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Freescale Semiconductor Technical Data
Document Number: MPXV7002 Rev 0, 09/2005
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXV7002 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * * * * * * * * * * * 2.5% Typical Error over +10C to +60C with Auto Zero 6.25% Maximum Error over +10C to +60C without Auto Zero Ideally Suited for Microprocessor or Microcontroller-Based Systems Thermoplastic (PPS) Surface Mount Package Temperature Compensated over +10 to +60C Patented Silicon Shear Stress Strain Gauge Available in Differential and Gauge Configurations Hospital Beds HVAC Respiratory Systems Process Control ORDERING INFORMATION
Device Type Options Case No. 482A 482A 1369 1351 1351 MPX Series Order No. MPXV7002GC6U Packing Options Rails Device Marking MPXV7002G
MPXV7002 SERIES
INTEGRATED PRESSURE SENSOR -2 to 2 kPa (-0.3 to 0.3 psi) 0.5 to 4.5 V OUTPUT SMALL OUTLINE PACKAGE
MPXV7002GC6U CASE 482A-01
Typical Applications
MPXV7002GP CASE 1369-01 MPXV7002DP CASE 1351-01
SMALL OUTLINE PACKAGE PIN NUMBERS(1)
1 2 3 4 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C
SMALL OUTLINE PACKAGE (MPXV7002 SERIES) Ported Gauge, Axial Port, SMT Elements Gauge, Axial Port, SMT Gauge, Side Port, SMT Differential, Dual Port, SMT Differential, Dual Port, SMT MPXV7002GC6T1 Tape & MPXV7002G Reel MPXV7002GP MPXV7002DP MPXV7002DPT1 Trays MPXV7002G Trays MPXV7002G Tape & MPXV7002G Reel VS
1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout
GND
Pins 1 and 5 through 8 are NO CONNECTS for surface mount package
(c) Freescale Semiconductor, Inc., 2005. All rights reserved.
Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 8.0 -30 to +100 10 to +60 Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.)
Characteristic Pressure Range(1) Supply Voltage Supply Current Pressure Offset(3) @ VS = 5.0 Volts Full Scale Output(4) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy(6) Sensitivity Response Time(8) (10 to 60C) (10 to 60C) (10 to 60C) (10 to 60C)
(2)
Symbol POP VS Io Voff VFSO VFSS -- V/P tR IO+ --
Min -2.0 4.75 -- 2.25 4.25 3.5 -- -- -- -- --
Typ -- 5.0 -- 2.5 4.5 4.0 2.5(7) 1.0 1.0 0.1 20
Max 2.0 5.25 10 2.75 4.75 4.5 V 6.25 ---------
Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS V/kPa ms mAdc ms
Output Source Current at Full Scale Output Warm-Up Time(9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 10 to 60C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of 5C between autozero and measurement. 8. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 9. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
MPXV7002 2 Sensors Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPXV7002 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10 to 60C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
Fluoro Silicone Gel Die Coat P1 Wire Bond Lead Frame
Die
Stainless Steel Cap
+5 V
Thermoplastic Case
Vout Vs IPS 1.0 F 0.01 F GND
OUTPUT
470 pF
P2 Differential Sensing Element
Die Bond
Figure 2. Cross-Sectional Diagram SOP (not to scale)
Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)
5.0
4.0 Output Voltage (V) 3.0
Transfer Function: Vout = VS x (0.2 x P(kPa)+0.5) 6.25% VFSS VS = 5.0 Vdc TA = 10 to 60C TYPICAL
2.0 1.0 0
MAX MIN
-2
-1
0 Differential Pressure (kPa)
1
2
Figure 4. Output versus Pressure Differential
MPXV7002 Sensors Freescale Semiconductor 3
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media.
Part Number MPXV7002GC6U/GC6T1 MPXV7002GP MPXV7002DP
The Pressure (P1) side may be identified by using the table below:
Case Type 482A-01 1369-01 1351-01
Pressure (P1) Side Identifier Vertical Port Attached Side with Port Attached Side with Dual Port Attached
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.660 16.76
0.100 TYP 8X 2.54
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 5. Small Outline Package Footprint
MPXV7002 4 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
-A4 5
D
8 PL
0.25 (0.010)
M
TB
S
A
S
N
-BG
8 1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-TSEATING PLANE
DIM A B C D G H J K M N S V W
CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV7002 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV7002 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPXV7002 Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPXV7002 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPXV7002 Sensors Freescale Semiconductor 9
How to Reach Us:
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MPXV7002 Rev. 0 09/2005

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