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| TDA7269SA 10W+10W STEREO AMPLIFIER WITH MUTE & ST-BY 1 FEATURES WIDE SUPPLY VOLTAGE RANGE UP TO +20V SPLIT SUPPLY 10+10W @THD = 10%, RL= 8, VS = 14V NO POP AT TURN-ON/OFF MUTE (POP FREE) STAND-BY FEATURE (LOW Iq) SHORT CIRCUIT PROTECTION TO GND THERMAL OVERLOAD PROTECTION CLIPWATT 11 PACKAGE Figure 1. Package Clipwatt11 Table 1. Order Codes Part Number TDA7269SA Package Clipwatt11 signed for high quality sound application as Hi-Fi music centers and stereo TV sets. The TDA7269SA is pin to pin compatible with TDA7269, TDA7269A, TDA7269ASA, TDA7265, TDA7499, TDA7499SA. 2 DESCRIPTION The TDA7269SA is class AB power amplifier assembled in the @ Clipwatt 11 package, specially deFigure 2. Block Diagram +VS 1000F MUTE/ ST-BY IN (L) 1F 3 15K 1F 5 7 + - 4 OUT (L) 18K 4.7 100nF 560 8 15K +5V P 18K GND 9 10 IN- (L) RL (L) IN- (R) 560 18K 1F IN (R) 11 + 1 6 -VS 1000F 2 OUT (R) 4.7 100nF RL (R) D94AU085 September 2004 Rev. 2 1/11 TDA7269SA Table 2. Absolute Maximum Ratings Symbol VS IO Ptot Tamb Tstg, Tj DC Supply Voltage Output Power Current (internally limited) Total Power Dissipation (Tamb = 70C) Ambient Operating Temperature (1) Storage and Junction Temperature Parameter Value 22 3 20 0 to 70 -40 to 150 Unit V A W C C Figure 3. Pin Connection (Top view) 11 10 9 8 7 6 5 4 3 2 1 IN+(1) IN-(1) GND IN-(2) IN+(2) -VS MUTE OUTPUT(2) +VS OUTPUT(1) -VS D03AU1506 Table 3. Thermal Data Symbol Rth j-case Rth j-amb Parameter Thermal Resistance Junction-case Max. Thermal Resistance Junction-ambient Value 3.9 48 Unit C/W C/W Figure 4. Single Supply Application D1 5.1V R1 10K PLAY 5V 0 MUTE C1 1F R3 15K MUTE Q1 BSX33 R2 15K C2 100F C3 1F IN (L) 5 7 + 8 9 C4 1F IN (R) 11 IN- (L) 3 4 OUT (L) R4 30K R5 1K + 2 IN- (R) R6 30K R7 1K C9 470F +VS C5 1000F C6 0.1F R8 4.7 C7 0.1F C10 470F OUT (L) 10 1 6 GND OUT (R) R9 4.7 C8 0.1F OUT (R) D96AU444A 2/11 TDA7269SA Table 4. ELECTRICAL CHARACTERISTCS (Refer to the test circuit VS = 14V; RL = 8; RS = 50; GV = 30dB, f = 1KHz; Tamb = 25C, unless otherwise specified) Symbol VS Iq VOS Ib PO Parameter Supply Voltage Range Total Quiescent Current Input Offset Voltage Non Inverting Input Bias Current Output Power THD = 10%; RL = 8; VS = 12.5V; RL = 4; THD = 1%; RL = 8; VS = 12.5V; RL = 4; THD Total Harmonic Distortion RL = 8; PO = 1W; f = 1KHz; RL = 8; PO = 0.1 to 5W; f = 100Hz to 15KHz; RL = 4; PO = 1W; f = 1KHz; RL = 4; VS = 10V; PO = 0.1 to 5W; f = 100Hz to 15KHz; CT SR GOL eN Ri SVR Tj Cross Talk Slew Rate Open Loop Voltage Gain Total Output Noise Input Resistance Supply Voltage Rejection (each channel) Thermal Shut-down Junction Temperature f = 100Hz; VR = 0.5V A Curve f = 20Hz to 22KHz 15 f = 1KHz; f = 10KHz; 50 6.5 70 60 10 80 3 4 20 60 145 8 0.02 1 8 7.5 -25 500 10 10 7.5 7.5 0.03 0.7 RL = 8; RL = 4; Test Condition Min. 5 5 60 Typ. Max. 20 15 100 25 Unit V V mA mV nA W W W W % % % % dB dB V/s dB V V K dB C MUTE FUNCTION [ref +VS] (*) VMUTE AMUTE Mute /Play threshold Mute Attenuation -7 60 -6 70 -5 V dB STAND-BY FUNCTIONS [ref: +VS] (only for Split Supply) VST-BY AST-BY IqST-BY Stand-by Mute threshold Stand-by Attenuation Quiescent Current @ Stand-by -3.5 -2.5 110 3 6 -1.5 V dB mA (*) In mute condition the current drawn from Pin 5 must be 650A 3/11 TDA7269SA 3 MUTE STAND-BY FUNCTION The pin 5 (MUTE/STAND-BY) controls the amplifier status by two different thresholds, referred to +VS. - When Vpin5 higher than = +VS -2.5V the amplifier is in Stand-by mode and the final stage generators are off. - When Vpin5 between = +VS -2.5V and VS -6V the final stage current generators are switched on and the amplifier is in mute mode. - When Vpin5 lower than = +VS -6V the amplifier is play mode. Figure 5. +VS (V) 20 t -VS -20 VIN (mV) Vpin5 (V) VS VS-2.5 VS-6 VS-10 Iq (mA) 0 VOUT (V) OFF STDBY MUTE PLAY STDBY PLAY OFF STDBY D94AU086 MUTE MUTE MUTE 4/11 TDA7269SA Figure 6. Test and Application Circuit (Stereo Configuration) +VS C4 C5 R2 C3 MUTE/ ST-BY IN (L) C1 +VS 5 7 + 8 3 R1 SW1 ST-BY DZ Q1 4 OUT (L) R5 IN- (L) R6 R7 C8 RL (L) R4 SW2 MUTE R3 GND 9 10 IN- (R) R8 R9 C2 IN (R) 11 + 1 6 -VS C7 2 OUT (R) R10 C9 RL (R) C6 D94AU087B 4 APPLICATION SUGGESTIONS 4.1 (Demo Board Schematic) The recommended values of the external components are those shown the demoboard schematic different values can be used, the following table can help the designer Table 5. . COMPONENT R1 R2 R3 R4 R5, R8 R6, R9 R7, R10 C1, C2 C3 C4, C6 C5, C7 C8, C9 Dz SUGGESTION VALUE 10K 15K 18K 15K 18K 560 4.7 1F 1F 1000F 0.1F 0.1F 5.1V PURPOSE Mute Circuit Mute Circuit Mute Circuit Mute Circuit Closed Loop Gain Setting (*) Frequency Stability Input DC Decoupling St-By/Mute Time Constant Supply Voltage Bypass Supply Voltage Bypass Frequency Stability Mute Circuit Larger On/Off Time LARGER THAN RECOMMENDED VALUE Increase of Dz Biasing Current Vpin #5 Shifted Downward Vpin #5 Shifted Upward Vpin #5 Shifted Upward Increase of Gain Decrease of Gain Danger of Oscillations Danger of Oscillations Higher Low Frequency Cutoff Smaller On/Off Time Danger of Oscillations Danger of Oscillations Vpin #5 Shifted Upward Vpin #5 Shifted Downward Vpin #5 Shifted Downward SMALLER THAN RECOMMENDED VALUE (*) Closed loop gain has to be 25dB 5/11 TDA7269SA 4.2 PC Board Figure 7. LC Figure 8. LS Figure 9. Component Layout 6/11 TDA7269SA 5 HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150C, it is important the dimensioning of the Heat Sinker RTh (C/W). The parameters that influence the dimensioning are: - Maximum dissipated power for the device (Pdmax) - Max thermal resistance Junction to case (R Th j-c) - Max. ambient temperature Tamb max - Quiescent current Iq (mA) 5.1 Example: VCC = 14V, Rload = 8ohm, RTh j-c = 3.9 C/W , Tamb max = 50C 2V cc Pdmax = (N channels) * -------------------------- + I q V c c 2 R lo ad Pdmax = 2 * ( 4.96 ) + 0.84 = 10.7 W 150 - T am b max 150 - 50 (Heat Sinker) R Th c-a = ---------------------------------------- - R T h j-c = --------------------- - 3.9 = 5.4C/W 10.7 P d max In figure 7 is shown the Power derating curve for the device. Figure 10. Power derating curve 2 25 20 (a) Pd (W) 15 (b) 10 (c) 5 a) b) c) Infinite Heatsink 5.0 C/ W 7.0 C/ W 0 0 40 80 Tamb (C) 120 160 7/11 TDA7269SA 6 CLIPWATT ASSEMBLING SUGGESTIONS The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much as possible in the plastic body center, as indicated in the example of figure 11. A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink. A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum contact pressure of 15 Kg/mm2 between it and the plastic body case. As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2 at least. Figure 11. Example of right placement of the clip 8/11 TDA7269SA Figure 12. Clipwat11 Mechanical Data & Package Dimensions mm DIM. MIN. A B C D E F F1 G G1 H1 H2 H3 L L1 L2 L3 M M1 10.7 19.85 17.9 14.55 11 5.5 2.54 2.54 11.2 0.421 1.57 16.87 1.7 17 12 18.6 0.781 0.700 0.580 0.433 0.217 0.100 0.100 0.441 0.49 0.77 0.8 0.15 1.5 0.55 0.88 0.15 1.83 17.13 0.062 0.664 0.067 0.669 0.480 0.732 0.019 0.030 0.031 TYP. MAX. 3.2 1.05 0.006 0.059 0.002 0.035 0.006 0.072 0.674 MIN. TYP. MAX. 0.126 0.041 Weight: 1.80gr inch OUTLINE AND MECHANICAL DATA Clipwatt11 0044448 G 9/11 TDA7269SA Table 6. Revision History Date May 2003 Septembe 2004 Revision 1 2 First Issue Changed Status and the graphic aspect in compliant to the new rules "Corporate Technical Pubblications Design Guide" Description of Changes 10/11 TDA7269SA Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11 |
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