View LCC_1186820.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

data sheet
Leadless Chip Carrier Package (LCC) Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has metalized terminals / pads on the sides and bottom of the package. An LCC package has terminals / pads on all four edges of the package. The lid for this package can be either ceramic "frit sealed" or metal "solder sealed". This package provides a hermetic environment for the IC inside. Applications: This IC package technology allows application and design engineers to maximize the performance characteristics of semiconductors (silicon, GaAs and S.A.W.). These packages enable end products (pagers, portable audio/video, disc drives, radio, IF & RF devices/components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon/GaAs/S.A.W. technologies are well addressed by the LCC product family.
Features:
CERAMIC
/
HERMETIC
LCC
The LCC offers a variety of features. From standard industry, Amkor provides a platform from prototype-to-production: * Flexible lead / pin counts * Variety of body sizes * Hermetic package * Exceptional thermal and electrical performance by design * Multi-layer, ground / power * Cavity Up / Cavity down configurations * Cavity package
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION.
www.amkor.com
DS810 Rev Date: 08'02

▲Up To Search▲

Price & Availability of LCC

	To Download LCC Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .