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PRELIMINARY DATA SHEET
SKY77171 AutoSmartTM Power Amplifier Module for WCDMA (1920-1980 MHz)
Applications
* WCDMA handsets
Description
The SKY77171 AutoSmartTM Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for Wideband Code Division Multiple Access (WCDMA) handsets. This small and efficient module packs full 1920-1980 MHz bandwidth coverage into a single compact package. The SKY77171 meets the stringent spectral linearity requirements of WCDMA transmission with high power added efficiency for power output of up to 28 dBm. AutoSmartTM power amplifier technology internally adjusts the RF transistor bias level throughout the dynamic operating range to minimize battery current consumption and ensure sufficient linear performance to meet WCDMA system requirements. The result is a significant savings in average battery current without the complications of a system-supplied mode function signal or analog bias control. AutoSmartTM response time is more than adequate for RF access probe and discontinuous transmission operation. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance. The SKY77171 AutoSmartTM PAM is manufactured with Skyworks' GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77171 is supplied directly from a three-cell nickel cadmium, a single-cell lithium ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Features
* Low voltage positive bias supply - 3.2 V to 4.2 V * Low VREF - 2.85 V, nominal * Low IREF - Less than 1 mA * Supports low collector voltage operation * Good linearity * High efficiency * Large dynamic range * 10-pad package - 4 x 4 x 1.15 mm * Power down control * InGaP
Skyworks offers lead (Pb)-free "environmentally friendly" packaging that is RoHS compliant (European Parliament for the Restriction of Hazardous Substances).
VCC (10) VREF (5) Feedback Control Circuit Driver Stage Bias VCC (1) RF_IN (2) Input Match DA Inter-Stage Match PA Power Stage Bias
MODULE
Output Match
(8) RF_OUT
GND (3,6,7,9)
200014_001
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200014P2 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * October 14, 2005
1
SKY77171 * PRELIMINARY DATA SHEET
PA MODULE FOR WCDMA (1920-1980 MHZ)
Electrical Target Specifications
The following tables list the electrical characteristics of the SKY77171 Power Amplifier. Table 1 lists the absolute maximum ratings, while Table 2 shows the recommended operating conditions to achieve the performance characteristics listed in Table 4. Table 3 presents a truth table for the power settings.
Table 1. Absolute Maximum Rating (1)
Parameter RF Input Power Supply Voltage Reference Voltage Case Temperature (2)
(1) (2)
Symbol PIN VCC VREF Operating TC Storage TSTG
Minimum -- -- -- -30 -55
Nominal 0 3.4 2.85 25 --
Maximum 7 6.0 2.95 +110 +125
Unit dBm Volts Volts C
No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value. Case Operating Temperature (TC) refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Parameter Power Output Operating Frequency Supply Voltage Reference Voltage Case Operating Temperature Symbol PO FO VCC VREF TC Minimum -- 1920.0 3.2 2.75 -30 Nominal -- 1950.0 3.4 2.85 +25 Maximum 28.0 1980.0 4.2 2.95 +85 Unit dBm MHz Volts Volts C
Table 3. Power Range Truth Table
Power Setting Power On Shut Down VREF 2.85 V 0.0 V Output Power 28 dBm --
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PA MODULE FOR WCDMA (1920-1980 MHZ)
SKY77171 * PRELIMINARY DATA SHEET
Table 4. Electrical Specifications for WCDMA Nominal Operating Conditions (1)
Characteristics Symbol GLOW Gain conditions GMID GHIGH Power Added Efficiency PAELOW PAEHIGH Total Supply current Quiescent current Reference Current Total Supply current in Power-down Mode 5 MHz offset Adjacent Channel Power (2) 10 MHz offset Second Third Noise Power in RX Band 2110-2170 MHz Noise Figure Input Voltage Standing Wave Ratio (VSWR) Stability (Spurious output) Ruggedness (3)
(1) (2) (3)
Condition PO = 0 dBm PO = 16 dBm PO = 28 dBm PO = 0 dBm PO = 28 dBm PO = 0 dBm PO = 28 dBm No RF In -- VCC = 3.4 V VREF = 0 V PO = 0 dBm PO = 28 dBm
Minimum -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 10:1
Typical 23 26 28 0.8 41.0 35 450 25 1 3 -45 -41 -60 -52 34.5 50.0 -141 4 1.5:1 -- --
Maximum -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -70 --
Unit
dB
%
ICC_LOW ICC_HIGH IQ IREF IPD ACP5
mA mA mA A
dBc
ACP10 f02 f03 RxBN NF VSWR S Ru
PO = 0 dBm PO = 28 dBm
Harmonic Suppression
-- -- PO 28 dBm -- -- 5:1 VSWR All phases PO 28 dBm
dBc dBm/Hz dB -- dBc VSWR
Unless specified otherwise: VCC = +3.4 V, VREF = +2.85 V, Temp = +25 C, Freq. = 1950 MHz. ACP is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets. All phases, time = 10 seconds.
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200014P2 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * October 14, 2005
3
SKY77171 * PRELIMINARY DATA SHEET
PA MODULE FOR WCDMA (1920-1980 MHZ)
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the SKY77171, the evaluation board schematic and diagram are included for preliminary analysis and design. Figure 2 shows the basic schematic of the board for the 1920 MHz to 1980 MHz range and Figure 3 is the assembly diagram.
VCC1
A C7 330pF
1
VCC1
VCC2
10
C4 A 330pF C5 1000 pF C6 10 F
VCC2
RFIN
2
RFIN
GND
9
RFOUT
3 GND RFOUT 8
4
NC
GND
7
5
VREF
GND
6
VREF
C9 1000 pF
A Place caps at closest proximity to PA module with the capacitor grounds directly connected to the PAM grounds.
200014_002
Figure 2. Evaluation Board Schematic
P1
RF IN PCS 4X4
J1
C7
II
J2
GND VCC1
C9 GND VREF
GND
U1
C5 C4
C6
VCC2 GND
RF OUT
EN14-D1225-002 12/11/01
P2
200014_003
Figure 3. Evaluation Board Assembly Diagram
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 4
October 14, 2005 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 200014P2
PA MODULE FOR WCDMA (1920-1980 MHZ)
SKY77171 * PRELIMINARY DATA SHEET
Package Dimensions and Pad Descriptions
The SKY77171 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 4 is a mechanical drawing of the pad layout for this package. Figure 6 shows each pad function and the pad numbering convention, which starts with pad 1 in the upper left and increments counter-clockwise around the package. Figure 7 illustrates typical case markings.
PIN 1 INDICATOR 4
2X 0.575 0.1 METAL PAD EDGES 0.05 A B C 0.1 2X 0.4 SOLDER MASK EDGES 0.1 A B C DETAIL A PAD SCALE: 2X 1X THIS ROTATION 1X ROTATED 90 CW 1X ROTATED 90 CCW 1X ROTATED 180
B C
2X 0.4 METAL PAD EDGES 0.05 A B C
4
0.55
0.1 0.575 SOLDER MASK EDGES 0.1 A B C DETAIL B PAD SCALE: 2X 3X THIS ROTATION 3X ROTATED 180
0.1 A B C
TOP VIEW
(1.225) 2X 0.925
(O0.3) SOLDER MASK OPENING (O0.15) METAL PAD - PIN 1 INDICATOR
TOP SIDE 4X 1.7 4X 0.85 (1.275)
B
2X 1.825
A 1.15 0.1 0.1 4X R0.2
A
SOLDER MASK OPENING 0.15 A B C
SIDE VIEW
BOTTOM VIEW
NOTES: Unless otherwise specified 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING IN ACCORDANCE WITH ASME Y14.5M-1994. 3. SEE APPLICABLE BONDING DIAGRAM AND DEVICE ASSEMBLY DRAWING FOR DIE AND COMPONENT PLACEMENT. 4. PADS ARE METAL DEFINED; THE CENTER PAD IS SOLDER MASK DEFINED.
200014_004
Figure 4. SKY77171 Package Drawing
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200014P2 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * October 14, 2005
5
SKY77171 * PRELIMINARY DATA SHEET
PA MODULE FOR WCDMA (1920-1980 MHZ)
0.7 0.4 0.4
0.7
0.65
0.9
2.5
0.85 TYP
0.85 TYP
1.4 4.4 4.4
0.2
STENCIL APERTURE
TOP VIEW APPROACH 1 0.7
Component Outline
0.8
STENCIL APERTURE
TOP VIEW APPRAOCH 2
0.4
0.5
0.6 3.5
0.85 TYP
0.85 TYP
0.25 4.4
METALLIZATION
TOP VIEW
All dimensions are in millimeters.
Thermal Via Array O0.3 mm on 0.6 mm Pitch. Additional Vias will improve thermal performance. NOTE: Thermal vias should be tented and filled with solder mask, 30-35 m Cu plating recommended.
2 4.5
SOLDER MASK OPENING
TOP VIEW
200014_005
Figure 5. Phone PCB Layout for 4 x 4 mm, 10-Pad Package - SKY77171
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October 14, 2005 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 200014P2
PA MODULE FOR WCDMA (1920-1980 MHZ)
SKY77171 * PRELIMINARY DATA SHEET
details on attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J-STD-020B. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel Information - RF Modules, Document Number 101568.
Electrostatic Discharge Sensitivity
The SKY77171 is a Class 2 device. Figure 8 lists the Electrostatic Discharge (ESD) immunity level for each non-ground pad of the SKY77171 product. The numbers in Figure 8 specify the ESD threshold level for each pad where the I-V curve between the pad and ground starts to show degradation. The ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pad, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization. Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after "the pad fails the electrical specification limits" or "the pad becomes completely non-functional". Skyworks employs most stringent criteria and fails devices as soon as the pad begins to show any degradation on a curve tracer. To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD handling precautions listed in Table 5.
Figure 6. Pad Names and Configuration (Top View)
Pin 1 Identifier Lot Number Year of Manufacture Week Package Sealed
SKY77171-NN EXXXXX.XX YYWW MEX
Part Number Revision Number
Country Code
200014_006
Figure 7. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SKY77171 is capable of withstanding an MSL3/250 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 3 C per second; maximum temperature should not exceed 250 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 250 C for more than 10 seconds. For
Figure 8. ESD Sensitivity of Non-ground Pads (Top View)
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com
200014P2 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * October 14, 2005
7
SKY77171 * PRELIMINARY DATA SHEET
PA MODULE FOR WCDMA (1920-1980 MHZ)
Table 5. Precautions for Handling GaAs IC-based Products to Avoid Induced Damage
Personnel Grounding Wrist Straps Conductive Smocks, Gloves and Finger Cots Antistatic ID Badges Relative Humidity Control and Air Ionizers Dissipative Floors (less than 109 to GND) Bags and Pouches (Faraday Shield) Protective Tote Boxes (Conductive Static Shielding) Protective Trays Grounded Carts Protective Work Order Holders Dissipative Table Tops Protective Test Equipment (Properly Grounded) Grounded Tip Soldering Irons Conductive Solder Suckers Static Sensors
Facility
Protective Packaging & Transportation
Protective Workstation
Skyworks Solutions, Inc. * Phone [781] 376-3000 * Fax [781] 376-3100 * sales@skyworksinc.com * www.skyworksinc.com 8
October 14, 2005 * Skyworks Proprietary and Confidential information. * Products and product information are subject to change without notice. * 200014P2
Ordering Information
Model Number SKY77171 Manufacturing Part Number SKY77171 Product Revision Package MCM 4x4 Operating Temperature -30 C to +85 C
Revision History
Revision P1 P2 P3 Level Date January 6, 2005 July 20, 2005 October 14, 2005 Preliminary Information Revise: change digital bias control to AutoSmartTM: Features (p1); Tables 1, 2, 3, 4: Figures 1-5, 6, 8 Add: Pb-Free statement, p1 Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752 Application Note: Tape and Reel Information - RF Modules, Document Number 101568 Standard SMT Reflow Profiles: JEDEC Standard J-STD-020.
(c) 2004-2005, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKSTM PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. SkyworksTM products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling SkyworksTM products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: SkyworksTM, the Skyworks symbol, and "Breakthrough Simplicity"TM. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.

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