 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME 3 STATE DUAL TONES WIRELESS DOOR BELL FEATURES * Direct Data Transmit ( Switch to VDD ). * 3 =6561 security codes. * 3 door chime sound and 1 melody. * VT : valid transmission active high. 8 3 IC BIT FORMAT "0" M3E.-H/M3D-95 "1" "X" KEY D0 D1 D2 D3 SOUND Ding Dong - Ding Dong Ding Ding - Ding Ding WEST MINISTER For Alice APPLICATION * Door bell system. . ELECTRICAL CHARACTERISTICS Characteristics Operating Voltage Operating Current Quiescent Current Driving Current Oscillator Frequency Operating Temperature Sym. VDD IOP ISB IOL FOSC Temp. Min. 2.4 2.4 -- 1 0 Typ. -- 4.5 0.3 -- 1 80 25 Max. 13 5 1 10 10 60 ( @VDD=4.5V unless otherwise specified ) Unit V mA A mA KHz @ VDS=1.2V External 30%, Rosc=240K M3E.-H M3D-95 No load M3E.-H No load M3D-95 REMARKS APPLICATION DIAGRAM VDD 1 A0 A1 0 M3E.-H VDD 1 18 DO X A0 A1 Rosc A2 A3 VDD D3 A4 A5 D2 A6 D1 A7 9 10 D0 IR / RF VDD 1 0 M3D-95 1 16 VDD IR / RF TEST3 Y X DIN OUT 1K Rosc VDD A2 Y A3 A4 A5 A6 A7 VSS BZ TEST VSS 8 9 * Rosc ~ M3E.-H : 240 K; M3D-95 : 240 K * All specs and applications shown above subject to change without prior notice. ( , ) 1/2 2002-02-26 MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME 3 STATE DUAL TONES WIRELESS DOOR BELL ASSIGNMENT & POSITION 15 14 13 3 IC M3E.-H/M3D-95 16 (M3D-95) Y X 12 11 10 1 2 3 ( 0,0 ) 4 5 6 7 8 9 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NAME TEST3 VDD A0 A1 A2 A3 A4 A5 A6 A7 VSS TEST BZ DIN OSC1 OSC2 X -626.75 -626.75 -626.75 -626.75 -442.75 -227.75 252 467 627 627 627 627 627 -108 -323.75 -626.75 UNIT : um Y -130 -290 -450 -610 -610 -610 -610 -610 -610 -395 -235 -75 604 604 604 434.5 * CHIP SIZE ~ 1.5 x 1.46 mm2 * IC substrate should be connected to VDD in PCB (PCB IC VDD) 2/2 2002-02-26 |
Price & Availability of M3E-H
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |