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| PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor Rev. 01 -- 7 April 2006 Product data sheet 1. Product profile 1.1 General description NPN low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS304PD. 1.2 Features I I I I I Low collector-emitter saturation voltage VCEsat High collector current capability IC and ICM High collector current gain (hFE) at high IC High efficiency due to less heat generation Smaller required Printed-Circuit Board (PCB) area than for conventional transistors 1.3 Applications I I I I I I High-voltage DC-to-DC conversion High-voltage MOSFET gate driving High-voltage motor control High-voltage power switches (e.g. motors, fans) Thin Film Transistor (TFT) backlight inverter Automotive applications 1.4 Quick reference data Table 1. VCEO IC ICM RCEsat [1] [2] Quick reference data Conditions open base [1] Symbol Parameter collector-emitter voltage collector current peak collector current collector-emitter saturation resistance Min [2] Typ 68 Max 80 3 6 88 Unit V A A m single pulse; tp 1 ms IC = 2 A; IB = 200 mA - Device mounted on a ceramic PCB, Al2O3, standard footprint. Pulse test: tp 300 s; 0.02. Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 2. Pinning information Table 2. Pin 1 2 3 4 5 6 Pinning Description collector collector base emitter collector collector 1 2 3 6 5 4 3 4 sym014 Simplified outline Symbol 1, 2, 5, 6 3. Ordering information Table 3. Ordering information Package Name PBSS304ND SC-74 Description plastic surface-mounted package (TSOP6); 6 leads Version SOT457 Type number 4. Marking Table 4. Marking codes Marking code AF Type number PBSS304ND PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 2 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IB IBM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current base current peak base current total power dissipation single pulse; tp 1 ms Tamb 25 C [1] [3] [4] [2] [1][5] Conditions open emitter open base open collector [1] [2] Min -65 -65 Max 80 80 5 1 3 6 0.8 2 360 600 750 1.1 2.5 150 +150 +150 Unit V V V A A A A A mW mW mW W W C C C single pulse; tp 1 ms Tj Tamb Tstg [1] [2] [3] [4] [5] junction temperature ambient temperature storage temperature Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on a ceramic PCB, Al2O3, standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. Pulse test: tp 10 ms; 10 %. PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 3 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 1600 Ptot (mW) 1200 (1) 006aaa270 800 (2) (3) 400 (4) 0 -75 -25 25 75 125 175 Tamb (C) (1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for collector 6 cm2 (3) FR4 PCB, mounting pad for collector 1 cm2 (4) FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1] [2] [3] [4] [1][5] Min - Typ - Max 350 208 160 113 50 45 Unit K/W K/W K/W K/W K/W K/W Rth(j-sp) [1] [2] [3] [4] [5] thermal resistance from junction to solder point Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint. Pulse test: tp 10 ms; 10 %. PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 4 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 10 0.02 0.01 1 006aaa271 0 10-1 10-5 10-4 10-3 10-2 10-1 1 10 102 tp (s) 103 FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0.01 1 0 10-1 10-5 006aaa272 10-4 10-3 10-2 10-1 1 10 102 tp (s) 103 FR4 PCB, mounting pad for collector 1 cm2 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 5 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 103 Zth(j-a) (K/W) 102 006aaa273 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 10 1 0 10-1 10-5 10-4 10-3 10-2 10-1 1 10 102 tp (s) 103 FR4 PCB, mounting pad for collector 6 cm2 Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 103 Zth(j-a) (K/W) 102 006aaa751 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 10 1 0 10-1 10-5 10-4 10-3 10-2 10-1 1 10 102 tp (s) 103 Ceramic PCB, Al2O3, standard footprint Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 6 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 7. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter ICBO Conditions Min 240 [1] [1] [1] [1] [1] [1] Typ 360 280 165 105 75 55 40 40 80 135 215 200 265 335 400 68 0.79 0.81 0.84 0.92 0.95 0.81 Max 100 50 100 100 55 105 175 275 255 335 415 505 88 0.87 0.89 0.92 1 1.03 1 Unit nA A nA nA collector-base cut-off VCB = 80 V; IE = 0 A current VCB = 80 V; IE = 0 A; Tj = 150 C collector-emitter cut-off current emitter-base cut-off current DC current gain VCE = 64 V; VBE = 0 V VEB = 5 V; IC = 0 A VCE = 2 V; IC = 0.5 A VCE = 2 V; IC = 1 A VCE = 2 V; IC = 2 A VCE = 2 V; IC = 3 A VCE = 2 V; IC = 4 A VCE = 2 V; IC = 5 A VCE = 2 V; IC = 6 A ICES IEBO hFE 190 115 70 45 35 25 - VCEsat collector-emitter saturation voltage IC = 0.5 A; IB = 50 mA IC = 1 A; IB = 50 mA IC = 2 A; IB = 200 mA IC = 3 A; IB = 150 mA IC = 3 A; IB = 300 mA IC = 4 A; IB = 400 mA IC = 5 A; IB = 0.5 A IC = 6 A; IB = 0.6 A [1] [1] [1] [1] [1] [1] [1] mV mV mV mV mV mV mV mV m V V V V V V - RCEsat VBEsat collector-emitter IC = 2 A; IB = 200 mA saturation resistance base-emitter saturation voltage IC = 0.5 A; IB = 50 mA IC = 1 A; IB = 50 mA IC = 1 A; IB = 100 mA IC = 3 A; IB = 150 mA IC = 3 A; IB = 300 mA [1] [1] [1] - VBEon base-emitter turn-on VCE = 2 V; IC = 2 A voltage PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 7 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor Table 7. Characteristics ...continued Tamb = 25 C unless otherwise specified. Symbol Parameter td tr ton ts tf toff fT Cc delay time rise time turn-on time storage time fall time turn-off time transition frequency VCE = 10 V; IC = 100 mA; f = 100 MHz Conditions VCC = 9.2 V; IC = 2 A; IBon = 0.1 A; IBoff = -0.1 A Min Typ 13 167 180 352 231 583 140 18 Max Unit ns ns ns ns ns ns MHz pF collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz Pulse test: tp 300 s; 0.02. [1] PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 8 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 600 (1) 006aaa711 6 IC (A) 006aaa712 hFE 400 (2) IB = 150 mA 135 120 105 90 75 4 60 45 30 (3) 15 2 200 0 10-1 1 10 102 103 104 IC (mA) 0 0 0.4 0.8 1.2 1.6 2.0 VCE (V) VCE = 2 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -55 C Tamb = 25 C Fig 6. DC current gain as a function of collector current; typical values 006aaa713 Fig 7. Collector current as a function of collector-emitter voltage; typical values 006aaa714 1.2 VBE (V) 0.8 1.2 VBEsat (V) 0.8 (1) (1) (2) (2) 0.4 (3) 0.4 (3) 0 10-1 1 10 102 103 104 IC (mA) 0 10-1 1 10 102 103 104 IC (mA) VCE = 2 V (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C IC/IB = 20 (1) Tamb = -55 C (2) Tamb = 25 C (3) Tamb = 100 C Fig 8. Base-emitter voltage as a function of collector current; typical values Fig 9. Base-emitter saturation voltage as a function of collector current; typical values PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 9 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 1 VCEsat (V) 10-1 006aaa715 1 VCEsat (V) 10-1 006aaa716 (1) (2) (3) (1) (2) (3) 10-2 10-2 10-3 10-1 1 10 102 103 104 IC (mA) 10-3 10-1 1 10 102 103 104 IC (mA) IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -55 C Tamb = 25 C (1) IC/IB = 100 (2) IC/IB = 50 (3) IC/IB = 10 Fig 10. Collector-emitter saturation voltage as a function of collector current; typical values 103 RCEsat () 102 006aaa717 Fig 11. Collector-emitter saturation voltage as a function of collector current; typical values 103 RCEsat () 102 006aaa718 10 10 (1) 1 (1) (2) (3) 1 (2) (3) 10-1 10-1 10-2 10-1 1 10 102 103 104 IC (mA) 10-2 10-1 1 10 102 103 104 IC (mA) IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = -55 C Tamb = 25 C (1) IC/IB = 100 (2) IC/IB = 50 (3) IC/IB = 10 Fig 12. Collector-emitter saturation resistance as a function of collector current; typical values Fig 13. Collector-emitter saturation resistance as a function of collector current; typical values PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 10 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 8. Test information IB 90 % input pulse (idealized waveform) IBon (100 %) 10 % IBoff IC 90 % output pulse (idealized waveform) IC (100 %) 10 % t td ton tr ts toff tf 006aaa003 Fig 14. BISS transistor switching time definition VBB VCC RB (probe) oscilloscope 450 VI R1 R2 RC Vo (probe) 450 DUT oscilloscope mlb826 VCC = 9.2 V; IC = 2 A; IBon = 0.1 A; IBoff = -0.1 A Fig 15. Test circuit for switching times PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 11 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 9. Package outline 3.1 2.7 6 5 4 0.6 0.2 1.1 0.9 3.0 2.5 1.7 1.3 pin 1 index 1 0.95 1.9 Dimensions in mm 2 3 0.40 0.25 0.26 0.10 04-11-08 Fig 16. Package outline SOT457 (SC-74) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PBSS304ND Package SOT457 Description 4 mm pitch, 8 mm tape and reel; T1 4 mm pitch, 8 mm tape and reel; T2 [1] [2] [3] [2] [3] Packing quantity 3000 -115 -125 10000 -135 -165 For further information and the availability of packing methods, see Section 14. T1: normal taping T2: reverse taping PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 12 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 11. Soldering 3.45 1.95 solder lands 0.95 3.30 2.825 0.45 0.55 occupied area solder paste solder resist 1.60 1.70 3.10 3.20 msc422 Dimensions in mm Fig 17. Reflow soldering footprint SOT457 (SC-74) 5.30 solder lands solder resist 5.05 0.45 1.45 4.45 occupied area solder paste MSC423 1.40 4.30 Dimensions in mm Fig 18. Wave soldering footprint SOT457 (SC-74) PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 13 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 12. Revision history Table 9. Revision history Release date 20060407 Data sheet status Product data sheet Change notice Supersedes Document ID PBSS304ND_1 PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 14 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 13. Legal information 13.1 Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet [1] [2] [3] Product status[3] Development Qualification Production Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification. Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.semiconductors.philips.com. 13.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Philips Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Philips Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. malfunction of a Philips Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Philips Semiconductors accepts no liability for inclusion and/or use of Philips Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- Philips Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.semiconductors.philips.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Philips Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, Philips Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- Philips Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- Philips Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com PBSS304ND_1 (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 01 -- 7 April 2006 15 of 16 Philips Semiconductors PBSS304ND 80 V, 3 A NPN low VCEsat (BISS) transistor 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Packing information. . . . . . . . . . . . . . . . . . . . . 12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) Koninklijke Philips Electronics N.V. 2006. All rights reserved. For more information, please visit: http://www.semiconductors.philips.com. For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com. Date of release: 7 April 2006 Document identifier: PBSS304ND_1 |
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