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Datasheet File OCR Text: |
Semiconductor SB1316 Chip LED Lamp Features * * * * 1.6mm(L)x0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications * * * * LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp Outline Dimensions unit : mm 1 SB1316 Absolute maximum ratings Characteristic Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature * Soldering Temperature 2 1 Symbol PD IF IFP VR Topr Tstg Tsol Ratings 40 10 50 4 -25 -30 240 80 100 for 5 seconds Unit mW mA mA V *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile 2-1) Preheating 100 to 150 within 2 minutes Soldering 240 Gradual cooling (Avoid quenching) within 5 seconds Electrical Characteristics Characteristic Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current Half Angle R Symbol VF IV Test Condition IF= 10mA IF= 10mA IF= 10mA IF= 10mA VR=4V IF= 10mA Min - Typ 4.0 3 430 35 65 70 Max 10 - Unit V mcd nm nm uA deg P 2 SB1316 Characteristic Diagrams Fig. 1 IF - VF Fig. 2 IV - IF Forward Current IF [mA] Forward Voltage VF [V] Luminous Intensity Iv [mcd] Forward Current IF [mA] Fig. 3 IF - Ta Fig.4 Spectrum Distribution Forward Current IF [mA] Relative Intensity [%] Ambient Temperature Ta [ ] Wavelength [nm] Fig. 5-1 Radiation Diagram(X) Fig. 5-2 Radiation Diagram(Y) Relative Luminous Intensity Iv [%] Relative Luminous Intensity Iv [%] 3 |
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