranges. This will eliminate external RC components usually needed to create a Power-on Reset. A maximum rise time for VDD is specified. See Electrical Specifications for details. When the device starts normal operation (exits the reset condition), device operating parameters (voltage, frequency, temperature, ...) must be met to ensure operation. If these conditions are not met, the device must be held in reset until the operating parameters are met. A simplified block diagram of the on-chip Power-On Reset circuit is shown in Figure 7-8.
For additional information refer to Application Notes "Power-Up Considerations" - AN522 and "Power-up Trouble Shooting" - AN607.
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(c) 1998 Microchip Technology Inc.
PIC12C5XX
FIGURE 7-8: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Power-Up Detect VDD POR (Power-On Reset) Pin Change SLEEP GP3/MCLR/VPP Wake-up on pin change
WDT Time-out MCLRE 8-bit Asynch Ripple Counter (Start-Up Timer) RESET On-Chip DRT OSC
S
Q
R
Q
CHIP RESET
FIGURE 7-9:
TIME-OUT SEQUENCE ON POWER-UP (MCLR PULLED LOW)
VDD MCLR INTERNAL POR TDRT
DRT TIME-OUT INTERNAL RESET
FIGURE 7-10: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): FAST VDD RISE TIME
VDD MCLR INTERNAL POR TDRT
DRT TIME-OUT
INTERNAL RESET
(c) 1998 Microchip Technology Inc.
DS40139D-page 33
PIC12C5XX
FIGURE 7-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD): SLOW VDD RISE TIME
V1 VDD MCLR INTERNAL POR TDRT
DRT TIME-OUT
INTERNAL RESET When VDD rises slowly, the TDRT time-out expires long before VDD has reached its final value. In this example, the chip will reset properly if, and only if, V1 VDD min.
7.5
Device Reset Timer (DRT)
7.6
Watchdog Timer (WDT)
In the PIC12C5XX, DRT runs from RESET and varies based on oscillator selection (see Table 7-5.) The DRT operates on an internal RC oscillator. The processor is kept in RESET as long as the DRT is active. The DRT delay allows VDD to rise above VDD min., and for the oscillator to stabilize. Oscillator circuits based on crystals or ceramic resonators require a certain time after power-up to establish a stable oscillation. The on-chip DRT keeps the device in a RESET condition for approximately 18 ms after MCLR has reached a logic high (VIHMCLR) level. Thus, programming GP3/MCLR/VPP as MCLR and using an external RC network connected to the MCLR input is not required in most cases, allowing for savings in cost-sensitive and/or space restricted applications, as well as allowing the use of the GP3/ MCLR/VPP pin as a general purpose input. The Device Reset time delay will vary from chip to chip due to VDD, temperature, and process variation. See AC parameters for details. The DRT will also be triggered upon a Watchdog Timer time-out. This is particularly important for applications using the WDT to wake from SLEEP mode automatically.
The Watchdog Timer (WDT) is a free running on-chip RC oscillator which does not require any external components. This RC oscillator is separate from the external RC oscillator of the GP5/OSC1/CLKIN pin and the internal 4 MHz oscillator. That means that the WDT will run even if the main processor clock has been stopped, for example, by execution of a SLEEP instruction. During normal operation or SLEEP, a WDT reset or wake-up reset generates a device RESET. The TO bit (STATUS<4>) will be cleared upon a Watchdog Timer reset. The WDT can be permanently disabled by programming the configuration bit WDTE as a '0' (Section 7.1). Refer to the PIC12C5XX Programming Specifications to determine how to access the configuration word.
TABLE 7-5:
Oscillator Configuration IntRC & ExtRC XT & LP
DRT (DEVICE RESET TIMER PERIOD)
POR Reset 18 ms (typical) 18 ms (typical) Subsequent Resets 300 s (typical) 18 ms (typical)
DS40139D-page 34
(c) 1998 Microchip Technology Inc.
PIC12C5XX
7.6.1 WDT PERIOD 7.6.2 WDT PROGRAMMING CONSIDERATIONS The WDT has a nominal time-out period of 18 ms, (with no prescaler). If a longer time-out period is desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT (under software control) by writing to the OPTION register. Thus, a time-out period of a nominal 2.3 seconds can be realized. These periods vary with temperature, VDD and part-topart process variations (see DC specs). Under worst case conditions (VDD = Min., Temperature = Max., max. WDT prescaler), it may take several seconds before a WDT time-out occurs. The CLRWDT instruction clears the WDT and the postscaler, if assigned to the WDT, and prevents it from timing out and generating a device RESET. The SLEEP instruction resets the WDT and the postscaler, if assigned to the WDT. This gives the maximum SLEEP time before a WDT wake-up reset.
FIGURE 7-12: WATCHDOG TIMER BLOCK DIAGRAM
From Timer0 Clock Source (Figure 6-5)
0 Watchdog Timer 1 M U X Postscaler Postscaler
8 - to - 1 MUX WDT Enable Configuration Bit PSA
PS2:PS0
To Timer0 (Figure 6-4) 0 MUX Note: T0CS, T0SE, PSA, PS2:PS0 are bits in the OPTION register. WDT Time-out 1 PSA
TABLE 7-6:
SUMMARY OF REGISTERS ASSOCIATED WITH THE WATCHDOG TIMER
Value on Power-On Reset 1111 1111 Value on All Other Resets 1111 1111
Address N/A
Name OPTION
Bit 7 GPWU
Bit 6 GPPU
Bit 5 T0CS
Bit 4 T0SE
Bit 3 PSA
Bit 2 PS2
Bit 1 PS1
Bit 0 PS0
Legend: Shaded boxes = Not used by Watchdog Timer, -- = unimplemented, read as '0', u = unchanged
(c) 1998 Microchip Technology Inc.
DS40139D-page 35
PIC12C5XX
7.7 Time-Out Sequence, Power Down, and Wake-up from SLEEP Status Bits (TO/PD/GPWUF) 7.8 Reset on Brown-Out
A brown-out is a condition where device power (VDD) dips below its minimum value, but not to zero, and then recovers. The device should be reset in the event of a brown-out. To reset PIC12C5XX devices when a brown-out occurs, external brown-out protection circuits may be built, as shown in Figure 7-13 and Figure 7-14.
The TO, PD, and GPWUF bits in the STATUS register can be tested to determine if a RESET condition has been caused by a power-up condition, a MCLR or Watchdog Timer (WDT) reset.
TABLE 7-7:
GPWUF TO
0 0 0 0 0 1 Legend: 0 0 1 1 u 1
TO/PD/GPWUF STATUS AFTER RESET
PD
0 u 0 1 u 0
RESET caused by WDT wake-up from SLEEP WDT time-out (not from SLEEP) MCLR wake-up from SLEEP Power-up MCLR not during SLEEP Wake-up from SLEEP on pin change
FIGURE 7-13: BROWN-OUT PROTECTION CIRCUIT 1
VDD VDD Q1
33k 10k
MCLR
40k* PIC12C5XX
Legend: u = unchanged Note 1: The TO, PD, and GPWUF bits maintain their status (u) until a reset occurs. A low-pulse on the MCLR input does not change the TO, PD, and GPWUF status bits.
This circuit will activate reset when VDD goes below Vz + 0.7V (where Vz = Zener voltage). *Refer to Figure 7-7 and Table 10-1 for internal weak pullup on MCLR.
FIGURE 7-14: BROWN-OUT PROTECTION CIRCUIT 2
VDD VDD Q1 MCLR R2 40k* PIC12C5XX
R1
This brown-out circuit is less expensive, although less accurate. Transistor Q1 turns off when VDD is below a certain level such that: VDD * R1 R1 + R2 = 0.7V
*Refer to Figure 7-7 and Table 10-1 for internal weak pull-up on MCLR.
DS40139D-page 36
(c) 1998 Microchip Technology Inc.
PIC12C5XX
7.9 Power-Down Mode (SLEEP) 7.10 Program Verification/Code Protection
A device may be powered down (SLEEP) and later powered up (Wake-up from SLEEP). 7.9.1 SLEEP If the code protection bit has not been programmed, the on-chip program memory can be read out for verification purposes. The first 64 locations and the last location can be read regardless of the code protection bit setting.
The Power-Down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the TO bit (STATUS<4>) is set, the PD bit (STATUS<3>) is cleared and the oscillator driver is turned off. The I/O ports maintain the status they had before the SLEEP instruction was executed (driving high, driving low, or hi-impedance). It should be noted that a RESET generated by a WDT time-out does not drive the MCLR pin low. For lowest current consumption while powered down, the T0CKI input should be at VDD or VSS and the GP3/ MCLR/VPP pin must be at a logic high level (VIHMC) if MCLR is enabled. 7.9.2 WAKE-UP FROM SLEEP
7.11
ID Locations
Four memory locations are designated as ID locations where the user can store checksum or other codeidentification numbers. These locations are not accessible during normal execution but are readable and writable during program/verify. Use only the lower 4 bits of the ID locations and always program the upper 8 bits as '0's.
The device can wake-up from SLEEP through one of the following events: 1. 2. 3. An external reset input on GP3/MCLR/VPP pin, when configured as MCLR. A Watchdog Timer time-out reset (if WDT was enabled). A change on input pin GP0, GP1, or GP3/ MCLR/VPP when wake-up on change is enabled.
These events cause a device reset. The TO, PD, and GPWUF bits can be used to determine the cause of device reset. The TO bit is cleared if a WDT time-out occurred (and caused wake-up). The PD bit, which is set on power-up, is cleared when SLEEP is invoked. The GPWUF bit indicates a change in state while in SLEEP at pins GP0, GP1, or GP3 (since the last time there was a file or bit operation on GP port). Caution: Right before entering SLEEP, read the input pins. When in SLEEP, wake up occurs when the values at the pins change from the state they were in at the last reading. If a wake-up on change occurs and the pins are not read before reentering SLEEP, a wake up will occur immediately even if no pins change while in SLEEP mode. The WDT is cleared when the device wakes from sleep, regardless of the wake-up source.
(c) 1998 Microchip Technology Inc.
DS40139D-page 37
PIC12C5XX
7.12 In-Circuit Serial Programming
The PIC12C5XX microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground, and the programming voltage. This allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. The device is placed into a program/verify mode by holding the GP1 and GP0 pins low while raising the MCLR (VPP) pin from VIL to VIHH (see programming specification). GP1 becomes the programming clock and GP0 becomes the programming data. Both GP1 and GP0 are Schmitt Trigger inputs in this mode. After reset, a 6-bit command is then supplied to the device. Depending on the command, 14-bits of program data are then supplied to or from the device, depending if the command was a load or a read. For complete details of serial programming, please refer to the PIC12C5XX Programming Specifications. A typical in-circuit serial programming connection is shown in Figure 7-15.
FIGURE 7-15: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION
To Normal Connections PIC12C5XX VDD VSS MCLR/VPP GP1 GP0 VDD To Normal Connections
External Connector Signals +5V 0V VPP CLK Data I/O
DS40139D-page 38
(c) 1998 Microchip Technology Inc.
PIC12C5XX
8.0 INSTRUCTION SET SUMMARY
Each PIC12C5XX instruction is a 12-bit word divided into an OPCODE, which specifies the instruction type, and one or more operands which further specify the operation of the instruction. The PIC12C5XX instruction set summary in Table 8-2 groups the instructions into byte-oriented, bit-oriented, and literal and control operations. Table 8-1 shows the opcode field descriptions. For byte-oriented instructions, 'f' represents a file register designator and 'd' represents a destination designator. The file register designator is used to specify which one of the 32 file registers is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If 'd' is '0', the result is placed in the W register. If 'd' is '1', the result is placed in the file register specified in the instruction. For bit-oriented instructions, 'b' represents a bit field designator which selects the number of the bit affected by the operation, while 'f' represents the number of the file in which the bit is located. For literal and control operations, 'k' represents an 8 or 9-bit constant or literal value. All instructions are executed within a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. Figure 8-1 shows the three general formats that the instructions can have. All examples in the figure use the following format to represent a hexadecimal number: 0xhhh where 'h' signifies a hexadecimal digit.
FIGURE 8-1:
GENERAL FORMAT FOR INSTRUCTIONS
6 5 d 4 f (FILE #) 0
Byte-oriented file register operations 11 OPCODE
d = 0 for destination W d = 1 for destination f f = 5-bit file register address Bit-oriented file register operations 11 OPCODE 87 54 b (BIT #) f (FILE #) 0
TABLE 8-1:
Field
f W b k
OPCODE FIELD DESCRIPTIONS
Description
b = 3-bit bit address f = 5-bit file register address Literal and control operations (except GOTO) 11 OPCODE k = 8-bit immediate value Literal and control operations - GOTO instruction 11 OPCODE k = 9-bit immediate value 9 8 k (literal) 0 8 7 k (literal) 0
Register file address (0x00 to 0x7F) Working register (accumulator) Bit address within an 8-bit file register Literal field, constant data or label Don't care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. Destination select; d = 0 (store result in W) d = 1 (store result in file register 'f') Default is d = 1 Label name Top of Stack Program Counter Watchdog Timer Counter Time-Out bit Power-Down bit Destination, either the W register or the specified register file location Options Contents Assigned to Register bit field In the set of User defined term (font is courier)
x
d
label TOS PC WDT TO PD
dest [] () <>
italics
(c) 1998 Microchip Technology Inc.
DS40139D-page 39
PIC12C5XX
TABLE 8-2:
Mnemonic, Operands ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF BCF BSF BTFSC BTFSS ANDLW CALL CLRWDT GOTO IORLW MOVLW OPTION RETLW SLEEP TRIS XORLW f,d f,d f - f, d f, d f, d f, d f, d f, d f, d f - f, d f, d f, d f, d f, d f, b f, b f, b f, b k k k k k k - k - f k
INSTRUCTION SET SUMMARY
12-Bit Opcode Description Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate left f through Carry Rotate right f through Carry Subtract W from f Swap f Exclusive OR W with f Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set AND literal with W Call subroutine Clear Watchdog Timer Unconditional branch Inclusive OR Literal with W Move Literal to W Load OPTION register Return, place Literal in W Go into standby mode Load TRIS register Exclusive OR Literal to W Cycles MSb 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 1 1 1 (2) 1 (2) 1 2 1 2 1 1 1 2 1 1 1 0001 0001 0000 0000 0010 0000 0010 0010 0011 0001 0010 0000 0000 0011 0011 0000 0011 0001 11df 01df 011f 0100 01df 11df 11df 10df 11df 00df 00df 001f 0000 01df 00df 10df 10df 10df LSb ffff ffff ffff 0000 ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff Status Affected Notes C,DC,Z Z Z Z Z Z None Z None Z Z None None C C C,DC,Z None Z None None None None Z None TO, PD None Z None None None TO, PD None Z 1,2,4 2,4 4
2,4 2,4 2,4 2,4 2,4 2,4 1,4 2,4 2,4 1,2,4 2,4 2,4 2,4 2,4
BIT-ORIENTED FILE REGISTER OPERATIONS 0100 0101 0110 0111 bbbf bbbf bbbf bbbf ffff ffff ffff ffff
LITERAL AND CONTROL OPERATIONS 1110 1001 0000 101k 1101 1100 0000 1000 0000 0000 1111 kkkk kkkk 0000 kkkk kkkk kkkk 0000 kkkk 0000 0000 kkkk kkkk kkkk 0100 kkkk kkkk kkkk 0010 kkkk 0011 0fff kkkk 1
3
Note 1: The 9th bit of the program counter will be forced to a '0' by any instruction that writes to the PC except for GOTO. (Section 4.6) 2: When an I/O register is modified as a function of itself (e.g. MOVF GPIO, 1), the value used will be that value present on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external device, the data will be written back with a '0'. 3: The instruction TRIS f, where f = 6 causes the contents of the W register to be written to the tristate latches of GPIO. A '1' forces the pin to a hi-impedance state and disables the output buffers. 4: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared (if assigned to TMR0).
DS40139D-page 40
(c) 1998 Microchip Technology Inc.
PIC12C5XX
ADDWF Syntax: Operands: Operation: Encoding: Description: Add W and f [ label ] ADDWF 0 f 31 d [0,1] (W) + (f) (dest)
0001 11df ffff
ANDWF f,d Syntax: Operands: Operation: Encoding: Description:
AND W with f [ label ] ANDWF 0 f 31 d [0,1] (W) .AND. (f) (dest)
0001 01df ffff
f,d
Status Affected: C, DC, Z
Add the contents of the W register and register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is '1' the result is stored back in register 'f'.
Status Affected: Z
The contents of the W register are AND'ed with register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is '1' the result is stored back in register 'f'.
Words: Cycles: Example:
W = FSR = W = FSR =
1 1
ADDWF 0x17 0xC2 0xD9 0xC2 FSR, 0
Words: Cycles: Example:
W= FSR = W = FSR =
1 1
ANDWF 0x17 0xC2 0x17 0x02 FSR, 1
Before Instruction
Before Instruction
After Instruction
After Instruction
ANDLW Syntax: Operands: Operation: Encoding: Description:
And literal with W [ label ] ANDLW 0 k 255 (W).AND. (k) (W) k
BCF Syntax: Operands: Operation:
Bit Clear f [ label ] BCF 0 f 31 0b7 0 (f)
0100 bbbf ffff
f,b
Status Affected: Z
1110 kkkk kkkk The contents of the W register are AND'ed with the eight-bit literal 'k'. The result is placed in the W register.
Status Affected: None Encoding: Description: Words: Cycles: Example: 1 1
BCF FLAG_REG, 7 Bit 'b' in register 'f' is cleared.
Words: Cycles: Example:
W W = =
1 1
ANDLW 0xA3 0x03 0x5F
Before Instruction
FLAG_REG = 0xC7
Before Instruction After Instruction
After Instruction
FLAG_REG = 0x47
(c) 1998 Microchip Technology Inc.
DS40139D-page 41
PIC12C5XX
BSF Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example: 1 1
BSF FLAG_REG, 7
Bit Set f [ label ] BSF 0 f 31 0b7 1 (f)
0101 bbbf ffff
BTFSS f,b Syntax: Operands: Operation: Encoding: Description:
Bit Test f, Skip if Set [ label ] BTFSS f,b 0 f 31 0b<7 skip if (f) = 1
0111 bbbf ffff
Status Affected: None
Bit 'b' in register 'f' is set.
Status Affected: None
If bit 'b' in register 'f' is '1' then the next instruction is skipped. If bit 'b' is '1', then the next instruction fetched during the current instruction execution, is discarded and an NOP is executed instead, making this a 2 cycle instruction.
Before Instruction
FLAG_REG = 0x0A
Words: Cycles: Example:
1 1(2)
HERE FALSE TRUE * * BTFSS GOTO * FLAG,1 PROCESS_CODE
After Instruction
FLAG_REG = 0x8A
BTFSC Syntax: Operands: Operation: Encoding: Description:
Bit Test f, Skip if Clear [ label ] BTFSC f,b 0 f 31 0b7 skip if (f) = 0 0110
bbbf ffff
Before Instruction
PC = = = = = address (HERE) 0, address (FALSE); 1, address (TRUE)
After Instruction
If FLAG<1> PC if FLAG<1> PC
Status Affected: None
If bit 'b' in register 'f' is 0 then the next instruction is skipped. If bit 'b' is 0 then the next instruction fetched during the current instruction execution is discarded, and an NOP is executed instead, making this a 2 cycle instruction.
Words: Cycles: Example:
1 1(2)
HERE FALSE TRUE BTFSC GOTO
FLAG,1 PROCESS_CODE
* * *
address (HERE) 0, address (TRUE); 1, address(FALSE)
Before Instruction
PC = = = = =
After Instruction
if FLAG<1> PC if FLAG<1> PC
DS40139D-page 42
(c) 1998 Microchip Technology Inc.
PIC12C5XX
CALL Syntax: Operands: Operation: Subroutine Call [ label ] CALL k 0 k 255 (PC) + 1 Top of Stack; k PC<7:0>; (STATUS<6:5>) PC<10:9>; 0 PC<8>
1001 kkkk kkkk
CLRW Syntax: Operands: Operation:
Clear W [ label ] CLRW None 00h (W); 1Z
0000 0100 0000
Status Affected: Z Encoding: Description: Words: Cycles: Example:
W W Z = = = The W register is cleared. Zero bit (Z) is set.
Status Affected: None Encoding: Description:
Subroutine call. First, return address (PC+1) is pushed onto the stack. The eight bit immediate address is loaded into PC bits <7:0>. The upper bits PC<10:9> are loaded from STATUS<6:5>, PC<8> is cleared. CALL is a two cycle instruction.
1 1
CLRW 0x5A 0x00 1
Before Instruction After Instruction
Words: Cycles: Example:
PC = PC = TOS =
1 2
HERE CALL THERE
Before Instruction
address (HERE) address (THERE) address (HERE + 1)
CLRWDT Syntax: Operands: Operation:
Clear Watchdog Timer [ label ] CLRWDT None 00h WDT; 0 WDT prescaler (if assigned); 1 TO; 1 PD
0000 0000 0100
After Instruction
CLRF Syntax: Operands: Operation:
Clear f [ label ] CLRF 0 f 31 00h (f); 1Z
0000 011f ffff
f
Status Affected: TO, PD Encoding: Description:
The CLRWDT instruction resets the WDT. It also resets the prescaler, if the prescaler is assigned to the WDT and not Timer0. Status bits TO and PD are set.
Status Affected: Z Encoding: Description: Words: Cycles: Example:
The contents of register 'f' are cleared and the Z bit is set.
Words: Cycles: Example:
1 1
CLRWDT ? 0x00 0 1 1
1 1
CLRF = = = FLAG_REG 0x5A 0x00 1
Before Instruction
WDT counter =
Before Instruction
FLAG_REG
After Instruction
WDT counter WDT prescale TO PD = = = =
After Instruction
FLAG_REG Z
(c) 1998 Microchip Technology Inc.
DS40139D-page 43
PIC12C5XX
COMF Syntax: Operands: Operation: Encoding: Description: Complement f [ label ] COMF 0 f 31 d [0,1] (f) (dest)
0010 01df ffff
DECFSZ f,d Syntax: Operands: Operation: Encoding: Description:
Decrement f, Skip if 0 [ label ] DECFSZ f,d 0 f 31 d [0,1] (f) - 1 d;
0010
skip if result = 0
ffff
Status Affected: Z
The contents of register 'f' are complemented. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
Status Affected: None
11df The contents of register 'f' are decremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. If the result is 0, the next instruction, which is already fetched, is discarded and an NOP is executed instead making it a two cycle instruction.
Words: Cycles: Example:
REG1 REG1 W
1 1
COMF = = = 0x13 0x13 0xEC REG1,0
Before Instruction After Instruction
Words: Cycles: Example:
1 1(2)
HERE DECFSZ GOTO CONTINUE * * * = = = = = address (HERE) CNT - 1; 0, address (CONTINUE); 0, address (HERE+1) CNT, 1 LOOP
DECF Syntax: Operands: Operation: Encoding: Description:
Decrement f [ label ] DECF f,d 0 f 31 d [0,1] (f) - 1 (dest)
0000 11df ffff
Before Instruction
PC CNT if CNT PC if CNT PC
After Instruction
Status Affected: Z
Decrement register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
GOTO Syntax: Operands: Operation:
Unconditional Branch [ label ] GOTO k 0 k 511 k PC<8:0>; STATUS<6:5> PC<10:9>
101k kkkk kkkk
Words: Cycles: Example:
CNT Z CNT Z
1 1
DECF = = = = 0x01 0 0x00 1 CNT,
1
Before Instruction
Status Affected: None Encoding: Description:
GOTO is an unconditional branch. The 9-bit immediate value is loaded into PC bits <8:0>. The upper bits of PC are loaded from STATUS<6:5>. GOTO is a two cycle instruction.
After Instruction
Words: Cycles: Example:
PC =
1 2
GOTO THERE address (THERE)
After Instruction
DS40139D-page 44
(c) 1998 Microchip Technology Inc.
PIC12C5XX
INCF Syntax: Operands: Operation: Encoding: Description: Increment f [ label ] 0 f 31 d [0,1] (f) + 1 (dest)
0010 10df ffff
IORLW Syntax: Operands: Operation: Encoding: Description:
Inclusive OR literal with W [ label ] IORLW k 0 k 255 (W) .OR. (k) (W)
1101 kkkk kkkk
INCF f,d
Status Affected: Z
The contents of the W register are OR'ed with the eight bit literal 'k'. The result is placed in the W register.
Status Affected: Z
The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'.
Words: Cycles: Example:
1 1
IORLW = = = 0x9A 0xBF 0 0x35
Words: Cycles: Example:
CNT Z CNT Z
1 1
INCF = = = = CNT,
1
Before Instruction
W W Z
Before Instruction
0xFF 0 0x00 1
After Instruction
After Instruction IORWF Syntax: INCFSZ Syntax: Operands: Operation: Encoding: Description: Increment f, Skip if 0 [ label ] 0 f 31 d [0,1] (f) + 1 (dest), skip if result = 0
0011 11df ffff
Inclusive OR W with f [ label ] 0 f 31 d [0,1] (W).OR. (f) (dest)
0001 00df ffff
IORWF
f,d
Operands: Operation: Encoding: Description:
INCFSZ f,d
Status Affected: Z
Inclusive OR the W register with register 'f'. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'.
Status Affected: None
The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. If the result is 0, then the next instruction, which is already fetched, is discarded and an NOP is executed instead making it a two cycle instruction.
Words: Cycles: Example:
1 1
IORWF 0x13 0x91 0x13 0x93 0 RESULT, 0
Before Instruction
RESULT = W =
Words: Cycles: Example:
1 1(2)
INCFSZ GOTO CONTINUE * * * = = = = = address (HERE) CNT + 1; 0, address (CONTINUE); 0, address (HERE +1) HERE CNT, LOOP 1
After Instruction
RESULT = W = Z =
Before Instruction
PC CNT if CNT PC if CNT PC
After Instruction
(c) 1998 Microchip Technology Inc.
DS40139D-page 45
PIC12C5XX
MOVF Syntax: Operands: Operation: Encoding: Description: Move f [ label ] 0 f 31 d [0,1] (f) (dest)
0010 00df ffff
MOVWF MOVF f,d Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example:
Move W to f [ label ] 0 f 31 (W) (f)
0000 001f ffff
MOVWF
f
Status Affected: None
Move data from the W register to register 'f'.
Status Affected: Z
The contents of register 'f' is moved to destination 'd'. If 'd' is 0, destination is the W register. If 'd' is 1, the destination is file register 'f'. 'd' is 1 is useful to test a file register since status flag Z is affected.
1 1
MOVWF = = = = TEMP_REG 0xFF 0x4F 0x4F 0x4F
Words: Cycles: Example:
W =
1 1
MOVF FSR, 0
Before Instruction
TEMP_REG W
After Instruction
TEMP_REG W
After Instruction
value in FSR register
NOP MOVLW Syntax: Operands: Operation: Encoding: Description: Move Literal to W [ label ] k (W)
1100 kkkk kkkk
No Operation [ label ] None No operation
0000 0000 0000
Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example:
NOP
MOVLW k
0 k 255
Status Affected: None No operation. 1 1
NOP
Status Affected: None
The eight bit literal 'k' is loaded into the W register. The don't cares will assemble as 0s.
Words: Cycles: Example:
W =
1 1
MOVLW 0x5A 0x5A
After Instruction
DS40139D-page 46
(c) 1998 Microchip Technology Inc.
PIC12C5XX
OPTION Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example
W
Load OPTION Register [ label ] None (W) OPTION OPTION
RLF Syntax: Operands: Operation:
Rotate Left f through Carry [ label ] RLF 0 f 31 d [0,1] See description below
0011 01df ffff
f,d
Status Affected: None
0000 0000 0010 The content of the W register is loaded into the OPTION register.
Status Affected: C Encoding: Description:
The contents of register 'f' are rotated one bit to the left through the Carry Flag. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is stored back in register 'f'.
1 1
OPTION
Before Instruction
= 0x07 0x07
C Words: Cycles: Example: 1 1
RLF = = = = =
register 'f'
After Instruction
OPTION =
REG1,0 1110 0110 0 1110 0110 1100 1100 1
RETLW Syntax: Operands: Operation:
Return with Literal in W [ label ] RETLW k 0 k 255 k (W); TOS PC
1000 kkkk kkkk
Before Instruction
REG1 C REG1 W C
After Instruction
Status Affected: None Encoding: Description:
The W register is loaded with the eight bit literal 'k'. The program counter is loaded from the top of the stack (the return address). This is a two cycle instruction.
RRF Syntax: Operands: Operation: Encoding: Description:
Rotate Right f through Carry [ label ] 0 f 31 d [0,1] See description below
0011 00df ffff
RRF f,d
Words: Cycles: Example:
1 2
CALL TABLE ;W contains ;table offset ;value. * ;W now has table * ;value. * ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; * * * RETLW kn ; End of table = = 0x07 value of k8
Status Affected: C
The contents of register 'f' are rotated one bit to the right through the Carry Flag. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'.
TABLE
C Words: Cycles: Example:
REG1 C REG1 W C
register 'f'
1 1
RRF = = = = = REG1,0 1110 0110 0 1110 0110 0111 0011 0
Before Instruction
W W
Before Instruction
After Instruction
After Instruction
(c) 1998 Microchip Technology Inc.
DS40139D-page 47
PIC12C5XX
SLEEP Syntax: Operands: Operation: Enter SLEEP Mode [label] None 00h WDT; 0 WDT prescaler; 1 TO; 0 PD
0000 0000 0011
SUBWF Syntax: Operands: Operation: Encoding: Description:
Subtract W from f [label] SUBWF f,d 0 f 31 d [0,1] (f) - (W) (dest)
0000 10df ffff
SLEEP
Status Affected: C, DC, Z
Subtract (2's complement method) the W register from register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
Status Affected: TO, PD, GPWUF Encoding: Description:
Time-out status bit (TO) is set. The power down status bit (PD) is cleared. GPWUF is unaffected. The WDT and its prescaler are cleared. The processor is put into SLEEP mode with the oscillator stopped. See section on SLEEP for more details.
Words: Cycles: Example 1:
REG1 W C REG1 W C
1 1
SUBWF = = = = = = 3 2 ? 1 2 1 REG1, 1
Before Instruction
Words: Cycles: Example:
1 1 SLEEP
After Instruction
; result is positive
Example 2: Before Instruction
REG1 W C REG1 W C = = = = = = 2 2 ? 0 2 1
After Instruction
; result is zero
Example 3: Before Instruction
REG1 W C REG1 W C = = = = = = 1 2 ? FF 2 0
After Instruction
; result is negative
DS40139D-page 48
(c) 1998 Microchip Technology Inc.
PIC12C5XX
SWAPF Syntax: Operands: Operation: Swap Nibbles in f [ label ] SWAPF f,d 0 f 31 d [0,1] (f<3:0>) (dest<7:4>); (f<7:4>) (dest<3:0>)
0011 10df ffff
XORLW Syntax: Operands: Operation: Encoding: Description:
Exclusive OR literal with W [label] XORLW k 0 k 255 (W) .XOR. k (W)
1111 kkkk kkkk
Status Affected: Z
The contents of the W register are XOR'ed with the eight bit literal 'k'. The result is placed in the W register.
Status Affected: None Encoding: Description:
The upper and lower nibbles of register 'f' are exchanged. If 'd' is 0 the result is placed in W register. If 'd' is 1 the result is placed in register 'f'.
Words: Cycles: Example:
1 1 XORLW
= = 0xB5 0x1A
Words: Cycles: Example
REG1 REG1 W
1 1
SWAPF = = =
0xAF
Before Instruction REG1, 0
W W
Before Instruction
0xA5 0xA5 0X5A
After Instruction
After Instruction XORWF Syntax: Operands: TRIS Syntax: Operands: Operation: Encoding: Description: Words: Cycles: Example
W TRIS
Exclusive OR W with f [ label ] XORWF 0 f 31 d [0,1] (W) .XOR. (f) (dest)
0001 10df ffff
f,d
Load TRIS Register [ label ] TRIS f=6 (W) TRIS register f
0000 0000 0fff
f
Operation: Encoding: Description:
Status Affected: Z
Exclusive OR the contents of the W register with register 'f'. If 'd' is 0 the result is stored in the W register. If 'd' is 1 the result is stored back in register 'f'.
Status Affected: None
TRIS register 'f' (f = 6) is loaded with the contents of the W register
1 1
TRIS = = 0XA5 0XA5 GPIO
Words: Cycles: Example
REG W REG W
1 1 XORWF
= = = = REG,1
Before Instruction After Instruction Note: f = 6 for PIC12C5XX only.
Before Instruction
0xAF 0xB5 0x1A 0xB5
After Instruction
(c) 1998 Microchip Technology Inc.
DS40139D-page 49
PIC12C5XX
NOTES:
DS40139D-page 50
(c) 1998 Microchip Technology Inc.
PIC12C5XX
9.0
9.1
DEVELOPMENT SUPPORT
Development Tools
9.3
ICEPIC: Low-Cost PICmicroTM In-Circuit Emulator
The PICmicrTM microcontrollers are supported with a full range of hardware and software development tools: * MPLABTM-ICE Real-Time In-Circuit Emulator * ICEPICTM Low-Cost PIC16C5X and PIC16CXXX In-Circuit Emulator * PRO MATE(R) II Universal Programmer * PICSTART(R) Plus Entry-Level Prototype Programmer * SIMICE * PICDEM-1 Low-Cost Demonstration Board * PICDEM-2 Low-Cost Demonstration Board * PICDEM-3 Low-Cost Demonstration Board * MPASM Assembler * MPLABTM SIM Software Simulator * MPLAB-C17 (C Compiler) * Fuzzy Logic Development System (fuzzyTECH(R)-MP) * KEELOQ(R) Evaluation Kits and Programmer
ICEPIC is a low-cost in-circuit emulator solution for the Microchip PIC12CXXX, PIC16C5X and PIC16CXXX families of 8-bit OTP microcontrollers. ICEPIC is designed to operate on PC-compatible machines ranging from 386 through PentiumTM based machines under Windows 3.x, Windows 95, or Windows NT environment. ICEPIC features real time, nonintrusive emulation.
9.4
PRO MATE II: Universal Programmer
The PRO MATE II Universal Programmer is a full-featured programmer capable of operating in stand-alone mode as well as PC-hosted mode. PRO MATE II is CE compliant. The PRO MATE II has programmable VDD and VPP supplies which allows it to verify programmed memory at VDD min and VDD max for maximum reliability. It has an LCD display for displaying error messages, keys to enter commands and a modular detachable socket assembly to support various package types. In standalone mode the PRO MATE II can read, verify or program PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices. It can also set configuration and code-protect bits in this mode.
9.2
MPLAB-ICE: High Performance Universal In-Circuit Emulator with MPLAB IDE
The MPLAB-ICE Universal In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PICmicro microcontrollers (MCUs). MPLAB-ICE is supplied with the MPLAB Integrated Development Environment (IDE), which allows editing, "make" and download, and source debugging from a single environment. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB-ICE allows expansion to support all new Microchip microcontrollers. The MPLAB-ICE Emulator System has been designed as a real-time emulation system with advanced features that are generally found on more expensive development tools. The PC compatible 386 (and higher) machine platform and Microsoft Windows(R) 3.x or Windows 95 environment were chosen to best make these features available to you, the end user. MPLAB-ICE is available in two versions. MPLAB-ICE 1000 is a basic, low-cost emulator system with simple trace capabilities. It shares processor modules with the MPLAB-ICE 2000. This is a full-featured emulator system with enhanced trace, trigger, and data monitoring features. Both systems will operate across the entire operating speed reange of the PICmicro MCU.
9.5
PICSTART Plus Entry Level Development System
The PICSTART programmer is an easy-to-use, lowcost prototype programmer. It connects to the PC via one of the COM (RS-232) ports. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. PICSTART Plus is not recommended for production programming. PICSTART Plus supports all PIC12CXXX, PIC14C000, PIC16C5X, PIC16CXXX and PIC17CXX devices with up to 40 pins. Larger pin count devices such as the PIC16C923, PIC16C924 and PIC17C756 may be supported with an adapter socket. PICSTART Plus is CE compliant.
(c) 1998 Microchip Technology Inc.
DS40139D-page 51
PIC12C5XX
9.6 SIMICE Entry-Level Hardware Simulator 9.8 PICDEM-2 Low-Cost PIC16CXX Demonstration Board
SIMICE is an entry-level hardware development system designed to operate in a PC-based environment with Microchip's simulator MPLABTM-SIM. Both SIMICE and MPLAB-SIM run under Microchip Technology's MPLAB Integrated Development Environment (IDE) software. Specifically, SIMICE provides hardware simulation for Microchip's PIC12C5XX, PIC12CE5XX, and PIC16C5X families of PICmicroTM 8-bit microcontrollers. SIMICE works in conjunction with MPLAB-SIM to provide non-real-time I/O port emulation. SIMICE enables a developer to run simulator code for driving the target system. In addition, the target system can provide input to the simulator code. This capability allows for simple and interactive debugging without having to manually generate MPLAB-SIM stimulus files. SIMICE is a valuable debugging tool for entrylevel system development.
The PICDEM-2 is a simple demonstration board that supports the PIC16C62, PIC16C64, PIC16C65, PIC16C73 and PIC16C74 microcontrollers. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-2 board, on a PRO MATE II programmer or PICSTART-Plus, and easily test firmware. The MPLAB-ICE emulator may also be used with the PICDEM-2 board to test firmware. Additional prototype area has been provided to the user for adding additional hardware and connecting it to the microcontroller socket(s). Some of the features include a RS-232 interface, push-button switches, a potentiometer for simulated analog input, a Serial EEPROM to demonstrate usage of the I2C bus and separate headers for connection to an LCD module and a keypad.
9.7
PICDEM-1 Low-Cost PICmicro Demonstration Board
9.9
PICDEM-3 Low-Cost PIC16CXXX Demonstration Board
The PICDEM-1 is a simple board which demonstrates the capabilities of several of Microchip's microcontrollers. The microcontrollers supported are: PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The users can program the sample microcontrollers provided with the PICDEM-1 board, on a PRO MATE II or PICSTART-Plus programmer, and easily test firmware. The user can also connect the PICDEM-1 board to the MPLAB-ICE emulator and download the firmware to the emulator for testing. Additional prototype area is available for the user to build some additional hardware and connect it to the microcontroller socket(s). Some of the features include an RS-232 interface, a potentiometer for simulated analog input, push-button switches and eight LEDs connected to PORTB.
The PICDEM-3 is a simple demonstration board that supports the PIC16C923 and PIC16C924 in the PLCC package. It will also support future 44-pin PLCC microcontrollers with a LCD Module. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers provided with the PICDEM-3 board, on a PRO MATE II programmer or PICSTART Plus with an adapter socket, and easily test firmware. The MPLAB-ICE emulator may also be used with the PICDEM-3 board to test firmware. Additional prototype area has been provided to the user for adding hardware and connecting it to the microcontroller socket(s). Some of the features include an RS-232 interface, push-button switches, a potentiometer for simulated analog input, a thermistor and separate headers for connection to an external LCD module and a keypad. Also provided on the PICDEM-3 board is an LCD panel, with 4 commons and 12 segments, that is capable of displaying time, temperature and day of the week. The PICDEM-3 provides an additional RS-232 interface and Windows 3.1 software for showing the demultiplexed LCD signals on a PC. A simple serial interface allows the user to construct a hardware demultiplexer for the LCD signals.
DS40139D-page 52
(c) 1998 Microchip Technology Inc.
PIC12C5XX
9.10 MPLAB Integrated Development Environment Software 9.12 Software Simulator (MPLAB-SIM)
The MPLAB-SIM Software Simulator allows code development in a PC host environment. It allows the user to simulate the PICmicro series microcontrollers on an instruction level. On any given instruction, the user may examine or modify any of the data areas or provide external stimulus to any of the pins. The input/ output radix can be set by the user and the execution can be performed in; single step, execute until break, or in a trace mode. MPLAB-SIM fully supports symbolic debugging using MPLAB-C17 and MPASM. The Software Simulator offers the low cost flexibility to develop and debug code outside of the laboratory environment making it an excellent multi-project software development tool.
The MPLAB IDE Software brings an ease of software development previously unseen in the 8-bit microcontroller market. MPLAB is a windows based application which contains: * A full featured editor * Three operating modes - editor - emulator - simulator * A project manager * Customizable tool bar and key mapping * A status bar with project information * Extensive on-line help MPLAB allows you to: * Edit your source files (either assembly or `C') * One touch assemble (or compile) and download to PICmicro tools (automatically updates all project information) * Debug using: - source files - absolute listing file The ability to use MPLAB with Microchip's simulator allows a consistent platform and the ability to easily switch from the low cost simulator to the full featured emulator with minimal retraining due to development tools.
9.13
MPLAB-C17 Compiler
The MPLAB-C17 Code Development System is a complete ANSI `C' compiler and integrated development environment for Microchip's PIC17CXXX family of microcontrollers. The compiler provides powerful integration capabilities and ease of use not found with other compilers. For easier source level debugging, the compiler provides symbol information that is compatible with the MPLAB IDE memory display.
9.14
Fuzzy Logic Development System (fuzzyTECH-MP)
9.11
Assembler (MPASM)
The MPASM Universal Macro Assembler is a PChosted symbolic assembler. It supports all microcontroller series including the PIC12C5XX, PIC14000, PIC16C5X, PIC16CXXX, and PIC17CXX families. MPASM offers full featured Macro capabilities, conditional assembly, and several source and listing formats. It generates various object code formats to support Microchip's development tools as well as third party programmers. MPASM allows full symbolic debugging from MPLABICE, Microchip's Universal Emulator System. MPASM has the following features to assist in developing software for specific use applications. * Provides translation of Assembler source code to object code for all Microchip microcontrollers. * Macro assembly capability. * Produces all the files (Object, Listing, Symbol, and special) required for symbolic debug with Microchip's emulator systems. * Supports Hex (default), Decimal and Octal source and listing formats. MPASM provides a rich directive language to support programming of the PICmicro. Directives are helpful in making the development of your assemble source code shorter and more maintainable.
fuzzyTECH-MP fuzzy logic development tool is available in two versions - a low cost introductory version, MP Explorer, for designers to gain a comprehensive working knowledge of fuzzy logic system design; and a full-featured version, fuzzyTECH-MP, Edition for implementing more complex systems.
Both versions include Microchip's fuzzyLABTM demonstration board for hands-on experience with fuzzy logic systems implementation.
9.15
SEEVAL(R) Evaluation and Programming System
The SEEVAL SEEPROM Designer's Kit supports all Microchip 2-wire and 3-wire Serial EEPROMs. The kit includes everything necessary to read, write, erase or program special features of any Microchip SEEPROM product including Smart SerialsTM and secure serials. The Total EnduranceTM Disk is included to aid in tradeoff analysis and reliability calculations. The total kit can significantly reduce time-to-market and result in an optimized system.
(c) 1998 Microchip Technology Inc.
DS40139D-page 53
PIC12C5XX
9.16 KEELOQ(R) Evaluation and Programming Tools
KEELOQ evaluation and programming tools support Microchips HCS Secure Data Products. The HCS evaluation kit includes an LCD display to show changing codes, a decoder to decode transmissions, and a programming interface to program test transmitters.
DS40139D-page 54
(c) 1998 Microchip Technology Inc.
Software Tools
Programmers
Demo Boards
(c) 1998 Microchip Technology Inc. DS40139D-page 55
TABLE 9-1:
PIC12C5XX Emulator Products
PIC14000
PIC16C5X PIC16CXXX PIC16C6X PIC16C7XX PIC16C8X PIC16C9XX PIC17C4X PIC17C7XX
24CXX 25CXX 93CXX
HCS200 HCS300 HCS301
MPLABTM-ICE
u
u
u
u
u
u
u
u
u
u
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PIC12C5XX
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PIC12C5XX
NOTES:
DS40139D-page 56
(c) 1998 Microchip Technology Inc.
PIC12C5XX
10.0 ELECTRICAL CHARACTERISTICS - PIC12C508/PIC12C509/ PIC12LC508/PIC12LC509
Absolute Maximum Ratings
Ambient Temperature under bias ........................................................................................................... -40C to +125C Storage Temperature.............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS .................................................................................................................0 to +7.5 V Voltage on MCLR with respect to VSS...............................................................................................................0 to +14 V Voltage on all other pins with respect to VSS ................................................................................-0.6 V to (VDD + 0.6 V) Total Power Dissipation(1) ....................................................................................................................................700 mW Max. Current out of VSS pin...................................................................................................................................200 mA Max. Current into VDD pin......................................................................................................................................150 mA Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO > VDD) ............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................25 mA Max. Output Current sourced by any I/O pin...........................................................................................................25 mA Max. Output Current sourced by I/O port (GPIO)..................................................................................................100 mA Max. Output Current sunk by I/O port (GPIO )......................................................................................................100 mA Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL)
NOTICE:
Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
DS40139D-page 57
PIC12C5XX
10.1 DC CHARACTERISTICS: PIC12C508/509 (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Sym VDD Min 2.5 3.0 RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) VDR VPOR SVDD IDD 0.05* -- -- -- -- -- IWDT -- -- -- -- -- -- 1.8 1.8 15 19 19 3.75 3.75 3.75 0.25 0.25 2 2.4 2.4 27 35 35 8 9 4 4 5 18 1.5* VSS Typ(1) Max 5.5 5.5 Units V V V V V/ms mA mA A A A A A A A A A Conditions FOSC = DC to 4 MHz (Commercial/ Industrial) FOSC = DC to 4 MHz (Extended) Device in SLEEP mode See section on Power-on Reset for details See section on Power-on Reset for details XT and EXTRC options (Note 4) FOSC = 4 MHz, VDD = 5.5V INTRC Option FOSC = 4 MHz, VDD = 5.5V LP OPTION, Commercial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Industrial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Extended Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabledVDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended VDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended
DC Characteristics Power Supply Pins
Characteristic Supply Voltage
Power-Down Current (5)
IPD
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in kOhm. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
DS40139D-page 58
(c) 1998 Microchip Technology Inc.
PIC12C5XX
10.2 DC CHARACTERISTICS: PIC12C508/509 (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 10.1 and Section 10.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS VSS VIH 2.0 0.8VDD 0.8VDD 0.8VDD 0.7VDD 0.9VDD 50 250 0.5V 0.2VDD 0.2VDD 0.3VDD V V V V Note1
DC CHARACTERISTICS
Param No.
Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT (in EXTRC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer
D030 D031 D032 D033
D040 D040A D041 D042 D042A D043 D070 D060 D061 D063
with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT OSC1 (XT, HS and LP) OSC1 (in EXTRC mode) GPIO weak pull-up current IPUR Input Leakage Current (Notes 2, 3) I/O ports IIL MCLR, GP2/T0CKI OSC1 Output Low Voltage I/O ports/CLKOUT
VDD VDD VDD VDD VDD VDD 400 +1 +5(5) +5
V V V V V V A
4.5 VDD 5.5V For VDD > 5.5V or VDD < 4.5V For entire VDD range Note1 VDD = 5V, VPIN = VSS
A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration V
D080 D080A D083 D083A Note 1: 2: 3: 4: 5:
IOL = 8.5 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C OSC2 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40C to +125C Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up.
VOL
-
-
0.6
(c) 1998 Microchip Technology Inc.
DS40139D-page 59
PIC12C5XX
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 10.1 and Section 10.2. Sym Min Typ Max Units Conditions VOH VDD - 0.7 VDD - 0.7 OSC2 VDD - 0.7 VDD - 0.7 Capacitive Loading Specs on Output Pins OSC2 pin V V V V IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C
Param No. D090 D090A D092 D092A
Characteristic Output High Voltage I/O ports/CLKOUT (Note 3)
D100
COSC2
-
-
15
pF
In XT, HS and LP modes when external clock is used to drive OSC1.
D101 Note 1: 2: 3: 4: 5:
All I/O pins and OSC2 CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up.
DS40139D-page 60
(c) 1998 Microchip Technology Inc.
PIC12C5XX
10.3 DC CHARACTERISTICS:
DC Characteristics Power Supply Pins Characteristic Supply Voltage Sym VDD
PIC12LC508/509 (Commercial, Industrial)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min 2.5 3.0 Typ(1) Max 5.5 5.5 1.5* VSS 0.05* -- -- -- -- -- 1.8 1.8 15 19 19 3.75 3.75 3.75 0.25 0.25 2 2.4 2.4 27 35 35 8 9 4 4 5 18 Units V V V V V/ms mA mA A A A A A A A A A Conditions FOSC = DC to 4 MHz (Commercial/ Industrial) FOSC = DC to 4 MHz (Extended) Device in SLEEP mode See section on Power-on Reset for details See section on Power-on Reset for details XT and EXTRC options (Note 4) FOSC = 4 MHz, VDD = 5.5V INTRC Option FOSC = 4 MHz, VDD = 5.5V LP OPTION, Commercial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Industrial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Extended Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabledVDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended VDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended
RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3)
VDR VPOR SVDD IDD
IWDT
-- -- -- -- -- --
Power-Down Current (5)
IPD
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in kOhm. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
(c) 1998 Microchip Technology Inc.
DS40139D-page 61
PIC12C5XX
10.4 DC CHARACTERISTICS: PIC12LC508/509 (Commercial, Industrial)
Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 10.1 and Section 10.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS VSS VIH 2.0 0.8VDD 0.8VDD 0.8VDD 0.7VDD 0.9VDD 50 250 0.5V 0.2VDD 0.2VDD 0.3VDD V V V V Note1
DC CHARACTERISTICS
Param No.
Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT (in EXTRC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer
D030 D031 D032 D033
D040 D040A D041 D042 D042A D043 D070 D060 D061 D063
with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT OSC1 (XT, HS and LP) OSC1 (in EXTRC mode) GPIO weak pull-up current IPUR Input Leakage Current (Notes 2, 3) I/O ports IIL MCLR, GP2/T0CKI OSC1 Output Low Voltage I/O ports/CLKOUT
VDD VDD VDD VDD VDD VDD 400 +1 +5(5) +5
V V V V V V A
4.5 VDD 5.5V For VDD > 5.5V or VDD < 4.5V For entire VDD range Note1 VDD = 5V, VPIN = VSS
A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration V
D080 D080A D083 D083A Note 1: 2: 3: 4: 5:
IOL = 8.5 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C OSC2 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40C to +125C Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up.
VOL
-
-
0.6
DS40139D-page 62
(c) 1998 Microchip Technology Inc.
PIC12C5XX
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 10.1 and Section 10.2. Sym Min Typ Max Units Conditions VOH VDD - 0.7 VDD - 0.7 OSC2 VDD - 0.7 VDD - 0.7 Capacitive Loading Specs on Output Pins OSC2 pin V V V V IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C
Param No. D090 D090A D092 D092A
Characteristic Output High Voltage I/O ports/CLKOUT (Note 3)
D100
COSC2
-
-
15
pF
In XT, HS and LP modes when external clock is used to drive OSC1.
D101 Note 1: 2: 3: 4: 5:
All I/O pins and OSC2 CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up.
(c) 1998 Microchip Technology Inc.
DS40139D-page 63
PIC12C5XX
TABLE 10-1:
VDD (Volts) 2.5
PULL-UP RESISTOR RANGES - PIC12C508/C509
Temperature (C) -40 25 85 125 -40 25 85 125 -40 25 85 125 -40 25 85 125 Min GP0/GP1 38K 42K 42K 50K 15K 18K 19K 22K GP3 285K 343K 368K 431K 247K 288K 306K 351K 42K 48K 49K 55K 17K 20K 22K 24K 346K 414K 457K 504K 292K 341K 371K 407K 63K 63K 63K 63K 20K 23K 25K 28K 417K 532K 532K 593K 360K 437K 448K 500K Typ Max Units
5.5
2.5
5.5
*
These parameters are characterized but not tested.
DS40139D-page 64
(c) 1998 Microchip Technology Inc.
PIC12C5XX
10.5 Timing Parameter Symbology and Load Conditions - PIC12C508/C509
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F pp 2 ck cy drt io S F H I L Fall High Invalid (Hi-impedance) Low P R V Z Period Rise Valid Hi-impedance to CLKOUT cycle time device reset timer I/O port mc osc os t0 wdt MCLR oscillator OSC1 T0CKI watchdog timer Frequency T Time Lowercase subscripts (pp) and their meanings:
Uppercase letters and their meanings:
FIGURE 10-1: LOAD CONDITIONS - PIC12C508/C509
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP modes when external clock is used to drive OSC1
(c) 1998 Microchip Technology Inc.
DS40139D-page 65
PIC12C5XX
10.6 Timing Diagrams and Specifications FIGURE 10-2: EXTERNAL CLOCK TIMING - PIC12C508/C509
Q4 OSC1 1 2 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 10-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC12C508/C509
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial), -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Characteristic
External CLKIN Frequency(2) DC DC Oscillator Frequency
(2)
AC Characteristics
Parameter No.
Sym
FOSC
Min
Typ(1)
Max
Units
Conditions
-- -- -- -- -- -- -- -- -- -- 4/FOSC -- -- -- --
4 200 4 200 -- -- -- -- 10,000 -- -- -- -- 25* 50*
MHz XT osc mode kHz LP osc mode
0.1 DC 1 TOSC External CLKIN Period
(2)
MHz XT osc mode kHz ns ns ms ns ns ms -- ns ms ns ns XT oscillator LP oscillator XT oscillator LP oscillator LP osc mode EXTRC osc mode XT osc mode LP osc mode EXTRC osc mode XT osc mode LP osc mode
250 250 5
Oscillator Period(2)
250 250 5
2 3 4
Tcy
Instruction Cycle Time(3)
-- 50* 2* -- --
TosL, TosH Clock in (OSC1) Low or High Time TosR, TosF Clock in (OSC1) Rise or Fall Time
* These parameters are characterized but not tested.
Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS40139D-page 66
(c) 1998 Microchip Technology Inc.
PIC12C5XX
TABLE 10-3: CALIBRATED INTERNAL RC FREQUENCIES - PIC12C508/C509
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial), -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Characteristic
Internal Calibrated RC Frequency Internal Calibrated RC Frequency * These parameters are characterized but not tested.
AC Characteristics
Parameter No.
Sym
Min* Typ(1)
3.64 3.51 4.00 4.00
Max* Units
4.32 4.26
Conditions
MHz VDD = 5.0V MHz VDD = 2.5V
Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
FIGURE 10-3:
I/O TIMING - PIC12C508/C509
Q4 Q1 Q2 Q3
OSC1
I/O Pin (input)
17 19 18 New Value 20, 21
I/O Pin (output)
Old Value
Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
(c) 1998 Microchip Technology Inc.
DS40139D-page 67
PIC12C5XX
TABLE 10-4: TIMING REQUIREMENTS - PIC12C508/C509
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Characteristic OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- TBD TBD -- -- Typ(1) -- -- -- 10 10 Max 100* -- -- 25** 25** Units ns ns ns ns ns AC Characteristics
Parameter No. 17 18 19 20 21
Sym TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in EXTRC mode. 3: See Figure 10-1 for loading conditions.
FIGURE 10-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING - PIC12C508/C509
VDD MCLR 30 Internal POR 32 DRT Timeout (Note 2) Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1) 34
32
32
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software. 2: Runs in MCLR or WDT reset only in XT and LP modes.
DS40139D-page 68
(c) 1998 Microchip Technology Inc.
PIC12C5XX
TABLE 10-5: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC12C508/C509
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Parameter No.
30 31
Sym TmcL Twdt TDRT TioZ
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period(2) I/O Hi-impedance from MCLR Low
Min 2000* 9* 9* --
Typ(1) -- 18* 18* --
Max -- 30* 30* 2000*
Units ns ms ms ns
Conditions VDD = 5 V VDD = 5 V (Commercial) VDD = 5 V (Commercial)
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
TABLE 10-6:
DRT (DEVICE RESET TIMER PERIOD - PIC12C508/C509)
POR Reset 18 ms (typical) 18 ms (typical) Subsequent Resets 300 s (typical) 18 ms (typical)
Oscillator Configuration IntRC & ExtRC XT & LP
(c) 1998 Microchip Technology Inc.
DS40139D-page 69
PIC12C5XX
FIGURE 10-5: TIMER0 CLOCK TIMINGS - PIC12C508/C509
T0CKI 40 41
42
TABLE 10-7:
TIMER0 CLOCK REQUIREMENTS - PIC12C508/C509
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1. Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS40139D-page 70
(c) 1998 Microchip Technology Inc.
PIC12C5XX
NOTES:
(c) 1998 Microchip Technology Inc.
DS40139D-page 71
PIC12C5XX
DS40139D-page 72
(c) 1998 Microchip Technology Inc.
PIC12C5XX
11.0 DC AND AC CHARACTERISTICS - PIC12C508/PIC12C509/ PIC12LC508/PIC12LC509
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information only and devices will operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time. "Typical" represents the mean of the distribution while "max" or "min" represents (mean + 3) and (mean - 3) respectively, where is standard deviation.
FIGURE 11-1: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 2.5V)
Calibrated Internal RC Frequency Range vs Temperature (Vdd=2.5V)
4.45
4.25
4.05 Frequency (Mhz)
3.85
3.65
3.45
3.25 -40 25 Temperature (Deg C) 85 125
(c) 1998 Microchip Technology Inc.
DS40139D-page 73
PIC12C5XX
FIGURE 11-2: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 5.0V)
Calibrated Internal RC Frequency Range vs Temperature (Vdd=5.0V)
FIGURE 11-3: WDT TIMER TIME-OUT PERIOD vs. VDD
50 45 40
Frequency (Mhz)
35 WDT period (mS) 30
Max +125C
25 20
Max +85C
25 Temperature (Deg C)
85
Typ +25C
15 10
TABLE 11-1:
Oscillator
DYNAMIC IDD (TYPICAL) WDT ENABLED, 25C
Frequency VDD = 2.5V
MIn -40C
5 2 VDD = 5.5V 620 A* 1.1 mA 775 A 37 A 3 4 5 VDD (Volts) 6 7
External RC 4 MHz 250 A* Internal RC 4 MHz 420 A XT 4 MHz 251 A LP 32 KHz 7 A *Does not include current through external R&C.
DS40139D-page 74
(c) 1998 Microchip Technology Inc.
PIC12C5XX
FIGURE 11-4: SHORT DRT PERIOD VS. VDD
1000 900
-5
FIGURE 11-6: IOH vs. VOH, VDD = 5.5 V
0
800 700 WDT period (s) 600 IOH (mA)
Max +125C Max +85C
-10
-15
C
500 400 300 200
M
M in
Ty p
+8
+2
-30
MIn -40C
3.5
M
ax
-4
Typ +25C
0
-25
4.0
C
5
C
5 C
-20
in
+1
25
4.5
5.0
5.5
100 2 3 4 5 VDD (Volts) 6 7
VOH (Volts)
FIGURE 11-5: IOH vs. VOH, VDD = 2.5 V
0
FIGURE 11-7: IOL vs. VOL, VDD = 2.5 V
25
-1
20
Max -40C
-2
15 IOH (mA) IOL (mA)
-3
Typ +25C
-4
C +125
10
Min
Min +85C
-5
Min +
85C
5
-6
Typ +25C
Max -40C
Min +125C
-7 500m
1.0
1.5
2.0
2.5
0 0 250.0m 500.0m 1.0 VOL (Volts)
VOH (Volts)
(c) 1998 Microchip Technology Inc.
DS40139D-page 75
PIC12C5XX
FIGURE 11-8: IOL vs. VOL, VDD = 5.5 V
50
Max -40C
40
30 IOL (mA)
Typ +25C
20
Min +85C
Min +125C
10
0 250.0m 500.0m 750.0m 1.0 VOL (Volts)
NOTES:
DS40139D-page 76
(c) 1998 Microchip Technology Inc.
PIC12C5XX
12.0 ELECTRICAL CHARACTERISTICS - PIC12C508A/PIC12C509A/ PIC12LC508A/PIC12LC509A
Absolute Maximum Ratings
Ambient Temperature under bias ........................................................................................................... -40C to +125C Storage Temperature.............................................................................................................................. -65C to +150C Voltage on VDD with respect to VSS .................................................................................................................0 to +7.0 V Voltage on MCLR with respect to VSS...............................................................................................................0 to +14 V Voltage on all other pins with respect to VSS ................................................................................-0.6 V to (VDD + 0.6 V) Total Power Dissipation(1) ....................................................................................................................................700 mW Max. Current out of VSS pin...................................................................................................................................200 mA Max. Current into VDD pin......................................................................................................................................150 mA Input Clamp Current, IIK (VI < 0 or VI > VDD) ....................................................................................................................20 mA Output Clamp Current, IOK (VO < 0 or VO > VDD) ............................................................................................................20 mA Max. Output Current sunk by any I/O pin ................................................................................................................25 mA Max. Output Current sourced by any I/O pin...........................................................................................................25 mA Max. Output Current sourced by I/O port (GPIO)..................................................................................................100 mA Max. Output Current sunk by I/O port (GPIO )......................................................................................................100 mA Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOL x IOL)
NOTICE:
Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 77
PIC12C5XX
12.1 DC CHARACTERISTICS: PIC12C508A/509A (Commercial) PIC12C508A/509A (Industrial) PIC12C508A/509A (Extended)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Sym VDD VDR VPOR SVDD IDD 0.05* -- -- -- -- -- IWDT -- -- -- -- -- -- 0.6 0.6 15 19 19 3.75 3.75 3.75 0.25 0.25 2 1.4 1.4 27 35 35 8 9 4 4 5 18 Min 3.0 1.5* VSS Typ(1) Max 5.5 Units V V V V/ms mA mA A A A A A A A A A Conditions FOSC = DC to 4 MHz (Commercial/ Industrial, Extended) Device in SLEEP mode See section on Power-on Reset for details See section on Power-on Reset for details XT and EXTRC options (Note 4) FOSC = 4 MHz, VDD = 5.5V INTRC Option FOSC = 4 MHz, VDD = 5.5V LP OPTION, Commercial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Industrial Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled LP OPTION, Extended Temperature FOSC = 32 kHz, VDD = 3.0V, WDT disabled VDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended VDD = 3.0V, Commercial VDD = 3.0V, Industrial VDD = 3.0V, Extended
DC Characteristics Power Supply Pins
Characteristic Supply Voltage RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3)
Power-Down Current (5)
IPD
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in kOhm. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
DS40139D-page 78
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
12.2 DC CHARACTERISTICS:
DC Characteristics Power Supply Pins Characteristic Supply Voltage RAM Data Retention Voltage(2) VDD Start Voltage to ensure Power-on Reset VDD Rise Rate to ensure Power-on Reset Supply Current(3) Sym VDD VDR VPOR SVDD IDD 0.05* -- -- -- -- IWDT Power-Down Current (5) IPD -- -- TBD TBD TBD TBD A A VDD = 2.5V, Commercial VDD = 2.5V, Industrial TBD TBD TBD TBD TBD TBD TBD TBD
PIC12LC508A/509A (Commercial, Industrial)
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Min 2.5 1.5* VSS Typ(1) Max 5.5 Units V V V V/ms mA mA A A A Conditions FOSC = DC to 4 MHz (Commercial/ Industrial) Device in SLEEP mode See section on Power-on Reset for details See section on Power-on Reset for details XT and EXTRC options (Note 4) FOSC = 4 MHz, VDD = 2.5V INTRC Option FOSC = 4 MHz, VDD = 2.5V LP OPTION, Commercial Temperature FOSC = 32 kHz, VDD = 2.5V, WDT disabled LP OPTION, Industrial Temperature FOSC = 32 kHz, VDD = 2.5V, WDT disabled
--
TBD
TBD
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to Vss, T0CKI = VDD, MCLR = VDD; WDT enabled/disabled as specified. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: Does not include current through Rext. The current through the resistor can be estimated by the formula: IR = VDD/2Rext (mA) with Rext in kOhm. 5: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 79
PIC12C5XX
12.3 DC CHARACTERISTICS: PIC12C508A/509A (Commercial, Industrial, Extended)
Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 12.1 and Section 12.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS VSS VIH 2.0 0.8VDD 0.8VDD 0.8VDD 0.7VDD 0.9VDD 50 250 0.5V 0.2VDD 0.2VDD 0.3VDD V V V V Note1
DC CHARACTERISTICS
Param No.
Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT (in EXTRC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer
D030 D031 D032 D033
D040 D040A D041 D042 D042A D043 D070 D060 D061 D063
with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT OSC1 (XT, HS and LP) OSC1 (in EXTRC mode) GPIO weak pull-up current IPUR Input Leakage Current (Notes 2, 3) I/O ports IIL MCLR, GP2/T0CKI OSC1 Output Low Voltage I/O ports/CLKOUT
VDD VDD VDD VDD VDD VDD 400 +1 +5(5) +5
V V V V V V A
4.5 VDD 5.5V For VDD > 5.5V or VDD < 4.5V For entire VDD range Note1 VDD = 5V, VPIN = VSS
A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration V
D080 D080A D083 D083A Note 1: 2: 3: 4: 5:
IOL = 8.5 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C OSC2 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40C to +125C Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up.
VOL
-
-
0.6
DS40139D-page 80
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating voltage VDD range as described in DC spec Section 12.1 and Section 12.2. Sym Min Typ Max Units Conditions VOH VDD - 0.7 VDD - 0.7 OSC2 VDD - 0.7 VDD - 0.7 Capacitive Loading Specs on Output Pins OSC2 pin V V V V IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C
Param No. D090 D090A D092 D092A
Characteristic Output High Voltage I/O ports/CLKOUT (Note 3)
D100
COSC2
-
-
15
pF
In XT, HS and LP modes when external clock is used to drive OSC1.
D101 Note 1: 2: 3: 4: 5:
All I/O pins and OSC2 CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C5XX be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up.
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 81
PIC12C5XX
12.4 DC CHARACTERISTICS: PIC12LC508A/509A (Commercial, Industrial)
Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 12.1 and Section 12.2. Sym Min Typ Max Units Conditions VIL VSS VSS VSS VSS VIH TBD TBD 0.8VDD 0.8VDD 0.7VDD 0.9VDD 50 TBD TBD TBD 250 TBD TBD TBD 0.5V 0.2VDD 0.2VDD 0.3VDD V V V V Note1
DC CHARACTERISTICS
Param No.
Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT (in EXTRC mode) OSC1 (in XT, HS and LP) Input High Voltage I/O ports with TTL buffer
D030 D031 D032 D033
D040 D040A D041 D042 D042A D043 D070 D060 D061 D063
with Schmitt Trigger buffer MCLR, GP2/T0CKI/AN2/INT OSC1 (XT, HS and LP) OSC1 (in EXTRC mode) GPIO weak pull-up current IPUR Input Leakage Current (Notes 2, 3) I/O ports IIL MCLR, GP2/T0CKI OSC1 Output Low Voltage I/O ports/CLKOUT
VDD VDD VDD VDD VDD VDD 400 TBD TBD TBD
V V V V V V A
4.5 VDD 5.5V For VDD > 5.5V or VDD < 4.5V For entire VDD range Note1 VDD = 5V, VPIN = VSS
A Vss VPIN VDD, Pin at hiimpedance A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration V
D080 D080A D083 D083A Note 1: 2: 3: 4: 5:
IOL = 8.5 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 7.0 mA, VDD = 4.5V, -40C to +125C OSC2 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40C to +85C 0.6 V IOL = 1.2 mA, VDD = 4.5V, -40C to +125C Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C67X be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up.
VOL
-
-
TBD
DS40139D-page 82
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating temperature 0C TA +70C (commercial) -40C TA +85C (industrial) Operating voltage VDD range as described in DC spec Section 12.1 and Section 12.2. Sym Min Typ Max Units Conditions VOH VDD - 0.7 VDD - 0.7 OSC2 VDD - 0.7 VDD - 0.7 Capacitive Loading Specs on Output Pins OSC2 pin V V V V IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C
Param No. D090 D090A D092 D092A
Characteristic Output High Voltage I/O ports/CLKOUT (Note 3)
D100
COSC2
-
-
15
pF
In XT, HS and LP modes when external clock is used to drive OSC1.
D101 Note 1: 2: 3: 4: 5:
All I/O pins and OSC2 CIO 50 pF Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. In EXTRC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC12C67X be driven with external clock in RC mode. The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. Negative current is defined as coming out of the pin. Extended operating range is Advance Information for this device. When configured as external reset, the input leakage current is the weak pulll-up current of -10mA minimum. This pull-up is weaker than the standard I/O pull-up.
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 83
PIC12C5XX
TABLE 12-1:
VDD (Volts) 2.5
PULL-UP RESISTOR RANGES - PIC12C508A/C509A
Temperature (C) -40 25 85 125 -40 25 85 125 -40 25 85 125 -40 25 85 125 Min GP0/GP1 38K 42K 42K 50K 15K 18K 19K 22K GP3 285K 343K 368K 431K 247K 288K 306K 351K 42K 48K 49K 55K 17K 20K 22K 24K 346K 414K 457K 504K 292K 341K 371K 407K 63K 63K 63K 63K 20K 23K 25K 28K 417K 532K 532K 593K 360K 437K 448K 500K Typ Max Units
5.5
2.5
5.5
*
These parameters are characterized but not tested.
DS40139D-page 84
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
12.5 Timing Parameter Symbology and Load Conditions - PIC12C508A/C509A
The timing parameter symbols have been created following one of the following formats: 1. TppS2ppS 2. TppS T F pp 2 ck cy drt io S F H I L Fall High Invalid (Hi-impedance) Low P R V Z Period Rise Valid Hi-impedance to CLKOUT cycle time device reset timer I/O port mc osc os t0 wdt MCLR oscillator OSC1 T0CKI watchdog timer Frequency T Time Lowercase subscripts (pp) and their meanings:
Uppercase letters and their meanings:
FIGURE 12-1: LOAD CONDITIONS - PIC12C508A/C509A
Pin CL VSS
CL = 50 pF for all pins except OSC2 15 pF for OSC2 in XT, HS or LP modes when external clock is used to drive OSC1
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 85
PIC12C5XX
12.6 Timing Diagrams and Specifications FIGURE 12-2: EXTERNAL CLOCK TIMING - PIC12C508A/C509A
Q4 OSC1 1 2 3 3 4 4 Q1 Q2 Q3 Q4 Q1
TABLE 12-2:
EXTERNAL CLOCK TIMING REQUIREMENTS - PIC12C508A/C509A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial), -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 12.1 Characteristic
External CLKIN Frequency(2) DC DC Oscillator Frequency
(2)
AC Characteristics
Parameter No.
Sym
FOSC
Min
Typ(1)
Max
Units
Conditions
-- -- -- -- -- -- -- -- -- -- 4/FOSC -- -- -- --
4 200 4 4 200 -- -- -- 10,000 -- -- -- -- 25* 50*
MHz XT osc mode kHz LP osc mode MHz EXTRC osc mode MHz XT osc mode kHz ns ms ns ns ms -- ns ms ns ns XT oscillator LP oscillator XT oscillator LP oscillator LP osc mode XT osc mode LP osc mode EXTRC osc mode XT osc mode LP osc mode
DC 0.1 DC
1
TOSC
External CLKIN Period
(2)
250 5 Oscillator Period(2) 250 250 5 2 3 4 Tcy Instruction Cycle Time(3) -- 50* 2* TosR, TosF Clock in (OSC1) Rise or Fall Time -- --
* These parameters are characterized but not tested.
TosL, TosH Clock in (OSC1) Low or High Time
Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. When an external clock input is used, the "max" cycle time limit is "DC" (no clock) for all devices. 3: Instruction cycle period (TCY) equals four times the input oscillator time base period.
DS40139D-page 86
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
TABLE 12-3: CALIBRATED INTERNAL RC FREQUENCIES - PIC12C508A/C509A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial), -40C TA +85C (industrial), -40C TA +125C (extended) Operating Voltage VDD range is described in Section 10.1 Characteristic
Internal Calibrated RC Frequency Internal Calibrated RC Frequency * These parameters are characterized but not tested.
AC Characteristics
Parameter No.
Sym
Min* Typ(1)
TBD TBD 4.00 4.00
Max* Units
TBD TBD
Conditions
MHz VDD = 5.0V MHz VDD = 2.5V
Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 87
PIC12C5XX
FIGURE 12-3: I/O TIMING - PIC12C508A/C509A
Q4 OSC1 Q1 Q2 Q3
I/O Pin (input)
17 19 18 New Value 20, 21
I/O Pin (output)
Old Value
Note: All tests must be done with specified capacitive loads (see data sheet) 50 pF on I/O pins and CLKOUT.
TABLE 12-4:
TIMING REQUIREMENTS - PIC12C508A/C509A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 12.1 Characteristic OSC1 (Q1 cycle) to Port out valid(3) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) Port input valid to OSC1 (I/O in setup time) Port output rise time(3) Port output fall time(3) Min -- TBD TBD -- -- Typ(1) -- -- -- 10 10 Max 100* -- -- 25** 25** Units ns ns ns ns ns
AC Characteristics
Parameter No. 17 18 19 20 21
Sym TosH2ioV TosH2ioI TioV2osH TioR TioF
* These parameters are characterized but not tested. ** These parameters are design targets and are not tested. No characterization data available at this time. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: Measurements are taken in EXTRC mode. 3: See Figure 12-1 for loading conditions.
DS40139D-page 88
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
FIGURE 12-4: RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER TIMING PIC12C508A/C509A
VDD MCLR 30 Internal POR 32 DRT Timeout (Note 2) Internal RESET Watchdog Timer RESET 31 34 I/O pin (Note 1) 34
32
32
Note 1: I/O pins must be taken out of hi-impedance mode by enabling the output drivers in software. 2: Runs in MCLR or WDT reset only in XT and LP modes.
TABLE 12-5:
RESET, WATCHDOG TIMER, AND DEVICE RESET TIMER - PIC12C508A/C509A
AC Characteristics Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 12.1 Parameter No.
30 31
Sym TmcL Twdt TDRT TioZ
Characteristic MCLR Pulse Width (low) Watchdog Timer Time-out Period (No Prescaler) Device Reset Timer Period(2) I/O Hi-impedance from MCLR Low
Min 2000* 9* 9* --
Typ(1) -- 18* 18* --
Max -- 30* 30* 2000*
Units ns ms ms ns
Conditions VDD = 5 V VDD = 5 V (Commercial) VDD = 5 V (Commercial)
32 34
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 89
PIC12C5XX
TABLE 12-6: DRT (DEVICE RESET TIMER PERIOD) - PIC12C508A/C509A
POR Reset 18 ms (typical) 18 ms (typical) Subsequent Resets 300 s (typical) 18 ms (typical) Oscillator Configuration IntRC & ExtRC XT & LP
FIGURE 12-5: TIMER0 CLOCK TIMINGS - PIC12C508A/C509A
T0CKI 40 41
42
TABLE 12-7:
TIMER0 CLOCK REQUIREMENTS - PIC12C508A/C509A
Standard Operating Conditions (unless otherwise specified) Operating Temperature 0C TA +70C (commercial) -40C TA +85C (industrial) -40C TA +125C (extended) Operating Voltage VDD range is described in Section 12.1. Min
0.5 TCY + 20* 10* 0.5 TCY + 20* 10* 20 or TCY + 40* N
AC Characteristics
Parameter Sym Characteristic No.
40 Tt0H T0CKI High Pulse Width - No Prescaler - With Prescaler 41 Tt0L T0CKI Low Pulse Width - No Prescaler - With Prescaler 42 Tt0P T0CKI Period
Typ(1) Max Units Conditions
-- -- -- -- -- -- -- -- -- -- ns ns ns ns ns Whichever is greater. N = Prescale Value (1, 2, 4,..., 256)
* These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested.
DS40139D-page 90
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
13.0 DC AND AC CHARACTERISTICS - PIC12C508A/PIC12C509A/ PIC12LC508A/PIC12LC509A
The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables the data presented are outside specified operating range (e.g., outside specified VDD range). This is for information only and devices will operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time. "Typical" represents the mean of the distribution while "max" or "min" represents (mean + 3) and (mean - 3) respectively, where is standard deviation.
FIGURE 13-1: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 5.0V) (INTERNAL RC IS CALIBRATED TO 25C, 5.0V)
Not available at this time.
FIGURE 13-2: CALIBRATED INTERNAL RC FREQUENCY RANGE VS. TEMPERATURE (VDD = 2.5V) (INTERNAL RC IS CALIBRATED TO 25C, 5.0V)
Not available at this time.
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 91
PIC12C5XX
TABLE 13-1:
Oscillator
DYNAMIC IDD (TYPICAL) - WDT ENABLED, 25C
Frequency VDD =3.0V VDD = 5.5V 620 A* 1.1 mA 775 A 37 A
External RC 4 MHz 300 A* Internal RC 4 MHz 520 A XT 4 MHz 300 A LP 32 KHz 10 A *Does not include current through external R&C.
FIGURE 13-3: WDT TIMER TIME-OUT PERIOD vs. VDD
50
FIGURE 13-4: SHORT DRT PERIOD VS. VDD
1000 900
45 800 40 700 WDT period (mS) WDT period (s) 35 30 600
500 400 300 200
25 20 15 10 5 2 3 4 5 VDD (Volts)
Max +125C Max +85C
Max +125C Max +85C Typ +25C
Typ +25C
MIn -40C
MIn -40C
100 2 6 7 3 4 5 VDD (Volts) 6 7
DS40139D-page 92
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
FIGURE 13-5: IOH vs. VOH, VDD = 2.5 V
0
FIGURE 13-7: IOL vs. VOL, VDD = 2.5 V
35
30
-5
TBD
25
-10
TBD
IOL (mA) 20
IOH (mA)
-15
15
-20
10
-25
5
-30 1.5 2.0 2.5 3.0 3.5
0 0 500.0m 750.0m 1.0 VOH (Volts) VOL (Volts)
FIGURE 13-6: IOH vs. VOH, VDD = 3.5 V
0
FIGURE 13-8: IOL vs. VOL, VDD = 3.5 V
35
-5
30
-10
IOH (mA)
M
+ in
12
5C C
25
ax -4 0 C
-15
Mi Ty
-20
Ma
x
0C -4
15
-25
10
-30 1.5 2.0 2.5 3.0 3.5
5 VOH (Volts)
0 0 500.0m 750.0m 1.0 VOL (Volts)
(c) 1998 Microchip Technology Inc.
Preliminary
Ty p
C 25 p+
IOL (mA)
85 n+
20
M
C C 5 +8 125 in n + M i M
+2 5
C
DS40139D-page 93
PIC12C5XX
FIGURE 13-9: IOH vs. VOH, VDD = 5.5 V
0
FIGURE 13-10: IOL vs. VOL, VDD = 5.5 V
50
-5
Max -40C
40
-10
IOH (mA)
30
-15
C
Typ +25C
IOL (mA)
M
M in
+8
C
5 C
-20
in
+1
25
20
Min +85C
Ty p
+2
0
-25
C
5
Min +125C
-30 3.5 4.0 4.5 5.0 5.5
M
ax
-4
10
0 250.0m 500.0m 750.0m 1.0 VOL (Volts)
VOH (Volts)
DS40139D-page 94
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
14.0
14.1
PACKAGING INFORMATION
Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXCDE AABB Example 12C508A 04I/PSAZ 9825
8-Lead SOIC (150 mil) XXXXXXX XXXX 8-Lead SOIC (208 mil) XXXXXXX XXXXXXX AABBCDE
Example C508A 9825 Example 12C508A 04I/SM 9824SAZ
8-Lead Windowed Ceramic Side Brazed (300 mil) XXX
Example JW
XXXXXX
12C508A
Legend: MM...M XX...X AA BB C
D E Note:
Microchip part number information Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Facility code of the plant at which wafer is manufactured O = Outside Vendor C = 5" Line S = 6" Line H = 8" Line Mask revision number Assembly code of the plant or country of origin in which part was assembled
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
(c) 1998 Microchip Technology Inc.
DS40139D-page 95
PIC12C5XX
Package Type: K04-018 8-Lead Plastic Dual In-line (P) - 300 mil
E
D 2 1 E1
n
A A1
R
c
L A2
eB Units Dimension Limits PCB Row Spacing Number of Pins Pitch Lower Lead Width Upper Lead Width Shoulder Radius Lead Thickness Top to Seating Plane Top of Lead to Seating Plane Base to Seating Plane Tip to Seating Plane Package Length Molded Package Width Radius to Radius Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter.
B1 p B INCHES* NOM 0.300 8 0.100 0.018 0.014 0.060 0.055 0.005 0.000 0.012 0.006 0.150 0.140 0.080 0.060 0.020 0.005 0.130 0.120 0.370 0.355 0.250 0.245 0.280 0.267 0.310 0.342 5 10 5 10 MILLIMETERS NOM MAX 7.62 8 2.54 0.56 0.36 0.46 1.65 1.40 1.52 0.25 0.00 0.13 0.38 0.20 0.29 4.06 3.56 3.81 2.54 1.52 2.03 0.89 0.13 0.51 3.56 3.05 3.30 9.78 9.02 9.40 6.60 6.22 6.35 7.42 6.78 7.10 7.87 8.67 9.65 5 10 15 5 10 15
MIN n p B B1 R c A A1 A2 L D E E1 eB
MAX
MIN
0.022 0.065 0.010 0.015 0.160 0.100 0.035 0.140 0.385 0.260 0.292 0.380 15 15
Dimension "B1" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B1." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
DS40139D-page 96
(c) 1998 Microchip Technology Inc.
PIC12C5XX
Package Type: K04-057 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil
E1 E
p D 2 B n 1
45
X
L c R2 A A1
R1 L1
A2
Units Dimension Limits Pitch Number of Pins Overall Pack. Height Shoulder Height Standoff Molded Package Length Molded Package Width Outside Dimension Chamfer Distance Shoulder Radius Gull Wing Radius Foot Length Foot Angle Radius Centerline Lead Thickness Lower Lead Width Mold Draft Angle Top Mold Draft Angle Bottom
*
MIN p n A A1 A2 D E E1 X R1 R2 L L1 c B
INCHES* NOM 0.050 8 0.061 0.054 0.035 0.027 0.007 0.004 0.193 0.189 0.154 0.150 0.237 0.229 0.015 0.010 0.005 0.005 0.005 0.005 0.016 0.011 0 4 0.005 0.000 0.008 0.009 0.014 0.017 12 0 12 0
MAX
MIN
0.069 0.044 0.010 0.196 0.157 0.244 0.020 0.010 0.010 0.021 8 0.010 0.010 0.020 15 15
MILLIMETERS NOM MAX 1.27 8 1.56 1.37 1.75 0.69 0.90 1.11 0.10 0.18 0.25 4.80 4.89 4.98 3.81 3.90 3.99 5.82 6.01 6.20 0.25 0.38 0.51 0.13 0.13 0.25 0.13 0.13 0.25 0.28 0.41 0.53 8 0 4 0.00 0.13 0.25 0.22 0.25 0.19 0.36 0.43 0.51 0 12 15 0 12 15
Controlling Parameter. Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
(c) 1998 Microchip Technology Inc.
DS40139D-page 97
PIC12C5XX
Package Type: K04-056 8-Lead Plastic Small Outline (SM) - Medium, 208 mil
E1 E
p D 2 n B L c R2 A A1 1
R1 L1
A2
Units Dimension Limits Pitch Number of Pins Overall Pack. Height Shoulder Height Standoff Molded Package Length Molded Package Width Outside Dimension Shoulder Radius Gull Wing Radius Foot Length Foot Angle Radius Centerline Lead Thickness Lower Lead Width Mold Draft Angle Top Mold Draft Angle Bottom
*
MIN p n A A1 A2 D E E1 R1 R2 L L1 c B
INCHES* NOM 0.050 8 0.070 0.074 0.037 0.042 0.002 0.005 0.200 0.205 0.203 0.208 0.313 0.300 0.005 0.005 0.005 0.005 0.016 0.011 0 4 0.015 0.010 0.008 0.009 0.014 0.017 0 12 12 0
MAX
MIN
0.079 0.048 0.009 0.210 0.213 0.325 0.010 0.010 0.021 8 0.020 0.010 0.020 15 15
MILLIMETERS NOM MAX 1.27 8 2.00 1.89 1.78 1.21 0.94 1.08 0.22 0.05 0.14 5.08 5.33 5.21 5.16 5.41 5.28 7.62 7.94 8.26 0.13 0.13 0.25 0.13 0.13 0.25 0.28 0.41 0.53 8 0 4 0.25 0.38 0.51 0.19 0.22 0.25 0.36 0.43 0.51 0 12 15 0 12 15
Controlling Parameter. Dimension "B" does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003" (0.076 mm) per side or 0.006" (0.152 mm) more than dimension "B." Dimensions "D" and "E" do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions "D" or "E."
DS40139D-page 98
(c) 1998 Microchip Technology Inc.
PIC12C5XX
Package Type: K04-084 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) - 300 mil
E
W
T 2 n 1
D
U
A
A1
L A2 c eB B1 p B
Units Dimension Limits PCB Row Spacing Number of Pins Pitch Lower Lead Width Upper Lead Width Lead Thickness Top to Seating Plane Top of Body to Seating Plane Base to Seating Plane Tip to Seating Plane Package Length Package Width Overall Row Spacing Window Diameter Lid Length Lid Width * Controlling Parameter.
MIN n p B B1 c A A1 A2 L D E eB W T U
0.098 0.016 0.050 0.008 0.145 0.103 0.025 0.130 0.510 0.280 0.310 0.161 0.440 0.260
INCHES* NOM 0.300 8 0.100 0.018 0.055 0.010 0.165 0.123 0.035 0.140 0.520 0.290 0.338 0.166 0.450 0.270
MAX
MIN
0.102 0.020 0.060 0.012 0.185 0.143 0.045 0.150 0.530 0.300 0.365 0.171 0.460 0.280
MILLIMETERS NOM MAX 7.62 8 2.54 2.49 2.59 0.41 0.51 0.46 1.27 1.40 1.52 0.20 0.25 0.30 3.68 4.70 4.19 3.12 2.62 3.63 0.89 0.64 1.14 3.56 3.30 3.81 12.95 13.21 13.46 7.11 7.37 7.62 7.87 9.27 8.57 4.09 4.34 4.22 11.18 11.68 11.43 6.60 7.11 6.86
(c) 1998 Microchip Technology Inc.
DS40139D-page 99
PIC12C5XX
DS40139D-page 100
(c) 1998 Microchip Technology Inc.
PIC12C5XX
INDEX A
ALU ....................................................................................... 9 Applications........................................................................... 4 Architectural Overview .......................................................... 9 Assembler MPASM Assembler..................................................... 53
O
OPTION Register ............................................................... 17 OSC selection..................................................................... 27 OSCCAL Register .............................................................. 18 Oscillator Configurations .................................................... 28 Oscillator Types HS............................................................................... 28 LP ............................................................................... 28 RC .............................................................................. 28 XT ............................................................................... 28
B
Block Diagram On-Chip Reset Circuit ................................................. 33 Timer0......................................................................... 23 TMR0/WDT Prescaler................................................. 26 Watchdog Timer.......................................................... 35 Brown-Out Protection Circuit .............................................. 36
P
Package Marking Information ............................................. 95 Packaging Information ........................................................ 95 PICDEM-1 Low-Cost PICmicro Demo Board ..................... 52 PICDEM-2 Low-Cost PIC16CXX Demo Board................... 52 PICDEM-3 Low-Cost PIC16CXXX Demo Board ................ 52 PICSTART(R) Plus Entry Level Development System......... 51 POR Device Reset Timer (DRT) ................................... 27, 34 PD............................................................................... 36 Power-On Reset (POR).............................................. 27 TO............................................................................... 36 PORTA ............................................................................... 21 Power-Down Mode ............................................................. 37 Prescaler ............................................................................ 26 PRO MATE(R) II Universal Programmer .............................. 51 Program Counter ................................................................ 19
C
CAL0 bit .............................................................................. 18 CAL1 bit .............................................................................. 18 CAL2 bit .............................................................................. 18 CAL3 bit .............................................................................. 18 CALFST bit ......................................................................... 18 CALSLW bit ........................................................................ 18 Carry ..................................................................................... 9 Clocking Scheme ................................................................ 12 Code Protection ............................................................ 27, 37 Configuration Bits................................................................ 27 Configuration Word ............................................................. 27
D
DC and AC Characteristics ........................................... 73, 91 Development Support ......................................................... 51 Development Tools ............................................................. 51 Device Varieties .................................................................... 7 Digit Carry ............................................................................. 9
Q
Q cycles .............................................................................. 12
R
RC Oscillator ...................................................................... 29 Read Modify Write .............................................................. 22 Register File Map ............................................................... 14 Registers Special Function ......................................................... 15 Reset .................................................................................. 27 Reset on Brown-Out ........................................................... 36
E
Errata .................................................................................... 3
F
Family of Devices.................................................................. 5 Features................................................................................ 1 FSR..................................................................................... 20 Fuzzy Logic Dev. System (fuzzyTECH(R)-MP) .................... 53
S
SEEVAL(R) Evaluation and Programming System .............. 53 SLEEP .......................................................................... 27, 37 Software Simulator (MPLAB-SIM) ...................................... 53 Special Features of the CPU .............................................. 27 Special Function Registers ................................................. 15 Stack................................................................................... 19 STATUS ................................................................................9 STATUS Register ............................................................... 16
I
I/O Interfacing ..................................................................... 21 I/O Ports.............................................................................. 21 I/O Programming Considerations........................................ 22 ICEPIC Low-Cost PIC16CXXX In-Circuit Emulator ............ 51 ID Locations .................................................................. 27, 37 INDF.................................................................................... 20 Indirect Data Addressing..................................................... 20 Instruction Cycle ................................................................. 12 Instruction Flow/Pipelining .................................................. 12 Instruction Set Summary..................................................... 40
T
Timer0 Switching Prescaler Assignment ................................ 26 Timer0 ........................................................................ 23 Timer0 (TMR0) Module .............................................. 23 TMR0 with External Clock .......................................... 25 Timing Diagrams and Specifications ............................ 66, 86 Timing Parameter Symbology and Load Conditions .... 65, 85 TRIS Registers ................................................................... 21
K
KeeLoq(R) Evaluation and Programming Tools.................... 54
L
Loading of PC ..................................................................... 19
M
Memory Organization.......................................................... 13 Data Memory .............................................................. 14 Program Memory ........................................................ 13 MPLAB Integrated Development Environment Software .... 53
W
Wake-up from SLEEP ........................................................ 37 Watchdog Timer (WDT)................................................ 27, 34 Period ......................................................................... 35 Programming Considerations ..................................... 35 WWW, On-Line Support ........................................................3
Z
Zero bit ..................................................................................9
(c) 1998 Microchip Technology Inc.
DS40139D-page 101
PIC12C5XX
NOTES:
DS40139D-page 102
(c) 1998 Microchip Technology Inc.
PIC12C5XX
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip World Wide Web (WWW) site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape or Microsoft Explorer. Files are also available for FTP download from our FTP site.
Systems Information and Upgrade Hot Line
The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive any currently available upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-602-786-7302 for the rest of the world.
980106
Connecting to the Microchip Internet Web Site
The Microchip web site is available by using your favorite Internet browser to attach to: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.futureone.com/pub/microchip The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events
Trademarks: The Microchip name, logo, PIC, PICSTART, PICMASTER and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. PICmicro, FlexROM, MPLAB and fuzzyLAB are trademarks and SQTP is a service mark of Microchip in the U.S.A. All other trademarks mentioned herein are the property of their respective companies.
(c) 1998 Microchip Technology Inc.
DS40139D-page 103
PIC12C5XX
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (602) 786-7578. Please list the following information, and use this outline to provide us with your comments about this Data Sheet. To: RE: Technical Publications Manager Reader Response Total Pages Sent
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: PIC12C5XX Questions: 1. What are the best features of this document? Y N Literature Number: DS40139D FAX: (______) _________ - _________
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
8. How would you improve our software, systems, and silicon products?
DS40139D-page 104
(c) 1998 Microchip Technology Inc.
PIC12C5XX
PIC12C5XX Product Identification System
PART NO. -XX X /XX XXX Pattern: Package: Special Requirements SN SM P JW I E 04 = = = = = = = = Examples
a) PIC12C508A-04/P Commercial Temp., PDIP Package, 4 MHz, normal VDD limits PIC12C508A-04I/SM Industrial Temp., SOIC package, 4 MHz, normal VDD limits PIC12C509-04I/P Industrial Temp., PDIP package, 4 MHz, normal VDD limits
Temperature Range: Frequency Range: Device
150 mil SOIC 208 mil SOIC 300 mil PDIP 300 mil Windowed Ceramic Side Brazed b) 0C to +70C -40C to +85C -40C to +125C c) 4 MHz
PIC12C508 PIC12C509 PIC12C508T (Tape & reel for SOIC only) PIC12C509T (Tape & reel for SOIC only) PIC12C508A PIC12C509A PIC12C508AT (Tape & reel for SOIC only) PIC12C509AT (Tape & reel for SOIC only) PIC12LC508A PIC12LC509A PIC12LC508AT (Tape & reel for SOIC only) PIC12LC509AT (Tape & reel for SOIC only)
Please contact your local sales office for exact ordering procedures.
Sales and Support
Products supported by a preliminary Data Sheet may possibly have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office (see below) 2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277 Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. For latest version information and upgrade kits for Microchip Development Tools, please call 1-800-755-2345 or 1-602-786-7302.
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 105
PIC12C5XX
NOTES:
DS40139D-page 106
Preliminary
(c) 1998 Microchip Technology Inc.
PIC12C5XX
NOTES:
(c) 1998 Microchip Technology Inc.
Preliminary
DS40139D-page 107
M
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 602-786-7200 Fax: 602-786-7277 Technical Support: 602 786-7627 Web: http://www.microchip.com
AMERICAS (continued)
Toronto
Microchip Technology Inc. 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253
ASIA/PACIFIC (continued)
Singapore
Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore 188980 Tel: 65-334-8870 Fax: 65-334-8850
ASIA/PACIFIC
Hong Kong
Microchip Asia Pacific RM 3801B, Tower Two Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2-401-1200 Fax: 852-2-401-3431
Taiwan, R.O.C
Microchip Technology Taiwan 10F-1C 207 Tung Hua North Road Taipei, Taiwan, ROC Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Atlanta
Microchip Technology Inc. 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307
Boston
Microchip Technology Inc. 5 Mount Royal Avenue Marlborough, MA 01752 Tel: 508-480-9990 Fax: 508-480-8575
EUROPE
United Kingdom
Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-1189-21-5858 Fax: 44-1189-21-5835
India
Microchip Technology Inc. India Liaison Office No. 6, Legacy, Convent Road Bangalore 560 025, India Tel: 91-80-229-0061 Fax: 91-80-229-0062
Chicago
Microchip Technology Inc. 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075
Japan
Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa 222-0033 Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
France
Arizona Microchip Technology SARL Zone Industrielle de la Bonde 2 Rue du Buisson aux Fraises 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Dallas
Microchip Technology Inc. 14651 Dallas Parkway, Suite 816 Dallas, TX 75240-8809 Tel: 972-991-7177 Fax: 972-991-8588
Dayton
Microchip Technology Inc. Two Prestige Place, Suite 150 Miamisburg, OH 45342 Tel: 937-291-1654 Fax: 937-291-9175
Korea
Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934
Germany
Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 Muchen, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Detroit
Microchip Technology Inc. 42705 Grand River, Suite 201 Novi, MI 48375-1727 Tel: 248-374-1888 Fax: 248-374-2874
Italy
Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-39-689 9939 Fax: 39-39-6899883 7/7/98
Shanghai
Microchip Technology RM 406 Shanghai Golden Bridge Bldg. 2077 Yan'an Road West, Hong Qiao District Shanghai, PRC 200335 Tel: 86-21-6275-5700 Fax: 86 21-6275-5060
Los Angeles
Microchip Technology Inc. 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 714-263-1888 Fax: 714-263-1338
New York
Microchip Technology Inc. 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 516-273-5305 Fax: 516-273-5335
San Jose
Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955
Microchip received ISO 9001 Quality System certification for its worldwide headquarters, design, and wafer fabrication facilities in January, 1997. Our field-programmable PICmicroTM 8-bit MCUs, Serial EEPROMs, related specialty memory products and development systems conform to the stringent quality standards of the International Standard Organization (ISO).
All rights reserved. (c) 1998, Microchip Technology Incorporated, USA. 9/98
Printed on recycled paper.
Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies.
DS40139D-page 108
(c) 1998 Microchip Technology Inc.

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