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USB260 New Product Vishay General Semiconductor Surface Mount Ultrafast Plastic Rectifier Major Ratings and Characteristics IF(AV) VRRM IFSM trr VF Tj max. 2.0 A 600 V 90 A 30 ns 1.0 V 150 C DO-214AA (SMB) Features * * * * * * * * Glass passivated chip junction Ideal for automated placement Ultrafast recovery times for high efficiency Low forward voltage, low power losses High forward surge capability Meets MSL level 1, per J-STD-020C Solder Dip 260 C, 40 seconds Component in accordance to RoHS 2002/95/EC and WEE 2002/96/EC Mechanical Data Case: DO-214AA (SMB) Epoxy meets UL 94V-0 flammability rating Terminals: Matte tin plated leads, solderable per J-STD-002B and JESD22-B102D E3 suffix for commercial grade, HE3 suffix for high reliability grade (AEC Q101 qualified) Polarity: Color band denotes cathode end Typical Applications For use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive and Telecommunication. Maximum Ratings (TA = 25 C unless otherwise specified) Parameters Device marking code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current (see Fig. 1) Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load Non-repetitive avalanche energy at IAS = 2.0 A, L = 10 mH, TJ = 25 C Operating junction and storage temperature range VRRM VRMS VDC IF(AV) IFSM EAS TJ, TSTG Symbol USB260 U60 600 420 600 2.0 90 20 - 55 to + 150 V V V A A mJ C Unit Document Number 84705 14-Dec-05 www.vishay.com 1 USB260 Vishay General Semiconductor Electrical Characteristics (TA = 25 C unless otherwise specified) Parameters Breakdown voltage Instantaneous forward voltage (1) at IF = 1 A at IF = 2.0 A Maximum reverse current (1) Maximum reverse recovery time Typical junction capacitance Notes: (1) Pulse test: 300 s pulse width, 1 % duty cycle at VR = 600 V Test condition at IR = 10 A TJ = 25 C TJ = 25 C TJ = 25 C TJ = 125 C TJ = 25 C TJ = 125 C VF IR trr CJ Symbol V(BR) 1.25 1.5 1.0 30 30 45 Typ. 600 (minimum) 1.6 1.1 5.0 100 V A ns pF Max. Unit V IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A at 4.0 V, 1 MHz Thermal Characteristics (TA = 25 C unless otherwise specified) Parameters Typical thermal Notes: (1) Units mounted on P.C.B. with 2.0 x 2.0" copper pad areas resistance (1) Symbol RJA RJL USB260 45 10 Unit C/W Ordering Information Preferred P/N USB260-E3/52T USB260-E3/5BT Unit Weight (g) 0.093 0.093 Preferred Package Code 52T 5BT Base Quantity 750 3200 Delivery Mode 7" Diameter Plastic Tape & Reel 13" Diameter Plastic Tape & Reel Ratings and Characteristics Curves (TA = 25 C unless otherwise noted) 3.0 3.0 D = 0.5 2.5 D = 0.2 2.0 D = 0.1 D = 0.3 D = 1.0 D = 0.8 Average Forward Rectified Current (A) 2.0 Average Power Loss (W) 1.5 T 1.0 P.C.B. Mounted on 2.0 x 2.0" copper pad areas 0 80 90 100 110 120 130 140 150 1.0 0.5 0 D - tp/T tp 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 Lead Temperature (C) Average Forward Current (A) Figure 1. Maximum Forward Current Derating Curve Figure 2. Forward Power Loss Characteristics www.vishay.com 2 Document Number 84705 14-Dec-05 USB260 Vishay General Semiconductor 100 1000 Peak Forward Surge Current (A) 80 Junction Capacitance (pF) 100 60 40 10 20 0 1 10 100 1 0.1 1 10 100 Number of Cycles at 60 Hz Reverse Voltage (V) Figure 3. Maximum Non-Repetitive Peak Forward Surge Current Figure 6. Typical Junction Capacitance 100 100 TJ = 150 C 10 TJ = 125 C 1 TJ = 25 C 0.1 Transient Thermal Impedance (C/W) Instantaneous Forward Current (A) 10 0.01 0.1 0.6 1.1 1.6 2.1 2.6 3.1 3.6 1 0.01 0.1 1 10 100 Instantaneous Forward Voltage (V) t, Pulse Duration (s) Figure 4. Typical Instantaneous Forward Characteristics Figure 7. Typical Transient Thermal Impedance 1000 Instantaneous Reverse Current (A) 100 TJ = 150 C 10 TJ = 125 C 1 TJ = 25 C 0.1 0 10 20 30 40 50 60 70 80 90 100 Percent of Rated Peak Reverse Voltage (%) Figure 5. Typical Reverse Leakage Characteristics Document Number 84705 14-Dec-05 www.vishay.com 3 USB260 Vishay General Semiconductor Package outline dimensions in inches (millimeters) DO-214AA (SMB) Mounting Pad Layout Cathode Band 0.085 MAX. (2.159 MAX.) 0.086 (2.20) 0.077 (1.95) 0.155 (3.94) 0.130 (3.30) 0.086 MIN. (2.18 MIN.) 0.180 (4.57) 0.160 (4.06) 0.012 (0.305) 0.006 (0.152) 0.096 (2.44) 0.084 (2.13) 0.060 MIN. (1.52 MIN.) 0.220 REF 0.060 (1.52) 0.030 (0.76) 0.220 (5.59) 0.205 (5.21) 0.008 (0.2) 0 (0) www.vishay.com 4 Document Number 84705 14-Dec-05 Legal Disclaimer Notice Vishay Notice Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale. Document Number: 91000 Revision: 08-Apr-05 www.vishay.com 1 |
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