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  Datasheet File OCR Text:
 Composite Transistors
XN0A554 (XN6A554)
Silicon NPN epitaxial planer transistor
For high speed switching
4 2.90+0.20 -0.05 1.90.1 (0.95) (0.95) 5 6
1.50+0.25 -0.05 2.8+0.2 -0.3
Unit: mm
0.16+0.10 -0.06
q q
3
2
1
(0.65)
0.30+0.10 -0.05 0.50+0.10 -0.05 10
1.1+0.2 -0.1
q
s Absolute Maximum Ratings
Parameter Collector to base voltage Rating Collector to emitter voltage of Emitter to base voltage element Collector current Peak collector current Total power dissipation Overall Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC ICP PT Tj Tstg
(Ta=25C)
Ratings 40 40 5 100 300 300 150 -55 to +150 Unit V V V mA mA mW C C
1 : Collector (Tr1) 2 : Base (Tr2) 3 : Collector (Tr2)
4 : Emitter (Tr2) 5 : Emitter (Tr1) 6 : Base (Tr1) EIAJ : SC-74 Mini6-G1 Package
Marking Symbol: DT Internal Connection
6 5 4 Tr1 1 2 3
Tr2
s Electrical Characteristics
Parameter Collector cutoff current Emitter cutoff current Forward current transfer ratio Forward current transfer hFE ratio Collector to emitter saturation voltage Base to emitter saturation voltage Transition frequency Collector output capacitance Turn-off time Turn-on time Storage time
*1 *2
(Ta=25C)
Symbol ICBO IEBO hFE hFE (small/large)*1 VCE(sat) VBE(sat) fT Cob ton toff tstg
*2
Conditions VCB = 40V, IE = 0 VEB = 4V, IC = 0 VCE = 1V, IC = 10mA VCE = 1V, IC = 10mA IC = 10mA, IB = 1mA IC = 10mA, IB = 1mA VCE = 10V, IE = -10mA, f = 200MHz VCB = 10V, IE = 0, f = 1MHz
min
typ
0 to 0.1
2SC3757 x 2 elements
1.1+0.3 -0.1
s Basic Part Number of Element
5
q
Two elements incorporated into one package. Reduction of the mounting area and assembly cost by one half. Low VCE(sat).
max 0.1 0.1
Unit A A
60 0.5 0.99 0.17
320
0.25 1.0
450 2 17 17 10 6
MHz pF
Ratio between 2 elements Test Circuits Note) The Part number in the Parenthesis shows conventional part number.
0.40.2
s
Features
V V
ns
1
Composite Transistors
ton, toff Test Circuit
0.1F Vout 220 Vin=10V 3.3k 3.3k Vbb= -3V 50
XN0A554
tstg Test Circuit
0.1F A 910 0.1F 500 Vin=10V 500 50 Vbb=2V VCC=10V 90 Vout
PT -- Ta
500
1k
Total power dissipation PT (mW)
400
50
VCC=3V
300
Vin Vout
10% 90%
Vin Vout
10% 90%
0 Vin
200
10% 10% tstg (Wave form at A)
Vout
toff
100
ton
0 0 40 80 120 160
Ambient temperature Ta (C)
IC -- VCE
120 100
VCE(sat) -- IC
Collector to emitter saturation voltage VCE(sat) (V)
Ta=25C IC/IB=10 100
VBE(sat) -- IC
IC/IB=10
Base to emitter saturation voltage VBE(sat) (V)
100
30 10 3 1 0.3 0.1 0.03 0.01 0.1 25C Ta=75C
30 10 3 25C 1 0.3 0.1 0.03 0.01 Ta=-25C 75C
Collector current IC (mA)
IB=3.0mA 2.5mA
80
2.0mA 1.5mA
60 1.0mA 40 0.5mA 20
-25C
0 0 0.2 0.4 0.6 0.8 1.0 1.2
0.3
1
3
10
30
100
1
3
10
30
100
300
1000
Collector to emitter voltage VCE (V)
Collector current IC (mA)
Collector current IC (mA)
hFE -- IC
600 VCE=1V 600
fT -- I E
6
Cob -- VCB
Collector output capacitance Cob (pF)
VCE=10V Ta=25C f=1MHz IE=0 Ta=25C
Forward current transfer ratio hFE
500
Transition frequency fT (MHz)
500
5
400
400
4
300
300
3
200
Ta=75C 25C -25C
200
2
100
100
1
0 0.1
0.3
1
3
10
30
100
0 -1
0 -3 -10 -30 -100 -300 -1000 1 3 10 30 100
Collector current IC (mA)
Emitter current IE (mA)
Collector to base voltage VCB (V)
2
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR


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