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DATA SHEET
SKY77148 PA Module for CDMA2000 (450-460 MHz)
Applications
* Digital cellular (CDMA2000) * Wireless Local Loop (WLL)
Description
The SKY77148 Power Amplifier Module (PAM) is a fully matched 7-pin surface mount module developed for Code Division Multiple Access (CDMA2000) handset and Wireless Local Loop applications. This small and efficient power amplifier packs full coverage of the 450-460 MHz bandwidth into a single compact package. The device meets the stringent CDMA2000 linearity requirements to and exceeding 29 dBm output power. A low current pin (VCONT) provides improved efficiency for the low RF power range of operation. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry within the module, which includes on-board bias circuitry as well as input and interstage matching circuits. Output match into a 50 load is realized off-chip within the module package to optimize efficiency and power performance. This device is manufactured with Skyworks' GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77148 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with a rated output in the 3.2 to 4.2 volt range. Setting the voltage on the low current reference pin to zero volts accomplishes power down. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage from the battery.
Features
* Low voltage positive bias supply - (3.2 V to 4.2 V) * Good linearity * High efficiency across wide dynamic range * Dual-mode operation * 7-pin package - 6 mm x 6 mm x 1.5 mm * Power down control * Low power state control * CDMA2000
Skyworks offers lead (Pb)-free "environmentally friendly" packaging that is RoHS compliant (European Parliament for the Restriction of Hazardous Substances).
VCC2 (5) VREF (3) VCONT (4) Driver Stage Bias VCC1 (1) RF IN (2) GND (7) Input Match DA InterStage Match Power Stage Bias
MMIC
MODULE
PA
Output Match
(6) RF OUT
103018_001
Figure 1. Functional Block Diagram
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1
DATA SHEET * SKY77148
PA MODULE FOR CDMA2000 (450-460 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the SKY77148 Power Amplifier Module. Table 1 lists the absolute maximum ratings while Table 2 shows the recommended operating conditions to achieve the performance characteristics listed in Table 4. A truth table for the power ranges is shown in Table 3.
Table 1. Absolute Maximum Ratings 1
Parameter RF Input Power Supply Voltage Reference Voltage Case Temperature 2
1
Symbol PIN VCC VREF Operating Storage TC TSTG
Minimum -- -- -- -30 -55
Nominal 0.0 3.4 3.0 +25 --
Maximum 6.0 6.0 3.1 +110 +125
Unit dBm Volts Volts C
No damage assuming only one parameter at a time is set at limit with all other parameters set at or below nominal value.
2 Case Operating Temperature refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Parameter Supply Voltage Reference Voltage Control voltage Operating Frequency Case Operating Temperature LOW HIGH Symbol VCC VREF VCONT VCONT FO TC Minimum 3.2 2.95 2.5 0.0 450.0 -30 Nominal 3.4 3.0 -- -- 455 +25 Maximum 4.2 3.05 3.0 0.5 460 +85 MHz C Unit Volts Volts Volts
Table 3. Power Range Truth Table
Power Mode High Power Low Power Shut Down VREF 3.0 V 3.0 V 0.0 V VCONT 0.0-0.5 V 2.5-3.0 V 0.0 V Range 16 dBm to 29 dBm 16 dBm --
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PA MODULE FOR CDMA2000 (450-460 MHZ)
DATA SHEET * SKY77148
Table 4. Electrical Specifications for CDMA Nominal Operating Conditions 1
Characteristics Symbol GLOW Gain conditions Digital Mode GHIGH PAELOW Power Added Efficiency Digital Mode PAEHIGH Total Supply Current ICC_LOW ICC_HIGH Quiescent Current Reference Current Control Current Total Supply Current in Power-down Mode IQ_LOW IQ_HIGH IREF ICONT IPD ACP1LOW 885 kHz offset ACP1HIGH Adjacent Channel Power 2,3 ACP2LOW 1.98 MHz offset ACP2HIGH Harmonic Suppression Noise Power in RX Band 460-470 MHz Noise Figure Input Voltage Standing Wave Ratio Stability (Spurious output) Ruggedness--No damage 4
1
Condition VCONT 2.5 V PO = 16 dBm VCONT 0.5 V PO = 29 dBm VCONT 2.5 V PO = 16 dBm VCONT 0.5 V PO = 29 dBm PO = 16 dBm PO = 29 dBm VCONT 2.5 V VCONT 0.5 V
Minimum 24.5 29.0 7.0 35.0 -- -- 50 70 --
Typical 26.5 31.0 8.0 38.0 155 650 65 90 0.75 .95 2.0 -47.0 -50.0 -65.0 -59.0 -45.0 -55.0 -129 5.0 1.6:1 -- --
Maximum 28.2
Unit
dB 32.5 -- % -- 175 705 75 105 1.0 1.2 4.5 -45.5 -46.5 dBc -- -- -- -- -- -- -- -58.0 -57.0 -35.0 -40.0 -127 5.5 2.0:1 -65.0 -- dBm/Hz dB -- dBc VSWR dBc mA A A mA mA
VCONT = 2.5 V VCC = 3.4 V VREF = 0 V VCONT 2.5 V PO 16 dBm VCONT 0.5 V PO 29 dBm VCONT 2.5 V PO 16 dBm VCONT 0.5 V PO 29 dBm PO 29 dBm PO 29 dBm PO 29 dBm
-- -- -- --
Second Third
FO2 FO3 RxBN NF VSWR S Ru
5:1 VSWR all phases PO 29 dBm
-- 10:1
Unless otherwise specified: VCC = +3.4 V, VREF = +3.0 V, Freq = 455 MHz, TC = 25 C ACP is specified per CDMA2000 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = -3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. All phases, time = 10 seconds.
2 3 4
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DATA SHEET * SKY77148
PA MODULE FOR CDMA2000 (450-460 MHZ)
Table 5. Electrical Specifications for CDMA Recommended Operating Conditions 1
Characteristics Symbol GLOW Gain conditions Digital Mode GHIGH ACP1LOW 885 kHz offset ACP1HIGH Adjacent Channel Power 23 ACP2LOW 1.98 MHz offset ACP2HIGH Harmonic Suppression Second Third Noise Power in RX Band 460-470 MHz Noise Figure Input Voltage Standing Wave Ratio Stability (Spurious output) Ruggedness--No damage 4
1 2 3 4
Condition VCONT 2.5 V PO = 16 dBm VCONT 0.5 V PO = 29 dBm VCONT 2.5 V PO 16 dBm VCONT 0.5 V PO 28.5 dBm VCONT 2.5 V PO 16 dBm VCONT 0.5 V PO 28.5 dBm PO 29 dBm PO 29 dBm PO 29 dBm
Minimum 24.5 28.0 -- -- -- -- -- -- -- -- --
Maximum 29.0
Unit
dB 34.0 -44.0 -44.0 dBc -58.0 -56.0 -35.0 -40.0 -126.5 6.5 2.0:1 -60.0 10:1 dBm/Hz dB -- dBc VSWR dBc
FO2 FO3 RxBN NF VSWR S Ru
5:1 VSWR all phases PO 29 dBm
Per Table 2. ACP is specified per CDMA2000 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = -3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. All phases, time = 10 seconds.
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PA MODULE FOR CDMA2000 (450-460 MHZ)
DATA SHEET * SKY77148
Characterization Data
The graphs from Figure 2 through Figure 8 illustrate the characteristics of a typical SKY77148 power amplifier designed for operation in the PCS frequency band (450-460 MHz). This amplifier was selected by characterizing a group of devices and choosing a part with average electrical performance for both nominal and the full range of recommended operating conditions, including worst case limits. The graphs illustrate the digital signal characteristics of the SKY77148. Shown are power sweep characteristics for key performance parameters over temperature and frequency, up to 29.5 dBm output power. The data was taken up to and including 16 dBm output power with the bias mode control pin setting of VCONT = 2.5 volts. Beyond 16 dBm output power, the VCONT was set to zero volts.
34 33 32 31 30
Gain (dB)
VREF = 3.0 V VCC = 3.4 V VCONT > 2.5 V VCONT < 0.5 V 29.5 dBm
29 28 27 26 25 24 23 22 0 2 4 6 8 10 12 14 16 18 Output Power (dBm) 20 22 24 26 28 30
103018_002
Figure 2. SKY77148 Gain vs. Output Power
Legend
450 @ -30 C 455 @ -30 C 460 @ -30 C
450 @ +25 C 455 @ +25 C 460 @ +25 C
450 @ +85 C 455 @ +85 C 460 @ +85 C
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DATA SHEET * SKY77148
PA MODULE FOR CDMA2000 (450-460 MHZ)
800 700 600 500
VREF = 3.0 V VCC = 3.4 V 29.5 dBm
ICC (mA)
400 300 200 100 0 0 2 4 6 8 10
VCONT > 2.5 V
VCONT < 0.5 V
12
14 16 18 Output Power (dBm)
20
22
24
26
28
30
10318_003
Figure 3. SKY77148 Primary Bias current vs. Output Power
45 40 35
Power Added Efficiency (%)
VREF = 3.0 V VCC = 3.4 V VCONT > 2.5 V VCONT < 0.5 V 29.5 dBm
30 25 20 15 10 5 0 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm)
103018_004
Figure 4. SKY77148 Power Added Efficiency vs. Output Power
Legend
450 @ -30 C 455 @ -30 C 460 @ -30 C
450 @ +25 C 455 @ +25 C 460 @ +25 C
450 @ +85 C 455 @ +85 C 460 @ +85 C
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PA MODULE FOR CDMA2000 (450-460 MHZ)
DATA SHEET * SKY77148
76 72
Adjacent Channel Power Ratio (-dBc)
VREF = 3.0 V VCC = 3.4 V
68 64 60 56 52 48 44 40 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm)
103018_005
VCONT > 2.5 V
VCONT < 0.5 V
29.5 dBm
Figure 5. SKY77148 Adjacent Channel Power (885 kHz) vs. Output Power
90 85
Adjacent Channel Power Ratio (-dBc)
VREF = 3.0 V VCC = 3.4 V
80 75 70 65 60 55 50
VCONT > 2.5 V
VCONT < 0.5 V
29.5 dBm
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
Output Power (dBm)
103018_006
Figure 6. SKY77149 Adjacent Channel Power (1.98 MHz) vs. Output Power
Legend
450 @ -30 C 455 @ -30 C 460 @ -30 C
450 @ +25 C 455 @ +25 C 460 @ +25 C
450 @ +85 C 455 @ +85 C 460 @ +85 C
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DATA SHEET * SKY77148
PA MODULE FOR CDMA2000 (450-460 MHZ)
60
VREF = 3.0 V VCC = 3.4 V
55
2nd Harmonic Rejection (-dBc)
VCONT > 2.5 V
VCONT < 0.5 V
29.5 dBm
50
45
40
35
30 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm)
103018_006
Figure 7. SKY77149 Second Harmonic Rejection vs. Output Power
75
VREF = 3.0 V VCC = 3.4 V
70
3rd Harmonic Rejection (-dBc)
65
VCONT > 2.5 V
VCONT < 0.5 V
29.5 dBm
60
55
50 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Output Power (dBm)
103018_007
Figure 8. SKY77148 Third Harmonic Rejection vs. Output Power
Legend
450 @ -30 C 455 @ -30 C 460 @ -30 C
450 @ +25 C 455 @ +25 C 460 @ +25 C
450 @ +85 C 455 @ +85 C 460 @ +85 C
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PA MODULE FOR CDMA2000 (450-460 MHZ)
DATA SHEET * SKY77148
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77148, the evaluation board schematic and assembly diagrams are included for preliminary analysis and design. In Figure 9, the basic schematic of the evaluation board for the 450 MHz to 460 MHz range is shown.
1 A C6 220 pF RF IN
VCC1
GND
7
RF OUT 2 RF IN RF OUT 6
VREF C1 3300 pF VCONT B C2 1 F
3
VREF
VCONT 4
VCC2
5 A C5 330 pF C3 20 F C4 10000 pF
VCC
A Place caps at closest proximity to PA module with the capacitor grounds directly connected to the PAM grounds. B (decoupling capacitor) is not required when a voltage regulator is present.
103018_009
Figure 9. Evaluation Board Schematic
C6
1
U1 C5 C3 C1 C4 RF OUT
C2 (see note) RF IN
SKYWORKS
6x6_7_PIN
03-01-01
NOTE: C2 (decoupling capacitor) is not required when a voltage regulator is present.
Prototype Test-Board Component Description Value Location 3300 pF C1 1 F C2 (see note) 20 F C3 10,000 pF C4 330 pF C5 220 pF C6
103018_010
GND
GND
VREF
Figure 10. Evaluation Board Assembly Diagram
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VCONT
GND
VCC
9
DATA SHEET * SKY77148
PA MODULE FOR CDMA2000 (450-460 MHZ)
Package Dimensions and Pin Descriptions
The SKY77148 is a multi-layer laminate base, overmold encapsulated modular package designed for surface-mounted solder attachment to a printed circuit board. Figure 11 is a mechanical drawing of the pad layout for this package. Figure 12 provides a recommended phone board layout footprint for the PAM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50-ohm terminals. Figure 13 shows each pin name and the pin numbering convention, which starts with pin 1 in the upper left, as indicated, and increments counter-clockwise around the package. Figure 14 illustrates typical case markings.
SOLDER MASK EDGES 0.015MIN. TYP
6.04 PAD 1 INDICATOR
B C
0.8 0.05
(0.12)
0.8 0.05 DETAIL A PAD SCALE: 2X
METAL PAD EDGES
1X THIS ROTATION 1X ROTATED 90 CW 1X ROTATED 90 CCW 0.8 0.05 SOLDER MASK EDGES 0.015 MIN. TYP 0.8 0.05 0.15 A B C (0.12) METAL PAD EDGES DETAIL B PAD SCALE: 2X 1X 1X 1X 1X THIS ROTATION ROTATED 90 CW ROTATED 90 CCW ROTATED 180 2.825
6.04
TOP VIEW
METAL PAD PAD 1 INDICATOR
4X 2.5
1.5
B
A 1.5 0.1 0.1 SOLDER MASK OPENING 0.2 A B C
A
7X SMT PAD 0.15 A B C
SIDE VIEW
ALL DIMENSIONS IN MILLIMETERS
BOTTOM VIEW
103018_011
Figure 11. SKY77148 Package Dimensions
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PA MODULE FOR CDMA2000 (450-460 MHZ)
DATA SHEET * SKY77148
6.34 2X 1.5 7X 1.07 PAD 1 7X 0.8 2.83 PAD 7
1.5 3.17 4X 2.5
6.44 Package Outline Exposed Center Pad 7X 1.17 PAD 1 7X 0.9 2.83 2X 1.5
STENCIL APERTURE
TOP VIEW STENCIL APERTURE SIZE FOR THE CENTER GROUND PAD SHOULD BE 80% TO 100% (BY AREA) OF THE SOLDER MASK OPENING.
Common Ground Pad 6X 1.07 PAD 1 6X 0.8 0.25 Package Outline 3.22
4X 2.5
1.5
Package Outline Exposed Center Pad
SOLDER MASK OPENING
TOP VIEW 0.6
3.17
3X 2.5
0.6 6.34
METALLIZATION
Thermal Via Array under PA areas. O0.3 mm on 0.6 pitch. Additional vias will improve thermal performance. NOTE: Thermal vias should be tented and filled with solder mask, 30-35 m Cu plating is recommended.
TOP VIEW THE SHADED AREA REPRESENTS THE MERGER OF THE CENTER GROUND PAD AND 1 INDIVIDUAL I/O GROUND PAD. THEREFORE, THE NUMBER OF PLACES DIMENSIONED WILL BE REDUCED.
103018_012
Figure 12. Phone PCB Layout Footprint for 6 x 6, 7-Pad Package - SKY77148
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DATA SHEET * SKY77148
PA MODULE FOR CDMA2000 (450-460 MHZ)
VCC1
1
7
GND
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel, Document Number 101568.
RF IN
2
6
GROUND PAD
RF OUT
Electrostatic Discharge Sensitivity
VREF 3 4 VCONT Pad layout as seen from top view looking through the package. GROUND PAD is package underside. 5 VCC2
103018_013
Figure 13. Pin Names and Configuration
The SKY77148 is a Class 1 device. Figure 15 lists the Electrostatic Discharge (ESD) immunity level for each pin of the SKY77148 product. The numbers in Figure 15 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pin, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization.
Pin 1 Identifier
Manufacturing Part Number
SKY77148-NN
Lot Number Year Manufactured Week Package Sealed
Revision Number
VCC1
> +2 kV < -2 kV
1
7
GND
EXXXXX.XX YYWW MEX
Country Code
RF IN
> +2 kV < -2 kV
103018_014
2 GROUND PAD
6
RF OUT
> +2 kV < -2 kV
Figure 14. Typical Case Markings
VREF
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77148 is capable of withstanding an MSL 3/235 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 C per second; maximum temperature should not exceed 235 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 235 C for more than 10 seconds. For details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks
> +2 kV < -2 kV
3
4
5
VCC2
> +1.6 kV < -2.0 kV
VCONT
> +2 kV < -2 kV
Pad layout as seen from top view looking through the package.
103018_015
Figure 15. ESD Sensitivity Areas (Top View)
Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after "the pin fails the electrical specification limits" or "the pin becomes completely nonfunctional". Skyworks employs most stringent criteria to fail devices as soon as the pin begins to show any degradation on a curve tracer. To avoid ESD damage, either latent or visible, it is very important that the product assembly and test areas follow the Class 1 ESD handling precautions listed in Table 6.
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PA MODULE FOR CDMA2000 (450-460 MHZ)
DATA SHEET * SKY77148
Table 6. Precautions for Handling GaAs IC-based Products to Avoid Induced Damage
Personnel Grounding Facility Wrist Straps Conductive Smocks, Gloves and Finger Cots Antistatic ID Badges Relative Humidity Control and Air Ionizers Dissipative Floors (less than 109 to GND) Dissipative Table Tops Protective Test Equipment (Properly Grounded) Grounded Tip Soldering Irons Conductive Solder Suckers Static Sen sors Bags and Pouches (Faraday Shield) Protective Tote Boxes (Conductive Static Shielding) Protective Trays Grounded Carts Protective Work Order Holders
Protective Workstation
Protective Packaging and Transportation
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Ordering Information
Model Number SKY77148 Manufacturing Part Number SKY77148 Product Revision -15 Package 7-pin MCM L4 6 x 6 x 1.5 mm Operating Temperature -30 C to +85 C
Revision History
Revision A B Level Date October 19, 2005 May 12, 2006 Initial Release Revise: Tables 2, 4 Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 Application Note: Tape and Reel Information - RF Modules, Document Number 101568 JEDEC Standard J-STD015-020
(c) 2002-2006, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks(R), the Skyworks logo, and Breakthrough Simplicity(R). Product names or services listed in this publication are for identification purposes only, and may be trademarks of Skyworks or other third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.

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