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GP2S60
GP2S60
SMT, Detecting Distance : 0.5mm Phototransistor Output, Compact Reflective Photointerrupter
Description
GP2S60 is a compact-package, phototransistor output, reflective photointerrupter, with emitter and detector facing the same direction in a molding that provides noncontact sensing. The compact package series is a result of unique technology, combing transfer and injection molding, that also blocks visible light to minimize false detection. This photointerrupter can be ordered in different CTR ranks, and has a thin, leadless (T&R) package, suitable for reflow soldering.
Agency approvals/Compliance
1. Compliant with RoHS directive
Applications
1. Detection of object presence or motion. 2. Any application, which production is migrating to 100% surface mount components. 3. Example : printer, optical storage
Features
1. Reflective with Phototransistor Output 2. Highlights : * Compact Size * Surface Mount Type (SMT), reflow soldering, with gullwing leads * Tape and Reel (T&R) 1 000 pcs per reel 3. Key Parameters : * Optimal Sensing Distance : 0.7mm * Package : 4x3x1.7mm * Visible light cut resin to prevent 4. Lead free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D3-A02101EN Date Oct. 3. 2005 (c) SHARP Corporation
GP2S60
Internal Connection Diagram
Top view
1
4
1 2 3 4
Collector Emitter Cathode Anode
2
3
Outline Dimensions
Top view (0.7) Detector center
(Unit : mm)
(0.55)
(0.63) 0.4
3 4
(0.7) Emitter center 2.7 3.2
Opaque resin molding portion 1.1
(1.8) (0.57)
2
1
Pattern for directional Distinction (NC)
Plating area * Unspecified tolerance : 0.15mm. * Dimensions in parenthesis are shown for reference. * Dimensions on the outline drawing is the maximum value excluding burr. * The dimensions shown do not include burr. Burr's dimension : 0.15mm MAX.
Product mass : approx. 0.01g Plating material : Au
Country of origin
Japan
Sheet No.: D3-A02101EN
(0.57)
(0.65)
1.7
2
GP2S60
Absolute Maximum Ratings
Parameter Forward current Input Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Output Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature 1 Soldering temperature
Symbol Rating IF 50 VR 6 PD 75 VCEO 35 VECO 6 20 IC 75 PC 100 Ptot Topr -25 to +85 Tstg -40 to +100 Tsol 260
(Ta=25C) Unit mA V mW V V mA mW mW C C C
1 For 5s or less
Electro-optical Characteristics
Parameter Forward voltage Input Reverse current Output Collector dark current 2 Collector Current Transfer 3 Leak current characRise time Response time teristics Fall time
Symbol VF IR ICEO IC ILEAK tr tf
Condition IF=20mA VR=6V VCE=20V IF=4mA, VCE=2V IF=4mA, VCE=2V VCE=2V, IC=100A, RL=1k, d=1mm
MIN. - - - 40 - - -
TYP. 1.2 - 1 85 - 20 20
(Ta=25C) MAX. Unit 1.4 V 10 A 100 nA 130 A 500 nA 100 s 100
2 The condition and arrangement of the reflective object are shown below. The rank splitting of collector current (IC) shall be executed according to the table below. Rank A B Collector current, IC [A] (IF=4mA, VCE=2V) 40 to 80 65 to 130
3 Without reflective object.
Test Condition and Arrangement for Collector Current
Aluminum evaporation d=1mm glass plate
Sheet No.: D3-A02101EN
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GP2S60
Model Line-up
Model No. GP2S60 GP2S60A GP2S60B Rank A or B A B IC(A) 40 to 130 40 to 80 65 to 130 Conditions IF=4mA VCE=2V Ta=25C
Please contact a local SHARP sales representative to see the actial status of the produiction.
Sheet No.: D3-A02101EN
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GP2S60
Fig.1 Forward Current vs. Ambient Temperature
60 50
Fig.2 Collector Power Dissipation vs. Ambient Temperature
120 100 Power dissipation P (mW) 80 75 60 40 20 15 Ptot
Forward current IF (mA)
40 30 20 10 0 25 0 25 50 75 85 100 Ambient temperature Ta (C)
P,PC
0 -25
0
25
50
75 85
100
Ambient temperature Ta (C)
Fig.3 Forward Current vs. Forward Voltage
Ta=75C 50C
Fig.4 Collector Current vs. Forward Current
700 600 VCE=2V Ta=25C
Collector current IC (A)
Forward current IF (mA)
100
25C 0C -25C 500 400 300 200 100
10
1 0 0.5 1 1.5 2 2.5 3 Forward voltage VF (V)
0 0 5 10 15 20 Forward current IF (mA)
Fig.5 Collector Current vs. Collector-Emitter Voltage
600 Ta=25C 500 Collector current IC (A) 400 10mA 300 200 100 0 0 2 4 6 8 10 Collector-emitter voltage VCE (V) IF=15mA
Fig.6 Relative Collector Current vs. Ambient Temperature
120 VCE=2V IF=4mA 100 Relative collector current (%) 80 60 40 20 0 -25
7mA 4mA 2mA
0
25
50
75
Ambient temperature Ta (C)
Sheet No.: D3-A02101EN
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GP2S60
Fig.7 Collector Dark Current vs. Ambient Temperature
10-6 VCE=20V Collector dark current ICEO (A)
Fig.8 Response Time vs. Load Resistance
1 000 VCE=2V IC=100A Ta=25C tr Response time (s) 100 tf
10-7
10-8
10
td
10
-9
ts 10-10 0 25 50 75 100 Ambient temperature Ta (C) 1 0.1
1
10
100
1 000
Load resistance RL (k)
Fig.9 Test Circuit for Response Time
Fig.10 Relative Collector Current vs. Distance
100 L 3 3.5 90 VCE=2V IF=4mA Ta=25C Al evaporation glass
Reflector Plate
VCC Input Output Output 10% 90% Relative collector current (%) RL
RD Input
80 70 60 50 40 30 20 10 0 0.5 1
td tr
ts tf
1.5
2
2.5
4
4.5
5
Distance between sensor and Aluminum evaporation glass L (mm)
Fig.11 Spectral Sensitivity
100 Ta=25C
Fig.12 Detecting Position Characteristics (1)
100 OMS test card d 1mm Sensor - 0 + VCE=2V IF=4mA d=1mm
Relative collector current (%)
80 Relative sensitivity (%)
80
60
60
40
40
20
20
0 600
700
800
900
1 000
1 100
1 200
-3
-2
-1
0
1
2
3
4
5
6
Wavelength (nm)
OMS card moving distance (mm)
Sheet No.: D3-A02101EN
6
GP2S60
Fig.13 Detecting Position Characteristics (2)
100 OMS test card d 1mm Sensor - 0 + VCE=2V IF=4mA d=1mm
Relative collector current (%)
80
60
40
20
-3
-2
-1
0
1
2
3
4
5
6
OMS card moving distance (mm)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D3-A02101EN
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GP2S60
Design Considerations Design guide
1) Regarding to prevention of malfunction To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the external light. 2) Distance characteristic The distance between the photointerrupter and the object to be detected shall be determined the distance by referencing Fig.10 "Relative collector current vs. distance". 3) For wiring on a mounting PCB To avoid possibility for short, please do not apply pattern wiring on the back side of the device. 4) Regarding to mounting this product There is a possibility that the opaque molded resin portion may have a crack by force at mounting etc. Please use this product after well confirmation of conditions in your production line. This product is not designed against irradiation and incorporates non-coherent IRED.
Degradation
In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration.
Parts
This product is assembled using the below parts.
* Light detector (qty. : 1)
Category Phototransister Material Silicon (Si) Maximum Sensitivity wavelength (nm) 930 Sensitivity wavelength (nm) 700 to 1 200 Response time (s) 20
* Light emitter (qty. : 1)
Category Infrared emitting diode (non-coherent) Material Gallium arsenide (GaAs) Maximum light emitting wavelength (nm) 950 I/O Frequency (MHz) 0.3
* Material
Case Epoxy resin Black polyphenylene sulfide PCB Glass epoxy resin Lead frame plating Au plating
Sheet No.: D3-A02101EN
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GP2S60
Recommended pattern
(Unit : mm) 2-1 2-1.7 2-1
area : Please do not apply the pattern wiring to avoid the possibility of short circuit.
Regarding amount of solder, if there is solder leakage in terminal wiring pattern between PCB and housing main body, the reliability will be deteriorated. Please check the proper amount of solder in advance not to have solder leakage into terminal wiring pattern between PCB and housing main body.
2-0.65
2-0.45
2-0.65
Sheet No.: D3-A02101EN
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GP2S60
Manufacturing Guidelines Storage and management after open Storage condition
Storage temp.: 5 to 30C, Storage humidity : 70%RH or less at regular packaging.
Treatment after opening the moisture-proof package
After opening, you should mount the products while keeping them on the condition of 5 to 25C and 70%RH or less in humidity within 4 days. After opening the bag once even if the prolonged storage is necessary, you should mount the products within two weeks. And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products and silicagel are sealed up again, you should keep them under the condition of 5 to 30C and 70%RH or less in humidity.
Baking before mounting
When the above-mentioned storage method could not be executed, please process the baking treatment before mounting the products. However the baking treatment is permitted within one time. Recommended condition : 125C, 16 to 24 hours Do not process the baking treatment with the product wrapped. When the baking treatment processing, you should move the products to a metallic tray or fix temporarily the products to substrate.
Sheet No.: D3-A02101EN
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GP2S60
Soldering Method Reflow Soldering:
Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please solder within one time.
MAX 240C 1 to 4C/s 200C
MAX 160C
1 to 4C/s
1 to 4C/s
25C MAX10s MAX120s MAX60s MAX90s
Other notice
Please take care not to let any external force exert on lead pins. Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the cooling and soldering conditions.
Cleaning instructions Solvent cleaning :
Solvent temperature should be 45C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
Sheet No.: D3-A02101EN
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GP2S60
Presence of ODC
This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC). *Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE).
Sheet No.: D3-A02101EN
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GP2S60
Package specification Tape and Reel package Package materials
Carrier tape : PS (with anti-static material) Cover tape : PET (three layer system) Reel : PS
Package method
2 000 pcs of products shall be packaged in a reel. One reed with silicagel is endased in aluminum laminated bag. After sealing up the bag, it encased in one case (5 bags/case).
Carrier tape structure and Dimensions
J G F E D C I
B H A L
X. MA
H K
Dimensions List A B 0.3 8 3.50.05 G H 1.550.05 3.60.1
C 1.750.1 I 0.30.05
D 40.1 J 1.250.1
(Unit : mm) E F 0.1 0.1 2 4 K L 2.20.1 1.10.1
Reel structure and Dimensions
e d g c
f a b
Dimensions List a b 180 91 e f 210.8 11.41
5
c
(Unit : mm) d 130.2
60+0.5 -0 g 2+0.3 -0
Sheet No.: D3-A02101EN
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GP2S60
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
Storage method
Storage conditions should follow the condition shown below. Storage temperature : 5 to 30C Storage hunidity : 70%RH or less
Sheet No.: D3-A02101EN
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GP2S60
Important Notices
* The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. * Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. * Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). * If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. * This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. * Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
[H146]
Sheet No.: D3-A02101EN
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