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MCX18N00A/MCX18N00B
Micro Unit CCD
Description The micro unit CCD is a CCD color camera unit with built-in CCD image sensor, drive system IC, sample-and-hold IC, signal processor IC and lens system. Features * Ultra-compact size: MCX18N00A 18.3mm x 18.3mm x 8.4mm MCX18N00B 18.3mm x 18.3mm x 9.6mm * Y/C analog output * Employs a Type 1/5, 180,000-pixel color CCD image sensor * Equipped with a fixed focus lens: MCX18N00A F2.8/f = 2.9mm MCX18N00B F2.8/f = 4.0mm Applications * TV conference cameras * Image input cameras Absolute Maximum Ratings * Supply voltage VH DVDD1, DVDD2, AVDD6 AVDD1, AVDD2, AVDD3 AVDD4, AVDD5 VCC VL * Input voltage VI * Operating temperature Topr * Storage temperature Tstg Recommended Operating Conditions * Supply voltage VH DVDD1, DVDD2, AVDD6 AVDD1, AVDD2, AVDD3 AVDD4, AVDD5 VCC VL * Input voltage VDCIN * Operating temperature Topr Block Diagram
Lens CCD Image Sensor S/H Digital Signal Process Y/C
64 pin QFN (Ceramic)
Peripheral ICs * EVR: MB88347 (Fujitsu Limited.) * EEPROM: AK6420 (Asahi Kasei Microsystems Co., Ltd.)
+18 +7.0 +7.0 +7.0 +14.0 -17.5 -0.5 to DVDD + 0.5 0 to +40 -30 to +80
V V V V V V V C C
14.25 to 15.75 3.0 to 3.6 4.75 to 5.25 4.5 to 5.5 4.5 to 5.25 -8.5 to -7.5 1.0 to 4.5 0 to +40
V V V V V V V C
Timing Generator
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E97432B9X
MCX18N00A/MCX18N00B
Pin Configuration
CCDOUT
PCOMP
VREFC
DGND
DGND
4FSCO
IREFC
DGND
4FSCI
AVDD6
AGND
XCLR
VBC
HD
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
VD
SCK
40 SI 39 SO 38 CASI 37 CSROM 36 RESETTG 35 DGND 34 OSCI 33 OSCO 32 CK 31 DVDD1 30 XCS 29 CASCK 28 CASO 27 CSEVR 26 DGND 25 VL
VGC 57 AVDD5 58 IOC 59 IOY 60 VGY 61 IREFY 62 VREFY 63 VBY 64 DGND DGND 1 2
DGND 3 SHOUT SHIN AGND AGND SIFSEL 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
AVDD4
AVDD1
AGCCONT
-2-
SUBOUT
OFFSET
AGND
DCOUT
VH
SUBIN
AGND
DVDD2
AVDD2
AVDD3
TEST
DCIN
VCC
MCX18N00A/MCX18N00B
Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Symbol DGND DGND DGND SHOUT SHIN AGND AGND SIFSEL DVDD2 AGND VH AGND AVDD4 VCC TEST SUBIN AGCCONT OFFSET AVDD1 AVDD2 AVDD3 DCIN DCOUT SUBOUT VL DGND CSEVR CASO CASCK XCS DVDD1 CK OSCO OSCI DGND I/O -- -- -- O I -- I I -- -- -- -- -- -- I I I I -- -- -- I O O -- -- O O O I -- I O I -- Digital GND Digital GND Digital GND Sample-and-hold output. Connect directly to Pin 5. Sample-and-hold input. Analog GND Analog GND Serial communication mode selection: Microcomputer (low)/RS232C (high). +3.3V power supply for signal processing system. Analog GND +15V power supply for CCD image sensor drive. Analog GND +5V power supply for A/D converter. +5V power supply for sample-and-hold. Test pin. Connect to VCC. CCD image sensor SUB voltage input. AGC control. OFFSET control. +5V power supply for sample-and-hold pulse. +5V power supply for RG pulse. +5V power supply for H pulse. DC amplifier input. DC amplifier output. SUB pulse output. -8V power supply for CCD image sensor drive. Digital GND EVR chip select. Serial communication data output for peripheral ICs (EVR, EEPROM). Serial communication clock output for peripheral ICs (EVR, EEPROM). Switched by the SIFSEL setting. Chip select during microcomputer mode. Baud rate setting (4800bps (low)/9600bps (high)) during RS232C mode. +3.3V power supply for timing generator. 27MHz clock input. 27MHz oscillator output. 27MHz oscillator input. Digital GND -3- Description
MCX18N00A/MCX18N00B
Pin No. 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
Symbol RESETTG CSROM CASI SO SI SCK XCLR AVDD6 4FSCI 4FSCO AGND PCOMP VD HD DGND DGND DGND CCDOUT VBC VREFC IREFC VGC AVDD5 IOC IOY VGY IREFY VREFY VBY
I/O I O I O I I I -- I O -- O O O -- -- -- O
Description Reset pin (active low) with pull-up resistor for timing generator. EEPROM chip select. Serial communication data input for peripheral ICs (EVR, EEPROM). Serial communication data output. Serial communication data input. Serial communication clock input. Initialization pin (active low). EEPROM re-read. +3.3V power supply for 4fsc oscillator. 4fsc oscillator input. 4fsc oscillator output. Analog GND Phase comparison output for PLL lock. Vertical sync output. Horizontal sync output. Digital GND Digital GND Digital GND CCD image sensor buffer output.
I
D/A converter peripheral circuit connection pins for chroma signal.
-- O O
+5V power supply for D/A converter. Chroma signal output. Luminance signal output.
I
D/A converter peripheral circuit connection pins for luminance signal.
-4-
MCX18N00A/MCX18N00B
Electrical Characteristics DC Characteristics Item Pins Symbol DVDD1 DVDD2 AVDD1 AVDD2 AVDD3 Supply voltage AVDD4 AVDD5 AVDD6 VCC VH VL IDD1 IDD2 IADD1 IADD2 IADD3 Operating current IADD4 IADD5 IADD6 ICC IH IL Input voltage 1 Input voltage 2 Input voltage 3 5, 7 1, 6 DCIN VT+ VT- VIH1 VIL1 VDCIN DVDD1 = 3.3V DVDD2 = 3.3V AVDD1 = 5.0V AVDD2 = 5.0V AVDD3 = 5.0V AVDD4 = 5.0V AVDD5 = 5.0V AVDD6 = 3.3V VCC = 5.0V VH = 15.0V VL = -8.0V DVDD2 x 0.8 DVDD1 x 0.7 1.0 Display Display value - 0.1 value AVDD4 x 0.7 A/D input amplitude = 2Vp-p D/A output amplitude = 2Vp-p Conditions Min. 3.0 3.0 4.75 4.75 4.75 4.5 4.5 3.0 4.5 14.25 -8.5 Typ. 3.3 3.3 5.00 5.00 5.00 5.0 5.0 3.3 5.0 15.00 -8.0 7.2 36 3.1 1.0 4.9 15 24 1.0 54 6.9 1.4 DVDD2 x 0.2 DVDD1 x 0.3 4.5 Display value + 0.1 AVDD4 x 0.3 Max. 3.6 3.6 5.25 5.25 5.25 5.5 5.5 3.6 5.25 15.75 -7.5 Unit V V V V V V V V V V V mA mA mA mA mA mA mA mA mA mA mA V V V V V
Input voltage 4 SUBIN VSUB Input voltage 5 4FSCI VIH2 VIL2
-5-
MCX18N00A/MCX18N00B
Item Output voltage 1 Output voltage 2 Output voltage 3 Output voltage 4 Output voltage 5 Hysteresis 1 Hysteresis 2 Threshold value 1 Threshold value 2 Threshold value 3 Feedback resistance 1 Feedback resistance 2 Input amplitude Pull-up resistance DC amplifier gain Input leak current 1 Input leak current 2 1 2 3 4 5 6 7
Pins 2 3 4 SUBOUT 4FSCO 7 5 TEST 6 4FSCI OSC 4FSC OSC 1
Symbol VOH1 VOL1 VOH2 VOL2 VOH3 VOL3 VOH4 VOL4 VOH5 VOL5
Conditions IOH1 = -1.2mA IOL1 = 2.4mA IOH2 = -2.4mA IOL2 = 4.8mA IOH3 = -8mA IOL3 = 8mA IOH4 = -4mA IOL4 = 5.4mA IOH5 = -3mA IOL5 = 3mA
Min. DVDD2 - 0.8
Typ.
Max. 0.4
Unit V V V V V V V V V V Vp-p
DVDD2 - 0.8 0.4 DVDD1/2 DVDD1/2 VH - 0.25 VL + 0.25 AVDD4/2 AVDD4/2 0.5 0.6
VTH1 VTH2 VTH3 RFE1 RFE2 OSCI = DVDD1 or GND 4FSCI = AVDD4 or GND 50MHz sine wave RPU G 500k 250k 0.5 50k
1.35 DVDD1/2 AVDD4/2 2M 1M 5M 2.5M
100k 4.4
150k
SIFSEL II3 5 II2
VIN = DVDD2 VIN = GND or DVDD2
12 -10
30
75 10
A A
RESETTG CSEVR, CSROM, SO, PCOMP, VD, HD CASO, CASCK OSCO XCS, SI, SCK, XCLR, CASI OSCI, CK SIFSEL
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MCX18N00A/MCX18N00B
Note) VSUB display value The VSUB display value is displayed by a code on the rear surface of the MUC. Symbol -- = 5.25 f 8.75 X 0 5.50 G 9.00 Y 1 5.75 h 9.25 Z 2 6.00 J 9.50 3 6.25 K 4 6.50 L 6 6.75 m 7 7.00 N 8 7.25 P 9 7.50 R A 7.75 S C 8.00 U D 8.25 V
Actual voltage (V) 5.00 Symbol E
Actual voltage (V) 8.50 Symbol W
9.75 10.00 10.25 10.50 10.75 11.00 11.25 11.50 11.75
Actual voltage (V) 12.00 12.25 12.50 12.75 AC Characteristics Classification XCLR RESETTG Minimum low interval Minimum low interval SCK input pulse width (high interval) SCK input pulse width (low interval) XCS input setup time, activated by the falling edge of SCK XCS input hold time, activated by the rising edge of SCK SI input setup time, activated by the rising edge of Serial SCK communication SI input hold time, activated by the rising edge of SCK SO output transition time (Hi-Z Data active), activated by the falling edge of XCS SO transition time (Data active Hi-Z), activated by the rising edge of XCS SO output delay time, activated by the falling edge of SCK
TSUXCS XCS TWLSCK SCK TPDSO TZDSO SO DATA TSUSI THSI SI DATA DATA DATA DATA DATA TDZSO TWHSCK
Item
Symbol TWCLR TWRST TWHSCK TWLSCK TSUXCS THXCS TSUSI THSI TZDSO TDZSO TPDSO
Min. 500 35 430 430 430 640 140 140 70 70 70
Typ. -- -- -- -- -- -- -- -- -- -- --
Max. Unit -- -- -- -- -- -- -- -- 200 200 240 ns ns ns ns ns ns ns ns ns ns ns
THXCS
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MCX18N00A/MCX18N00B
Image Sensor Characteristics Item Sensitivity Saturation signal Smear Dark signal Dark signal shading Measurement System
[A] CCD OUT [Y] Micro unit CCD C.D.S AMP LPF1 (3dB down 4MHz) Y signal output
(Ta = 25C) Min. 285 700 0.007 0.012 2 1 Typ. 360 Max. Unit mV mV % mV mV Measurement method 1 2 3 4 5 Ta = 60C Ta = 60C Remarks Center of screen Ta = 60C, center of screen
Symbol S Ysat Sm Ydt Ydt
Note) Adjust the amplifier gain so that the gain between [A] and [Y] equals 1.
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MCX18N00A/MCX18N00B
Image Sensor Characteristics Measurement Method Measurement conditions (1) In the following measurements, each supply voltage is at the typical values. (2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output of the measurement system. Definition of Standard Imaging Conditions 1) Standard imaging condition I: Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern for evaluation is not applicable.) Use a ND2 filter and image at F5.6 or equivalent. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source with a uniformity of brightness within 2% at all angles (color temperature of 3200K). 1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/250s, measure the Y signal (Ys) at the center of the screen and substitute the values into the following formula. S = Ys x 250 [mV] 60
2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity applying with an average value of Y signal output, 200mV, measure the minimum value of the Y signal. 3. Smear Set to standard imaging condition II. With using ND2 filter and the lens diaphragm at F5.6 or equivalent, adjust the luminous intensity to 500 times the intensity applying with an average value of Y signal output, 200mV. When the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value YSm [mV] of the Y signal output, and substitute the values into the following formula. Sm = 1 YSm 1 x x x 100 [%] (1/10V method conversion value) 10 200 500
4. Dark signal Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature of 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 5. Dark signal shading After measuring 4, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the Y signal output, and substitute the values into the following formula. Ydt = Ydmax - Ydmin [mV] -9-
MCX18N00A/MCX18N00B
Optical Characteristics MCX18N00A Item Focus length Aperture Shading Resolution Symbol f F SH SV R 220 Min. Typ. 2.9 2.8 50 25 % % TV lines Horizontal Vertical Center of screen Max. Unit Remarks
MCX18N00B Item Focus length Aperture Shading Resolution Symbol f F SH SV R 220 Min. Typ. 4.0 2.8 30 15 % % TV lines Horizontal Vertical Center of screen Max. Unit Remarks
Measurement System
IOY LPF Micro unit CCD IOC BPF AMP VIDEO OUT
- 10 -
MCX18N00A/MCX18N00B
Communication Code Table CateByte Bit gory 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 3 3 3 3 3 3 1 2 3 3 4 4 5 6 7 8 9 0 to 7 0 to 7 0 to 3 4 to 7 0 to 3 4 to 7 YDLY 0 to 7 0 to 7 0 to 7 0 to 7 RMATY 0 to 7 RMATC Matrix coefficient Matrix coefficient Matrix coefficient Matrix coefficient Luminance signal delay adjustment Setup level Symbol Description Recommended Initial EEPROM value (H) value (H) Address (H) 00 01 0 6 E 8 24 34 0B 2A 12 3E CA 0C 00 FF Luminance signal gain 86 AA 26 84 04 FC Linear matrix quadrant control Linear matrix gain Linear matrix hue -- -- -- -- Linear matrix coefficient Linear matrix coefficient Linear matrix coefficient Linear matrix coefficient Adjustment value Adjustment value Adjustment value Adjustment value 00 00 00 Sample-and-hold output offset 3D 89 00 - 11 - 00 01 D 6 E 4 24 34 0B 32 F8 32 D3 0C 00 00 86 AA 26 84 04 FC F 1 1 0 20 11 D0 F8 00 00 00 3D 89 00 4F, 51, 53, 55 50, 52, 54, 56 57, 59, 5B, 5D 58, 5A, 5C, 5E 15 16 17 18 19 1A 01 02 03 03 04 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 11 12 13 14
10 0 to 7 BMATY 11 0 to 7 BMATC 12 0 to 7 13 0 to 7 14 0 to 7 1 2 3 4 5 6 7 7 7 7 8 9 0 to 7 YGAIN 0 to 7 0 to 7 0 to 7 0 to 7 0 to 7 0 to 3 RBQUAD 4 5 6 to 7 0 to 7 RYGAIN 0 to 7 BYGAIN CONGAIN CONHUE
10 0 to 7 RYHUE 11 0 to 7 BYHUE 1 2 3 4 5 6 0 to 7 0 to 7 0 to 7 0 to 7 SHOFST 0 to 7 0 to 7
MCX18N00A/MCX18N00B
CateByte Bit gory 3 4 4 4 4 5 5 5 5 5 5 5 5 5 5 6 6 6 6 6 7 7 7 7 7 8 8 8 8 8 8 8 8 8 8 7 1 2 3 4 1 2 3 3 3 3 4 5 6 7 1 2 3 4 5 1 2 3 4 5 1 1 1 1 2 2 2 2 2 3 0 to 7
Symbol
Description
Recommended Initial EEPROM value (H) value (H) Address (H) 00 00 70 66 80 80 1E FF 0 0 0 10 00 00 00 00 3A 26 48 D0 04 00 14 05 55 74 0 0 0 0 0 0 0 0 0 00 25 26 27 28 29 22 23 24 1B 1C 1D 1E 1F 20 21
0 to 7 VREFY 0 to 7 VREFC 0 to 7 VSUB 0 to 7
VREFY adjustment VREFC adjustment VSUB adjustment
Adjustment value Adjustment value Adjustment value 80 1E FF
0 to 7 AGCCONT Gain control 0 to 7 0 1 2 3 to 7 0 to 7 SHTSPDL 0 to 7 0 to 7 0 to 7 0 to 7 WBR 0 to 7 WBG 0 to 7 WBB 0 to 7 0 to 7 0 to 7 0 to 7 0 to 7 0 to 7 0 to 7 0 to 2 3 AWB AWB control White balance control White balance control White balance control Shutter speed (bit 0 to bit 7) SHTSPDM SHTHL SHTON Shutter speed (bit 8) Electronic shutter high speed/ low speed switching Electronic shutter OFF/ON
-- -- -- -- -- -- -- -- 3A 26 48 -- -- 00 14 05 55 74 -- -- -- -- -- -- --
4 to 6 AEADJUST AE adjustment mode switching 7 0 1 2 3 4 to 7 0 to 7 SW External switch control AE MCR SPRS AE control Microcontroller control Suppress control
-- -- --
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MCX18N00A/MCX18N00B
CateByte Bit gory 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 9 9 9 9 9 10 10 10 10 10 10 10 10 10 10 10 4 4 4 4 4 4 5 5 5 5 5 5 5 5 6 7 8 9 0 1 2 to 4 5 6 7 0 1 2 3 4 5 6 7
Symbol FLON BLCOF
Description Flickerless ON/OFF Backlight compensation ON/OFF
Recommended Initial EEPROM value (H) value (H) Address (H) -- -- -- 0 0 0 0 0 0 0 0 0 0 0 0 0 0 00 00 00 00 00 00 07 00 02 00 80 00 00 0 0 0 0 0 0 0 0 0 2A 2B 2C 2D 2E
AWB1 AWB2 AWB3 E2WR E2WEN
AWB mode selection AWB mode selection AWB mode selection EEPROM write control EEPROM write enable transmit
-- -- -- -- -- --
E2RSW E2RAL1 E2RAL2 E2RAL3 E2RAL4
EEPROM read control EEPROM read range specification EEPROM read range specification EEPROM read range specification EEPROM read range specification EEPROM control code EEPROM address EEPROM data SPEC code SPEC data
-- -- -- -- -- -- -- -- -- -- -- 07 00 02 00 80 --
0 to 7 E2CODE 0 to 7 E2ADRS 0 to 7 E2DATA 0 to 7 SPCODE
10 0 to 7 SPCDAT 11 0 to 7 1 2 3 4 5 1 2 2 3 3 3 3 4 4 4 4 0 to 7 0 to 7 0 to 7 0 to 7 0 to 7 0 to 7 0 to 6 ADJSTH 7 ADJSTVL
Horizontal position specification Vertical position specification Vertical position specification
-- -- -- -- -- --
0 to 1 ADJSTVM 2 3 4 to 7 0 1 2 3 PGON3 PGON1 PGON2
Pattern generator ON/OFF Pattern generator ON/OFF
-- -- --
Pattern generator ON/OFF
--
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MCX18N00A/MCX18N00B
CateByte Bit gory 10 10 10 10 10 10 10 10 10 10 10 10 4 4 5 5 5 5 5 5 6 7 8 9 4
Symbol PGCOLSEL
Description Color bar monochrome switching Color specification Horizontal/vertical switching Raster setting Pattern switching Pattern generator ON/OFF
Recommended Initial EEPROM value (H) value (H) Address (H) -- -- -- -- -- -- -- 0 0 0 0 0 0 0 0 00 00 00 00
5 to 7 PGCOL 0 1 PGHV PGRSTR
2 to 3 PGPTSL 4 5 6 to 7 PGGAIN 0 to 7 0 to 7 0 to 7 0 to 7 PGON4
Output level
-- -- -- -- --
- 14 -
MCX18N00A/MCX18N00B
SPEC Code Table Code (H) 1 2 3 4 5 6 7 8 9 0A 0B 0C 11 12 13 14 15 16 17 18 21 22 23 24 25 31 32 33 34 35 36 [AWB] SPD [AWB] FRM [AWB] RSFT [AWB] BSFT [AWB] USRR [AWB] USRB [AWB] PRER [AWB] PREB AWB response speed AWB detection window setting [AE] BLC [AE] HIST Backlight compensation control Histogram backlight compensation control [AE] MAX [AE] MIN [AE] LIM AE maximum gain AE minimum gain AE shutter speed upper limit Symbol [AE] SPD Description AE response speed Recommended value (H) 08 04 BB Adjustment value 07 EE 0C 00 01 01 03 03 02 12 03 02 4C 58 Adjustment value Adjustment value 08 05 05 04 07 52 80 8A 3D 80 00 Initial Address value (H) (H) 08 04 BB 11 07 EE 0C 00 01 01 03 03 02 00 03 02 4C 58 3A 90 08 05 05 04 07 52 80 8A 3D 80 00 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D
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MCX18N00A/MCX18N00B
Notes on Handling 1) Static charge prevention Micro unit CCDs are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling micro unit CCDs. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Please use IC socket for mounting of micro unit CCDs. IC socket : HS6401-K YAMATO SCIENTIFIC CO.,LTD. 3) Dust and dirt protection a) Operate in clean environments. b) Do not either touch lens by hand or have any object come in contact with lens surfaces. Should dirt stick to a lens surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the lens. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 4) Do not expose to strong light (sun rays) for long periods. 5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) Micro unit CCDs are precise optical equipment that should not be subject to mechanical shocks.
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Application Circuit
RS-232C
SO SI
IC103 AK6420AM
C131 0.1
1 CS IC104 S-80730AN LPF (3.0MHz)
VCC 8 +5V R115 1k
2 SK
BUSY 7
3 DI
RESET 6
OUT VDD VSS
R104 100k
R106 3.3k 0.5% TP102 CCDOUT R105 220 C128 0.1 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 C123 0.1 C122 0.1 Q101 2SA1586YG R114 1k X102 14.31818MHz
L108 10H
123
123 R116 3.3k
IN GND OUT
4 DO R113 3.3k
GND 5
R112 10k C126 0.1
C125 C124 18p 18p
Q102 2SD2216J-Q Y
IC102 MB88347PFV
1 VSS
GND 16
VBC
HD
VD
DGND
AGND
4FSCI
IREFC
DGND
DGND
PCOMP
4 AO4 R108 220 0.5% R109 220 0.5% C129 0.1 R110 10 61 VGY 62 IREFY C121 10p R103 270 X101 27MHz R111 3.3k 0.5% C130 0.1 63 VREFY OSCI 34 IC101 MCX18N00A/B CK 32 DVDD1 31 XCS 30 CASCK 29 CASO 28 CSEVR 27 DGND 26 VL 25 C1191000p C120 10p OSCO 33 64 VBY 1 DGND 2 DGND 3 DGND 4 SHOUT TP101 S/H OUT 5 SHIN 6 AGND 7 AGND SIFSEL 8 DGND 35 RESETTG 36 60 IOY CSROM 37 59 IOC CASI 38 58 AVDD5 SO 39
CLK 13
CCDOUT
57 VGC SI 40
VREFC
4FSCO
AVDD6
3 AO3
DI 14
XCLR SCK
2 AO2 C127 R107 0.1 10
AO1 15
FL101 BPF (3.58MHz) R117 3.3k
5 AO5
LD 12
R120 33k
Q104 2SD2216J-Q 123 R118 1k Q103 2SA1586YG L110 10H C133 27p R119 1k R121 47k R122 2.2k
IN GND OUT
6 AO6
DO 11
7 AO7
AO8 10
C
8 VDD
VCC 9
C132 0.1
AGND
VCC
AVDD4
AGCCONT
DVDD2
AGND
SUBIN
VH
TEST
AVDD1
AVDD2
AVDD3
DCIN
DCOUT
L101 10H C103 2.2/20V
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 C117 10/16V C110 0.1 C109 2.2/20V C108 0.1 C107 0.1 C106 0.1
OFFSET
SUBOUT
L107 100H
L102 100H
L103 10H
L104 10H
C102 0.1
L105 10H
- 17 -
C101 10/6.3V C105 0.1 C104 1/10V
+3.3V
D101 MA159A-TX (1/2) L106 10H C112 6.8 16V C113 1 35V C111 22/20V C114 0.1 25V R101 100k R102 1M
C118 0.1
C116 0.1
L109 10H
D101 MA159A-TX (2/2)
C115 1000p 50V
MCX18N00A/MCX18N00B
GND +15V +5V -8V
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
Package Outline
Unit: mm
64pin QFN (720mil)
18.28 0.3 7.6 40 24 25
41 2-1.50max 5.50max
18.28 0.3 16.2 7.6
56 64 1 8 1st. pin Index. 35
9 64-R(0.25)
57
PACKAGE STRUCTURE ceramic Au
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL 4.20g
MCX18N00A/MCX18N00B
PACKAGE WEIGHT
3.5 0.4
0.30min
7.30 0.5
8.37 0.5
2-1.50max
2
3.20max.
O
1.
04
3.20max.
5.50max
64 - 0.80
MCX18N00A 16.08 0.2 P1.016 X 15 = 15.24 64 - 0.50
- 18 -
Package Outline
Unit: mm
64pin QFN (720mil)
18.28 0.3 7.6 40 24 25
41 2-1.50max 5.50max
18.28 0.3 16.2 7.6
56 57 2 35 64 1 8 1st. pin Index.
9 64-R(0.25)
3.20max.
O
1.
04
3.20max.
5.50max
PACKAGE STRUCTURE ceramic Au
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL 4.20g
MCX18N00A/MCX18N00B
PACKAGE WEIGHT
3.5 0.4
0.30min
8.50 0.5
9.57 0.5
2-1.50max
64 - 0.80
MCX18N00B
16.08 0.2 P1.016 X 15 = 15.24 64 - 0.50
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