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ELECTRONIC
COMPONENTS GROUP Opto-Electronic Devices Division
x ',, / /d / $5 . I 777 .wrza*
SHARPCORPORATION
SPECIFICATION
FOR
f
DEVICE SPECIFICATION
Emitting Diode
MODEL No.
GL5ZS44
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas: * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (`Terminal) * Measuring equipment L * Tooling machines * Computers If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment [ * Other safety equipment I (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * Nuclear power control equipment * Medical equipment C (4) PIease contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED BY: M.Katoh, Department General Manager of Engineering DeptJII Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION
I
CUSTOMER'S
APPROVAL
`DATE:
BY:
DG996041
MODEL No.
Juni16/9!I
PAGE
GL5ZS44
l/10
GL5ZS44 Snecification
1. Application This specificationappliesto the light emitting diodedevice Model No. GL5ZS44. [AlGaInP (dicing or m-ii/brake type) Sunset-orange LED device]
2. Outline dimensions pin COMedOnS and
.. .. . .. . ... .. . .. .. . .. ... ... .
Refer to the attachedsheetPage2.
. 3. Ratingsandcharacteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4. 3- 1. Absolute maximumratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4- 1. Test itemsandtestconditions 4-2. Measurement itemsandFailurejudgement criteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage6. 5- 1. Applied standard 5-2. Samplingmethodand level 5-3. Test items,judgementcriteria and classifrcaof defect 5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria andclakfica of defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage7-8. 6-l. Packing 6-2. Luminousintensity rank 6-3. Dominant wavelengthrank 6-4. Environment
7. Precautionsfor use. . . . . . . ..*..................................... 7-l. Lead forming method 7-2. Notice of installation 7-3. SolderingConditions ,7-k For cleaning
Refer to the attachedsheetPageg-10.
DG996041
MODEL No.
Jun/16/99
PAGE
GL5ZS44
2ilO
Colotless ttrnsp8reney
"I
k
Vote) Unspecified tol. to be CO.2mm Vote) Coldxolled steelleadsareplatedwith but the tie-bar cut portionsha\, no plating do not sol&r this part of the product unit mm Material Lead : (Fe) Cold rolled steel Package: Epoxy resin Finish Lead : So platedor wave soldering Drawing No. 51106022
DG99604 I
MODEL No.
Jun116/99
PAGE
I
3. Ratings and characteristics
GL5ZS44
I
3110
(Note 1) Duty ratio=l/lO,Pulse width=O. lms (Note 2) At the position of 1.6mm from the bottom resin package 3-2. Electra-optical characteristics MIN. Parameter Symbol Conditions Forward voltage vF r Iv Luminous intensity (Note 3) IF=2OmA Peak emission wavelength J.P Dominant wavelength 1.d 1 ! Spectrum radiation bandwidth A ;1 VR4V Reverse current IR Terminal capacitance ct V=OV,f=lMHz Viewing Angle 281/2 rF=2OmA (Note 3) Refer to the suplement item 6. regarding the standard of rank classification. I (Ta=25"C) h&4x. unit V 2.6 mcd run
TYP. 2.1
3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
120 a 9 e s z 2 7 g 2 : 2 a 20 0 -25 0 Ambient 25 50 Temperature 75 a51OO Ta("C) 125 60 40 100 80
60 50 40 30 20 10 0 -25 0 Ambient 25 50 Temperature 7585100 Ta("C) 125
DC5996041 MODEL No. GL5ZS44
Junl16/!w PAGE 4110
Peak 1000
Forward
Current
vs.
Duty Ratio (Ta=2573
f 2
10 l/100 l/10 Duty Raito 1 DR 10
3-4. Characteristics
Forward
Diagram&p)
Current
(Note 1)
vs.Forward Voltage (Ta=25"C) Relative Luminous intensity vs. Ambient Temperature
( I F=2OmA)
ii'
i
i//i'
(I! I,, , , , Ii ii ii i IAI I I I I I I I
2 Oh
.r E 3
100
-J--Ji
I
1 ! i !!
1
1.21.41.61.8 Forward Voltage
2
2.22.42.6 VF(V)
`-60 -40 -20 0 20 40 60 80
Ambient Temprature TarC)
100 120
Relative
Luminour
Intensity
vs.
Frorard
Voltage
(TaKZ@C) 1000
5. Y z 2
2 .-Ea v 5 -I : .: 2
100
10
1
0. 1
0. 01 0. 1 Forward 1 Current 10 IFhA) a 100
(Note 1) Above characteristic data are typical data and not
smttced
data.
DG99604 1 MODEL No. GL5ZS44
Jud16/99
PAGE 5110
4. Reliability The reliability of products shall be satisfied with items listed below. 4-l. Test items and test conditions Test items Solderability Soldering temperature Mechanical shock Variable frequency vibration Terminal strength (Tension) Terminal strength (Bending) Temperature cycling High temp. and high humidity storage Test conditions 23025C. 5s Prior disposition : Dip in rosin flux 26025C. 5s Confidence level: 909 Samples (n) LTPD Defective (C) (%I n=l l? C=O n=ll. n=ll, n=ll, n=ll, -0" n=ll, C=O C=O C=O C=O C=O 20 20 20 20 20 20 10 10 10 10 10
15 OOOm/s2,0.5ms. 3times / kX,*Y,kZ direction 2oom/s2, 100 to 2 Ooo to lOOHz/sweep for 4mi.n. ,4times/fX,ltY,fZ direction Weight:lON, S/each terminal
Weight:SN, 0" : /each terminal
90" + 0% -90"
-4O"c(3Omin)~+lOO"c(3Omirt).3O Ta=+6O"C, 9O%RH. t=lOOOh
cycles
n=22. C=O n=22, C=O n=22. C=O n=22, C=O
High temperature storage Ta=lOO"C, t=lOOOh Low temperature storage Ta=-QO"C , t=lOOOh Operation life Ta=25"C, IrMAX, t=lOOOh *3
n=22, C=O
4-2. Measurement items and Failure judgement criteria * 1 Measurement Forward voltage Reverse current Luminous intensity Symbol
VF
Failure judgement criteria *2 VF > u.sL. x 1.2
IR
IR > U.S.L. x 2.0 Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
Iv
% Solderability : Solder shall be adhere at the area of 95% or more of dipped portion. % Terminal strength : Package is not destroyed, and terminal is not slack. *l: Measuring condition is in accordance with specification. *2: U.S .L. is shown by Upper Specification Limit. *3: IF w.is shown by forward current of absolute maxirnum ratings.
5. Incoming inspection 5-1. Applied standard : IS0 2859-l 5-2. Sampling method and level : A single sampling plan,normal inspection level II : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items, judgement criteria and classifica of defect No. 1 2 3 4 5 6 7 8 9 10 11 12 Test items Disconnection Position of Cutting off rim Reverse terminal Outline dimensions Characteristics Cut off the rim Foreign substance Scratch Void Uneven density of material for scattering Unbalanced center Burr I I judgement criteria Not emit light Different from dimension Different from dimension Not satisfy outline specification Over the limit value of specification at Vr. IR, and Iv Exceed -0.2rnm .White point : Exceed Q 0.3mm (on top view) Black point : Exceed 4 0.3rnm (on top view) Shim form : Exceed 3.Omm (on too view) Exceed $I 0.3mm or O.lmm x l.Omm (on top view) Exceed @0.3mm (on top view) Extremely uneven density Exceed M.25nun from package center Exceed +0.2mm againstprovided dimension Insertion position of terminal Minor defect Major defect :lassifica of defec
I 13 I Insertion position of .--:--l
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect No. 14 15 Test items Chapped the surface Hollow the surface judgement criteria The surface chapped is striking for see the lamp top The surface hollow is striking for see the lamp top classifica of defec Minor defect
DG996041 MODEL No. GL5ZS44
Junh6/99 PAGE 1 7110
6. Supplement 6-1. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put Product weight : 0.28g (One Product,Typ.) (Indication label sample) SHIPMENT TABLE - Model numher PART No. GLSZS44 *clQUANTITY 250 - Quantity of products LOT No. KA99B19 + Lot number * 0' @-Cl tLuminous intensity rank dominant wavelength rank SHARP' MADE IN JAPAN + Production country 0 @ @ @ @
following label by pack.
cl --0
00000 QOQ
Production plant code(to he indicated alphabetically) Support code Year of production(the last two figures of the year) Month of production (to he indicated alphabetically with January corresponding to A) Date of production(Ol-31)
6-l-2. Outer package Put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6- 1-3. Outer package out line dimension Width: 14Omm. Depth : 225mm, Hight : 9Omm 6-2luminous intensity rank (Note 1) (Ta=25"c )
ci
(Note 1) Tolerance:~lS% In regard to luminous intensity , the following ranking shall be carried out. However the quantity of each rank shall not he pre scribed. In case of the distribution of the luminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. 6-3.Dominant wavelength rank (Note 2) Rank Dominant wavelength 0 598.5 y602.0 P 601.0 604.5 Q 603.5 607.0 R 606.0 609.5 S 608.5 612.0 :Ta=25"c ) Condition
Unit
run
IF2cTnA
I (Note 2) The condition of measurement : The measurement oft slightemission from the front side of lamp. This rank value is the setting value of when that classifies it the rank and be not a guarantee value. Also I shall not ask the delivery ratio of each rank.
DG996041 MODEL No.
Jun/16/!39 PAGE g/10
I
GL5ZS44
6-4. Environment 6-4-l. Ozonosphere destmctive chemicals. (1) The device doesn't contain following substance. (2) The device doesn't have a production line whose process requires following substance. Restricted part: CFCs,halones,CCl,,,Trichloroethane(Methychloroform) 642. Bromic non-burning mate&s The &vice doesn't contain bromic non-burning materials(PBBOs,PBBs)
IX996041
MODEL No.
Jun/16/99
PAGE
GL5ZS44
9/10
7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering 7 - 2. Notice of installation 7-Z-l installation on a P WB !Jhen mounting an LED lamp on a PYB, not apply do physical stress to the lead pins. . The lead pin pitch should match the PWB pin-hole pitch:absolutely avoid widening or narrowing the lead pins. . lhen positioning an LED lamp,basically employ an LED with tie-bar cut or use a spacer. 7-2-2 when an LED 1 is mounted directly on a PWB If the bottom face of an LED lamp is mounted directly on single-sided P'R the base of the lead pins may be subjected to physical stress due to PWB warp,cutting or clinching of lead pins.Prior to use.be sure to check that no disconnection inside of the resin or damageto resin etc., is found. Whenan LED lamp is mounted on a double-sided PW.the heat during soldering affects the resin;therefore,keep the LED lamp more that 1.6mmafloat above the P'JB. 7-2-3 Installation using a holder During an LED lamp posiIioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-2-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure..\ hole of the case should be designed not to subject the inside of resin to any undue stress.
Good
DG996041
MODELNo.
Judl6/!39 PAGE
I
GL5ZS44
1 lO/lO
7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of Soldering 295C+5"c, within 3 seconds 1. Manual soldering 260"ct5"C. within 5 seconds 2. Wave soldering Preheating 70C to 8O"c, within 30 seconds 3. Auto soldering Soldering 245"ck5"c, within 5 seconds (Note) Avoid dipping resin into soldering bath. Avoid applying stress to lead pins while they are heated.For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur.
Soldering
iron
7 - 4. For cleaning (1) Solvent cleaning : Solvent telsperature 45C or less Immersion for 3 min or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size.ultrasonic power output,cleaning time,PYB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning ( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is us&there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.

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