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| 2.0x1.25mm SMD CHIP LED LAMP APTC2012EC HIGH EFFICIENCY RED Features !2.0mmx1.25mm SMT LED,0.75mm THICKNESS. !LOW Description The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. POWER CONSUMPTION. VIEWING ANGLE. COLORS AND LENS TYPES AVAILABLE. : 2000PCS / REEL. !WIDE !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS !PACKAGE Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB6364 APPROVED : J. Lu REV NO: V.2 CHECKED :Allen Liu DATE:DEC/11/2002 DRAWN: F.Y.YUAN PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . APTC2012EC HIGH EFFICIENCY RED (GaAsP/ GaP ) WATER CLEAR 4 Ty p . 12 V i ew i n g An g l e 21/2 120 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength D ev i c e High Efficiency Red High Efficiency Red Ty p . 6 27 6 25 45 15 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V Spectral Line Half-width High Efficiency Red Capacitance Forward Voltage Reverse Current High Efficiency Red High Efficiency Red High Efficiency Red Absolute Maximum Ratings at T)=25C P ar am e t e r Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. H i g h E f f i c i e n c y R ed 105 30 160 5 -40C To +85C Un it s mW mA mA V SPEC NO: DSAB6364 APPROVED : J. Lu REV NO: V.2 CHECKED :Allen Liu DATE:DEC/11/2002 DRAWN: F.Y.YUAN PAGE: 2 OF 4 High Efficiency Red APTC2012EC SPEC NO: DSAB6364 APPROVED : J. Lu REV NO: V.2 CHECKED :Allen Liu DATE:DEC/11/2002 DRAWN: F.Y.YUAN PAGE: 3 OF 4 APTC2012EC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB6364 APPROVED : J. Lu REV NO: V.2 CHECKED :Allen Liu DATE:DEC/11/2002 DRAWN: F.Y.YUAN PAGE: 4 OF 4 |
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