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MRA4003T3 Series Surface Mount Standard Recovery Power Rectifier SMA Power Surface Mount Package Features construction with glass passivation. Ideally suited for surface mounted automotive applications. Features http://onsemi.com * Compact Package with J-Bend Leads Ideal for Automated Handling * Stable, High Temperature, Glass Passivated Junction * Pb-Free Packages are Available Mechanical Characteristics STANDARD RECOVERY RECTIFIERS 1.0 AMPERES 300-1000 VOLTS * Case: Molded Epoxy * * * * * Epoxy meets UL 94 V-0 @ 0.125 in Weight: 70 mg (Approximately) Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 seconds in Solder Bath Polarity: Band in Plastic Body Indicates Cathode Lead Marking: MRA4003T3 = R13 Marking MRA4004T3 = R14 MRA4005T1 = R15 Marking: MRA4005T3 = R15 Marking: MRA4006T3 = R16 Marking: MRA4007T3 = R17 CASE 403D SMA PLASTIC MARKING DIAGRAM R1x AYWWG MAXIMUM RATINGS Please See the Table on the Following Page R1x A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package ORDERING INFORMATION See detailed ordering and shipping information in the ordering information section on page 4 of this data sheet. (c) Semiconductor Components Industries, LLC, 2006 1 May, 2006 - Rev. 5 Publication Order Number: MRA4003T3/D MRA4003T3 Series MAXIMUM RATINGS Value Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Avg. Rectified Forward Current (At Rated VR, TL = 150C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TL = 150C) Non-Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature Symbol VRRM VRWM VR IO IFRM MRA4003T3 300 MRA4004T3 400 MRA4005T1, MRA4005T3 600 MRA4006T3 800 MRA4007T3 1000 Unit Volts 1 2 Amp Amps IFSM 30 Amps Tstg, TC TJ -55 to 150 -55 to 175 C C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Lead (Note 1) Thermal Resistance, Junction-to-Ambient (Note 2) Symbol RJL RJA Value 16.2 88.3 Unit C/W ELECTRICAL CHARACTERISTICS Value Characteristic Maximum Instantaneous Forward Voltage (Note 3) (IF = 1 A) (IF = 2 A) Maximum Instantaneous Reverse Current (at rated DC voltage) 1. Minimum Pad Size 2. 1 inch Pad Size 3. Pulse Test: Pulse Width 250 s, Duty Cycle 2%. IF, INSTANTANEOUS FORWARD CURRENT (AMPS Symbol VF 1.1 1.18 IR 10 1.04 1.12 50 mA TJ = 25C TJ = 100C Unit Volts 10 100E-6 IR , REVERSE CURRENT (AMPS) TJ = 150C 10E-6 TJ = 150C 1.0 1.0E-6 100C -40C 0.1 100E-9 25C 10E-9 1.0E-9 100C 0.01 25C 0.4 0.6 0.8 1.0 1.2 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 0 50 100 150 200 250 300 350 VR, REVERSE VOLTAGE (VOLTS) 400 Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current http://onsemi.com 2 MRA4003T3 Series IO, AVERAGE FORWARD CURRENT (AMPS) 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 20 80 40 60 100 120 TL, LEAD TEMPERATURE (C) 140 160 Freq = 20 kHz Square Wave Ipk/IO = p 5 10 20 PFO , AVERAGE POWER DISSIPATION (WATTS) 1.8 1.6 1.4 Square Wave 1.2 1.0 0.8 0.6 20 0.4 0.2 0 0 0.5 1.0 1.5 IO, AVERAGE FORWARD CURRENT (AMPS) 2.0 10 Ipk/IO = p 5 dc dc Figure 3. Current Derating per Leg Figure 4. Forward Power Dissipation per Leg 100 TJ = 25C C, CAPACITANCE (pF) 10 1 0 20 40 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Capacitance r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 RqJL (Min Pad Board) RqJA (1 inch Pad Board) 0.1 0.01 RqJL(t) = RqJL * r(t) 0.001 10E-6 100E-6 1E-3 10E-3 100E-3 t, TIME (s) 1E+0 10E+0 100E+0 1E+3 10E+3 Figure 6. Thermal Response http://onsemi.com 3 MRA4003T3 Series ORDERING INFORMATION Device MRA4003T3 MRA4003T3G MRA4004T3 MRA4004T3G MRA4005T1 MRA4005T1G MRA4005T3 MRA4005T3G MRA4006T3 MRA4006T3G MRA4007T3 MRA4007T3G Package SMA SMA (Pb-Free) SMA SMA (Pb-Free) SMA SMA (Pb-Free) SMA SMA (Pb-Free) SMA SMA (Pb-Free) SMA SMA (Pb-Free) Shipping 5000/Tape & Reel 5000/Tape & Reel 5000/Tape & Reel 5000/Tape & Reel 1500/Tape & Reel 1500/Tape & Reel 5000/Tape & Reel 5000/Tape & Reel 5000/Tape & Reel 5000/Tape & Reel 5000/Tape & Reel 5000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MRA4003T3 Series PACKAGE DIMENSIONS SMA CASE 403D-02 ISSUE C HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D-01 OBSOLETE, NEW STANDARD IS 403D-02. DIM A A1 b c D E HE L MIN 1.91 0.05 1.27 0.15 2.29 4.06 4.83 0.76 MILLIMETERS NOM MAX 2.16 2.41 0.10 0.15 1.45 1.63 0.28 0.41 2.60 2.92 4.32 4.57 5.21 5.59 1.14 1.52 MIN 0.075 0.002 0.050 0.006 0.090 0.160 0.190 0.030 INCHES NOM 0.085 0.004 0.057 0.011 0.103 0.170 0.205 0.045 MAX 0.095 0.006 0.064 0.016 0.115 0.180 0.220 0.060 b D POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) A L c A1 SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 5 MRA4003T3/D |
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