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OKI Semiconductor MR27V402E 262,144-Word x 16-Bit or 524,288-Word x 8-Bit One Time PROM FEDR27V402E-01-03 Issue Date: Jan. 15, 2004 GENERAL DESCRIPTION The MR27V402E is a 4 Mbit One Time Programmable Read-Only Memory that can be electrically switched between 262,144-word x 16-bit and 524,288-word x 8-bit by the state of the BYTE pin. The MR27V402E supports high speed asynchronous read operation using a single 3.3V power supply. FEATURES * 262,144-word x 16-bit/524,288-word x 8-bit electrically switchable configuration * +3.3 V power supply * Access time 80 nS MAX * Operating current 30 mA MAX * Standby current 50 A MAX * Input/Output TTL compatible * Three-state output * Packages: 40-pin plastic DIP (DIP40-P-600-2.54) (MR27V402ERP) 40-pin plastic SOP (SOP40-P-525-1.27-K) (MR27V402EMP) 44-pin plastic TSOP (TSOP(2)44-P-400-0.80-K) (MR27V402ETP) 42-pin plastic SOJ (SOJ42-P-400-1.27) (MR27V402EJA) 1/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP PIN CONFIGURATION (TOP VIEW) NC 1 NC 1 A17 1 A7 2 A6 3 A5 4 A4 5 A3 6 A2 7 A1 8 A0 9 CE 10 VSS 11 OE 12 D0 13 D8 14 D1 15 D9 16 D2 17 D10 18 D3 19 D11 20 40 A8 39 A9 38 A10 37 A11 36 A12 35 A13 34 A14 33 A15 32 A16 31 BYTE/VPP 30 VSS 29 D15/A-1 28 D7 27 D14 26 D6 25 D13 24 D5 23 D12 22 D4 21 VCC 42 NC 41 A8 40 A9 39 A10 38 A11 37 A12 36 A13 35 A14 34 A15 33 A16 32 BYTE/VPP 31 VSS 30 D15/A-1 29 D7 28 D14 27 D6 26 D13 25 D5 24 D12 23 D4 22 VCC 44 NC 43 NC 42 A8 41 A9 40 A10 39 A11 38 A12 37 A13 36 A14 35 A15 34 A16 33 BYTE/VPP 32 VSS 31 D15/A-1 30 D7 29 D14 28 D6 27 D13 26 D5 25 D12 24 D4 23 VCC NC 2 A17 3 A7 4 A6 5 A5 6 A4 7 A3 8 A2 9 A1 10 A0 11 CE 12 VSS 13 OE 14 D0 15 D8 16 D1 17 D9 18 D2 19 D10 20 D3 21 D11 22 A17 2 A7 3 A6 4 A5 5 A4 6 A3 7 A2 8 A1 9 A0 10 CE 11 VSS 12 OE 13 D0 14 D8 15 D1 16 D9 17 D2 18 D10 19 D3 20 D11 21 40-pin DIP or SOP 42-pin SOJ 44-pin TSOP(II) Pin name D15/A-1 A0 to A17 D0 to D14 CE OE BYTE/VPP VCC VSS NC Data output / Address input Address input Data output Chip enable Output enable Functions Mode switch / Program power supply voltage Power supply voltage GND Non connection 2/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP BLOCK DIAGRAM A-1 x 8/x 16 Switch CE CE OE OE BYTE/VPP PGM Column Decoder A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 Row Decoder Memory Cell Matrix 262,144 x 16-Bit or 524,288 x 8-Bit Address Buffer Multiplexer Output Buffer D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D12 D14 D15 D11 D13 In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin. FUNCTION TABLE Mode Read (16-Bit) Read (8-Bit) Output disable Standby Program Program inhibit Program verify CE L L L H L H H OE L L H H H L 9.75 V 4.0 V BYTE H L H L H L 3.3 V DOUT VCC D0 to D7 D8 to D14 DOUT Hi-Z Hi-Z Hi-Z DIN Hi-Z DOUT L/H D15/A-1 : Don't Care (H or L) 3/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP ABSOLUTE MAXIMUM RATINGS Parameter Operating temperature under bias Storage temperature Input voltage Output voltage Power supply voltage Program power supply voltage Power dissipation per package Symbol Ta Tstg VI VO VCC VPP PD -- relative to VSS Condition -- Value 0 to 70 -55 to 125 -0.5 to VCC+0.5 -0.5 to VCC+0.5 -0.5 to 5 -0.5 to 11.5 1.0 Unit C C V V V V W RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70C) Parameter VCC power supply voltage VPP power supply voltage Input "H" level Input "L" level Symbol VCC VPP VIH VIL VCC = 3.0 to 3.6 V Condition Min. 3.0 -0.5 2.2 -0.5 Typ. -- -- -- -- Max. 3.6 VCC+0.5 VCC+0.5 0.6 Unit V V V V Voltage is relative to VSS. : Vcc+1.5 V(Max.) when pulse width of overshoot is less than 10 ns. : -1.5 V(Min.) when pulse width of undershoot is less than 10 ns. 4/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP ELECTRICAL CHARACTERISTICS DC Characteristics (VCC = 3.3 V 0.3 V, Ta = 0 to 70C) parameter Input leakage current Output leakage current VCC power supply current (Standby) VCC power supply current (Read) VPP power supply current Input "H" level Input "L" level Output "H" level Output "L" level Symbol ILI ILO ICCSC ICCST ICCA IPP VIH VIL VOH VOL Condition VI = 0 to VCC VO = 0 to VCC CE = VCC CE = VIH CE = VIL, OE = VIH tc = 80 ns VPP = VCC -- -- IOH = -400 A IOL = 2.1 mA Min. -- -- -- -- -- -- 2.2 -0.5 2.4 -- Typ. -- -- -- -- -- -- -- -- -- -- Max. 10 10 50 1 30 10 VCC+0.5 0.6 -- 0.4 Unit A A A m mA A V V V V Voltage is relative to VSS. : Vcc+1.5 V(Max.) when pulse width of overshoot is less than 10 ns. : -1.5 V(Min.) when pulse width of undershoot is less than 10 ns. AC Characteristics (VCC = 3.3 V 0.3 V, Ta = 0 to 70C) Parameter Address cycle time Address access time CE access time OE access time Output disable time Output hold time Symbol tC tACC tCE tOE tCHZ tOHZ tOH Condition -- CE = OE = VIL OE = VIL CE = VIL OE = VIL CE = VIL CE = OE = VIL Min. 80 -- -- -- 0 0 0 Max. -- 80 80 40 30 25 -- Unit ns ns ns ns ns ns ns Measurement conditions Input signal level-------------------------------- 0 V/3 V Input timing reference level ------------------ 0.8 V/2.0 V Output load -------------------------------------- 50 pF Output timing reference level---------------- 0.8 V/2.0 V 2.08 V 800 Output 50 pF (Including scope and jig) 5/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP Timing Chart (Read Cycle) 16-Bit Read Mode (BYTE = VIH) tC Address tC tOH tCE CE tACC tCHZ tOE OE tOH tACC D0 to D15 Hi-Z Valid Data tOHZ Valid Data Hi-Z 8-Bit Read Mode (BYTE = VIL) tC Address tC tOH tCE CE tACC tCHZ tOE OE tOH tACC D0 to D7 Hi-Z Valid Data tOHZ Valid Data Hi-Z 6/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION) DC Characteristics (Ta = 25C 5C) Parameter Input leakage current VPP power supply current (Program) VCC power supply current Input "H" level Input "L" level Output "H" level Output "L" level Program voltage VCC power supply voltage Symbol ILI IPP2 ICC VIH VIL VOH VOL VPP VCC Condition VI = VCC+0.5 V CE = VIL -- -- -- IOH = -400 A IOL = 2.1 mA -- -- Min. -- -- -- 3.0 -0.5 2.4 -- 9.5 3.9 Typ. -- -- -- -- -- -- -- 9.75 4.0 Max. 10 50 50 VCC+0.5 0.8 -- 0.45 10.0 4.1 Unit A mA mA V V V V V V Voltage is relative to VSS. AC Characteristics (VCC = 4.0 V 0.1 V, BYTE/VPP = 9.75 V 0.25 V, Ta = 25C 5C) Parameter Address set-up time OE set-up time Data set-up time Address hold time Data hold time Output float delay time from OE VPP voltage set-up time Program pulse width Data valid from OE Address hold from OE high Symbol tAS tOES tDS tAH tDH tOHZ tVS tPW tOE tAOH Condition -- -- -- -- -- -- -- -- -- -- Min. 100 2 100 2 100 0 2 9 -- 0 Typ. -- -- -- -- -- -- -- 10 -- -- Max. -- -- -- -- -- 100 -- 11 100 -- Unit ns s ns s ns ns s s ns ns Pin Check Function Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer. Setting up address as following condition call the preprogrammed codes on device outputs. (VCC = 3.3 V 0.3 V, CE = VIL, OE = VIL, BYTE/VPP = VIH, Ta = 25C 5C) A0 0 1 A1 1 0 A2 0 1 A3 1 0 A4 0 1 A5 1 0 A6 0 1 A7 1 0 A8 0 1 A9 VH A10 A11 A12 A13 A14 A15 A16 A17 DATA FF00 00FF FFFF 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 VH Other conditions : VH = 8 V 0.25 V 7/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP Consecutive Programming Waveforms A0 to A17 tAS CE tPW OE tDS D0 to D15 tVS BYTE/Vpp Din tDH Din High tAH Consecutive Program Verify Waveforms A0 to A17 CE tACC OE High tAHO tOE D0 to D15 tOHZ Dout Dout BYTE/Vpp 9.75 V 8/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP Program and Program Verify Cycle Waveforms A0 to A17 tAS CE tPW tOES OE tOHZ D0 to D15 tDS Din tDH tOE tOHZ Dout tAHO BYTE/Vpp 9.75 V Pin Capacitance (VCC = 3.3 V, Ta = 25C, f = 1 MHz) Parameter Input BYTE/VPP Output Symbol CIN1 CIN2 COUT Condition VI = 0 V VO = 0 V Min. -- -- -- Typ. -- -- -- Max. 8 (10) 60 10 (12) pF Unit ( ) : DIP only 9/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP Programming/Verify Flow Chart Programming Start NG Bad Insertion Pin Check PASS Address = First Location Verify Start NG Pin Check PASS Address = First Location Bad Insertion VCC = 4.0 V VCC = 3.0 V/VPP = 3.0 V VPP = 9.75 V Program 10 s Verify PASS VCC = 3.6 V/VPP = 3.6 V NG Increment Address NO Last Address? YES Verify PASS Device Passed X=0 Device Failed NG Address = First Location Verify(One Word) PASS Increment Address NO NG X = X+1 YES Last Address? YES X = 2? NO Program 10 s VCC = 3.0 V/VPP = 3.0 V NG Verify PASS Device Passed Device Failed 10/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP PACKAGE DIMENSIONS (Unit: mm) DIP40-P-600-2.54 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5m) 6.10 TYP. 2/Dec. 11, 1996 11/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP (Unit: mm) SOJ42-P-400-1.27 Mirror finish 5 Notes for Mounting the Surface Mount Type Package Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5m) 1.86 TYP. 5/Dec. 5, 1996 The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP (Unit: mm) TSOP(2)44-P-400-0.80-K Mirror finish 5 Notes for Mounting the Surface Mount Type Package Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5m) 0.54 TYP. 3/Dec. 10, 1996 The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 13/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP (Unit: mm) SOP40-P-525-1.27-K Mirror finish 5 Notes for Mounting the Surface Mount Type Package Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (5m) 1.27 TYP. 3/Oct. 21, 1996 The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 14/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP REVISION HISTORY Document No. FEDR27V402E-01-02 FEDR27V402E-01-03 Date Sep. 2001 Jan. 15, 2004 Page Previous Current Edition Edition - 1, 2 - 1, 2, 12 Final edition 2 Description Added 42SOJ package. 15/16 FEDR27V402E-01-03 OKI Semiconductor MR27V402E / OTP NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2004 Oki Electric Industry Co., Ltd. 16/16 |
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