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TDA7299 SOUND 2W MONO AMPLIFIER s s s s s s s s CAN DELIVER 2W THD 10% 12V/8 INTERNAL FIXED GAIN 20dB NO BOUCHEROT CELL THERMAL PROTECTION AC SHORT CIRCUIT PROTECTION SVR CAPACITOR FOR BETTER RIPPLEREJECTION LOW TURN-ON/OFF POP STAND-BY MODE SO8 (4+4) ORDERING NUMBER: TDA7299 DESCRIPTION The device TDA7299 is a new technology Mono Audio Amplifier in SO package specially designed for 12V sound cards application. Thanks to the fully complementary output configuraBLOCK DIAGRAM tion the device delivers a rail voltage swing without need of boostrap capacitors. VS VS=12V 100F 0.1F IN IN + OUT 470F SVR 8 47F GND D94AU160A September 2002 1/7 TDA7299 ABSOLUTE MAXIMUM RATINGS Symbol VS IO Top Tj Tstg Operating Supply Voltage Output Put Peak Current Operating Temperature Range Junction Temperature Storage Temperature Range Parameter Value 18 1.5 0 to 70 150 -40 to 125 Unit V A C C C PIN CONNECTION (Top view) VS OUT SVR IN 1 2 3 4 D94AU162 8 7 6 5 GND GND GND GND THERMAL DATA Symbol Rth j-amb Rth j-case Parameter Thermal Resistance Junction to ambient (on PCB) Thermal Resistance Junction to case Value 80 20 Unit C/W C/W ELECTRICAL CHARACTERISTICS (Tamb = 25C; VS = 12V; RL = 8; f = 1KHz; unless otherwise specified.) Symbol VS IS Isb VO AV RIN PO Parameter Supply Voltage Range Quiescent Current Stand-By Current Quiescent Output Voltage Voltage Gain Input Impedance Output Power THD = 10% RL = 4, VS = 8.5V, THD = 10% 50 1.8 Pin 2 shorted to GND 6 20 100 2 2 Test Condition Min. 4.5 20 Typ. Max. 18 30 0.3 Unit V mA mA V dB K W W 2/7 TDA7299 ELECTRICAL CHARACTERISTICS (continued) (Tamb = 25C; VS = 12V; RL = 8; f = 1KHz; unless otherwise specified.) Symbol Pot THD SVR Parameter Transient Output Power *) Distortion Supply Voltage Rejection Test Condition Vi = 400mVp, THD < 2%, RL = 4 PO = 1W Vripple = 150mVrms; Fripple = 1KHz Rg = 10K; BW = 20Hz to 20KHz 50 Min. Typ. 2 1 Max. Unit W % dB V V EI Vsb Input Noise Voltage Stand-By Enable Voltage 1.5 5 1 *) Limited by the RTH of the package Figure 1. Application Circuit VS 0.1F IN VS=12V 100F 470F OUT 8 IN SVR STAND-BY 47F GND VS 0.1F IN IN OUT 470F SVR 8 STAND-BY 47F GND D94AU161A APPLICATION HINTS: For 12V supply and 8 speaker application, its maximum power dissipation is about 1.8W. Assumming that max ambient temperature is 70C. required thermal resistance of the device and heat dissipating means must be equal to (150 - 70)/1.8 = 45C/W. Junction to pin thermal resistance of the package is about 20C/W. That means external heat sink of about 25C/W is required. Cu ground plane of PCB can be used as heat dissipating means. Stand-By switches must be able to discharge Csvr current. 3/7 TDA7299 Figure 2. On Board Copper Area copper area 2 x 1 cm Rth j-a = 60C/W Vcc = 12V Rl = 4 ohm Pout = 2W Pd = 1.8W TDA7299 Tj = 108C Tpin = 82C Tj = 96C Tpin = 70C copper 35um copper area 3 x 3 cm Rth j-a = 53C/W Figure 3. Pout vs Supply Voltage (Rload = 8) AUDIO PRECISION remote LEVEL(W) vs measured DMM(Vdc) Pout(W) 5 THD = 10% THD = 0.1% 1 Power dissipation limited Rload= 8 ohm f = 1KHz 0.1 4.500 6.000 7.500 9.000 10.50 12.00 13.50 15.00 16.50 18.00 Vs (V) Figure 4. Pout vs Supply Voltage (Rload = 4) AUDIO PRECISION remote 5 LEVEL(W) vs measured DMM(Vdc) Pout(W) Power dissipation limitation THD = 10% THD = 0. 1% 1 Current Limiter Intervention Rload = 4 OHM f = 1KHz 0.1 4.500 6.000 7.500 9.000 10.50 12.00 13.50 15.00 16.50 18.00 Vs (V) 4/7 TDA7299 Figure 5. SVR vs Frequency AUDIO PRECISION remote XTALK(dB) vs measured FREQ(Hz) S.V.R.(dB) -30.00 -35.00 -40.00 -45.00 Vs = 4.5V -50.00 Vs = 9V -55.00 -60.00 Vs = 18V -65.00 -70.00 -75.00 -80.00 20 100 1k 10k 20k Rload = 4 OHM CSVR = 47uF Rs = 600OHM Vrip = 0.5 Vrms Vs = 12V Frequency (Hz) 5/7 TDA7299 DIM. MIN. A a1 a2 a3 b b1 C c1 D (1) E e e3 F (1) L M S 3.8 0.4 4.8 5.8 0.65 0.35 0.19 0.25 0.1 mm TYP. MAX. 1.75 0.25 1.65 0.85 0.48 0.25 0.5 0.026 0.014 0.007 0.010 0.004 MIN. inch TYP. MAX. 0.069 0.010 0.065 0.033 0.019 0.010 0.020 OUTLINE AND MECHANICAL DATA 45 (typ.) 5.0 6.2 1.27 3.81 4.0 1.27 0.6 8 (max.) 0.15 0.016 0.189 0.228 0.050 0.150 0.157 0.050 0.024 0.197 0.244 SO8 (1) D and F do not include mold flash or protrusions. Mold flash or potrusions shall not exceed 0.15mm (.006inch). 6/7 TDA7299 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2002 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 7/7 |
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