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| Amplifier, Power, 0.6W 1.5-3.3 GHz Features 0.6 Watt Saturated Output Power Level Variable Drain Voltage (4-10V) Operation MSAGTM Process MAAPGM0026-DIE 903185 -- Preliminary Information Description The MAAPGM0026-DIE is a 2-stage, 0.6 W power amplifier with on-chip bias networks. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage or as a driver stage in high power applications. Fabricated using M/A-COM's repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate (MSAGTM) Process, each device is 100% RF tested on wafer to ensure performance compliance. M/A-COM's MSAGTM process features robust silicon-like manufacturing processes, planar processing of ion implanted transistors, multiple implant capability enabling power, low-noise, switch and digital FETs on a single chip, and polyimide scratch protection for ease of use with automated manufacturing processes. The use of refractory metals and the absence of platinum in the gate metal formulation prevents hydrogen poisoning when employed in hermetic packaging. Primary Applications 2.5-2.7 GHz MMDS GPS WLAN Point-to-Multipoint Radios Electrical Characteristics: TB = 40C1, Z0 = 50 , VDD = 8V, VGG = -2V, Pin = 12 dBm Parameter Bandwidth Output Power Power Added Efficiency 1-dB Compression Point Small Signal Gain Input VSWR Gate Current Drain Current Output Third Order Intercept Noise Figure 3 Order Intermodulation Distortion Single Carrier Level = 23 dBm 5th Order Intermodulation Distortion Single Carrier Level = 23 dBm 2nd Harmonic 3 Harmonic 1 1. TB = MMIC Base Temperature M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. rd rd Symbol f POUT PAE P1dB G VSWR IGG IDD OTOI NF IM3 IM5 2f 3f Typical 1.5-3.3 28 25 27 20 1.7:1 < 10 < 300 36 6 31 41 -15 -25 Units GHz dBm % dBm dB mA mA dBm dB dBc dBc dBc dBc * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Power, 0.6W 1.5-3.3 GHz Maximum Operating Conditions2 Parameter Input Power Drain Supply Voltage Gate Supply Voltage Quiescent Drain Current (No RF) Quiescent DC Power Dissipated (No RF) Junction Temperature Storage Temperature Symbol PIN VDD VGG IDQ PDISS Tj TSTG Absolute Maximum 17.0 +12.0 -3.0 360 2.4 180 -55 to +150 MAAPGM0026-DIE 903185 -- Preliminary Information Units dBm V V mA W C C 2. Operation beyond these limits may result in permanent damage to the part. Recommended Operating Conditions3 Characteristic Drain Voltage Gate Voltage Input Power Junction Temperature Thermal Resistance MMIC Base Temperature Symbol VDD VGG PIN Tj JC TB 33.1 Min 4.0 -2.3 Typ 8.0 -2.0 Max 10.0 -1.5 15.0 150 150 Note 3 Unit V V dBm C C/W C 3. Maximum MMIC Base Temperature = 150C-- JC * VDD * IDQ 4. Operation outside of these ranges may reduce product reliability. Operating Instructions This device is static sensitive. Please handle with care. To operate the device, follow these steps. 1. Apply VGG = -2 V, VDD= 0 V. 2. Ramp VDD to desired voltage, typically 8 V. 3. Adjust VGG to set IDQ, (approximately @ -2 V). 4. Set RF input. 5. Power down sequence in reverse. Turn VGG off last. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Power, 0.6W 1.5-3.3 GHz MAAPGM0026-DIE 903185 -- Preliminary Information 50 45 40 POUT (dBm), PAE(%) POUT (dBm), PAE(%) 50 POUT PAE 45 40 35 30 25 20 15 10 5 0 POUT PAE 35 30 25 20 15 10 5 0 1.25 1.75 2.25 2.75 3.25 3.75 4 5 6 7 Drain Voltage (volts) 8 9 10 Frequency (GHz) Figure 1. Output Power and Power Added Efficiency vs. Frequency at VDD = 8V. Figure 2. Saturated Output Power and Power Added Efficiency vs. Drain Voltage at fo = 2.25 GHz. 40 30 GAIN 6 35 VSWR 25 5 30 P1dB (dBm) 20 15 3 15 10 10 VDD = 4 VDD = 8 5 1.25 1.75 VDD = 6 VDD = 10 2.25 2.75 3.25 3.75 2 5 1.25 1.75 2.25 2.75 3.25 1 3.75 Frequency (GHz) Figure 3. 1dB Compression Point vs. Drain Voltage Frequency (GHz) Figure 4. Small Signal Gain and VSWR vs. Frequency at VDD = 8V. 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. VSWR 25 Gain (dB) 20 4 Amplifier, Power, 0.6W 1.5-3.3 GHz Mechanical Information Chip Size: 2.980 x 1.580 x 0.075 mm (117 x 62 x 3 mils) MAAPGM0026-DIE 903185 -- Preliminary Information 0.177mm. 1.490mm. 2.980mm. 1.580mm. VDD 1.378mm. OUT 0.840mm. 0.840mm. IN VGG 0.202mm. 0 1.490mm. 2.853mm. 0 Figure 5. Die Layout Chip edge to bond pad dimensions are shown to the center of the bond pad. Bond Pad Dimensions Pad RF In and Out DC Drain Supply Voltage VDD DC Gate Supply Voltage VGG Size (m) 100 x 200 200 x 150 150 x 150 Size (mils) 4x8 8x6 6x6 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Amplifier, Power, 0.6W 1.5-3.3 GHz Assembly and Bonding Diagram VDD 0.1 F MAAPGM0026-DIE 903185 -- Preliminary Information 100 pF VDD RFIN OUT IN RFOUT 100 pF VGG VGG 0.1 F Figure 6. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization fixture for CW test- Assembly Instructions: Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 C to less than 5 minutes. Wirebonding: Bond @ 160 C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent damage to amplifier. 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. |
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