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Fiber Optics
XFP 850 nm Small Form Factor Module 10 Gigabit Pluggable Transceiver Compatible with XFP MSA Rev. 3.1
Preliminary Data Sheet Features Standards * Compatible with IEEE 802.3aeTM-2002 * Compatible with Fibre Channel 10GFC Draft 3.5 * Compatible with XFP MSA Rev. 3.1 Optical
V23833-F0005-B101 V23833-F0005-B102
File: 2115
* IEEE Ethernet: Serial 850 nm 10GBASE-SR * T11 Fibre Channel: Serial 850 nm 1200-M5-SN-I; 1200-M5E-SN-I; 1200-M6-SN-I * Transmission distance - up to 82 m1) (50 m MMF) - up to 300 m1) (on special MMF) * Vertical Cavity Surface Emitting Laser at 850 nm (VCSEL) * LC connector, multimode fiber * Full duplex transmission mode
1)
Maximum reach as defined by IEEE. Longer reach possible depending upon link implementation.
Ordering Information Part Number V23833-F0005-B101 V23833-F0005-B102 Chassis/Signal Grounding Concept Separated Common
1
Standard Multi-Protocol Multi-Protocol
2004-06-16
Preliminary Product Information
V23833-F0005-B101 V23833-F0005-B102
Applications Monitoring and Control * * * * * * * * * * * * Laser safety shut off Supply voltage 5 V / 3.3 V Transmit power Received power RSSI Laser bias current Tx_DIS Mod_NR Mod_DeSel Interrupt Mod_ABS P_Down/RST Rx_Los
Mechanical * Color coded beige for 850 nm * Belly-to-belly applications * Latching mechanism with low insertion force Electrical * * * * * * * Hot pluggable Power supply 5 V / 3.3 V only Total power consumption < 1.5 W max. XFI electrical interface Reference clock not required Management and control via 2-wire interface 30 pin connector, 0.8 mm pitch
Applications * * * * * * * * 10GBE, 10GFC and G.709 transmission systems for short range Integration on PCI card, with eventually mid-board mounting Belly-to-belly for high density applications Enterprise and campus network applications Storage applications Backplane and switch applications Aggregation point for lower date rate XFP evaluation kit V23833-F9909-Z001 available upon request
Preliminary Product Information
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Pin Configuration Pin Configuration
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
GND VEE5 MOD_DESEL INTERRUPT TX_DIS VCC5 GND VCC3 VCC3 SCL SDA MOD_ABS MOD_NR RX_LOS GND
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
GND TD+ TD- GND GND REFCLK- REFCLK+ GND VCC2 P_DOWN/RST VCC2 GND RD+ RD- GND
Bottom of Board (As viewed through top of board)
Top of Board
File: 2304
Figure 1
XFP Transceiver Electrical Pad Layout
Preliminary Product Information
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Pin Configuration Connector Pin Assignments Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Signal Name GND Pin No. 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Signal Name GND TD+ TD- GND GND REFCLK- REFCLK+ GND
VEE5
MOD_DESEL INTERRUPT TX_DIS
VCC5
GND
VCC3 VCC3
SCL SDA MOD_ABS MOD_NR RX_LOS GND
VCC2
P_DOWN
VCC2
GND RD+ RD- GND
Preliminary Product Information
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Pin Configuration Pin Description Signal Name MOD_DESEL Level LVTTL I/O I Pin No. 3 Description Module De-select: when "L" allows the module to respond to 2-wire serial interface command. "H" active Interrupt: indicates presence of an important condition which can be read on the 2-wire serial interface. "H" active Transmitter Disable: transmitter laser source is turned off. "H" active 2-wire Interface Clock 2-wire Interface Data Module Absent: indicating the modules not present. "H" active Module not ready: module operational fault Receiver Loss Of Signal Indicator Power Saving Mode: places the module in the stand-by condition. Active "H". During the falling edge set the module reset Transmitter Inverted Data Input Transmitter Not-inverted Data Input Receiver Data Output Inverted Receiver Data Output Not-inverted Reference Clock Not-inverted Input1) Reference Clock Inverted Input1) Management and Monitoring Ports
INTERRUPT
LVTTL
O
4
TX_DIS SCL SDA MOD_ABS MOD_NR RX_LOS P_DOWN
LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL LVTTL
I I I O O O I
5 10 11 12 13 14 21
Transmit Functions TD- TD+ RD- RD+ REFCLK+ REFCLK- CML CML CML CML PECL PECL I I O O I I 28 29 17 18 24 25
Receive Functions
Preliminary Product Information
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Pin Configuration Pin Description (cont'd) Signal Name DC Power GND 0V +5 V +3.3 V +1.8 V - I I I 1,7,15,16,19, 23,26,27,30 6 8,9 20,22 Ground connection for both signal and chassis on the module Positive power supply, nominal Positive power supply, nominal Positive power supply, nominal Level I/O Pin No. Description
VCC5 VCC3 VCC2
1)
Reference clock not required. Input internally terminated 50 to ground.
Preliminary Product Information
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Description Description System Block Diagram
Connector
XFP Module
D
C
C
RX CDR
ASIC/SerDes
A B B TX CDR
Host Board
File: 2306
Figure 2 Optical Interface Standard Specifications * * * * * IEEE 802.3aeTM-2002 clause 52, 10GBASE-SR Fibre Channel 10GFC Draft 3.5, 1200-M5-SN-I Fibre Channel 10GFC Draft 3.5, 1200-M5E-SN-I Fibre Channel 10GFC Draft 3.5, 1200-M6-SN-I XFP MSA Rev. 3.1
Standard IEEE Fibre Channel
Fiber Type 62.5 m MMF 50 m MMF 62.5 m MMF 50 m MMF 50 m MMF
Minimum Modal Bandwidth Operating Range1) at 850 nm (MHz*km) (meters) 160 400 200 500 2000 2 to 26 2 to 66 0.5 to 33 0.5 to 82 0.5 to 300
1)
Longer reaches possible depending upon link implementation.
Preliminary Product Information
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Description Electrical Interface Standard Specifications * IEEE 802.3aeTM-2002 clause 45 & 47 * XFP MSA Rev. 3.1 Environment: Thermal Management Recommendations Operating air inlet temperature: 0C - 50C Operating Airflow: 200 LFM (1.5 m/s) Operating Humidity: 80% RH non-condensing Maximum operating case temperature is 70C as defined by UL 1950. Module can withstand and operate within specification with case temperature of 75C for up to 96 hrs/yr. Transceiver requires airflow parallel to cooling fins. Maximum airflow required per XFP MSA is 3 m/s. Fibers and Connectors The transceiver LC features a duplex receptacle and is designed for multimode LC cables, 0 polished end face (PC). 30-pin Connector The module interface connector is a 30-pin, printed circuit board edge connection with a 0.8 mm pitch. The appropriate mating connector for the customer PCB is a 30-pin SMT, dual row, right angled, edge connector, 0.8 mm pitch (TycoAmp part number 788862C or equivalent). Cage/Heatsink Requirement The cage/heatsink assembly required to mount the XFP module is defined by the MSA.
Preliminary Product Information
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Description Regulatory Compliance Feature ESD: Electrostatic Discharge to the Electrical Pins (HBM) Immunity: Against Electrostatic Discharge (ESD) to the Module Receptacle Immunity: Against Radio Frequency Electromagnetic Field Emission: Electromagnetic Interference (EMI) Standard EIA/JESD22-A114-B (MIL-STD 883D Method 3015.7) EN 61000-4-2 IEC 61000-4-2 Comments Class 1a (> 500 V)
Discharges ranging from 2 kV to 25 kV to the front end / faceplate / receptacle cause no damage to module (under recommended conditions). With a field strength of 30 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on module performance between the specification limits. Noise frequency range: 30 MHz to 40 GHz Radiated emission does not exceed specified limits.
EN 61000-4-3 IEC 61000-4-3
FCC 47 CFR Part 15, Class B EN 55022 Class B CISPR 22
Preliminary Product Information
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Technical Data Technical Data Absolute Maximum Ratings Parameter Storage Ambient Temperature
1) 1) 2)
Symbol
Limit Values min. max. 85 50 80 6 4 500 1.5 -20 0 0 0 0 -500
Unit C C C V V V dBm
Operating Ambient Temperature Operating Case Temperature1) Supply Voltage +5.0 V Supply Voltage +3.3 V
TS TA TC V5 V3
STd RxP max
Static Discharge Voltage, All Pins Average Receive Optical Power
1) 2)
Non condensing. With specified airflow (see "Environment: Thermal Management Recommendations").
Exceeding any one of these values may permanently destroy the device. Recommended Operating Conditions Parameter Operating Case Temperature1) Transceiver Total Power Consumption Supply Voltage +5.0 V Supply Current +5.0 V Supply Voltage +3.3 V Supply Current +3.3 V
1)
Symbol min.
Values typ. 1.25 4.75 3.14 5.0 50 3.3 300 3.47 5.25 max. 70 0
Unit C W V mA V mA
TC P VCC5 ICC5 VCC3 ICC3
Worst case thermal location (see Figure 15).
Preliminary Product Information
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Technical Data Optical Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, TC = 0C to 70C)
Parameter Transmitter Launch Power in OMA1) Average Launch Power Center Wavelength Range1) RMS Spectral Width1) Extinction Ratio Relative Intensity Noise12OMA Eye Mask Definition Transmitter and Dispersion Penalty Encircled Flux Optical Return Loss Tolerance Average Launch Power of OFF Transmitter Receiver
Symbol min.
Values typ. max.
Unit
PO-OMA PO-Avg
C-Tx I ER RIN TDP EF ORLT
-2.8 -3 840 3 -2 850 0.4 5.5 -128 According to IEEE and Fibre Channel 3.9 at 19 m 86%, at 4.5 m 30% 12 -30 -1 860 0.45
dBm dBm nm nm dB dB/Hz dB
dB dBm
PO-OFF
Stressed Receiver Sensitivity in PIN-S OMA Sensitivity in OMA2) Average Receive Power Signal Detect Deassert Level Signal Detect Assert Level Signal Detect Hysteresis Receiver Reflectance Center Wavelength Range
1) 2)
-7.5 -11.1 -1 -30 -20 1 840 2 -13 4 -12 860
dBm dBm dBm dBm dBm dB dB nm
PIN PIN-max PSDL PSD PSD
REFRx C-Rx
Conforms to IEEE triple trade off between center wavelength, RMS spectral width and minimum OMA. Receiver sensitivity, which is defined for an ideal input signal is informative only.
Preliminary Product Information
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Technical Data Electrical DC Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, TC = 0C to 70C)
Parameter
Symbol min.
Values typ. max.
Unit
3.3 V CMOS I/O DC Characteristics (Management, Logic and Monitoring Ports) External Pull-up Resistor for Open Drain Output High Voltage1) Output Low Voltage1) Input High Voltage Input Low Voltage Input Pull-up Current2) LVPECL I/O Characteristics (REFCLK+/-) Differential Input Voltage (pk-pk)3) XFI I/O DC Characteristics (TD+/-; RD+/-) Differential Input Amplitude (pk-pk)4) Differential Output Amplitude (pk-pk)5)
1) 2) 3) 4) 5)
Rpullup Voh Vol Vih Vil Ipd
10 2.4
22 3.5 0.4 2
k V V V V A
0 -10 0
0.8 10
Vin_diff
400
2000
mV p-p
TD+/- RD+/-
240 680
1640 1700
mV p-p diff mV p-p diff
Rpull-up = 10 k to 3.3 V. Vin = 3.3 V.
AC coupled in transceiver. AC coupled input at host board. AC coupled output at host board.
Preliminary Product Information
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Technical Data Electrical AC Characteristics
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, TC = 0C to 70C)
Parameter XFI Input AC Characteristics (TD+/-) Baud Rate Baud Rate Tolerance Differential Input Impedance Differential Return Loss1) Input Differential Skew2) Total Jitter3) Deterministic Jitter3) XFI Output AC Characteristics (RD+/-) Baud Rate Baud Rate Tolerance Rise and Fall Times4) Output Differential Skew Output Differential Impedance Total Jitter
5) 5)
Symbol min.
Values typ. max.
Unit
TD+/- TDtol
9.95 -500 80 8
10.3125 100 t.b.d.
10.75 500 120
Gbit/s ppm dB ps
ZIN
|S11| TSKEWIN TJTD TJTD
0.61 0.2
UI pp UI pp
RD+/- RDtol
9.95 -100 24
10.3125
10.75 100
Gbit/s ppm ps ps
tr , tf
TSKEWOUT
t.b.d. 80 8 0.34 0.18 100 120
ZOUT
TJRD DJRD
dB UI UI
Differential Output Return Loss1) |S22| Deterministic Jitter
Preliminary Product Information
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Technical Data Electrical AC Characteristics (cont'd)
(VCC5 = 4.75 V to 5.25 V, VCC3 = 3.14 V to 3.47 V, TC = 0C to 70C)
Parameter
Symbol min.
Values typ. max.
Unit
3.3 V CMOS I/O AC Characteristics for I2C Signals (SDA; SCL) SCL Clock Frequency SCL Period Low SCL Period High Bus Free Time6) Start Condition Setup Time Stop Condition Setup Time Start Condition Hold Time Data Hold Time Data Setup Time SDA and SCL Rise and Fall Time
1) 2) 3) 4) 5) 6)
fSCL tLOW tHIGH tBUF tSU_START tSU_STOP tH_START tH_DATA tSU_DATA tr , tf
0 1.3 0.6 1.3 0.6 0.6 0.6 0 100
400
kHz s s s s s s s ns
300
ns
100 MHz - 5.5 GHz above 5.5 GHz see XFP MSA 3.1. Not defined at crossing point. Per XFP MSA 3.1 table 17, 1 UI = 96.97 ps. 20%, 80%. Per XFP MSA 3.1 table 19, 1 UI = 96.97 ps. Between stop and start condition.
Preliminary Product Information
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Technical Data Timing Parameters for XFP Management Parameter TX_DIS Assert Time Time to Initialize3) INTERRUPT Assert Delay4) INTERRUPT Negate Delay5) P_DOWN/RST Assert Delay6) MOD_NR Assert Delay7) MOD_NR Negate Delay8) P_DOWN Reset Time9) RX_LOS Assert Delay10) RX_LOS Negate Delay11)
1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11)
Symbol min.
1) 2)
Values max. 10 2 300 200 500 100 1 1 10 100 100
Unit s ms ms ms s s ms ms s s s
t_off t_on t_init Interrupt_on Interrupt_off P_Down/RST_on Mod_nr_on Mod_nr_off t_loss_on t_loss_off
TX_DIS Negate Time
Rising edge of TX_DIS to fall of output signal below 10% of nominal. Falling edge of TX_DIS to rise of output signal above 90% of nominal. From power on or hot plug after supply or from falling edge of P_DOWN/RST. From occurrence of the condition triggering INTERRUPT. From clear on read INTERRUPT flags. From power down initiation. From occurrence of fault to assertion of MOD_NR. From clearance of signal to negation of MOD_NR. Min. length of P_DOWN assert to initiate reset. From occurrence of loss of signal to assertion of RX_LOS. From occurrence of presence of signal to negation of RX_LOS.
Preliminary Product Information
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Eye Safety Eye Safety This laser based multimode transceiver is a Class 1M product. It complies with IEC 60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10 and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001. INVISIBLE LASER RADIATION CLASS 1M LASER PRODUCT DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Note: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Failure to adhere to the above restrictions could result in a modification that is considered an act of "manufacturing", and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Emission Data Wavelength Maximum total output power (as defined by IEC: 7 mm aperture at 100 mm distance) Beam divergence (full angle) / NA (half angle) 850 nm 743 W / -1.3 dBm 20 / 0.18 rad
FDA
Complies with 21 CFR 1040.10 and 1040.11
IEC
Class 1M Laser Product
File: 2412
Figure 3
Required Labels
Laser Emission
Tx
Top view
Rx
File: 1333
Figure 4
Laser Emission
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Preliminary Product Information
V23833-F0005-B101 V23833-F0005-B102
Application Notes Application Notes Host Board Layouts
Dimensions in mm
File: 2508
Figure 5
XFP Host Board Mechanical Layout
Detail Z see Figure 6.
Preliminary Product Information
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Application Notes
Dimensions in mm
File: 2509
Figure 6
XFP Host Board Mechanical Layout, Detail Z
Preliminary Product Information
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Application Notes
Dimensions in mm
File: 2510
Figure 7
Recommended Single Sided Bezel Design
Dimensions in mm
File: 2511
Figure 8
Recommended Double Sided Mounting Bezel Design
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Application Notes Mechanical
File: 2512
Figure 9
PCI Card Application
Preliminary Product Information
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Application Notes
Dimensions in mm
File: 2513
Figure 10
XFP Transceiver Connector Illustration
Preliminary Product Information
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Application Notes
Top View GND 16 17 18 19 20 21 22 Toward ASIC 23 24 25 26 27 28 29 30 GND RX_LOS RD- MOD_NR RD+ MOD_ABS GND SDA VCC2 SCL P_DOWN/RST VCC3 VCC2 VCC3 GND GND REFCLK+ VCC5 REFCLK- TX_DIS GND INTERRUPT GND MOD_DESEL TD- VEE5 TD+ GND GND
File: 2514
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Toward Bezel
Figure 11
Host PCB XFP Pinout
Preliminary Product Information
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Application Notes
Host Board
Host +5 V 0.1 F Host +3.3 V 0.1 F Host +1.8 V 0.1 F 4.7 H 22 F 4.7 H 22 F 4.7 H 22 F VCC5
1)
0.1 F VCC3
xx F XFP Connector
1)
0.1 F VCC2
xx F
XFP Module
1)
0.1 F
xx F
1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory.
File: 2305
Figure 12
Recommended Host Board Supply Filtering Network
Preliminary Product Information
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Package Outlines Package Outlines
Dimensions in mm
File: 2206
Figure 13
Mechanical Dimensions
Revision code
Laser class
Description
Part number
Country of origin Optional marking (MS/ES) Dimensions in mm
WW: week of production nnnnnnnn: serial number
File: 2402
Figure 14
Label Description
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Package Outlines
Dimensions in mm
File: 2207
Figure 15
XFP Temperature Reference Point
Preliminary Product Information
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V23833-F0005-B101 V23833-F0005-B102 Revision History: Previous Version: Page 2004-06-16 none DS0
Subjects (major changes since last revision)
Edition 2004-06-16 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 Munchen, Germany
(c) Infineon Technologies AG 2004.
All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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