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HB56AW1672E Series 16777216-word x 72-bit High Density Dynamic RAM Module ADE-203-684A (Z) Rev. 1.0 Nov. 26, 1996 Description The HB56AW1672E belongs to 8-byte DIMM (Dual in-line Memory Module) family , and has been developed an optimized main memory solution for 4 and 8-byte processor applications. The HB56AW1672E is a 16 M x 72 Dynamic RAM Module, mounted 18 pieces of 64-Mbit DRAM (HM5164400ATT) sealed in TSOP package and 2 pieces of 16-bit BiCMOS line driver (74LVT16244) sealed in TSSOP package. An outline of the HB56AW1672E is 168-pin socket type package (dual lead out). Therefore, the HB56AW1672E makes high density mounting possible without surface mount technology. The HB56AW1672E provides common data inputs and outputs. Decoupling capacitors are mounted beside each TSOP on the its module board. Features * 168-pin socket type package (Dual lead out) Lead pitch : 1.27 mm * Single 3.3 V (0.3 V) * High speed Access time: tRAC = 60 ns/70 ns (max) Access time: tCAC = 20 ns/23 ns (max) * Low power dissipation Active mode: 8.46 W/7.16 W (max) Standby mode (TTL): 166 mW (max) * Buffered input except RAS and DQ * 4 byte interleave enabled, dual address input (A0/B0) * JEDEC standard outline buffered 8-byte DIMM * Fast page mode capability * 8192 refresh cycles: 64 ms * 2 variations of refresh RAS-only refresh CAS-before-RAS refresh * TTL compatible HB56AW1672E Series Ordering Information Type No. HB56AW1672E-6A HB56AW1672E-7A Access time 60 ns 70 ns Package 168-pin dual lead out socket type Contact pad Gold Pin Arrangement 1 pin 10 pin 11 pin 40 pin 41 pin 84 pin 85 pin 94 pin 95 pin 124 pin 125 pin 168 pin Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Signal name Pin No. VSS DQ0 DQ1 DQ2 DQ3 VCC DQ4 DQ5 DQ6 DQ7 DQ8 VSS DQ9 DQ10 DQ11 DQ12 DQ13 VCC DQ14 DQ15 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 Signal name Pin No. VSS OE2 RE2 CE4 NC WE2 VCC NC NC DQ18 DQ19 VSS DQ20 DQ21 DQ22 DQ23 VCC DQ24 NC NC 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 Signal name Pin No. VSS DQ36 DQ37 DQ38 DQ39 VCC DQ40 DQ41 DQ42 DQ43 DQ44 VSS DQ45 DQ46 DQ47 DQ48 DQ49 VCC DQ50 DQ51 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 Signal name VSS NC NC NC NC PDE VCC NC NC DQ54 DQ55 VSS DQ56 DQ57 DQ58 DQ59 VCC DQ60 NC NC 2 HB56AW1672E Series Pin Arrangement (cont) Pin No. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 Signal name Pin No. DQ16 DQ17 VSS NC NC VCC WE0 CE0 NC RE0 OE0 VSS A0 A2 A4 A6 A8 A10 NC VCC NC NC 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 Signal name Pin No. NC NC DQ25 DQ26 DQ27 VSS DQ28 DQ29 DQ30 DQ31 VCC DQ32 DQ33 DQ34 DQ35 VSS PD1 PD3 PD5 PD7 ID0(VSS ) VCC 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 Signal name Pin No. DQ52 DQ53 VSS NC NC VCC NC NC NC NC NC VSS A1 A3 A5 A7 A9 A11 NC VCC NC B0 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 Signal name NC NC DQ61 DQ62 DQ63 VSS DQ64 DQ65 DQ66 DQ67 VCC DQ68 DQ69 DQ70 DQ71 VSS PD2 PD4 PD6 PD8 ID1 (VSS) VCC 3 HB56AW1672E Series Pin Description Pin name A0 to A11, B0 Function Address input Row address Column address Refresh address DQ0 to DQ71 RE0, RE2 CE0, CE4 WE0, WE2 OE0, OE2 PD1 to PD8 ID0, ID1 PDE VCC VSS NC Data input/output Row address strobe (RAS) Column address strobe (CAS) Read/Write enable Output enable Presence detect ID bit Presence detect Enable Power supply Ground No connection A0 to A12, B0 A0 to A10, B0 A0 to A12, B0 Presence Detect Pin Assignment (Controlled by PDE pin) PDE = Low Pin Name PD1 PD2 PD3 PD4 PD5 PD6 PD7 PD8 Pin No. 79 163 80 164 81 165 82 166 60 ns 1 1 1 1 0 1 1 0 70 ns 1 1 1 1 0 0 1 0 PDE = High All High-Z High-Z High-Z High-Z High-Z High-Z High-Z High-Z 1 : High Level (Driver Output) 0 : Low Level (Driver Output) 4 HB56AW1672E Series Block Diagram RE0 CE0 WE0 OE0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 DQ32 DQ33 DQ34 DQ35 A0 B0 A1 to A12 VCC VSS 0.22 F x 20 pcs CAS RAS WE OE I/O I/O D0 I/O I/O CAS RAS WE OE I/O I/O D1 I/O I/O CAS RAS WE OE I/O I/O D2 I/O I/O CAS RAS WE OE I/O I/O D3 I/O I/O CAS RAS WE OE I/O I/O D4 I/O I/O CAS RAS WE OE I/O I/O D5 I/O I/O CAS RAS WE OE I/O I/O D6 I/O I/O CAS RAS WE OE I/O I/O D7 I/O I/O CAS RAS WE OE I/O I/O D8 I/O I/O D0 to D8 D9 to D17 D0 to D17 D0 to D17, 74LVT16244 D0 to D17, 74LVT16244 RE2 CE4 WE2 OE2 DQ36 DQ37 DQ38 DQ39 DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 DQ64 DQ65 DQ66 DQ67 DQ68 DQ69 DQ70 DQ71 PD1 to PD8 VCC VCC VCC VCC VSS VCC VSS VCC VSS VSS PD1 PD2 PD3 PD4 PD5 PD6 PD7 PD8 CAS RAS WE OE I/O I/O D9 I/O I/O CAS RAS WE OE I/O I/O D10 I/O I/O CAS RAS WE OE I/O I/O D11 I/O I/O CAS RAS WE OE I/O I/O D12 I/O I/O CAS RAS WE OE I/O I/O D13 I/O I/O CAS RAS WE OE I/O I/O D14 I/O I/O CAS RAS WE OE I/O I/O D15 I/O I/O CAS RAS WE OE I/O I/O D16 I/O I/O CAS RAS WE OE I/O I/O D17 I/O I/O *D0 to D17: HM5164400 : 74LVT16244 5 HB56AW1672E Series Absolute Maximum Ratings Parameter Voltage on any pin relative to V SS Supply voltage relative to VSS Short circuit output current Power dissipation Operating temperature Storage temperature Symbol VT VCC Iout PT Topr Tstg Value -0.5 to +4.6 -0.5 to +4.6 50 19 0 to +70 -55 to +125 Unit V V mA W C C Recommended DC Operating Conditions (Ta = 0 to +70C) Parameter Supply voltage Symbol VSS VCC Input high voltage Input low voltage Note: VIH VIL Min 0 3.0 2.0 -0.3 Typ 0 3.3 -- -- Max 0 3.6 VCC + 0.3 0.8 Unit V V V V 1 1 1 Notes 1. All voltage referenced to V SS . 6 HB56AW1672E Series DC Characteristics (Ta = 0 to +70C, VCC = 3.3 V 0.3 V, VSS = 0 V) HB56AW1672E 60 ns Parameter Operating current* , * 1 2 70 ns Max 2350 46 Min -- -- Max 1990 46 Unit Test conditions mA mA t RC = min TTL interface RAS, CAS = VIH Dout = High-Z CMOS interface RAS, CAS VCC - 0.2 V Dout = High-Z t RC = min RAS = VIH, CAS = VIL Dout = enable t RC = min t PC = min 0 V Vin 4.6 0 V Vin 4.6 Dout = disable High Iout = -2 mA Low Iout = 2 mA Symbol Min I CC1 I CC2 -- -- Standby current -- 28 -- 28 mA RAS-only refresh current*2 Standby current* 1 I CC3 I CC5 I CC6 I CC7 I LI I LO VOH VOL -- -- -- -- -10 -10 2.4 0 2350 100 2710 2170 10 10 VCC 0.4 -- -- -- -- -10 -10 2.4 0 1990 100 2350 1990 10 10 VCC 0.4 mA mA mA mA A A V V CAS-before-RAS refresh current Fast page mode current*1, * 3 Input leakage current Output leakage current Output high voltage Output low voltage Notes : 1. I CC depends on output load condition when the device is selected. ICC max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Address can be changed once or less within one page mode cycle tPC. Capacitance (Ta = 25C, VCC = 3.3 V 0.3 V) Parameter Input capacitance (Address) Input capacitance (CAS, WE, OE) Input capacitance (RAS) I/O capacitance (DQ) Symbol CI1 CI2 CI3 CI/O Typ -- -- -- -- Max 20 20 78 20 Unit pF pF pF pF Notes 1 1 1 1, 2 Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method. 2. CAS = VIH to disable Dout. 7 HB56AW1672E Series AC Characteristics (Ta = 0 to +70C, VCC = 3.3 V 0.3 V, VSS = 0 V) *1, *2,*18 Test Conditions * * * * * Input rise and fall time: 5 ns Input levels: VIL = 0 V, V IH = 3 V Input timing reference levels: 0.8 V, 2.4 V Output timing reference levels: 0.8 V, 2.0 V Output load: 1 TTL gate + C L (100 pF) (Including scope and jig) Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters) HB56AW1672E 60 ns Parameter Random read or write cycle time RAS precharge time CAS precharge time RAS pulse width CAS pulse width Row address setup time Row address hold time Column address setup time Column address hold time RAS to CAS delay time RAS to column address delay time RAS hold time CAS hold time CAS to RAS precharge time OE to Din delay time OE delay time from Din CAS delay time from Din Transition time (rise and fall) Refresh period (8,192 cycle) Symbol Min t RC t RP t CP t RAS t CAS t ASR t RAH t ASC t CAH t RCD t RAD t RSH t CSH t CRP t OED t DZO t DZC tT t REF 110 40 10 60 15 5 10 0 10 20 15 20 60 10 20 0 0 3 -- Max -- -- -- 10000 10000 -- -- -- -- 40 25 -- -- -- -- -- -- 50 64 70 ns Min 130 50 13 70 18 5 10 0 15 20 15 23 70 10 23 0 0 3 -- Max -- -- -- 10000 10000 -- -- -- -- 47 30 -- -- -- -- -- -- 50 64 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ms 5 6 6 7 20 3 4 Notes 8 HB56AW1672E Series Read Cycle HB56AW1672E 60 ns Parameter Access time from RAS Access time from CAS Access time from address Access time from OE Read command setup time Read command hold time to CAS Read command hold time to RAS Column address to RAS lead time Column address to CAS lead time CAS to output in low-Z Output data hold time Output data hold time from OE Output buffer turn-off time Output buffer turn-off to OE CAS to Din delay time Symbol Min t RAC t CAC t AA t OEA t RCS t RCH t RRH t RAL t CAL t CLZ t OH t OHO t OFF t OEZ t CDD -- -- -- -- 0 0 0 35 30 2 3 3 -- -- 20 Max 60 20 35 20 -- -- -- -- -- -- -- -- 20 20 -- 70 ns Min -- -- -- -- 0 0 0 40 35 2 3 3 -- -- 23 Max 70 23 40 23 -- -- -- -- -- -- -- -- 20 20 -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 13 13 5 12 12 Notes 8, 9 9, 10, 16 9, 11, 16 9, 19 Write Cycle HB56AW1672E 60 ns Parameter Write command setup time Write command hold time Write command pulse width Write command to RAS lead time Write command to CAS lead time Data-in setup time Data-in hold time Symbol Min t WCS t WCH t WP t RWL t CWL t DS t DH 0 10 10 20 15 0 15 Max -- -- -- -- -- -- -- 70 ns Min 0 15 10 23 18 0 20 Max -- -- -- -- -- -- -- Unit ns ns ns ns ns ns ns Notes 14 9 HB56AW1672E Series Read-Modify-Write Cycle HB56AW1672E 60 ns Parameter Read-modify-write cycle time RAS to WE delay time CAS to WE delay time Column address to WE delay time OE hold time from WE Symbol Min t RWC t RWD t CWD t AWD t OEH 155 90 40 55 15 Max -- -- -- -- -- 70 ns Min 181 103 46 63 18 Max -- -- -- -- -- Unit ns ns ns ns ns 14 14 14 Notes Refresh Cycle HB56AW1672E 60 ns Parameter CAS setup time (CBR refresh cycle) CAS hold time (CBR refresh cycle) WE setup time (CBR refresh cycle) WE hold time (CBR refresh cycle) RAS precharge to CAS hold time Symbol Min t CSR t CHR t WRP t WRH t RPC 10 10 5 10 0 Max -- -- -- -- -- 70 ns Min 10 10 5 10 0 Max -- -- -- -- -- Unit ns ns ns ns ns Notes Fast Page Mode Cycle HB56AW1672E 60 ns Parameter Fast page mode cycle time Fast page mode RAS pulse width Access time from CAS precharge RAS hold time from CAS precharge Symbol Min t PC t RASP t CPA t CPRH 40 -- -- 40 Max -- 70 ns Min 45 Max -- Unit ns 15 9, 16 Notes 100000 -- 40 -- -- 45 100000 ns 45 -- ns ns 10 HB56AW1672E Series Fast Page Mode Read-Modify-Write Cycle HB56AW1672E 60 ns Parameter Fast page mode read- modify-write cycle time WE delay time from CAS precharge Symbol Min t PRWC t CPW 85 60 Max -- -- 70 ns Min 96 68 Max -- -- Unit ns ns 14 Notes Notes: 1. AC measurements assume t T = 5 ns. 2. An initial pause of 200 s is required after power up followed by a minimum of eight initialization cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh). 3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a reference point only; if t RCD is greater than the specified tRCD (max) limit, then access time is controlled exclusively by tCAC . 4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a reference point only; if t RAD is greater than the specified tRAD (max) limit, then access time is controlled exclusively by tAA . 5. Either t OED or tCDD must be satisfied. 6. Either t DZO or tDZC must be satisfied. 7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition times are measured between V IH (min) and VIL (max). 8. Assumes that t RCD tRCD (max) and tRAD tRAD (max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, t RAC exceeds the value shown. 9. Measured with a load circuit equivalent to 1 TTL loads and 100 pF. 10. Assumes that t RCD tRCD (max) and tRCD + tCAC (max) tRAD + tAA (max). 11. Assumes that t RAD tRAD (max) and tRCD + tCAC (max) tRAD + tAA (max). 12. Either t RCH or tRRH must be satisfied for a read cycles. 13. t OFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. 14. t WCS , t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only; if t WCS tWCS (min), the cycle is an early write cycle and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD tRWD (min), tCWD tCWD (min), and tAWD tAWD (min), or tCWD tCWD (min), tAWD tAWD (min) and tCPW t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out (at access time) is indeterminate. 15. t RASP defines RAS pulse width in Fast page mode cycles. 16. Access time is determined by the longest among t AA , t CAC and t CPA. 17. All the V CC and VSS pins shall be supplied with the same voltages. 18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data to the device. 19. When output buffers are enable once, sustain the low impedance state until valid data is obtained. when output buffer is turned on and off within a vary short time, generally it causes large V CC/V SS line noise, which causes to degrade V IH min/VIL max level. 20. XXX: H or L (H: VIH (min) VIN VIH (max), L: VIL (min) VIN VIL (max)) ///////: Invalid Dout When the address, clock and input pins are not described on timing waveforms, their pins must be applied VIH or VIL. 11 HB56AW1672E Series Timing Waveforms*20 Read Cycle t RC t RAS t RP RAS t CSH t RCD tT t RSH t CAS t CRP CAS t RAD t ASR t ASC t RAL t CAL t CAH t RAH Address Row Column t RRH t RCS t RCH WE t DZC t CDD Din High-Z t DZO t OEA t OED OE t OEZ t CAC t AA t RAC t CLZ Dout t OFF t OH Dout t OHO 12 HB56AW1672E Series Early Write Cycle t RC t RAS t RP RAS t CSH t RCD tT t RSH t CAS t CRP CAS t ASR t RAH t ASC t CAH Address Row Column t WCS t WCH WE t DS t DH Din Din Dout High-Z* * t WCS t WCS (min) 13 HB56AW1672E Series Delayed Write Cycle t RC t RAS t RP RAS t CSH t RCD tT CAS t ASR t RAH t ASC t CAH t RSH t CAS t CRP Address Row Column t CWL t RCS t RWL t WP WE t DZC t DS t DH Din High-Z Din t OEH t OED t DZO OE t OEZ t CLZ Dout High-Z Invalid Dout 14 HB56AW1672E Series Read-Modify-Write Cycle t RWC t RAS t RP RAS tT t RCD t CAS t CRP CAS t RAD t ASR tRAH t ASC t CAH Address Row t RCS Column t CWD t AWD t RWD tCWL t RWL t WP WE t DZC t DS Din High-Z Din t DH t DZO t OED t OEA t OEH OE t CAC t AA t RAC t OEZ t OHO High-Z Dout t CLZ Dout 15 HB56AW1672E Series RAS-Only Refresh Cycle t RC t RAS RAS t RP tT t CRP t RPC t CRP CAS t ASR t RAH Address Row t OFF Dout High-Z 16 HB56AW1672E Series CAS-Before-RAS Refresh Cycle t RC t RP RAS t RPC CAS t CSR tT t CHR t RPC t CRP t RAS t RP , + * $ t CP t WRP t WRH t CP WE Address t OFF Dout High-Z 17 HB56AW1672E Series Fast Page Mode Read Cycle t RASP t CPRH t RP RAS tT t CSH t RCD CAS t RAL t RAD t ASR t RAH Address Row t CAL t ASC t CAH Column 1 t CAL t ASC t CAH Column 2 t CAL t ASC t CAH Column N t CAS t CP t PC t CAS t CP t RSH t CAS t CRP t RCS tRCS WE t DZC t CDD Din t DZO High-Z t OED t DZC t CDD High-Z t DZO t OED tRCH tRCH t RCS t RRH t RCH t DZC t CDD High-Z t DZO t OED , OE t RAC t AA t OH t CPA t AA t OH t CPA t AA t OH t OEA t OHO t OEA t OHO t OFF t OEZ t OHO t OEA t CAC t CLZ t OFF t CAC t OEZ t CLZ t CAC t CLZ t OFF t OEZ Dout Dout 1 Dout 2 Dout N 18 HB56AW1672E Series Fast Page Mode Early Write Cycle t RASP t RP RAS tT t CSH t RCD t CAS t PC t CP t CAS t CP t RSH t CAS t CRP CAS t ASR t RAH t ASC t CAH t ASC t CAH t ASC t CAH Address Row Column 1 Column 2 Column N t WCS t WCH t WCS t WCH t WCS t WCH WE t DS t DH t DS t DH t DS t DH Din Din 1 Din 2 Din N Dout High-Z* * t WCS t WCS (min) 19 HB56AW1672E Series Fast Page Mode Delayed Write Cycle t RASP t RP RAS tT t CSH t RCD CAS t CP t PC t CAS t CAS t CP t RSH t CAS t CRP t RAD t ASR t RAH Address Row t ASC t CAH Column 1 t CWL t RCS WE t WP t DZC t DS t DH Din t DZO t OED Din 1 t DZO t OED t WP t DZC t DS t DH Din 2 t DZO t OED t WP t DZC t DS t DH Din N t RCS t ASC t CAH Column 2 t CWL t RCS t ASC t CAH Column N t CWL t RWL t OEH t OEH t OEH OE t CLZ t CLZ t CLZ t OEZ t OEZ t OEZ Dout High-Z Invalid Dout Invalid Dout Invalid Dout 20 HB56AW1672E Series Fast Page Mode Read-Modify-Write Cycle t RASP t RP RAS tT t CP t RCD CAS t PRWC t CP t CAS t CAS t RSH t CAS t CRP t RAD t ASR t ASC t RAH Row t CAH Column 1 t RWD t AWD t CWD WE t RCS t WP t DZC t DS t DH Din t DZO t OED t ASC t CAH Column 2 t CWL t RCS t CPW t AWD t CWD t CWL t RCS t ASC t CAH Column N t CPW t AWD t CWD t RWL t CWL Address t WP t DZC t DS t DH Din 2 t OED t OEH t DZO t OED t WP t DZC t DS t DH Din N Din 1 t DZO t OEH t OEH * OE t OHO t OHO t OHO t AA t OEA t CAC t RAC t AA t CPA t OEA t CAC t AA t CPA t OEA t CAC t CLZ t OEZ t CLZ t OEZ t CLZ t OEZ High-Z Dout Dout 1 Dout 2 Dout N 21 HB56AW1672E Series Physical Outline HB56AW1672E Unit: mm/inch Front side 133.35 5.250 3.00 0.118 127.35 5.014 4.00 max. 0.157 max ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Component area ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, (Front) ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, 1 84 ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, B B 36.83 1.450 54.61 2.150 A 11.43 0.450 8.89 0.350 1.270.10 0.0500.004 Back side 2 - 3.00 2 - 0.118 ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Component area ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, (Back) ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, 168 85 4.00 0.157 17.78 0.700 Detail A Detail B 1.27 0.050 2.54 min 0.100 min 0.25 max 0.010 max 1.00 0.05 0.039 0.002 22 3.125 0.125 0.123 0.005 6.35 0.250 2.00 0.10 0.079 0.004 31.75 1.250 4.00 min. 0.157 min. 3.00 0.118 HB56AW1672E Series When using this document, keep the following in mind: 1. This document may, wholly or partially, be subject to change without notice. 2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without Hitachi's permission. 3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any other reasons during operation of the user's unit according to this document. 4. Circuitry and other examples described herein are meant merely to indicate the characteristics and performance of Hitachi's semiconductor products. Hitachi assumes no responsibility for any intellectual property claims or other problems that may result from applications based on the examples described herein. 5. No license is granted by implication or otherwise under any patents or other rights of any third party or Hitachi, Ltd. 6. MEDICAL APPLICATIONS: Hitachi's products are not authorized for use in MEDICAL APPLICATIONS without the written consent of the appropriate officer of Hitachi's sales company. Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi's products are requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL APPLICATIONS. Hitachi, Ltd. Semiconductor & IC Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 For further information write to: Hitachi America, Ltd. Semiconductor & IC Div. 2000 Sierra Point Parkway Brisbane, CA. 94005-1835 USA Tel: 415-589-8300 Fax: 415-583-4207 Hitachi Europe GmbH Electronic Components Group Continental Europe Dornacher Strae 3 D-85622 Feldkirchen Munchen Tel: 089-9 91 80-0 Fax: 089-9 29 30 00 Hitachi Europe Ltd. Electronic Components Div. Northern Europe Headquarters Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA United Kingdom Tel: 0628-585000 Fax: 0628-778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 0104 Tel: 535-2100 Fax: 535-1533 Hitachi Asia (Hong Kong) Ltd. Unit 706, North Tower, World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel: 27359218 Fax: 27306071 23 HB56AW1672E Series Revision Record Rev. 1.0 Date Contents of Modification Drawn by Approved by Nov. 26, 1996 Initial issue 24 |
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