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PREPARED
BY:
DATE: suln/tO/?q DATE: ELECTROMC COMPONENTS GROUP SHARP CORPORATION
SPECNo. ISSUE PAGE REPRESENTATIVE
DG996036 J&16/99
ruQ.ds. APPROVED BY: < un J-
10 pages
DIVISION:
lik e5
.T qKJ7~s-e
SPECIFICATION
DEVICE SPECIFICATION FOR
Opto-Electronic Devices Division
Light Emitting Diode
MODEL No.
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharps consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment L * Tooling machines * Computers I If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability . and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportanon control and safety equipment (aircraft, train, automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment [ * Other safety equipment I (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * Medical equipment I * Nuclear power control equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED
1
CUSTOMERS
APPROVAL
BY:
DATE: BY:
I M.Katoh, Department General LManager of Engineering Dept.,III Opto-Electronic Devices Division Electronic Components Group SHARP CORPOluTION
DG996036 MODEL No. GL5ZJ43
Jun/16/99
PAGE
l/10
GLSZr43
Sneeification
1. Application This specifkation applies to the light emitting diode device Model No. GL5Z43. [AlGaInP (dicing or scrilxylxake type> Grange LED device]
2. Outline dimensions and pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 2.
3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-4. 3-l. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram
4. Reliability . . . . . . . . . . ..*.......................................... 4- 1. Test items and test conditions 4-2. Measurement items and Failure judgement criteria
Refer to the attached sheet Page 5.
5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6. 5- 1. Applied standard 5-2. Sampling method and level 5-3. Test items, judgement criteria and classilica of defect 5-4. Test items the surface is be applied for flat type, judgement criteria and classilica of defect
6. Supplement . . . . . . ..*..................*.......................... 6-l. Packing 6-2. Luminous intensity rank 6-3. Dominant wavelength rank 64. Environment
Refer to the attached sheet Page 7-8.
7. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 9- 10. 7- 1. Lead forming method 7-2. Notice of installation 7-3. Soldering Conditions .74. For cleaning
2. outline dimensions aad pin
co~ections
Colorless
transparency \
Pin COMectiOns 0. Anode 0. cathode rote) Unspecif!ed tol. to be ~0.2mm rote) Cold .rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product. . unit mm Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Finish Lead : Sn plated or wave soldering Drawing No.
51106017
DG996036
MODEL No.
Jun/16/%
PAGE
GL5ZJ43
3/10
3.
Ratings and characteristics
(Note 1) Duty ratio=l/lO,Pulse width=Qlms (Note 2) At the position of 1.6mm from the bottom resin package
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
120 a s e g z 2 -0 5 2 ," m d 100 80 60 40 20 0' -25 ' 0 Ambient I 25 50 I I 125
60
75 `?iO Ta(W
-25
0 Ambient
25
50 Temperature
7585
100 Ta (%I
125
Temperature
I
Peak Forward Current vs. Duty Ratio
DG996036 MODEL No. GL5ZJ43
Jud16/9!3 PAGE I
4/10
10 l/100 l/10 Duty Raito 1 DR 10
3-4. Characteristics Diagram&p)
Forward Current
(Note 1)
vs.Forward Voltage (Ta=25"C) Relative Luminous Intensity vs. Ambient Temperature
( I F=2OmN
1000
loo
Iiii""iiiitlltrllI III
: O-
IIIIII
l-00
EE J A : .c, 5 0. 1 1 1.2 1.4 Forward 1.6 1.8 Voltage 2 2.2 VFOJ) 2.4 2.6 2 10
-60 -40 -20 0 20 40 60 80
Ambient Temprature TarC)_
100
120
Relative
Luminous
Intensity
vs.
Frorard
Voltap~
1000
(Ta+X'C)
5 .t G
100
10
>" .z G
p:
0. 1
0. 01 0. 1 Forward 1 Current 10 IFhA) 100
(Note 1) Above characteristic data are typical data and not a guarantteed data.
DG996036
MODEL No.
Jun/16/99
PAGE
GL5ZJ43
5110
4. Reliability The reliability of products shall be satisfied with items listed below. Ll. Test items and test conditions Test items Solderability soldering temperature Mechanical shock Variable frequency vibration Terminal strength (Tension) Terminal strength (Bending) Temperature cycling High temp. and high humidity storage Test conditions 23025C. 5s Prior disposition : Dip in rosin flux 260t5"C. 5s Cordidence level: 90% Samples (n) LTPD Defective (C) (%) n=ll. n=ll, n=ll, n=ll, n=ll. n=ll, C=O C=O C=O C=O C=O C=O 20 20 20 20 20 20 10 10 10 10 10
15 0OOm/s*, 0.5ms. 3times f iX+Y&Z direction 2OOm/s*, 100 to 2 0OOto lOOH&weep for 4min. ,4timesffX,*Yfi direction Weight: 1ON. Ss/each terminal Weight:SN,O" + 9O" + O"* -90" + 0" /each terminal -4O"c(3Omin)~+10O"c(3Omin),30 Ta=+6O"c, 9O%RH, t=100Oh cycles
n=22, C=O n=22, C=O n=22, C=O n=22. C=O
igh temperature storage Ta=lO0"C, t=10OOh ow temperature storage Ta=40"C, Operation life t=lOO0h t=lOOOh *3
Ta=25@C, IrMAX,
n=22, C=O
4-2. Measurement items and Failure judgement criteria *l Measurement Forward voltage Reverse current Luminous intensity Symbol VF
IR
Failure judgement criteria *2 v, > U.S.L. x 1.2 IR > U.S.L. x 2.0 Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
Iv
z Solderability : Solder shall be adhere at the area of 95% or more of dipped portion. % Terminal strength : Package is not destroyed, and terminal is not slack. * 1: Measuring condition is in accordance with specification. *2: U.S.L. is shown by Upper Specification Limit. *3: IF MAX.is shown by forward current of absolute maximum ratings.
DG996036
MODEL, No.
Jlln/16/99
PAGE
GL5ZJ43
6110
5. Incoming inspection 5-l. Applied standard : IS0 2859-1 5-2. Sampling method and level : A single sampling plannormal inspection level lI : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items. iudaement criteria and classifica of defect
No.
Test items
DiscoMection
judgement criteria Not emit light Different from dimension Different from dimension Not satisfy outline specification Over the limit value of specification at V,, Ia, and Iv Exceed -0.2mm White pint : Exceed d 0.3nun (on top view) Black point : Exceed 4 0.3mm (on top view) String form: Exceed 3.Omm (on top view) Exceed 9 0.3mm or O.lmm x l&run (on top view) Exceed 4 0.3mm (on top view) Extremely uneven density Exceed +&25mm from package center Exceed +0.2mm againstprovided dimension Insertion position of terminal
classifica of defer
1 2 3 4 5 6 7 8 9 10 11 12 .3
Position of Cutting off rim Reverse terminal Outline
dimensions
Major defect
characteristics Cut off the rim Foreign substance Scratch Void Uneven density of material for scattering Unbalanced center Burr Insertion position of terminal
Minor defect
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect No. 14 15 Test items Chapped the surface Hollow the surface judgement criteria The surface chapped is striking for see the lamp top The surface hollow is striking for see the lamp top classifica of defec Minor defect
DG996036 MODEL No.
Jun/16/99
PAGE 7/10
GL5ZJ43
6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One ProducfTyp.) (Indication label sample) SHIPMENT TABLE PART No. GL5ZJ43 + Model number *o clclclclo ClUANTITY 250 + Quantity of products - cl --LOT No. KA99B19 4- Lot number * 0 0 O@ 0 Cl-0 t - Luminous intensity rank dominant wavelength rank SHARP' MADE IN JAPAN + Production country 0 @ @ @ @ Production plant code(to be indicated alphabetically) support code Year of production(the last two figures of the year) Month of production (to be indicated alphabetically with January correspondingto A) Date of production(Ol-3 1)
6-l-2. Outer package Put 8 packs (the sameluminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer packageout line dimension Width : 14Omm.Depth : 225mm, Hight : 90mm 6-2Luminous intensimrank (Note 1) Rank Luminous intensity
4
tTa=25aC 1
.---~_
unit mcd
Condition +2OmA
Q
R S T
3417 4920 7085 10203
-
6657 9586 13803 ( 19877)
(Note 1) Tolerance:*15% In regardto luminousintensity , the following ranking shallbe carried out. However the quantity of eachrank shall not be pre scribed. In caseof the distribution of the luminous intensity shift to high, at that point new upperrank is prescribedand lower rank is delete. 6-3.Dominant wavelengthrank (Note 2) (Ta=25"C) Rank Dominant wavelength unit Condition T 613.5 617.0 I U 616.0 619.5 V 618.5 622.0 run 1~2Om4 W 621.0 624.5 X 623.5 627.0 I-INote 2) The condition of measurement The measurement the light emission from the front sideof lamp. : of This rank value is the setting value of when that classifiesit the rank and be not a guaranteevalue. Also I shall not ask the delivery ratio of eachrank.
DG!N6036
Junt16l99
MODEL No.
GL5ZJ43
PAGE
8110
64 Environment 641. Ozonosphere destructive chemicals. (1) The device doesn't contain following substance. (2) The device doesn't have a production line whose process requires following substance. Restricted part: CFCsJlalonestCCL,Trichloroethane(Methych
642.
Bromic non-burning materials The device doesn't contain bromic non-burning materia.Ls(PBBOs~BBs)
IX996036
MODEL, No.
Junl16/99
PAGE 9110
I
7. pncaurions
for use
GL5ZJ43
7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-2-l installation on a P W B Vhen mounting an LED lamp on a PVB,do not apply physical stress to the lead pins. *The lead pin pitch should match the PYB pin-hole pitch:absolutely avoid widening or narrowing the lead pins. Vhen positioning an LED lamp,basically employ an LED with tie-bar cut or use a spacer. 7-2-2 Vhen an LED 1 is mounted directly on a P W B If the bottom face of an LED lamp is mounted directly on single-sided Pm, the base of the lead pins may be subjected to physical stress due to PIB warpcutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damage to resin etc.,is found-When an LED lamp is mounted on a double-sided PYB,the heat during soldering affects the resin;therefore,keep the LED lamp more that 1.61~s~ afloat above the PVB. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat,mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure-A hole of the case should be designed not to subject the inside of resin to any undue stress.
l
NG
Good
DG996036
MODEL No.
JunllWW
PAGE lo/lo
GL5ZJ43
7 - 3. Soldering Conditions ' Solder the lead pins under the following conditions Conditions Type of S oldering 29%+5"c. within 3 seconds 1. Manual soldering 26O"ck5"c, within 5 seconds 2. Wave soldering Preheating 70C to 8O"c, within 30 seconds 3. Auto soldering Soldering 245"c+5"c, within 5 seconds (Note) Avoid dipping resin into soldering bath Avoid applying stress to lead pins while they are heated. For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur.
7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,PW size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning.
(2 > Ultrasonic
( 3 > Applicable solvent : Ethyl alcohol, Yethyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.

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