|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
FMS2016-001 High Power Reflective GaAs SP4T Switch FEATURES: * * * * * * 3x3x0.9mm Packaged pHEMT Switch High isolation: >30dB at 1.8GHz Low Insertion loss: 0.65dB at 1.8GHz Excellent low control voltage performance Excellent harmonic performance under GSM/DCS/PCS/EDGE power levels RoHS Compliant (Directive 2002/95/EC) Datasheet v2.4 FUNCTIONAL SCHEMATIC: ANT RF1 RF2 RF3 RF4 GENERAL DESCRIPTION: The FMS2016-001 is a low loss, high power and linear single pole four throw Gallium Arsenide antenna switch designed for use in mobile handset and other high power switching applications. The die is fabricated using the Filtronic FL05 0.5m switch process technology, which offers excellent performance optimised for switch applications. TYPICAL APPLICATIONS: * * . Multi-band GSM/DCS/PCS/EDGE handset modules High power and linear RF switching applications ELECTRICAL SPECIFICATIONS: Parameter Insertion Loss 1.0 - 2.0 GHz Return Loss Isolation RF1 - RF2, RF1 - RF3, RF2 - RF4 Isolation RF3 - RF4 0.5 - 2.5 GHz 0.5 - 1.0 GHz 1.0 - 2.0 GHz 0.5 - 1.0 GHz 1.0 - 2.0 GHz 1 GHz, Pin = +35 dBm, 100% Duty Cycle 2nd Harmonic Level 2 GHz, Pin = +35 dBm, 100% Duty Cycle 1 GHz, Pin = +35 dBm, 100% Duty Cycle 3rd Harmonic Level 2 GHz, Pin = +35 dBm, 100% Duty Cycle Switching speed : Trise, Tfall Ton, Toff Control Current 10% to 90% RF and 90% to 10% RF <0.3 50% control to 90% RF and 50% control to 10% RF +35dBm RF input @1GHz 0.9 & 0.91 GHz, Pin = +20 dBm IP3 1.85 & 1.86 GHz, Pin = +20 dBm 1.0GHz P0.1dB 2.0GHz >37 dBm >66 >38 dBm dBm <10 >68 0.5 15 -75 -65 dBc s s A dBm -75 -75 -65 -60 dBc dBc 26 30 16 0.65 20 34 32 34 30 -75 -60 0.85 dB dB dB dB dB dB dBc Test Conditions 0.5 - 1.0 GHz Min Typ 0.55 Max 0.75 Units dB Note: TAMBIENT = 25C, Vctrl = 0V/2.7V, ZIN = ZOUT = 50 External DC blocking capacitors are required on all RF ports (typ: 47pF) 1 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com Tel: +44 (0) 1325 301111 Website: www.filtronic.com FMS2016-001 Datasheet v2.4 ABSOLUTE MAXIMUM RATINGS: PARAMETER Max Input Power Control Voltage Operating Temperature Storage Temperature SYMBOL Pin Vctrl Toper Tstor ABSOLUTE MAXIMUM +38dBm +6V -40C to +100C -55C to +150C Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the device. TRUTH TABLE: V1 High Low Low Low V2 Low High Low Low V3 Low Low High Low V4 Low Low Low High PATH(S) RF1 to ANT RF2 to ANT RF3 to ANT RF4 to ANT Note: High: 2.7V to 6V; Low: 0V to 0.2V PAD LAYOUT: V1 ANT V2 PAD REF 1 2 PAD NAME RF1 GND RF3 V3 N/C V4 RF4 GND RF2 V2 ANT V1 DESCRIPTION RF Port 1 Ground Connection RF Port 3 Vctrl3 (ANT to RF3) No Connection Vctrl4 (ANT to RF4) RF Port 4 Ground Connection RF Port 2 Vctrl2 (ANT to RF2) Antenna Port Vctrl1 (ANT to RF1) Pin 1 RF1 GND RF3 2 3 12 11 10 9 RF2 GND RF4 3 4 5 PADDLE 8 7 6 4 5 6 7 8 V3 V4 9 10 11 12 2 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com Tel: +44 (0) 1325 301111 Website: www.filtronic.com FMS2016-001 Datasheet v2.4 TYPICAL MEASURED PERFORMANCE ON EVALUATION BOARD: Note: Measurement Conditions VCTRL= 0V (low) & 2.5V (high), TAMBIENT = 25C unless otherwise stated Insertion Loss FMS2016QFN INSERTION LOSS 0 -0.1 -0.2 -0.3 -0.4 -0.5 RF1 to RF2 Isolation FMS2016QFN RF1 to RF2 ISOLATION 0 -5 -10 -15 dB -20 -25 -30 -35 -40 dB -0.6 -0.7 -0.8 -0.9 -1 -1.1 -1.2 0.5 1 1.5 2 Frequency (GHz) 2.5 3 3.5 0.5 1 1.5 2 Frequency (GHz) 2.5 3 3.5 RF3 to RF4 Isolation FMS2016QFN RF3 to RF4 ISOLATION 0 -5 -10 -15 dB -20 -25 -30 -35 -40 0.5 1 1.5 2 Frequency (GHz) 2.5 3 3.5 dB RF1 to RF3 AND RF2 to RF4 Isolation FMS2016QFN RF1 to RF3 and RF2 to RF4 ISOLATION 0 -5 -10 -15 -20 -25 -30 -35 -40 0.5 1 1.5 2 Frequency (GHz) 2.5 3 3.5 Return Loss FMS2016QFN RETURN LOSS -15 -20 -25 dB -30 -35 -40 0.5 1 1.5 2 Frequency (GHz) 2.5 3 3.5 3 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com Tel: +44 (0) 1325 301111 Website: www.filtronic.com FMS2016-001 Datasheet v2.4 EVALUATION BOARD COMPONENT SIDE LAYOUT: C1 C1 C1 C1 C1 C2 C2 C2 C2 BILL OF MATERIALS: LABEL Board RFC DCC C1 C2 COMPONENT Preferred evaluation board material is 0.25 mm thick ROGERS RT4350. All RF tracks should be 50 ohm characteristic material. SMA RF connector DC connector Capacitor, 47pF, 0402 Capacitor, 470pF, 0603 EVALUATION BOARD DE-EMBEDDING DATA (MEASURED): Insertion Loss Return Loss FMS2016QFN CALIBRATION BOARD INSERTION LOSS 0 -0.1 -0.2 -0.3 -0.4 dB -0.5 -0.6 -0.7 -0.8 -0.9 -1 0.5 1 1.5 2 Frequency (GHz) 2.5 3 3.5 -40 0.5 -35 dB -25 -20 -15 FMS2016QFN CALIBRATION BOARD RETURN LOSS -30 1 1.5 2 Frequency (GHz) 2.5 3 3.5 4 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com Tel: +44 (0) 1325 301111 Website: www.filtronic.com FMS2016-001 Datasheet v2.4 QFN 12 LEAD 3*3 PACKAGE OUTLINE: Note: PIN1 Identifier is at ground potential TAPE & REEL SPECIFICATION: TAPE DIMENSIONS Perforation DESCRIPTION Diameter Pitch Position SYMBOL D0 P0 E1 A0 B0 K SIZE (MM) 1.5 0.1 4.0 0.1 1.75 0.1 3.3 0.1 3.3 0.1 1.1 0.1 Cavity Length Width Depth Distance between centrelines Cavity to Perforation (length direction) P2 2.0 0.1 Cavity to Perforation (width direction) Carrier tape Width F 5.5 0.1 W 12 0.3 5 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com Tel: +44 (0) 1325 301111 Website: www.filtronic.com FMS2016-001 Datasheet v2.4 PREFERRED ASSEMBLY INSTRUCTIONS: Please refer to the FCSL Document on our website, under Handling and Assembly instructions, named; `QFN and DFN series package Assembly Guidelines' APPLICATION NOTES & DESIGN DATA: Application Notes and design data, including S-parameters are available on request. DISCLAIMERS: This product is not designed for use in any space based or life sustaining/supporting equipment. HANDLING PRECAUTIONS: To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500 V) as defined in JEDEC Standard No. 22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. ORDERING INFORMATION: PART NUMBER FMS2016-001-TR Tape & Reel (minimum quantity: 1k pcs) FMS2016-001-TB Packaged Die supplied in a Tube Packaged Die mounted on Evaluation Board DESCRIPTION Packaged Die FMS2016-001-EB 6 Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com Tel: +44 (0) 1325 301111 Website: www.filtronic.com |
Price & Availability of FMS2016-001-TB |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |