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KM732V787
Document Title
128Kx32-Bit Synchronous Burst SRAM
128Kx32 Synchronous SRAM
Revision History
Rev. No. 1.0 2.0 3.0 History Initial draft Modify Rev. No. from 0.0 to 1.0. Add VDDQ Supply voltage( 2.5V ) Draft Date May. 19. 1998 Jun. 02. 1998 Dec. 02. 1998 Remark Final Final Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
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December 1998 Rev 3.0
KM732V787
128Kx32-Bit Synchronous Burst SRAM
FEATURES
* Synchronous Operation. * On-Chip Address Counter. * Write Self-Timed Cycle. * On-Chip Address and Control Registers. * VDD= 3.3V+0.3V/-0.165V Power Supply. * VDDQ Supply Voltage 3.3V+0.3V/-0.165V for 3.3V I/O or 2.5V+0.4V/-0.125V for 2.5V I/O. * 5V Tolerant Inputs except I/O Pins. * Byte Writable Function. * Global Write Enable Controls a full bus-width write. * Power Down State via ZZ Signal. * Asynchronous Output Enable Control. * ADSP, ADSC, ADV Burst Control Pins. * LBO Pin allows a choice of either a interleaved burst or a linear burst. * Three Chip Enables for simple depth expansion with No Data Contention. * TTL-Level Three-State Output. * 100-TQFP-1420A
128Kx32 Synchronous SRAM
GENERAL DESCRIPTION
The KM732V787 is 4,194,304 bits Synchronous Static Random Access Memory designed to support zero wait state performance for advanced Pentium/Power PC based system. And with CS1 high, ADSP is blocked to control signals. It can be organized as 128K words of 32 bits. And it integrates address and control registers, a 2-bit burst address counter and high output drive circuitry onto a single integrated circuit for reduced components counts implementation of high performance cache RAM applications. Write cycles are internally self-timed and synchronous. The self-timed write feature eliminates complex off chip write pulse shaping logic, simplifying the cache design and further reducing the component count. Burst cycle can be initiated with either the address status processor(ADSP) or address status cache controller(ADSC) inputs. Subsequent burst addresses are generated internally in the systems burst sequence and are controlled by the burst address advance(ADV) input. ZZ pin controls Power Down State and reduces Stand-by current regardless of CLK. The KM732V787 is implemented with SAMSUNGs high performance CMOS technology and is available in a 100pin TQFP package. Multiple power and ground pins are utilized to minimize ground bounce.
FAST ACCESS TIMES
PARAMETER Cycle Time Clock Access Time Output Enable Access Time Symbol tCYC tCD tOE -7 8.5 7.5 3.5 -8 10 8 3.5 -9 12 9 3.5 Unit ns ns ns
LOGIC BLOCK DIAGRAM
CLK
LBO CONTROL REGISTER ADV ADSC BURST CONTROL LOGIC BURST ADDRESS COUNTER A0~A1 A0~A16 ADDRESS REGISTER A2~A16 A0~A1
128Kx32 MEMORY ARRAY
ADSP
CS1 CS2 CS2
GW
DATA-IN REGISTER CONTROL REGISTER
BW WEa WEb WEc WEd OE ZZ DQa0 ~ DQd7
CONTROL LOGIC
OUTPUT BUFFER
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December 1998 Rev 3.0
KM732V787
PIN CONFIGURATION(TOP VIEW)
128Kx32 Synchronous SRAM
ADSC
ADSP
WEd
WEb
WEa
WEc
ADV 83
CLK
CS1
CS2
CS2
VDD
GW
VSS
BW
OE
A6
A7
A8 82
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
81
A9 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
VSS
VDD
A5
A4
A3
A2
A1
A0
A10
A11
A12
A13
A14
A15
LBO
N.C.
N.C.
N.C.
PIN NAME
SYMBOL A0 - A16 PIN NAME Address Inputs TQFP PIN NO. 32,33,34,35,36,37, 44,45,46,47,48,49, 50,81,82,99,100 83 84 85 89 98 97 92 93,94,95,96 86 88 87 64 31 SYMBOL VDD VSS N.C. DQa0~a7 DQb0~b7 DQc0~c7 DQd0~d7 VDDQ VSSQ PIN NAME Power Supply(+3.3V) Ground No Connect Data Inputs/Outputs TQFP PIN NO. 15,41,65,91 17,40,67,90 1,14,16,30,38,39,42,43, 51,66,80 52,53,56,57,58,59,62,63 68,69,72,73,74,75,78,79 2,3,6,7,8,9,12,13 18,19,22,23,24,25,28,29 4,11,20,27,54,61,70,77 5,10,21,26,55,60,71,76
ADV ADSP ADSC CLK CS1 CS2 CS2 WEx OE GW BW ZZ LBO
Burst Address Advance Address Status Processor Address Status Controller Clock Chip Select Chip Select Chip Select Byte Write Inputs Output Enable Global Write Enable Byte Write Enable Power Down Input Burst Mode Control
N.C.
Output Power Supply (2.5V or 3.3V) Output Ground
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A16
50
N.C. DQc0 DQc1 VDDQ VSSQ DQc2 DQc3 DQc4 DQc5 VSSQ VDDQ DQc6 DQc7 N.C. VDD N.C. VSS DQd0 DQd1 VDDQ VSSQ DQd2 DQd3 DQd4 DQd5 VSSQ VDDQ DQd6 DQd7 N.C.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
100 Pin TQFP
(20mm x 14mm)
N.C. DQb7 DQb6 VDDQ VSSQ DQb5 DQb4 DQb3 DQb2 VSSQ VDDQ DQb1 DQb0 VSS N.C. VDD ZZ DQa7 DQa6 VDDQ VSSQ DQa5 DQa4 DQa3 DQa2 VSSQ VDDQ DQa1 DQa0 N.C.
December 1998 Rev 3.0
KM732V787
FUNCTION DESCRIPTION
128Kx32 Synchronous SRAM
The KM732V787 is a synchronous SRAM designed to support the burst address accessing sequence of the Pentium and Power PC based microprocessor. All inputs (with the exception of OE, LBO and ZZ) are sampled on rising clock edges. The start and duration of the burst access is controlled by ADSC, ADSP and ADV and chip select pins. When ZZ is pulled high, the SRAM will enter a Power Down State. At this time, internal state of the SRAM is preserved. When ZZ returns to low, the SRAM normally operates after 2cycles of wake up time. ZZ pin is pulled down internally. Read cycles are initiated with ADSP(or ADSC) using the new external address clocked into the on-chip address register when both GW and BW are high or when BW is low and WEa, WEb, WEc, and WEd are high. When ADSP is sampled low, the chip selects are sampled active, and the output buffer is enabled with OE. the data of cell array accessed by the current address are projected to the output pins. Write cycles are also initiated with ADSP(or ADSC) and are differentiated into two kinds of operations; All byte write operation and individual byte write operation. All byte write occurs by enabling GW(independent of BW and WEx.), and individual byte write is performed only when GW is high and BW is low. In KM732V787, a 128Kx32 organization, WEa controls DQa0 ~ DQa7 , WEb controls DQb0 ~ DQb7 , WEc controls DQc0 ~ DQc7 and WEd controls DQd0 ~ DQd7 . CS1 is used to enable the device and conditions internal use of ADSP and is sampled only when a new external address is loaded. ADV is ignored at the clock edge when ADSP is asserted, but can be sampled on the subsequent clock edges. The address increases internally for the next access of the burst when ADV is sampled low. Addresses are generated for the burst access as shown below, The starting point of the burst sequence is provided by the external address. The burst address counter wraps around to its initial state upon completion. The burst sequence is determined by the state of the LBO pin. When this pin is Low, linear burst sequence is selected. And this pin is High, Interleaved burst sequence is selected.
BURST SEQUENCE TABLE
LBO PIN HIGH First Address Case 1 A1 0 0 1 1 A0 0 1 0 1 A1 0 0 1 1 Case 2 A0 1 0 1 0 A1 1 1 0 0 Case 3 A0 0 1 0 1
(Interleaved Burst)
Case 4 A1 1 1 0 0 A0 1 0 1 0
Fourth Address
BURST SEQUENCE TABLE
LBO PIN LOW First Address Case 1 A1 0 0 1 1 A0 0 1 0 1 A1 0 1 1 0 Case 2 A0 1 0 1 0 A1 1 1 0 0 Case 3 A0 0 1 0 1 A1 1 0 0 1
(Linear Burst)
Case 4 A0 1 0 1 0
Fourth Address
Note : 1. LBO pin must be tied to high or low, and floating state must not be allowed.
ASYNCHRONOUS TRUTH TABLE
(See Notes 1 and 2):
OPERATION Sleep Mode Read Write Deselected ZZ H L L L L OE X L H X X I/O STATUS High-Z DQ High-Z Din, High-Z High-Z
Notes 1. X means "Don't Care". 2. ZZ pin is pulled down internally 3. For write cycles that following read cycles, the output buffersmust be disabled with OE, otherwise data bus contention will occur. 4. Sleep Mode means power down state of which stand-by current does not depend on cycle time. 5. Deselected means power down state of which stand-by current depends on cycle time.
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December 1998 Rev 3.0
KM732V787
SYNCHRONOUS TRUTH TABLE
CS1 H L L L L L L L X H X H X H X H CS2 X L X L X H H H X X X X X X X X CS2 X X H X H L L L X X X X X X X X ADSP ADSC X L L X X L H H H X H X H X H X L X X L L X L L H H H H H H H H ADV X X X X X X X X L L L L H H H H WRITE X X X X X X L H H H L L H H L L CLK
128Kx32 Synchronous SRAM
ADDRESS ACCESSED N/A N/A N/A N/A N/A External Address External Address External Address Next Address Next Address Next Address Next Address Current Address Current Address Current Address Current Address
OPERATION Not Selected Not Selected Not Selected Not Selected Not Selected Begin Burst Read Cycle Begin Burst Write Cycle Begin Burst Read Cycle Continue Burst Read Cycle Continue Burst Read Cycle Continue Burst Write Cycle Continue Burst Write Cycle Suspend Burst Read Cycle Suspend Burst Read Cycle Suspend Burst Write Cycle Suspend Burst Write Cycle
Notes : 1. X means "Dont Care". 2. The rising edge of clock is symbolized by . 3. WRITE = L means Write operation in WRITE TRUTH TABLE. WRITE = H means Read operation in WRITE TRUTH TABLE. 4. Operation finally depends on status of asynchronous input pins(ZZ and OE).
WRITE TRUTH TABLE
GW H H H H H H L BW H L L L L L X WEa X H L H H L X WEb X H H L H L X WEc X H H H L L X WEd X H H H L L X OPERATION READ READ WRITE BYTE a WRITE BYTE b WRITE BYTE c and d WRITE ALL BYTEs WRITE ALL BYTEs
Notes : 1. X means "Dont Care". 2. All inputs in this table must meet setup and hold time around the rising edge of CLK().
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December 1998 Rev 3.0
KM732V787
ABSOLUTE MAXIMUM RATINGS*
PARAMETER Voltage on VDD Supply Relative to VSS Voltage on VDDQ Supply Relative to VSS Voltage on Input Pin Relative to VSS Voltage on I/O Pin Relative to VSS Power Dissipation Storage Temperature Operating Temperature Storage Temperature Range Under Bias
128Kx32 Synchronous SRAM
SYMBOL VDD VDDQ VIN VIO PD TSTG TOPR TBIAS
RATING -0.3 to 4.6 VDD -0.3 to 6.0 -0.3 to VDDQ + 0.5 1.2 -65 to 150 0 to 70 -10 to 85
UNIT V V V V W C C C
*Notes : Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
OPERATING CONDITIONS at 3.3V I/O (0C TA70C)
PARAMETER Supply Voltage VDDQ Ground VSS 3.135 0 3.3 0 3.6 0 V V SYMBOL VDD MIN 3.135 Typ. 3.3 MAX 3.6 UNIT V
OPERATING CONDITIONS at 2.5V I/O(0C TA 70C)
PARAMETER Supply Voltage VDDQ Ground VSS 2.375 0 2.5 0 2.9 0 V V SYMBOL VDD MIN 3.135 Typ. 3.3 MAX 3.6 UNIT V
CAPACITANCE*(TA=25C, f=1MHz)
PARAMETER Input Capacitance Output Capacitance
*Note : Sampled not 100% tested.
SYMBOL CIN COUT
TEST CONDITION VIN=0V VOUT=0V
MIN -
MAX 5 8
UNIT pF pF
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December 1998 Rev 3.0
KM732V787
PARAMETER Input Leakage Current(except ZZ) Output Leakage Current SYMBOL IIL IOL
128Kx32 Synchronous SRAM
DC ELECTRICAL CHARACTERISTICS(TA=0 to 70C, VDD=3.3V+0.3V/-0.165V)
TEST CONDITIONS VDD=Max , VIN=VSS to VDD Output Disabled, VOUT=VSS to VDDQ Device Selected, IOUT=0mA, ZZVIL, All Inputs=VIL or VIH Cycle Time tCYC min Device deselected, IOUT=0mA, ZZVIL, f=Max, All Inputs0.2V or VDD-0.2V -7 -8 -9 -7 -8 -9 MIN -2 -2 2.4 2.0 -0.5* 2.0 -0.3* 1.7 MAX +2 +2 350 325 300 100 90 80 30 30 0.4 0.4 0.8 VDD+0.5** 0.7 VDD+0.5** mA mA V V V V V V V V mA mA UNIT A A
Operating Current
ICC
ISB Standby Current ISB1 ISB2 Output Low Voltage(3.3V I/O) Output High Voltage(3.3V I/O) Output Low Voltage(2.5V I/O) Output High Voltage(2.5V I/O) Input Low Voltage(3.3V I/O) Input High Voltage(3.3V I/O) Input Low Voltage(2.5V I/O) Input High Voltage(2.5V I/O)
* VIL(Min)=-2.0(Pulse Width tCYC/2) ** VIH(Max)=4.6(Pulse Width tCYC/2) ** In Case of I/O Pins, the Max. VIH=VDDQ+0.5V
Device deselected, IOUT=0mA, ZZ0.2V, f=0, All Inputs=fixed (VDD-0.2V or 0.2V) Device deselected, IOUT=0mA, ZZVDD-0.2V, f=Max, All InputsVIL or VIH IOL = 8.0mA IOH = -4.0mA IOL = 1.0mA IOH = -1.0mA
VOL VOH VOL VOH VIL VIH VIL VIH
TEST CONDITIONS
(VDD=3.3V+0.3V/-0.165V,VDDQ=3.3V+0.3/-0.165V or VDD=3.3V+0.3V/-0.165V,VDDQ=2.5V+0.4V/-0.125V, TA=0 to 70C)
PARAMETER Input Pulse Level(for 3.3V I/O) Input Pulse Level(for 2.5V I/O) Input Rise and Fall Time(Measured at 0.3V and 2.7V for 3.3V I/O) Input Rise and Fall Time(Measured at 0.3V and 2.1V for 2.5V I/O) Input and Output Timing Reference Levels for 3.3V I/O Input and Output Timing Reference Levels for 2.5V I/O Output Load VALUE 0 to 3V 0 to 2.5V 2ns 2ns 1.5V VDDQ/2 See Fig. 1
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December 1998 Rev 3.0
KM732V787
Output Load(A)
128Kx32 Synchronous SRAM
Output Load(B) (for tLZC, tLZOE, tHZOE & tHZC) +3.3V for 3.3V I/O /+2.5V for 2.5V I/O VL=1.5V for 3.3V I/O VDDQ/2 for 2.5V I/O Dout 353 / 1538 319 / 1667
Dout Z0=50
RL=50 30pF*
5pF*
* Capacitive Load consists of all components of the test environment. Fig. 1
* Including Scope and Jig Capacitance
AC TIMING CHARACTERISTICS(TA=0 to 70C, VDD=3.3V+0.3V/-0.165V)
PARAMETER Cycle Time Clock Access Time Output Enable to Data Valid Clock High to Output Low-Z Output Hold from Clock High Output Enable Low to Output Low-Z Output Enable High to Output High-Z Clock High to Output High-Z Clock High Pulse Width Clock Low Pulse Width Address Setup to Clock High Address Status Setup to Clock High Data Setup to Clock High Write Setup to Clock High(GW, BW, WEx) Address Advance Setup to Clock High Chip Select Setup to Clock High Address Hold from Clock High Address Status Hold from Clock High Data Hold from Clock High Write Hold from Clock High(GW, BW, WEx) Address Advance Hold from Clock High Chip Select Hold from Clock High ZZ High to Power Down ZZ Low to Power Up SYMBOL tCYC tCD tOE tLZC tOH tLZOE tHZOE tHZC tCH tCL tAS tSS tDS tWS tADVS tCSS tAH tSH tDH tWH tADVH tCSH tPDS tPUS KM732V787-7 MIN 8.5 0 2 0 2 3 3 2.0 2.0 2.0 2.0 2.0 2.0 0.5 0.5 0.5 0.5 0.5 0.5 2 2 MAX 7.5 3.5 3.5 3.5 KM732V787-8 MIN 10 0 2 0 2 4 4 2.0 2.0 2.0 2.0 2.0 2.0 0.5 0.5 0.5 0.5 0.5 0.5 2 2 MAX 8 3.5 3.5 3.5 KM732V787-9 MIN 12 0 2 0 2 4.5 4.5 2.0 2.0 2.0 2.0 2.0 2.0 0.5 0.5 0.5 0.5 0.5 0.5 2 2 MAX 9 3.5 3.5 3.5 UNIT ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns cycle cycle
Notes : 1. All address inputs must meet the specified setup and hold times for all rising clock edges whenever ADSC and/or ADSP is sampled low and CS is sampled low. All other synchronous inputs must meet the specified setup and hold times whenever this device is chip selected. 2. Both chip selects must be active whenever ADSC or ADSP is sampled low in order for the this device to remain enabled. 3. ADSC or ADSP must not be asserted for at least 2 Clock after leaving ZZ state. 4. At any given voltage and temperature, tHZC is less than tLZC.
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December 1998 Rev 3.0
TIMING WAVEFORM OF READ CYCLE
tCH tCL
CLOCK
tSH tCYC
KM732V787
tSS
ADSP
tSS tSH
ADSC
tAH A2 tWS tWH A3
BURST CONTINUED WITH NEW BASE ADDRESS
tAS
ADDRESS
A1
-9tCSH tADVS tADVH
(ADV INSERTS WAIT STATE)
WRITE
tCSS
CS
ADV
OE
tOE tHZOE tCD tOH Q2-1 Q2-2 Q2-3 Q2-4 Q3-1 Q3-2 Q3-3 Q1-1 tHZC Q3-4
tLZOE
Data Out
Dont Care Undefined
128Kx32 Synchronous SRAM
December 1998 Rev 3.0
NOTES : WRITE = L means GW = L, or GW = H, BW = L, WEx.= L CS = L means CS1 = L, CS2 = H and CS2 = L CS = H means CS1 = H, or CS1 = L and CS2 = H, or CS1 = L, and CS2 = L
TIMING WAVEFORM OF WRTE CYCLE
tCH tCL
CLOCK
tSH tCYC
KM732V787
tSS
ADSP
tSS tSH
ADSC
tAH A1 A2
(ADSC EXTENDED BURST)
tAS
ADDRESS
A3 tWS tWH
WRITE
tCSH
- 10 (ADV SUSPENDS BURST)
tCSS
CS
tADVS tADVH
ADV
OE
tDS D1-1 tLZOE Q0-4
Dont Care Undefined
tDH D2-2 D2-2 D2-3 D2-4 D3-1 D3-2 D3-3 D3-4
Data In
D2-1
128Kx32 Synchronous SRAM
December 1998 Rev 3.0
Data Out
Q0-3
TIMING WAVEFORM OF COMBINATION READ/WRTE CYCLE(ADSP CONTROLLED, ADSC=HIGH)
tCH tCL
CLOCK
tSS tSH tCYC
KM732V787
ADSP tAS
tAH A2 A3 tWS tWH A1
ADDRESS
WRITE
- 11 tADVS tADVH tDS D2-1 tOE tHZOE tLZOE Q1-1 Q3-1 tCD tLZC tDH
CS
ADV
OE
Data In
tHZC
tOH Q3-2 Q3-3 Q3-4
Data Out
Dont Care Undefined
128Kx32 Synchronous SRAM
December 1998 Rev 3.0
TIMING WAVEFORM OF SINGLE READ/WRITE CYCLE(ADSC CONTROLLED, ADSP=HIGH)
tCH tCL
CLOCK
tSH tCYC
KM732V787
tSS
ADSC
tWS A2 tWS tWH A3 A4 A5 A6 A7 A8 tWH A9
ADDRESS
A1
WRITE
tCSH
tCSS
- 12 tOE tHZOE Q1-1 Q2-1 Q3-1 Q4-1 tDS D5-1 D6-1
CS
ADV
OE
tCD Q8-1 tDH D7-1 tOH Q9-1
tLZOE
Data Out
Data In
128Kx32 Synchronous SRAM
Dont Care Undefined
December 1998 Rev 3.0
TIMING WAVEFORM OF SINGLE READ/WRITE CYCLE(ADSP CONTROLLED, ADSC=HIGH)
tCH tCL
CLOCK
tCYC
KM732V787
tSS
tSH
ADSP
tAS A2 A3 A4 A5 A6 A7 A8 tAH A9
ADDRESS
A1
WRITE
tCSS
tCSH
- 13 tHZOE Q1-1 Q2-1 Q3-1 Q4-1 tDS D5-1 D6-1 tDH
CS
ADV
OE
tCD Q8-1 tOH Q9-1
tOE
tLZOE
Data Out
Data In
D7-1
Dont Care Undefined
128Kx32 Synchronous SRAM
December 1998 Rev 3.0
TIMING WAVEFORM OF POWER DOWN CYCLE
tCH tCL
CLOCK
tSH tCYC
KM732V787
tSS
ADSP
ADSC
tAH A2 tWS tWH
tAS
ADDRESS
A1
WRITE
tCSH
tCSS
- 14 tOE tHZC Q1-1 tPDS
ZZ Setup Cycle Sleep State
CS
ADV
OE
tLZOE tHZOE
Data In
D2-1
D2-2
Data Out
tPUS
ZZ Recovery Cycle Normal Operation Mode
ZZ
Dont Care Undefined
128Kx32 Synchronous SRAM
December 1998 Rev 3.0
KM732V787
APPLICATION INFORMATION
DEPTH EXPANSION
128Kx32 Synchronous SRAM
The Samsung 128Kx32 Synchronous Burst SRAM has two additional chip selects for simple depth expansion. This permits easy secondary cache upgrades from 128K depth to 256K depth without extra logic. Data Address A[0:17] A[17] A[0:16]
I/O[0:63]
A[17] A[0:16]
CLK
Address CS2
Data
Address CS2 CS2
Data
64-bits Microprocessor
Address CLK Cache Controller
CS2 CLK ADSC WEx OE CS1 ADV ADSP (Bank 0) 128Kx32 SB SRAM
CLK ADSC WEx
128Kx32 SB SRAM (Bank 1)
OE CS1 ADV ADSP
ADS
INTERLEAVE READ TIMING (Refer to non-interleave write timing for interleave write timing)
(ADSP CONTROLLED , ADSC=HiGH) CLOCK
tSS tSH
ADSP
tAS tAH A2 tWS tWH
ADDRESS [0:n] WRITE
A1
tCSS
tCSH
CS1
Bank 0 is selected by CS2, and Bank 1 deselected by CS2
An+1
tADVS tADVH
Bank 0 is deselected by CS2, and Bank 1 selected by CS2
ADV
OE
tOE tHZC Q1-1 Q1-2 Q1-3 Q1-4 tCD tLZC Q2-1 Q2-2 Q2-3 Q2-4
Dont Care Undefined
Data Out (Bank 0) Data Out (Bank 1)
tLZOE
*Notes : n = 14 32K depth, 15 64K depth, 16 128K depth, 17 256K depth
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December 1998 Rev 3.0
KM732V787
PACKAGE DIMENSIONS
100-TQFP-1420A
22.00 0.30 20.00 0.20
128Kx32 Synchronous SRAM
Units; millimeters/Inches
0~8
0.10 0.127 + 0.05 -
16.00 0.30 14.00 0.20 0.10 MAX
(0.83) 0.50 0.10 #1 0.65 0.30 0.10 0.10 MAX (0.58)
1.40 0.10 0.50 0.10 0.05 MIN
1.60 MAX
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December 1998 Rev 3.0

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