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 DISCRETE SEMICONDUCTORS
DATA SHEET
dbook, halfpage
MBD128
BGA2715 MMIC wideband amplifier
Preliminary specification 2004 Feb 02
Philips Semiconductors
Preliminary specification
MMIC wideband amplifier
FEATURES * Internally matched to 50 * Wide frequency range (3.3 GHz at 3 dB bandwidth) * Flat 22 dB gain ( 1 dB up to 2.8 GHz) * -5 dBm output power at 1dB compression point * Good linearity for low current ( IP3(out) = 2 dBm) * Low second harmonic, -30 dBc at PDrive = -40 dBm * Unconditionally stable (K 2). APPLICATIONS * LNB IF amplifiers * Cable systems * ISM * General purpose. DESCRIPTION Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 SMD plastic package. QUICK REFERENCE DATA SYMBOL VS IS s212 NF PL(sat) PARAMETER DC supply voltage DC supply current insertion power gain noise figure saturated load power f = 1 GHz f = 1 GHz f = 1 GHz CONDITIONS 5 4.3 22 2.6 -4 TYP. 6 - - - -
1
Top view
Marking code: B6-.
BGA2715
PINNING PIN 1 2, 5 3 4 6 VS GND2 RF out GND1 RF in DESCRIPTION
6
5
4
1
6
3
2
3
MAM455
4
2, 5
Fig.1 Simplified outline (SOT363) and symbol.
MAX.
UNIT V mA dB dB dBm
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) SYMBOL VS IS Ptot Tstg Tj PD PARAMETER DC supply voltage supply current total power dissipation storage temperature operating junction temperature maximum drive power CAUTION This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport and handling. Ts 90 C CONDITIONS RF input AC coupled - - - -65 - - MIN. 6 8 200 +150 150 -10 MAX. UNIT V mA mW C C dBm
2004 Feb 02
2
Philips Semiconductors
Preliminary specification
MMIC wideband amplifier
THERMAL CHARACTERISTICS SYMBOL Rth j-s PARAMETER thermal resistance from junction to solder point CONDITIONS Ptot = 200 mW; Ts 90 C
BGA2715
VALUE 300
UNIT K/W
CHARACTERISTICS VS = 5 V; IS = 4.3 mA; Tj = 25 C; unless otherwise specified. SYMBOL IS s212 PARAMETER supply current insertion power gain f = 100 MHz f = 1 GHz f = 1.8 GHz f = 2.2 GHz f = 2.6 GHz f = 3 GHz RL IN RL OUT s122 NF BW K PL(sat) PL 1 dB IM2 IP3(in) IP3(out) return losses input return losses output isolation noise figure bandwidth stability factor saturated load power load power second order intermodulation input intercept point output intercept point f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz f = 1.6 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz at 1 dB gain compression; f = 1 GHz at 1 dB gain compression; f = 2.2 GHz at PD = -40 dBm, f0 = 1 GHz f = 1 GHz f = 2.2 GHz f = 1 GHz f = 2.2 GHz CONDITIONS MIN. 3.5 11 20 21 21 20 18 10 8 10 7 53 38 - - - - -5 -6 -9 -10 29 -21 -24 0 -1 TYP. 4.3 13.3 21.7 23.2 23.3 22.1 20.1 12 10 12 8.5 54 39 2.6 3.1 3.3 18 2.3 -4.0 -5.0 -8.0 -8.5 30 -19.4 -22.7 2.3 0.6 MAX. 5.5 15 23 25 25 24 22 - - - - - - 2.8 3.3 - - - - - - - - - - - - UNIT mA dB dB dB dB dB dB dB dB dB dB dB dB dB dB GHz - - dBm dBm dBm dBm dBc dBm dBm dBm dBm
at s212 -3 dB below flat gain at 1 GHz 3
2004 Feb 02
3
Philips Semiconductors
Preliminary specification
MMIC wideband amplifier
APPLICATION INFORMATION
BGA2715
Figure 2 shows a typical application circuit for the BGA2715 MMIC. The device is internally matched to 50 , and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF for applications above 100 MHz. However, when the device is operated below 100 MHz, the capacitor value should be increased. The 22 nF supply decoupling capacitor C1 should be located as closely as possible to the MMIC. The PCB top ground plane, connected to the pins 2,4 and 5 must be as close as possible to the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes, as close as possible to the MMIC.
V halfpage handbook, s C1 Vs RF input C2 GND1 GND2
MGU435
RF in
RF out C3
RF output
Fig.2 Typical application circuit.
Figure 3 show the PCB layout, used for the standaard demo board.
PCB layout, true size = 30 X 30 mm
Demo board with components
Fig.3 PCB layout.
2004 Feb 02
4
Philips Semiconductors
Preliminary specification
MMIC wideband amplifier
BGA2715
Grounding and output impedance If the grounding is not optimal, the gain becomes less flat and the 50 output matching becomes worse. If a better output matching to 50 is required, a 12 resistor (R1) can be placed in series with C3, see figure 4. This will significantly improve the output impedance, at the cost of 1 dB gain and 1 dB output power.
Vs C1 Vs RF input C2 GND1 GND2 RF in RF out C3 R1 RF output
Fig.4 Application circuit for better output impedance into 50 . APPLICATION EXAMPLES
The MMIC is very suitable as IF amplifier in e.g. LNB's. The excellent wideband characteristics make it an ideal building block (figure 5).
As second amplifier after an LNA, the MMIC offers an easy matching, low noise solution (figure 6).
handbook, halfpage
mixer to IF circuit or demodulator wideband amplifier oscillator
from RF circuit
handbook, halfpage
mixer to IF circuit or demodulator LNA wideband amplifier oscillator
MGU439
antenna
MGU438
Fig.5 Application as IF amplifier.
Fig.6 Application as RF amplifier.
2004 Feb 02
5
Philips Semiconductors
Preliminary specification
MMIC wideband amplifier
BGA2715
90 +1 135 +0.5 45 +2 1.0 0.8 0.6 +0.2 4GHz 0 180 0.2 0.5 1 100MHz 2 5 +5 0.2 0 0 0.4
-0.2
-5
-2 -135 -0.5 -1
IS = 4.3 mA; VS = 5.0 V; PD = -35 dBm; ZO = 50 .
-45 1.0 -90
Fig.7 Input reflection coefficient (s11); typical values.
90 +1 135 +0.5 45 +2 1.0 0.8 0.6 +0.2 +5 0 180 4GHz 0.2 1 2 100MHz -5 5 0 0 0.4 0.2
-0.2
-135
-0.5 -1
-2
-45
IS = 4.3 mA; VS = 5.0 V; PD = -35 dBm; ZO = 50 .
1.0 -90
Fig.8 Output reflection coefficient (s22); typical values.
2004 Feb 02
6
Philips Semiconductors
Preliminary specification
MMIC wideband amplifier
BGA2715
0 2 |s12| (dB) -10 -20 -30 -40 -50 -60 0 1000 2000 3000 4000 f (MHz)
30 |s21|2 (dB)
(1) (2)
20
(3)
10
0 0 1000 2000 3000 4000 f (MHz)
PD = -35 dBm; ZO = 50 . (1) IS = 4.7 mA; VS = 5.5 V. (2) IS = 4.3 mA; VS = 5 V. (3) IS = 3.9 mA; VS = 4.5 V.
IS = 4.3 mA; VS = 5.0 V; PD = -35 dBm; ZO = 50 .
Fig.9
Isolation (s122) as a function of frequency; typical values.
Fig.10 Insertion gain (s212) as a function of frequency; typical values.
0 PL (dBm) -5
(1) (2) (3)
0 PL (dBm) -5 -10 -15 -20 -25
(1) (2) (3)
-10 -15 -20 -25 -30 -50
f = 1 GHz; ZO = 50 . (1) VS = 5.5 V. (2) VS = 5 V. (3) VS = 4.5 V.
-30
-40
-30
-20
-10 0 PD (dBm)
-50
-40
-30
-20
-10 0 PD (dBm)
f = 2.2 GHz; ZO = 50 . (1) VS = 5.5 V. (2) VS = 5 V. (3) VS = 4.5 V.
Fig.11 Load power as a function of drive power at 1 GHz; typical values.
Fig.12 Load power as a function of drive power at 2.2 GHz; typical values.
2004 Feb 02
7
Philips Semiconductors
Preliminary specification
MMIC wideband amplifier
BGA2715
5 NF (dB) K
35 30 25
4 20
(3)
15 10
3
(2) (1)
5 0
2 0 1000 2000 f (MHz)
0
1000
2000
3000
4000 f (MHz)
ZO = 50 . (1) IS = 4.7 mA; VS = 5.5 V. (2) IS = 4.3 mA; VS = 5 V. (3) IS = 3.9 mA; VS = 4.5 V. IS = 4.3 mA; VS = 5.0 V; ZO = 50 .
Fig.13 Noise figure as a function of frequency; typical values.
Fig.14 Stability factor as a function of frequency; typical values.
2004 Feb 02
8
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Scattering parameters VS = 5.0 V; IS = 4.3 mA; PD = -35 dBm; ZO = 50 ; Tamb = 25 C; s21 MAGNITUDE (ratio) 4.641604 5.427784 7.924499 9.807075 11.13563 12.17817 13.02575 13.60797 14.14423 14.54321 14.65137 14.61385 13.78165 12.75107 11.55715 10.12992 8.961976 8.061087 7.318683 6.619309 6.105669 -75.98154 -56.90074 -37.20896 0.019248 0.020895 0.020531 -16.85382 0.019.73 3.789364 0.018743 25.3978 0.019651 48.40486 0.016703 7.697541 -11.0858 -28.17932 -45.60266 -60.69421 -72.89823 -85.18773 74.12332 0.017402 33.11605 100.012 0.014471 54.07247 127.2237 0.011662 94.4722 154.6647 0.008743 103.0426 0.352132 0.378963 0.359508 0.349807 0.327615 0.296875 0.27147 0.247253 0.217973 0.184766 0.150082 -179.671 0.005641 120.4153 0.338893 -153.3766 0.004588 124.9325 0.307361 -128.89 0.003866 138.7051 0.287623 -104.2842 0.002785 147.5162 0.271479 -80.09316 0.002036 155.3396 0.25378 -63.76927 -82.31896 -104.1092 -125.9161 -154.6072 177.7152 145.8774 115.0129 88.0727 61.52393 39.00544 18.63863 -1.617895 -21.22008 -40.71164 -60.81328 -55.31486 0.001473 124.9044 0.237554 -48.11004 -30.92853 0.001336 0.22656 -170.6765 -34.95361 -7.594877 0.001688 0.223868 33.8 33.8 26.8 17.8 12.2 8.4 6.7 5.1 3.2 2.3 2.0 1.9 2.3 2.3 2.8 3.0 3.3 3.4 3.8 -77.39562 -23.69087 7.997073 0.003611 -114.8849 0.219504 23.9 -14.09179 13.82793 0.01958 -110.345 0.231889 5.2 -14.37137 ANGLE (deg) MAGNITUDE (ratio) ANGLE (deg) MAGNITUDE (ratio) ANGLE (deg) KFACTOR s12 s22
2004 Feb 02
s11
f (MHz)
MAGNITUDE (ratio)
ANGLE (deg)
Philips Semiconductors
100
0.100503
27.76918
200
0.121228
24.6812
400
0.217855
3.974108
600
0.26219
-28.08926
800
0.26297
-61.21535
MMIC wideband amplifier
1000
0.241089
-96.9469
1200
0.211289
-136.4953
1400
0.18828
1754377
1600
0.187898
128.6387
1800
0.231527
80.79592
2000
0.257172
40.08414
2200
0.303945
2.249913
9
2400
0.311735
-39.67469
2600
0.288113
-77.37179
2800
0.265404
-114.1115
3000
0.24479
-151.8463
3200
0.225353
170.8795
3400
0.219366
136.6841
3600
0.226203
106.1421
3800
0.23349
78.62692
4000
0.244216
54.63669
Preliminary specification
BGA2715
Philips Semiconductors
Preliminary specification
MMIC wideband amplifier
PACKAGE OUTLINE
BGA2715
Plastic surface mounted package; 6 leads
SOT363
D
B
E
A
X
y
HE
vMA
6
5
4
Q
pin 1 index
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT363
REFERENCES IEC JEDEC EIAJ SC-88
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
2004 Feb 02
10
Philips Semiconductors
Preliminary specification
MMIC wideband amplifier
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
BGA2715
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 Feb 02
11
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613516/02/pp15
Date of release: 2004
Feb 02
Document order number:
9397 750 12826


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