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| Datasheet File OCR Text: |
| .630 16.00 BSC Square DOCUMENT CONTROL NO. PD - 1805 REVISION: C DATE: 03/09/05 .551 14.00 BSC Square .004 .008 0.09 0.20 GAUGE PLANE 0.25 mm .018 0.45 .030 0.75 .039 1.00 REF .063 1.60 Max. 1 .004 0.10 Seating Plane .007 0.17 .010 0.27 X.XX DENOTES DIMENSIONS X.XX IN MILLIMETERS .031 0.80 BSC .002 .006 0.05 0.15 .053 .057 1.35 1.45 Notes: 1. All dimensions in millimeters 2. Ref.: JEDEC MS-026D/BEB 3. Package Outline Exclusive of Mold Flash and Metal Burr Pericom Semiconductor Corporation 3545 N. 1st Street, San Jose, CA 95134 1-800-435-2335 * www.pericom.com DESCRIPTION: 64-Pin, Low Profile Quad Flat Package, LQFP PACKAGE CODE: FD |
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