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APTM120H57FTG
Full - Bridge MOSFET Power Module
VBUS Q1 Q3
VDSS = 1200V RDSon = 570m typ @ Tj = 25C ID = 17A @ Tc = 25C
Application * Welding converters * Switched Mode Power Supplies * Uninterruptible Power Supplies * Motor control
G1 S1 Q2 O UT1 O UT2 Q4
G3 S3
G2 S2 NT C1 0/VBUS NT C2
G4 S4
Features * Power MOS 7(R) FREDFETs - Low RDSon - Low input and Miller capacitance - Low gate charge - Fast intrinsic reverse diode - Avalanche energy rated - Very rugged * Kelvin source for easy drive * Very low stray inductance - Symmetrical design - Lead frames for power connections * Internal thermistor for temperature monitoring * High level of integration Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Solderable terminals both for power and signal for easy PCB mounting * Low profile * RoHS Compliant Max ratings 1200 17 13 68 30 684 390 22 50 3000 Unit V A V m W A mJ
G3 S3
G4 S4
OUT2
VBUS
0/VBUS
OUT1
S1 G1
S2 G2
NTC2 NTC1
Absolute maximum ratings
Symbol VDSS ID IDM VGS RDSon PD IAR EAR EAS
Parameter Drain - Source Breakdown Voltage Continuous Drain Current Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Avalanche current (repetitive and non repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy Tc = 25C Tc = 80C
Tc = 25C
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com
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1-6
APTM120H57FTG- Rev 1
July, 2006
APTM120H57FTG
All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics
Symbol IDSS RDS(on) VGS(th) IGSS Characteristic Test Conditions Min Zero Gate Voltage Drain Current Drain - Source on Resistance Gate Threshold Voltage Gate - Source Leakage Current
VGS = 0V,VDS = 1200V VGS = 0V,VDS = 1000V T j = 25C T j = 125C
Typ
VGS = 10V, ID = 8.5A VGS = VDS, ID = 2.5mA VGS = 30 V, VDS = 0V
570 3
Max 250 1000 684 5 100
Unit A m V nA
Dynamic Characteristics
Symbol Ciss Coss Crss Qg Qgs Qgd Td(on) Tr Td(off) Tf Eon Eoff Eon Eoff
Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total gate Charge Gate - Source Charge Gate - Drain Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy Turn-off Switching Energy
Test Conditions VGS = 0V VDS = 25V f = 1MHz VGS = 10V VBus = 600V ID = 17A Inductive switching @ 125C VGS = 15V VBus = 800V ID = 17A R G = 5 Inductive switching @ 25C VGS = 15V, VBus = 800V ID = 17A, R G = 5 Inductive switching @ 125C VGS = 15V, VBus = 800V ID = 17A, R G = 5
Min
Typ 5155 770 130 187 24 120 20 15 160 45 990 685 1565 857
Max
Unit pF
nC
ns
J
J
Source - Drain diode ratings and characteristics
Symbol IS VSD dv/dt trr Qrr Characteristic Continuous Source current (Body diode) Diode Forward Voltage Peak Diode Recovery Reverse Recovery Time Reverse Recovery Charge
Test Conditions Tc = 25C Tc = 80C
Min
Typ
VGS = 0V, IS = - 17A IS = - 17A VR = 600V diS/dt = 100A/s IS = - 17A VR = 600V diS/dt = 100A/s Tj = 25C Tj = 125C Tj = 25C Tj = 125C 2 7
Max 17 13 1.3 18 320 650
Unit A V V/ns ns C
July, 2006 2-6 APTM120H57FTG- Rev 1
dv/dt numbers reflect the limitations of the circuit rather than the device itself. IS - 17A di/dt 700A/s VR VDSS Tj 150C
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APTM120H57FTG
Thermal and package characteristics
Symbol RthJC VISOL TJ TSTG TC Torque Wt Characteristic Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Min 2500 -40 -40 -40 2.5
Typ
Max 0.32 150 125 100 4.7 160
Unit C/W V C N.m g
Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight
To Heatsink
M5
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol Characteristic R25 Resistance @ 25C B 25/85 T25 = 298.15 K Min
Typ 50 3952
Max
Unit k K
RT =
R 25
1 1 RT : Thermistor value at T exp B 25 / 85 T - T 25
T: Thermistor temperature
SP4 Package outline (dimensions in mm)
ALL DIMENSIO NS MARKED " * " ARE T OLERENCED AS :
See application note APT0501 - Mounting Instructions for SP4 Power Modules on www.microsemi.com
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3-6
APTM120H57FTG- Rev 1
July, 2006
APTM120H57FTG
Typical Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.35 Thermal Impedance (C/W) 0.3 0.25 0.2 0.15 0.1 0.05 0.1 0.05 0.0001 0.001 Single Pulse 0.9 0.7 0.5 0.3
0 0.00001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds) Low Voltage Output Characteristics 50
V GS=15, 10 & 8V
Transfert Characteristics 80 70 ID, Drain Current (A)
VDS > ID(on)xRDS (on)MAX 250s pulse test @ < 0.5 duty cycle
I D, Drain Current (A)
40 30 20 10 0 0 5 10 15 20
7V 6.5V
60 50 40 30 20 10 0
TJ=25C T J=125C T J=-55C
6V
5.5V 5V
25
30
0
1
2
3
4
5
6
7
8
9
VDS , Drain to Source Voltage (V) RDS(on) vs Drain Current ID, DC Drain Current (A)
Normalized to VGS=10V @ 8.5A
VGS, Gate to Source Voltage (V) DC Drain Current vs Case Temperature 20 16 12 8 4 0
RDS(on) Drain to Source ON Resistance
1.4 1.3 1.2 1.1 1 0.9 0.8 0
V GS=10V VGS=20V
10
20
30
40
25
50
75
100
125
150
July, 2006 4-6 APTM120H57FTG- Rev 1
ID, Drain Current (A)
TC, Case Temperature (C)
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APTM120H57FTG
RDS(on), Drain to Source ON resistance (Normalized) Breakdown Voltage vs Temperature BVDSS, Drain to Source Breakdown Voltage (Normalized) 1.15 1.10 1.05 1.00 0.95 0.90 0.85 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (C) Threshold Voltage vs Temperature 1.2 VGS(TH), Threshold Voltage (Normalized) I D, Drain Current (A) 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 150 TC, Case Temperature (C) Capacitance vs Drain to Source Voltage VGS, Gate to Source Voltage (V) 100000 C, Capacitance (pF) 14 12 10 8 6 4 2 0 0 40 80 120 160 200 240 Gate Charge (nC)
July, 2006
ON resistance vs Temperature 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (C) Maximum Safe Operating Area
VGS =10V ID=8.5A
100
100s limited by RDSon 1ms 10ms
10
1
Single pulse TJ =150C TC=25C 1 1200 10 100 1000 VDS , Drain to Source Voltage (V)
0
Gate Charge vs Gate to Source Voltage I D=17A TJ=25C
V DS=240V VDS=600V V DS =960V
10000
Ciss
1000
Coss
Crss 100 0 10 20 30 40 50 VDS, Drain to Source Voltage (V)
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5-6
APTM120H57FTG- Rev 1
APTM120H57FTG
Delay Times vs Current 180 160 td(on) and td(off) (ns) 140 100 80 60 40 20 0 5 10 15 20 25 30 35 I D, Drain Current (A) Switching Energy vs Current 0 5 10 15 20 25 I D, Drain Current (A) 30 35
V DS=800V RG =5 T J=125C L=100H
Rise and Fall times vs Current 80
VDS=800V RG=5 TJ=125C L=100H
t d(off) 60
tf
tr and tf (ns)
120
40 tr 20
td(on)
Switching Energy vs Gate Resistance 4
VDS=800V ID=17A TJ=125C L=100H
3
Switching Energy (mJ) Switching Energy (mJ)
2.5 2 1.5 1 0.5 0 5
V DS=800V RG=5 T J=125C L=100H
Eon Eoff
Eoff
3
2 1 Eoff
Eon
0
10
15
20
25
30
35
0
5
10
15
20
25
30
35
I D, Drain Current (A) Operating Frequency vs Drain Current 200 175
Gate Resistance (Ohms) Source to Drain Diode Forward Voltage
IDR, Reverse Drain Current (A)
225
1000
Frequency (kHz)
150 125 100 75 50 25 0 4 6
VDS=800V D=50% RG=5 T J=125C T C=75C
ZCS ZVS
100
T J=150C
10
T J=25C
Hard switching
1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 VSD, Source to Drain Voltage (V)
July, 2006 6-6 APTM120H57FTG- Rev 1
8 10 12 14 ID, Drain Current (A)
16
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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