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| 05210 ESD4-LFC LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS Cellular Phones I/O Ports Notebooks & Pocket PCs Personal Digital Assistant (PDA) Ground Positioning System (GPS) SMART Cards IEC COMPATIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns 5 BUMP FLIP CHIP FEATURES ESD Protection > 25 kilovolts Unidirectional Configuration Low Capacitance: 15pF Protects Up to Four(4) Data Lines RoHS Compliant MECHANICAL CHARACTERISTICS 5 Bump Flip Chip Package Weight 0.73 milligrams (Approximate) Available in Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Consult Factory for Leaded Device Availability Flammability Rating UL 94V-0 8mm Tape and Reel Per EIA Standard 481 PIN CONFIGURATION G1 05210.R3 2/07 1 www.protekdevices.com ESD4-LFC DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature DC Power Rating SYMBOL TA TSTG P VALUE -40 to 85 -55 to 150 200 UNITS C C mW ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT @ 25C Unless Otherwise Specified TYPICAL FORWARD VOLTAGE MAXIMUM CLAMPING VOLTAGE TYPICAL CAPACITANCE PER LINE (See Note 1) @2.5V, 1 MHz C pF V WM VOLTS @ 1mA V(BR) VOLTS @3.3V ID A @ 10mA VF VOLTS @ IP = 10mA VC VOLTS ESD4-LFC Note 1: 20% tolerance. 5.0 6.0 0.1 0.8 8 15 1.6 Cj - Capacitance (Normalized) FIGURE 1 CAPACITANCE VS REVERSE VOLTAGE (Normalized to Capacitance at 2.5V DC & 25C) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 1 2 3 4 5 6 VR - Reverse Voltage - Volts 05210.R3 2/07 2 www.protekdevices.com ESD4-LFC APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Ramp-up Temperature - C Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat t 25C to Peak 30-60 seconds Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down 05210.R3 2/07 3 www.protekdevices.com ESD4-LFC 5 BUMP FLIP CHIP PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE BOTTOM VIEW PACKAGE DIMENSIONS MILLIMETERS DIM MIN 0.914 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330 INCHES MIN 0.036 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.017 0.013 A G C O G H I 1 2 D I J E F B SIDE VIEW MAX 1.016 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457 MAX 0.040 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.022 0.018 A B C D E F G H I J 0.30 DIA. 63/67 Sn/Pb SOLDER BUMPS NOTE: 1. Controlling dimensions in millimeters. Outline & Dimensions: Rev 1 - 8/05, 06055 Tape & Reel Specifications (Dimensions in millimeters) Reel Dia. 178mm (7") Tape Width 8mm A0 B0 K0 D E F W P0 P2 P t 1.08 0.05 1.60 0.05 0.72 0.05 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 4.00 0.10 0.200.025 P0 t D P2 10 Pitches Cumulative Tolerance on Tape. 0.2 MARKING CODE DIAGRAM 4L E Top cover tape A0 K0 B0 F W P User Direction of Feed TAPE & REEL ORDERING NOMENCLATURE 1. 2. 3. 4. Surface mount product is taped and reeled in accordance with EIA-481. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e., ESD4-LFC-T73-1. Suffix - LF - Lead-Free, i.e., ESD4-LFC-LF-T73-1. Suffix - C - Coated Version, i.e., ESD4-LFC-LF-T73C-1. COPYRIGHT (c) ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05210.R3 2/07 4 www.protekdevices.com |
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