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| ICs for Compact Disc/CD-ROM Player AN8488SB 3-phase full-wave motor driver and DC motor BTL driver IC I Overview The AN8488SB is a motor driver IC incorporating a 3-phase full-wave motor driver and DC motor BTL driver IC with a reverse rotation brake/short brake changeover function. It is encapsulated into a high allowable power dissipation package (with copper block). 18.400.20 (10.00) 1.950.10 42 34 30 22 (1.315) Unit: mm 8.300.20 10.930.30 (4.00) 0.30 - 0.05 +0.10 0 to 10 0.500.20 * 3-phase full-wave and snubberless * FG output * Current limit * Reverse rotation prevention * Thermal protection circuit built-in 1 9 13 21 (3.20) (1.20) 0.80 Seating plane 0.35 - 0.05 +0.10 I Applications * Various types of optical disk drive HSOP042-P-0400C Note) The package of this product will be changed to lead-free type (HSOP042-P-0400G). See the new package dimensions section later of this datasheet. I Block Diagram 29 VM1 34 CS 36 A1 35 A2 32 A3 SG VCC2 VM2 VN VP H1+ H1- H2+ 16 17 18 Direction changeover Lower side distribution Direction detection Detection Hall bias EA Absolute value VTL Start/stop Thermal protection circuit FG Brake comparator circuit ER Logic EP = ER x EA 1 VM2 2 Amp. Upper side distribution Amp. Upper side power Lower side power Reset FIN1 VCC2 det. Hall amp. H2- 19 matrix H3+ 20 H3- 21 23 VH VREF det. EC 27 ECR 26 25 VCC1 22 28 BRK 15 14 11 SLIN VREF PG1 PG2 PCI FG S/S PC 12 1 2 5 10 9 4 7 0.100.10 2.700.10 I Features Publication date: December 2001 SDD00009BEB 1 AN8488SB I Pin Descriptions Pin No. Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 FIN1 PG1 PG2 N.C. VN PC N.C. VP N.C. VM2 VCC2 SLIN VREF N.C. FG BRK H1+ H1- H2+ SG Description SPD block power GND pin Driver block power GND pin N.C. Driver block inverted output pin Driver block power cut pin N.C. Driver block forward output pin N.C. Driver block motor power supply pin Driver block supply voltage pin Driver block input pin Driver block reference input pin N.C. FG signal output pin Brake mode setting pin Hall element-1 positive input pin Hall element-1 negative input pin Hall element-2 positive input pin Signal GND pin Pin No. Symbol 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 FIN2 H2- H3+ H3- VCC1 VH N.C. SS ECR EC PCI VM1 N.C. N.C. A3 N.C. CS A2 A1 Description Hall element-2 negative input pin Hall element-3 positive input pin Hall element-3 negative input pin SPD block supply voltage pin Hall bias pin N.C. Start/stop changeover pin Torque command reference input pin Torque command input pin Current feedback phase compensation pin SPD block motor supply voltage pin N.C. N.C. A3 phase output pin N.C. Current det. pin A2 phase output pin A1 phase output pin I Absolute Maximum Ratings Parameter Supply voltage Symbol VCC1 VCC2 VM1 , VM2 Output voltage 1 Output voltage 2 *4 *5 *4 Rating 7.0 14.0 - 0.3 to VM1 + 0.4 - 0.3 to VM2 + 0.4 0 to VCC1 30 1 200 50 786 -20 to +75 -55 to +150 Unit V VO1(n) VO2(n) V(n) ICC1 V V V mA mA mA mW C C Control signal input voltage Supply current Output current *3 IO(n) IHB *2 *1 Hall bias current Power dissipation PD Topr Tstg *1 Operating ambient temperature Storage temperature Note) Do not apply external currents or voltages to any pins not specifically mentioned. For circuit currents, '+' denotes current flowing into the IC, and '-' denotes current flowing out of the IC. *1: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25C. *2: The power dissipation shown is the value of independent IC without a heat sink at Ta = 75C. Refer to the PD Ta curves of the "I Application Notes" for details. 2 SDD00009BEB AN8488SB I Absolute Maximum Ratings (continued) Note) *3: n = 4, 7, 32, 35, 36 *4: n = 32, 35, 36 *5: n = 4, 7 *6: n = 5, 11, 12, 15, 25, 26, 27 I Recommended Operating Range Parameter Supply voltage Symbol VCC1 VCC2 VM1 , VM2 Range 4.25 to 5.5 4.5 to 13.5 Unit V I Electrical Characteristics at Ta = 25C Parameter Overall Circuit current 1 Circuit current 2 Start/stop Start voltage Stop voltage Medium voltage SDD00009BEB 3 AN8488SB I Electrical Characteristics at Ta = 25C (continued) Parameter Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed. Symbol Conditions Min Typ Max Unit FGH FGL VFGR HFG VCC1 = 5 V, IFG = - 0.01 mA VCC1 = 5 V, IFG = 0.01 mA VCC1 = 5 V, Input D-range at H2+, H2- VCC1 = 5 V VCC1 = 5 V VCC1 = 5 V VCC1 = 5 V, ECR = 1.65 V VCC1 = 5 V 3.0 1.5 1 3.5 1.65 60 10 1.74 90 VCC1 0.5 3.0 20 V V V mV VSBR VRBR VSBRL ISBR 1.0 V V V mA VDROF GSL+ GSL VO+ VO- VPCH VPCL IPC SL IN = 1.65 V R IN = 10 k SL IN = 3.3 V SL IN = 0 V VCC2 = 12 V VCC2 = 12 V VCC2 = 12 V, PC = 5 V -150 21 - 0.7 9.3 2.9 1.35 0 23 0 10.0 -10.0 100 +150 25 +0.7 -9.3 1.0 200 mV dB dB V V V V A VRST VR 4.5 V Parameter Thermal protection Thermal protection operating temperature Thermal protection hysteresis width Sled block supply voltage Sled block supply voltage detection hysteresis width Symbol VCC1 = 5 V VCC1 = 5 V Conditions Min Typ Max Unit C C V TSDON TSD VHD 160 45 0.2 4 SDD00009BEB AN8488SB I Usage Notes 1. Use the VCC2 at VCC2 VM2 . And use power supply always at on state. Otherwise it will cause malfunction. 2. On driver gain setting of driver block. Voltage gain of power amplifier: 23 dB 10 k 10 k 11 Input Input pin 500 5.5 k VREF 3. On operation mode of mute: PC H Driver output 4. On SS pin mode: SS H Spindle block Driver block On On M Off On L (Open) Off Off Active L (Open) Mute x7 4 M Load 7 x7 Power amp. Output pin VREF 5. On brake mode of spindle block: BRK H EC < ECR EC > ECR Acceleration Reverse rotation brake L (Open) Acceleration Short brake 6. Take time to check the characteristics on use. When changing an external circuit constant for use, consider not only static characteristics, but also transient characteristics and external parts with respect to the characteristics difference among ICs so that you can get enough margin. 7. Avoid short-circuit between output pin and power supply, output pin and GND (line-to-supply and line-to-ground fault) and output pins (load short-circuit). Otherwise the IC will be damaged and is likely to get fired. 8. Be cautious on a dip soldering. Prior study is required. SDD00009BEB 5 AN8488SB I Application Notes * PD Ta curves of HSOP042-P-0400C PD T a 3.000 2.723 2.500 Power dissipation PD (W) Mounted on standard board (glass epoxy: 75 x 75 x t0.8 mm3) Rth(j-a) = 45.9C/W 2.000 1 634 mW 1.500 1.311 1.000 Independent IC without a heat sink Rth(j-a) = 95.3C/W 0.500 786 mW 0.000 0 25 50 75 100 125 150 Ambient temperature Ta (C) * Phase conditions between Hall input and output current Phase of Hall pin H1+ A B C D E F H H M L L M H1 H3+ L M H H M L H3 H2 H1 H2 H2+ M L L M H H H3 0 ECR EC A3 Emit Output current 0 Sink A B C D E F A2 A1 A2 A3 A1 0 6 SDD00009BEB AN8488SB I Application Notes (continued) * Power consumption calculation method You can find a rough value of electric power to be consumed in the IC in the following method and the use of EXCEL (computer soft ware) will enable you to put it on a graph. Calculating formula: (Spindle block) 1. Let an induced voltage generated in each phase as below: (Reference to a motor center point) EA1 = EO x sin (X) * * * (1) EA2 = EO x sin (X+120) * * * (2) EA3 = EO x sin (X+240) * * * (3) X: Phase angle 2. Let a current flowing in each phase as below: IA2 = IO x sin (X+120) * * * (5) IA1 = IO x sin (X) * * * (4) IA3 = IO x sin (X+240) * * * (6) 3. The voltages generated by a wire-wound resistance of a motor are: VR2 = IA2 x R * * * (8) VR3 = IA3 x R * * * (9) VR1 = IA1 x R * * * (7) 4. In each phase, add the voltage generated by an induced voltage and that by a wire-wound resistance. VA1' = (1) + (4) VA2' = (2) + (5) VA3' = (3) + (6) 5. As the lowest voltage in each phase angle must be 0 V, you can get the voltage to be generated in each phase by means of subtracting the lowest voltage from the voltage of the remaining two phases. VA1 = VA1' - MIN (VA1', VA2', VA3') * * * (10) VA2 = VA2' - MIN (VA1', VA2', VA3') * * * (11) VA3 = VA3' - MIN (VA1', VA2', VA3') * * * (12) 6. Subtract the supply voltage from each phase's voltage found in item 5 and then multiply it by each phase's current, so that you can get the power consumption of the spindle block. PSPD = (12 - VAn ) x IAn n=1 3 (Driver block) PSL = (VM2 - IO * R) x IO VM2: Motor power supply voltage IO: Output current R: Wire wound resistor * Theory of thermal resistance A chip temperature or the fin temperature can be understood in the same way as Ohm's Law. Tj Rj-c P Rf Ta Rc-a Tj : Chip temperature Ta : Ambient temperature P : Electric power generated by IC Rj-c : Thermal resistance between a chip and a package Rc-a: Thermal resistance between a package and a surface of a heat sink or free air Tj = Ta + P x (Rj-c + Rc-a ) Make sure that Tj does not exceed 150C. If it exceeds 150C, you can suppress the rise of a chip temperature by adding a heat sink which is equivalent to Rf in the above figure. Tj = Ta + P x (Rj-c + Rc-a ) A package surface and the fin are available for a temperature measurement. But the fin part is recommendable for measurement because a package surface measurement does not always promise you a consistent measuring result. Note) What has been mentioned above is true to a stationary state, not to a transient state. SDD00009BEB 7 AN8488SB I Application Circuit Example RCS = 0.6 M 29 VM1 VM2 4 VN 34 CS 36 A1 35 A2 32 A3 7 VP VCC2 VM1 = 12 V FIN1 SG H1+ 16 H1- 17 H2+ 18 Hall amp. H2- 19 matrix Direction changeover Lower side distribution Direction detection Detection Hall bias EA Absolute value VTL Start/stop Thermal protection circuit FG Brake comparator circuit ER Logic EP = ER x EA 1 VM2 2 Amp. Upper side distribution Amp. Upper side power Lower side power Reset VCC2 det. H3+ 20 H3- 21 VH 23 VREF det. Servo torque command EC 27 ECR 26 S/S 25 VCC1 22 PCI 28 BRK 15 FG 14 SLIN 11 PG1 1 PG2 2 0.1 F S/S: High: SPD block on and driver block on Med: SPD block off and driver block on Low: SPD block off and driver block off Low: Short brake High: Reverse rotation break RIN = 10 k VCC = 5 V FG signal SLIN I New Package Dimensions (Unit: mm) * HSOP042-P-0400G (Lead-free package) 18.400.20 (10.00) 1.950.10 28 27 36 19 (1.315) 0.30-0.05 +0.10 8.300.10 10.930.20 (4.00) 3 to 10 0.500.20 2.700.10 3.00 max. 1 (1.20) 9 10 (3.20) 18 0.35+0.10 -0.05 0.80 Seating plane 0.100.10 Seating plane 8 SDD00009BEB VREF PC 12 5 10 9 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR |
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