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TC4864
300mW Audio Power Amplifier with Shutdown Mode
FEATURES
s s s s s s s s s 1.0% (Max) THD at 1kHz at 300mW Continuous Average Output Power into 8 1.0% (Max) THD at 1kHz at 300mW Continuous Average Output Power into 16 Shutdown Current 0.1A (typ) MSOP Packaging No Output Coupling Capacitors, Bootstrap Capacitors, or Snubber Circuits are Necessary Unity-gain Stable External Gain Configuration Capability 300mW Output Power Guaranteed Single Supply Operation
GENERAL DESCRIPTION
The TC4864 is a bridged audio power amplifier capable of delivering 300 mW of continuous average power into an 8 load with 1% (THD) from a 5V power supply. The TC4864 audio power amplifier is specifically designed to provide high quality output power from a low supply voltage, while requiring very few external components. The TC4864 does not require output coupling, or bootstrap, capacitors; nor does it require snubber networks. Because of this, it is ideal for low-power portable applications. The TC4864 features an externally controlled, low power consumption shutdown mode (Active High). The closed loop response of the unity-gain stable TC4864 can be configured by external gain-setting resistors. The device is offered in a space-saving 8-Pin MSOP package to suit applications where minimal board space layouts are essential. The TC4864 operates over an input supply voltage range of 2.7V to 5.5V.
APPLICATIONS
s s s Cellular Phones Personal Computers General Purpose Audio
ORDERING INFORMATION
TYPICAL OPERATING CIRCUIT
Part Number TC4864EUA
VDD RF 20k Audio Input Ci 0.39F Ri 20k CS 0.1F 6 4 3 IN- IN+ VDD
Package 8-Pin MSOP
Temp. Range -40C to +85C
PIN CONFIGURATION
Vo1 5 10k 50k 10k RL 8 Vo2 8
- +
8-Pin MSOP
SHDN VREF IN+ _ IN
1 2 3 4 8 7
-
2 VREF CB 1.0F 50k 1 SHDN OFF ON Shutdown Control Bias GND 7 VDD/2
+
Av = -1
TC4864 EUA
6 5
VO2 GND VDD VO1
Figure 1
TC4864-1 11/16/00
TelCom Semiconductor reserves the right to make changes in the circuitry and specifications of its devices.
300mW Audio Power Amplifier with Shutdown Mode TC4864
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage ...........................................................6.0V Storage Temperature ............................. -65C to +150C Input Voltage ..................................... -0.3V to VDD + 0.3V Power Dissipation ................................................ (Note 3) ESD Susceptibility(Note 4) ..................................... 3500V ESD Susceptibility (Note 5) .......................................250V Junction Temperature ............................................. 150C Soldering Information: Small Outline Package Vapor Phase (60 sec.) .................................. 215C Infrared (15 sec.) ........................................... 220C Thermal Resistance JC (MSOP) .......................................................... 56C/W JA (MSOP) ........................................................ 210C/W Operating Ratings Temperature Range TMIN TA TMAX ................... -40C TA +85C Supply Voltage ..................................... 2.7V VDD 5.5V
*Static-sensitive device. Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to Absolute Maximum Rating Conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS: (Notes 1 and 2)
The following specifications apply for VDD = 5V unless otherwise specified. Limits apply for TA = 25C
Symbol IDD ISD VOS PO Parameter Quiescent Power Supply Current Shutdown Current Output Offset Voltage Output Power Test Conditions VIN = 0V, IO = 0A (Note 8) VPIN1 = VDD VIN = 0V THD + N = 1% (max); f = 1kHz; RL = 8 (Note 9) THD+N = 1%(max); f=1kHz; RL = 16 THD+N PSRR VIH VIL Total Harmonic Distortion+Noise Power Supply Rejection Ratio Shutdown High Level Input Voltage Shutdown Low Level Input Voltage PO = 300mW; AVD = 2; RL = 8; 20Hz f 20kHz VDD = 4.9V -5.1V Min -- -- -- 300 -- -- 55 2.5 -- Typ 4.1 0.1 5 740 590 0.1 75 -- -- -- 0.8 Max 9 1 30 -- -- -- Units mA A mV mW mW % dB V V
ELECTRICAL CHARACTERISTICS: (Notes 1 and 2)
The following specifications apply for VDD = 3V unless otherwise specified. Limits apply for TA = 25C
Symbol IDD ISD VOS PO THD+N PSRR VIH VIL
TC4864-1 11/16/00
Parameter Quiescent Power Supply Current Shutdown Current Output Offset Voltage Output Power Total Harmonic Distortion+Noise Power Supply Rejection Ratio Shutdown High Level Input Voltage Shutdown Low Level Input Voltage
Test Conditions VIN = 0V, IO = 0A (Note 8) VPIN1 = VDD VIN = 0V THD = 1% (max); f = 1 kHz; RL = 8 THD = 1% (max); f = 1 kHz; RL = 16 PO = 100 mW; AVD = 2; RL = 8; 20Hz f 20kHz VDD = 2.9V -3.1V
Min -- -- -- -- -- -- 55 1.6 --
Typ 2.8 0.1 5 240 200 0.1 75 -- --
Max 6.5 1 -- -- -- -- -- -- 0.8
Units mA A mV mW mW % dB V V
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300mW Audio Power Amplifier with Shutdown Mode TC4864
ELECTRICAL CHARACTERISTICS: (Notes 1 and 2) (Continued)
Note 1: Note 2: All voltages are measured with respect to the ground pin, unless otherwise specified. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given; however, the typical value is a good indication of device performance. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX , JA, and the ambient temperature TA. The maximum allowable power dissipation is PDMAX = (TJMAX -TA)/JA . For the TC4864, TJMAX = 150C.The typical junction-to-ambient thermal resistance, when board mounted, is 210C/W for the MSOP package. Human body model, 100pF discharged through a 1.5 k resistor. Machine Model, 220pF -240pF discharged through all pins. Typicals are measured at 25C and represent the parametric norm. Limits are guaranteed to TelCom's AOQL (Average Outgoing Quality Level). The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier. The power dissipation limitation for the package occurs at 300mW of output power. This package limitation is based on 25C ambient temperature and JA = 210C/W. For higher output power possibilities refer to the Power Dissipation Section.
Note 3: . Note 4: Note 5: Note 6: Note 7: Note 8: Note 9:
PIN DESCRIPTION
Pin No. (MSOP) 1 2 3 4 5 6 7 8 Symbol SHDN VREF IN+ IN- VO1 VDD GND VO2 Description Shutdown Logic Input. Reference Voltage Output (VDD/2). Non-Inverting Input. Inverting Input. Non-Inverting Amplifier Output. Power Supply Input. Supply Power Return. Inverting Amplifier Output.
EXTERNAL COMPONENTS DESCRIPTION
Components 1 2 R C Functional Description Inverting input resistance which sets the closed-loop gain in conjunction with RF. This resistor also forms a high pass filter with C at fc = 1/(2RC). Input coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a highpass filter with R at fc = 1/(2RC). Refer to the section Proper Selection of External Components, for an explanation of how to determine the value of C. Feedback resistance which sets the closed-loop gain in conjunction with R. Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing section for information concerning proper placement and selection of the supply bypass capacitor. Bypass pin capacitor which provides half-supply filtering. Refer to the Proper Selection of External Components for information concerning proper placement and selection of CB.
3 4
RF CS
5
CB
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300mW Audio Power Amplifier with Shutdown Mode TC4864
DETAILED DESCRIPTION Application Information
Bridge Configuration Explanation As shown in Figure 1, the TC4864 has two operational amplifiers internally, allowing for several different amplifier configurations. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in a unity-gain, inverting configuration. The closed-loop gain of the first amplifier is set by selecting the ratio of RF to Ri while the second amplifier's gain is fixed by the two internal 10k resistors. Figure 1 shows that the output of amplifier one serves as the input to amplifier two which results in both amplifiers producing signals identical in magnitude, but out of phase 180.Consequently, the differential gain for the IC is AVD = 2*(RF/Ri) The load is driven differentially through outputs VO1 and VO2, creating an amplifier configuration commonly referred to as a "bridged mode". Bridged mode operation is different from the classical single-ended amplifier configuration where one side of its load is connected to ground. There are several distinct advantages to having a bridge amplifier design as opposed to a single-ended configuration. First, the bridge design provides differential drive to the load, thus doubling output swing for a predetermined supply voltage. Second, it is possible to generate four times the output power as that of a single-ended amplifier under the same conditions, provided that the amplifier is not current limited or clipped. For information on how to choose an amplifier's closed-loop gain while avoiding excessive clipping, please refer to the Audio Power Amplifier Design section. A bridge configuration, such as the one used in the TC4864, also creates a third advantage over single-ended amplifiers. Since the differential outputs, VO1 and VO2 , are biased at half-supply, no net DC voltage exists across the load. Thus, the need for an output coupling capacitor is eliminated in a bridge. As opposed to a single supply, singleended amplifier configuration, in which the capacitor is a requirement. If an output coupling capacitor is not used in a single-ended configuration, the half-supply bias across the load would result in both increased internal lC power dissipation as well as permanent loudspeaker damage. POWER DISSIPATION Power dissipation is an important factor when designing a successful amplifier, whether the amplifier be bridged or single-ended. Equation 1 illustrates the maximum power dissipation point for a bridge amplifier operating at a given
TC4864-1 11/16/00
supply voltage and driving a specified output load. PDMAX = (VDD )2/(22RL )
Equation 1.
Single-Ended
However, a direct consequence of the increased power delivered to the load by a bridge amplifier is an increase in internal power dissipation point for a bridge amplifier operating under the same conditions. PDMAX = 4(VDD )2/(2RL )
Equation 2.
Bridge Mode
Since the TC4864 has two operational amplifiers in one package, the maximum internal power dissipation is 4 times that of a single-ended amplifier. Still, the TC4864 does not require heatsinking, even with this substantial increase in power dissipation, . From Equation 1, assuming a 5V power supply and an 8 load, the maximum power dissipation point is 625 mW. The maximum power dissipation point obtained from Equation 2 must not be greater than the power dissipation that results from Equation 3: PDMAX = (TJMAX - TA )/JA
Equation 3.
For the MSOP package, JA = 210C/W. TJMAX = 150C for the TC4864. Depending on the ambient temperature, TA, of the system surroundings, Equation 3 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 2 is greater than that of Equation 3, either the supply voltage must be decreased, the load impedance must be increased, the ambient temperature reduced, or, through heat-sinking, the JA must be lowered. In a lot of cases, larger traces near the output, VDD ,and GND pins can be used to lower the JA . The larger areas of copper serve as a form of heatsinking, allowing a higher power dissipation. For the typical application of a 5V power supply, with an 8 load, the maximum ambient temperature possible without exceeding the maximum junction temperature, is approximately 44C. (Provided that the device operation is around the maximum power dissipation point and assuming surface mount packaging.) Internal power dissipation is a function of output power. If typical operation is not around the maximum power dissipation point, the ambient temperature can be increased. For power dissipation information for lower output powers, refer to the Typical Performance Characteristics curves.
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300mW Audio Power Amplifier with Shutdown Mode TC4864
POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is essential for low noise performance and high power supply rejection. The location of the capacitor on both the bypass and power supply pins should be as near the device as possible. A larger half supply bypass capacitor has the effect of improved PSRR due to increased half-supply stability. Typical applications use a 5V regulator with 10F and a 0.1F bypass capacitor which aids in supply stability, but does not eliminate the need for bypassing the supply nodes of the TC4864. The selection of bypass capacitors, especially CB, is thus dependent upon desired PSRR requirements, click and pop performance (as explained in the Proper Selection of External Components section), system cost, and size limitations. SHUTDOWN FUNCTION The TC4864 contains a shutdown pin to externally turn off the amplifier's bias circuitry in order to reduce power consumption while not in use. This feature turns the amplifier off when a logic high is placed on the shutdown pin. Typically, half supply is the trigger point between a logic low and logic high level. To provide maximum device performance, it's best to switch between the VIL and VIH limits specified in the Electrical Characteristics tables. By switching the shutdown pin to VDD, the TC4864 supply current draw will be minimized in the shutdown mode. While the device may be disabled with shutdown pin voltages less than the minimum VIH, the shutdown current may be greater than the typical value of 0.1A. Regardless of the conditions, the shutdown pin should be tied to a definite voltage so as to avoid unwanted state changes. In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry which provides a quick, smooth transition into shutdown. Another solution is to use a single-pole, single-throw switch in tandem with an external pull-up resistor. When the switch is closed, the shutdown pin is connected to ground and enables the amplifier. Conversely, if the switch is open, the external pull-up resistor will disable the TC4864. This design ensures that the shutdown pin will not float, thus preventing undesireable state changes. PROPER SELECTION OF EXTERNAL COMPONENTS Proper selection of external components in applications employing integrated power amplifiers is crucial in optimizing device and system performance. While the TC4864 is tolerant of a variety of external component combinations, consideration must be given to component values in order to maximize overall system quality. The TC4864 is unity-gain stable, giving maximum system flexibility to the designer. The TC4864 is best used in low gain configurations to minimize THD+N values and maximize the signal to noise ratio. Low gain configurations require large input signals to obtain a specified output power. Audio CODECs are sources from which input signals equal to or greater than 1 VRMS are available. For a more complete explanation of proper gain selection please refer to the section, Audio Power Amplifier Design. In addition to gain, one of the major considerations is the closed-loop bandwidth of the amplifier. The bandwidth is dictated, to a large extent, by the choice of external components shown in Figure 1. The input coupling capacitor, Ci , forms a first order high pass filter which limits low frequency response. This value should be chosen based on needed frequency response for a few distinct reasons. Selection of Input Capacitor Size Large input capacitors are too bulky and less cost effective for portable designs. There is clearly a need for a space-saving capacitor to couple in low frequencies without drastic attenuation. But, in many cases, the speakers used in portable systems, whether internal or external, lack the ability to reproduce signals below 150Hz. In this specific case, employing a large input capacitor may not increase system performance. In addition to system cost and size, click and pop performance is effected by the size of the input coupling capacitor, Ci. A larger input coupling capacitor requires more charge to reach its inactive DC voltage (nominally 1/2 VDD ). This charge comes from the output via the feedback and is apt to create pops upon enabling the device. Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops are minimized. Besides minimizing the input capacitor size, careful attention should be paid to the bypass capacitor value. Bypass capacitor,CB is the most critical component in minimizing turn-on pops, since it determines how fast the TC4864 turns on. The slower the TC4864's outputs ramp to their quiescent DC voltage (nominally 1/ 2 VDD ), the smaller the turn-on pop. Choosing CB = 1.0F along with a small value of Ci (in the range of 0.1F to 0.39F), should produce a clickless and popless shutdown function. While the device
TC4864-1 11/16/00
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300mW Audio Power Amplifier with Shutdown Mode TC4864
will function properly (no oscillations or motorboating) with CB = 0.1F , the device will be much more susceptible to turn-on clicks and pops. Thus, a value of CB = 1.0F or larger is recommended in all but the most cost sensitive designs. AUDIO POWER AMPLIFIER DESIGN Design a 300mW/8 Audio Amplifier Given: Power Output 300mW Load Impedance 8 Input Level 1 VRMS Input Impedance 20k Bandwidth 100Hz - 20kHz 0.25dB A designer must first determine the minimum supply rail to obtain the specified output power. By extrapolating from the Output Power vs Supply Voltage graphs in the Typical Performance Characteristics section, the supply rail can easily be found. Another way to determine the minimum supply rail is to calculate the required VOPEAK using Equation 4 and add the dropout voltage. Using this method, the minimum supply voltage would be (VOPEAK +(2*VOD )), where VOD is extrapolated from the Dropout Voltage vs Supply Voltage curve in the Typical Performance Characteristics section. VOPEAK = (2RLPO)
Equation 4.
-3dB frequency points. Five times away from a pole gives 0.17dB down from passband response which is better than the required 0.25dB specified. fL = 100Hz/5 = 20Hz fH = 20kHz x 5 = 100kHz As stated in the External Components section, Ri in conjunction with Ci create a highpass filter. Ci 1 2 Ri fC
Ci 1/(2* 20k* 20Hz) = 0.398F; use 0.39F The high frequency pole is determined by the product of the desired high frequency pole, fH , and the differential gain, AVD. With a AVD = 2 and fH = 100kHz, the resulting GBWP = 100kHz which is much smaller than the TC4864 GBWP of 18MHz. This figure illustrates a situation in which a designer needs to design an amplifier with a higher differential gain. The TC4864 can still be used without running into bandwidth problems.
Using the Output Power vs Supply Voltage graph for an 8 load, the minimum supply rail is 3.5V. But since 5V is a standard supply voltage in most applications, it is chosen for the supply rail. Extra supply voltage creates a buffer that allows the TC4864 to reproduce peaks in excess of 500mW without producing audible distortion. At this point, the designer must ensure that the power supply choice and the output impedance does not violate the conditions set forth in the Power Dissipation section. Once the power dissipation equations have been addressed, the required differential gain can be determined from Equation 5. AVD PORL)/(VIN) = VORMS/VINRMS RF/Ri = AVD/2
Equation 5.
From Equation 5, the minimum AVD is 1.55; use AVD = 2. Since the desired input impedance was 20k, and with a AVD of 2, a ratio of 1:1 of RF to Ri results in an allocation of Ri = RF = 20k. The final design step is to address the bandwidth requirements which must be stated as a pair of
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300mW Audio Power Amplifier with Shutdown Mode TC4864
TYPICAL CHARACTERISTICS
THD+N vs Frequency 10
Vdd = 5V Po = 300 mW RL= 8 Ohms Bridged Load
THD+N vs Frequency 10
Vdd = 3V Po = 100 mW RL= 8 Ohms Bridged Load
1
1
AVD = 20 AVD = 20 AVD = 10
THD + N(%)
THD + N(%)
0.1
AVD = 10
AVD = 2
0.1
AVD = 2
0.01
0.01
0.001 10 100 1000 Frequency (Hz) 10000 100000
0.001 10 100 1000 Frequency (Hz) 10000 100000
THD+N vs Frequency 10
Vdd = 5V Po = 250 mW RL= 16 Ohms Bridged Load
THD+N vs Frequency 10
Vdd = 3V Po = 100 mW RL= 16 Ohms Bridged Load
1
1
THD + N(%)
THD + N(%)
AVD = 20
AVD = 20
0.1
AVD = 10 AVD = 2
0.1
AVD = 10
AVD = 2
0.01
0.01
0.001 10 100 1000 Frequency (Hz) 10000 100000
0.001 10 100 1000 Frequency (Hz) 10000 100000
THD+N vs Frequency 10
Vdd = 5V Po = 200 mW RL= 32 Ohms Bridged Load
THD+N vs Frequency 10
Vdd = 3V Po = 75 mW RL= 32 Ohms Bridged Load
1
1
THD + N(%)
0.1
AVD = 20 AVD = 10
THD + N(%)
0.1
AVD = 20 AVD = 10 AVD = 2
0.01
AVD = 2
0.01
0.001 10 100 1000 Frequency (Hz)
TC4864-1 11/16/00
0.001
10000 100000
10
100
1000 Frequency (Hz)
10000
100000
7
300mW Audio Power Amplifier with Shutdown Mode TC4864
THD+N vs Output Power 10
THD+N vs Output Power 10
RL= 8 AVD = 2 BW < 80KHz Vdd = 5V Bridge Load
RL= 8 AVD = 2 BW < 80KHz Vdd = 3V Bridge Load
THD + N(%)
1
1
THD + N(%)
20 Hz
20KHz
20 Hz
0.1
20KHz 1 KHz
0.1
1 KHz
0.01 0.01
0.1 Output Power (W)
1
0.01 0.01
0.1 Output Power (W)
1
THD+N vs Output Power 10
THD+N vs Output Power 10
RL= 16 AVD = 2 BW < 80KHz Vdd = 3V Bridge Load
RL= 16 AVD = 2 BW < 80KHz Vdd = 5V Bridge Load
1
THD + N(%)
THD + N(%)
1
20 KHz
20 KHz
0.1
20 Hz
0.1
20 Hz
0.01 0.01
1KHz
0.1 Output Power (W)
1
0.01 0.01
1KHz
0.1 Output Power (W)
1
THD+N vs Output Power 10
RL= 32 AVD = 2 BW < 80KHz Vdd = 5V Bridge Load
THD+N vs Output Power 10
RL= 32 AVD = 2 BW < 80KHz Vdd = 3V Bridge Load
1
1
THD + N(%)
THD + N(%)
20 KHz
0.1
20 Hz
20 KHz
0.1
0.01
20 Hz
1KHz
0.01 0.01
1KHz
0.1 Output Power (W)
1
0.001 0.01
0.1 Output Power (W)
1
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300mW Audio Power Amplifier with Shutdown Mode TC4864
Output Power vs Supply Voltage 1.2
Freq = 1Khz RL= 8
Output Power vs Load Resistance 1000
Vdd = 5V Freq = 1KHz Bridge Load
1
800
Output Power (W)
0.8
Output Power (W)
10% THD+N
600
THD+N = 10%
0.6
0.4
1% THD+N
400
THD+N = 1%
0.2
200
0 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V)
0 8 16 24 32 40 48 56 64 Load Resistance ()
Output Power vs Supply Voltage 0.9 0.8 0.7
Freq = 1KHz RL = 16
Pwr Dissipation vs Output Power 700 600
Power Dissapation (mW)
Output Power (W)
RL = 8
0.6
10% THD+N
500 400
RL = 16
Vdd = 5V, Freq = 1KHz THD+N < 1.0% BW< 80KHz
0.5 0.4
1% THD+N
300 200 100 0 0 100 200 300 400 500 600 700 Output Power (mW)
RL = 32
0.3 0.2 0.1 0 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V)
Output Power vs Supply Voltage 0.6
Freq = 1Khz RL=32
Power Derating TC4864 - MSOP8 Package 700 600
0.5
10% THD+N
Power Dissapation (mW)
5 5.5
0.4
500 400 300 200 100 0 -50
Output Power (W)
0.3
0.2
1% THD+N
0.1
0 2.5 3 3.5 4 4.5 Supply Voltage (V)
-25
0
25
50
75
100
125
150
Ambient Temperature (C)
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300mW Audio Power Amplifier with Shutdown Mode TC4864
Dropout Voltage vs Supply Voltage 1.2 1.E-05 Noise Density
1
Dropout Voltage (V)
Top Side
Output Noise Voltage Densitiy (V)
1.1
Vdd = 5V RL = 8
0.9 0.8 0.7 0.6 0.5 0.4 2 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V)
Bottom Side
1.E-06
Vo1+Vo2 Vo1
1.E-07
Vo2
1.E-08 10 100 1000 Frequency (Hz) 10000 100000
Frequency Response vs Input Capacitor Size
Power Supply Rejection Ratio 70
1.0uf
0
60 50
Output Level (db)
0.1uf
-5
PSRR (db)
Vdd = 5V AVD = 2 RL = 8 Bridge
0.22uf 0.33uf
40 30 20 10 0
-10
-15 10 100 Frequency (Hz) 1000
1
10
100
1000
10000
100000
Frequency (Hz)
Open Loop Frequency Response
100 90 80 70 60 50 40 30 20 10 0 -10 -20 200 150 100 50 0 -50
0 2.5 3 5
Supply Current vs Supply Voltage
Vshdn = 0V No Load
Supply Current (mA)
4
Gain (dB)
Phase ()
3
2
1
1.0E+02 1.0E+03 1.0E+04 1.0E+05 1.0E+06 1.0E+07 1.0E+08
1.0E+01
Frequency
3.5
4
4.5
5
5.5
Supply Voltage (V)
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300mW Audio Power Amplifier with Shutdown Mode TC4864
TAPING FORM
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
User Direction of Feed
W
PIN 1 Standard Reel Component Orientation for TR Suffix Device
P
Reverse Reel Component Orientation for RT Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
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300mW Audio Power Amplifier with Shutdown Mode TC4864
PACKAGE DIMENSIONS
8-Pin MSOP
PIN 1
.122 (3.10) .114 (2.90)
.197 (5.00) .187 (4.80)
.026 (0.65) TYP.
.122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05)
6 MAX. .028 (0.70) .016 (0.40)
.008 (0.20) .005 (0.13)
Dimensions: inches (mm)
Sales Offices
TelCom Semiconductor, Inc. 1300 Terra Bella Avenue P.O. Box 7267 Mountain View, CA 94039-7267 TEL: 650-968-9241 FAX: 650-967-1590 E-Mail: liter@telcom-semi.com
TC4864-1 11/16/00
TelCom Semiconductor, GmbH Lochhamer Strasse 13 D-82152 Martinsried Germany TEL: (011) 49 89 895 6500 FAX: (011) 49 89 895 6502 2 12
TelCom Semiconductor H.K. Ltd. 10 Sam Chuk Street, Ground Floor San Po Kong, Kowloon Hong Kong TEL: (011) 852-2350-7380 FAX: (011) 852-2354-9957

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