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| (R) STTH310/S HIGH VOLTAGE ULTRAFAST RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS s s 3A 1000 V 175 C 1.42 V s s s Low forward voltage drop High reliability High surge current capability Soft switching for reduced EMI disturbances Planar technology DO-201AD STTH310 DESCRIPTION The STTH310, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagnetization in power supplies and other power switching applications. SMC STTH310S ABSOLUTE RATINGS (limiting values) Symbol VRRM V(RMS) IF(AV) Parameter Repetitive peak reverse voltage RMS voltage Average forward current Tl = 75C Tl = 75C IFSM Forward surge current t = 8.3 ms =0.5 =0.5 DO-201AD SMC DO-201AD SMC Tstg Tj Storage temperature range Maximum operating junction temperature Value 1000 700 3 3 55 45 - 50 + 175 + 175 C C A Unit V V A January 2003 - Ed: 1 1/5 STTH310/S THERMAL PARAMETERS Symbol Rth (j-l) Junction to lead Parameter L = 10 mm DO-201AD SMC Rth (j-a) Junction to ambient L = 10 mm DO-201AD Value 20 20 75 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR Parameter Reverse leakage current Tests conditions VR = 1000V Tj = 25C Tj = 125C VF Forward voltage drop IF = 3 A Tj = 25C Tj = 150C To evaluate the maximum conduction losses use the following equation : P = 1.20 x IF(AV) + 0.075 x IF2(RMS) DYNAMIC ELECTRICAL CHARACTERISTICS Symbol trr tfr VFP Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tests conditions IF = 0.5 A Irr = 0.25 A IR = 1A IF = 3 A dIF/dt = 50 A/s VFR = 1.1 x VF max Tj = 25C Tj = 25C Min. Typ. Max. 75 300 12 Unit ns ns V 0.98 Min. Typ. Max. 10 50 1.7 1.42 V Unit A 2/5 STTH310/S Fig. 1: Conduction losses versus average current. P(W) 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 1.0 100.0 Fig. 2: Forward voltage drop versus forward current. IFM(A) = 0.1 = 0.05 = 0.2 = 0.5 Tj=150C (typical values) Tj=150C (maximum values) =1 10.0 Tj=25C (maximum values) T IF(AV)(A) =tp/T 3.0 tp 0.1 3.5 0.0 0.5 1.0 VFM(V) 1.5 2.0 2.5 3.0 Fig. 3-1: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, Lleads = 10mm) (DO-201AD). Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 = 0.5 Fig. 3-2: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, S=1cm2) (SMC). Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 = 0.2 = 0.1 = 0.5 0.5 0.4 0.3 0.2 0.1 0.0 1.E-01 Single pulse = 0.2 = 0.1 0.3 T 0.2 0.1 Single pulse T tp(s) 1.E+01 =tp/T 1.E+02 tp 1.E+03 tp(s) 1.E+00 1.E+01 0.0 1.E-01 =tp/T 1.E+02 tp 1.E+03 1.E+00 Fig. 4: Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35m). Rth(j-a)(C/W) 110 100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 DO-201AD Lleads=10mm SMB S(cm) 3/5 STTH310/S PACKAGE MECHANICAL DATA SMC DIMENSIONS E1 REF. A1 D Millimeters Min. 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.60 Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063 A2 b c E E E1 A1 E2 C L A2 D b E2 L FOOTPRINT (in millimeters) 3.3 2.0 4.2 2.0 4/5 STTH310/S PACKAGE MECHANICAL DATA DO-201AD B A B OC note 1 E E note 1 OD OD note 2 DIMENSIONS REF. A B C D E 25.40 5.30 1.30 1.25 Millimeters Min. Max. 9.50 Inches Min. 1.000 0.209 0.051 0.049 NOTES 1 - The lead diameter D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15 mm) Max. 0.374 Ordering code STTH310 STTH310S STTH310RL s Marking STTH310 S10 STTH310 Package DO-201AD SMC DO-201AD Weight 1.12 g 0.245 g 1.12 g Base qty 600 2500 1900 Delivery mode Ammopack Tape & reel Tape & reel Epoxy meets UL 94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5 |
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