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DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D119
BYD63 Ripple blocking diode
Product specification Supersedes data of 1996 June 10 2003 Mar 06
Philips Semiconductors
Product specification
Ripple blocking diode
FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Guaranteed minimum turn-on time for absorbing forward current transients and oscillations * Specially designed as rectifier in the auxiliary power supply in e.g. switched mode power supplies * Available in ammo-pack. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VRRM VR IF(AV) PARAMETER repetitive peak reverse voltage continuous reverse voltage average forward current averaged over any 20 ms period; Ttp = 55 C; lead length = 10 mm; see Fig.2; see also Fig.4 averaged over any 20 ms period; Tamb = 65 C; PCB mounting (Fig.8); see Fig.3; see also Fig.4 IFRM IFSM Tstg Tj repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature Ttp = 55 C Tamb = 65 C t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax CONDITIONS - - - MIN.
k a
MAM123
BYD63
DESCRIPTION Cavity free cylindrical glass package through ImplotecTM(1) technology.
(1) Implotec is a trademark of Philips.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
handbook, 4 columns
Fig.1 Simplified outline (SOD81) and symbol.
MAX. 300 300 0.85 V V A
UNIT
-
0.45
A
- - - -65 -65
8.25 4.45 5 +175 +175
A A A C C
2003 Mar 06
2
Philips Semiconductors
Product specification
Ripple blocking diode
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF IR PARAMETER forward voltage reverse current CONDITIONS IF = 1 A; Tj = Tj max; see Fig.5 IF = 1 A; see Fig.5 VR = VRRMmax; see Fig.6 VR = VRRMmax; Tj = 165 C; see Fig.6 tfr ton forward recovery time turn-on time when switched to IF = 1 A in 50 ns; see Fig.9 when switched from VF = 0 V to VF = 3 V; measured between 10% and 90% of IF max; see Fig.11 - - - - - 500 MIN. - - - - - - TYP. MAX. 1.7 2.3 1 100 350 -
BYD63
UNIT V V A A ns ns
trr
reverse recovery time
when switched from IF = 0.5 A to - IR = 1 A; measured at IR = 0.25 A; see Fig.11 f = 1 MHz; VR = 0 V; see Fig.7 -
-
150
ns
Cd
diode capacitance
17
-
pF
THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.8. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient CONDITIONS lead length = 10 mm note 1 VALUE 60 120 UNIT K/W K/W
2003 Mar 06
3
Philips Semiconductors
Product specification
Ripple blocking diode
GRAPHICAL DATA
1.6
MLC303
BYD63
handbook, halfpage
handbook, halfpage
0.8
MLC304
I F(AV) (A) 1.2
I F(AV) (A) 0.6
lead length 10 mm 0.8 0.4
0.4
0.2
0 0 a = 1.42; VR = VRRMmax; = 0.5. Switched mode application. 100 T tp ( oC) 200
0
0
100
a = 1.42; VR = VRRMmax; = 0.5. Device mounted as shown in Fig.8. Switched mode application.
Tamb ( o C)
200
Fig.2
Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage).
Fig.3
Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage).
handbook, halfpage
3
MLC302
handbook, halfpage
6
MLC301
P (W) a = 3 2.5 2 2 1.57 1.42
IF (A) 4
1
2
0
0 0 0.5 I F(AV) (A) 1.0
0
1
2
3
4
V F (V)
5
a = IF(RMS)/IF(AV); VR = VRRMmax; = 0.5.
Fig.4
Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current.
Dotted line: Tj = 175 C. Solid line: Tj = 25 C.
Fig.5
Forward current as a function of forward voltage; maximum values.
2003 Mar 06
4
Philips Semiconductors
Product specification
Ripple blocking diode
BYD63
103 handbook, halfpage IR (A) 102
MGA853
102 handbook, halfpage
MLC305
Cd (pF)
10
10
1 0 100 T j ( o C) 200
1 1 10
102
V R (V)
103
VR = VRRMmax.
f = 1 MHz; Tj = 25 C.
Fig.6
Reverse current as a function of junction temperature; maximum values.
Fig.7
Diode capacitance as a function of reverse voltage; typical values.
handbook, halfpage
50 25
handbook, halfpage
MGD600
VF 90% 100%
7 50 t fr IF t
2 3 10%
MGA200
t
Dimensions in mm.
Fig.8 Device mounted on a printed-circuit board.
Fig.9 Forward recovery time definition.
2003 Mar 06
5
Philips Semiconductors
Product specification
Ripple blocking diode
BYD63
handbook, full pagewidth
3V DUT VF (V) 0 50 10 IF (A) 0 ton 10%
MBH530
100% 90%
Input impedance oscilloscope: 1 M, 22 pF; tr 7 ns. Source impedance: 50 ; tr 10 ns.
Fig.10 Test circuit and turn-on time waveform and definition.
handbook, full pagewidth
DUT +
IF (A) 0.5 1 t rr
10
25 V 50 0 0.25 0.5 IR (A) 1.0
t
MAM057
Input impedance oscilloscope: 1 M, 22 pF; tr 7 ns. Source impedance: 50 ; tr 15 ns.
Fig.11 Test circuit and reverse recovery time waveform and definition.
2003 Mar 06
6
Philips Semiconductors
Product specification
Ripple blocking diode
PACKAGE OUTLINE Hermetically sealed glass package; ImplotecTM(1) technology; axial leaded; 2 leads
BYD63
SOD81
G1
(2)
k
a
b
D
L
G
L
DIMENSIONS (mm are the original dimensions) UNIT mm b max. 0.81 D max. 2.15 G max. 3.8 G1 max. 5 L min. 28 0 1 scale 2 mm
Notes 1. Implotec is a trademark of Philips. 2. The marking band indicates the cathode. OUTLINE VERSION SOD81 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-20
2003 Mar 06
7
Philips Semiconductors
Product specification
Ripple blocking diode
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
BYD63
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Mar 06
8
Philips Semiconductors
Product specification
Ripple blocking diode
NOTES
BYD63
2003 Mar 06
9
Philips Semiconductors
Product specification
Ripple blocking diode
NOTES
BYD63
2003 Mar 06
10
Philips Semiconductors
Product specification
Ripple blocking diode
NOTES
BYD63
2003 Mar 06
11
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/02/pp12
Date of release: 2003
Mar 06
Document order number:
9397 750 10976

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