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Cree(R) XLamp(R) XR-E LED Data Sheet Cree XLamp LEDs combine the brightness of power LED chips with a rugged package capable of operating up to four watts. Cree XLamp LEDs lead the solidstate lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase design flexibility, while minimizing environmental impact. Cree XLamp LEDs bring lighting-class brightness and efficiency to a wide range of lighting and backlighting applications, including portable lighting and flashlights, outdoor and industrial, signaling, architectural, landscaping and entertainment/ advertising installations. FEATURES * Guaranteed minimum flux order codes up to 100 lm in white and 23.5 lm in blue * * Over 80 lm/W available in white Available in white (2,600 K to 10,000 K CCT), blue and royal blue * * * Drive currents: 350 to 1000 mA Industry's lowest thermal resistance: 8C/W Max junction temperature: 150C * * * * * Industry-leading JEDEC standard prequalification testing Reflow solderable - JEDEC J-STD-020C compatible Electrically neutral thermal path RoHS-compliant Lumen maintenance of greater than 70% after 50,000 hours Table of Contents Flux Characteristics (TJ = 25C) ...............................................................................2 Characteristics .........................................................................................................3 Relative Spectral Power ...........................................................................................4 Photometric Output vs. Junction Temperature (IF = 350 mA) ..................................5 Electrical Characteristics (TJ = 25C) .......................................................................6 Thermal Design ........................................................................................................6 Relative Intensity vs. Current (TJ = 25C) ................................................................7 Typical Spatial Radiation Pattern..............................................................................7 Reflow Soldering Characteristics ..............................................................................8 Notes........................................................................................................................9 Mechanical Dimensions (TA = 25C) .......................................................................0 Tape and Reel......................................................................................................... Dry Packaging and Packaging ................................................................................2 6 CLD-DS05.00 Data Sheet: Subject to change without notice. www.cree.com/xlamp Flux Characteristics (TJ = 25C) The following tables describe the available colors and flux for XR-E LEDs by listing the correlated color temperature or dominant wavelength range for the entire family and by providing several base order codes. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XR-E & XR-C Binning and Labeling document. Color CCT Range Min. Max. Base Order Codes Min Luminous Flux (lm) Group N4 P2 P3 Flux (lm) 62.0 67.2 73.9 80.6 87.4 93.9 100 62.0 67.2 73.9 56.8 62.0 Order Code XREWHT-L1-0000-00601 XREWHT-L1-0000-00701 XREWHT-L1-0000-00801 XREWHT-L1-0000-00901 XREWHT-L1-0000-00A01 XREWHT-L1-0000-00B01 XREWHT-L1-0000-00C01 XREWHT-L1-0000-006E4 XREWHT-L1-0000-007E4 XREWHT-L1-0000-008E4 XREWHT-L1-0000-005E7 XREWHT-L1-0000-006E7 Cool White 5,000 K 10,000 K P4 Q2 Q3 Q4 N4 Neutral White 3,700 K 5,000 K P2 P3 Warm White 2,600 K 3,700 K N3 N4 Dominant Wavelength Range Color Min. Group DWL (nm) 465 Max. Group DWL (nm) 485 Base Order Codes Min Luminous Flux (lm) Group H0 J0 Flux (lm) 18.1 23.5 Order Code Blue B3 B6 XREBLU-L1-0000-00H01 XREBLU-L1-0000-00J01 Dominant Wavelength Range Color Min. Group Royal Blue DWL (nm) 450 Max. Group DWL (nm) 465 Base Order Codes Min Radiant Flux (mW) Group 12 13 Flux (mW) 250 300 Order Code D3 D5 XREROY-L1-0000-00701 XREROY-L1-0000-00801 Notes: * Cree maintains a tolerance of +/- 7% on flux and power measurements. * Typical CRI for Cool White & Neutral White (3,700 K - 10,000 K CCT) is 75. * Typical CRI for Warm White (2,600 K - 3,700 K CCT) is 80. Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 2 CLD-DS05.006 Characteristics Characteristics Thermal Resistance, junction to solder point Viewing Angle (FWHM) Temperature coefficient of voltage (white, blue, royal blue) ESD Classification (HBM per Mil-Std-883D) DC Forward Current (white 5000 K) DC Forward Current (white < 5000 K, blue, royal blue) DC Pulse Current (@ 1 kHz, 10% duty cycle) Reverse Voltage Forward Voltage (@ 350 mA) Forward Voltage (@ 700 mA) Forward Voltage (@ 1000 mA) (white 5000 K) LED Junction Temperature * mA mA A V V V V C 3.3 3.5 3.7 150 Unit C/W degrees mV/C Minimum Typical 8 90 -4.0 Class 2 1000 700 1.8 5 3.9 Maximum * Note: For lumen maintenance data, see the Cree XLamp LED Reliability document. Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 3 CLD-DS05.006 Relative Spectral Power 100 Relative Intensity (%) 80 60 40 5000K 5000 K- -10000K CCT 10000 K CCT 3500K 3500 K- -5000K CCT 5000 K CCT 2600 K- -2500K CCT 3500 K CCT 2600K 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) White 100 Relative Intensity (%) 80 60 40 Royal Blue Blue 20 0 400 450 500 550 Wavelength (nm) Blue Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 4 CLD-DS05.006 Photometric Output vs. Junction Temperature (IF = 350 mA) 100% Relative Photmetric Output 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 25 50 75 100 125 150 White Blue Junction Temperature (C) 100% Relative Radiometric Output 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 25 50 75 100 125 150 Royal Blue Junction Temperature (C) Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 5 CLD-DS05.006 Electrical Characteristics (TJ = 25C) 1000 900 Forward Current (mA) 800 700 600 500 400 300 200 100 0 0.0 Max Current mA 1000 Tj max C 150 Max Vf V 4.3 Max amb C 150 0 107 150 C Ta Rth,j-a Max mA 3488.4 1000.0 0.0 10 Derated mA 1000.0 1000.0 0.0 0 98.4 150 C Ta 1200 1000 800 600 400 200 0 Maximum Current (mA) Rj-a = 10C/W Rj-a = 12C/W Rj-a = 15C/W Rj-a = 20C/W 1.0 2.0 3.0 4.0 5.0 Forward Voltage (V) 0 25 50 75 100 125 150 Rth,j-a 10 Rth,j-a 12 Ambient Temperature (C) Thermal Design Max Current mA 1000 Ta Max Derated Ta Max Derated Tj max C 150 C mA mA C mA mA Max Vf maximum forward current is 3488.4 V 4.3 0 1000.0 thermal resistance between the LED junction and ambient. Given 0 2907.0 1000.0 The determined by the Max amb C 150 107 1000.0 98.4 an existing thermal resistance of 1000.0 between the junction and the1000.0 point,1000.0 8C/W solder it is crucial for the end product to 0.0 0.0 150 0.0 0.0 be designed in a manner 150 minimizes the thermal resistance from the solder point to ambient in order to optimize that lamp life and optical characteristics. 1200 1000 800 600 400 200 0 0 25 50 75 100 125 150 800 700 Maximum Current (mA) Maximum Current (mA) 600 500 400 300 200 100 0 0 25 50 75 100 125 150 Rj-a = 10C/W Rj-a = 12C/W Rj-a = 15C/W Rj-a = 20C/W Rj-a = 10C/W Rj-a = 12C/W Rj-a = 15C/W Rj-a = 20C/W Ambient Temperature (C) Ambient Temperature (C) Cool White Neutral White, Warm White, Blue and Royal Blue 800 700 Current (mA) Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 600 500 400 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 6 CLD-DS05.006 Rj-a = 10C/W Relative Intensity vs. Current (TJ = 25C) 250 Relative Intensity (%) 200 150 100 50 0 0 100 200 300 400 500 600 700 800 900 1000 Forward Current (mA) Typical Spatial Radiation Pattern 120 100 Relative Intensity (%) 80 60 40 20 0 -100 -80 -60 -40 -20 0 20 40 60 80 100 Angle () Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 7 CLD-DS05.006 Reflow Soldering Characteristics The following reflow soldering profiles are provided for reference. Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Cree XLamp LEDs are compatible with JEDEC J-STD-020C. Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat: Temperature Min (Tsmin) Preheat: Temperature Max (Tsmax) Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25C to Peak Temperature Lead-Based Solder 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds 215C 10-30 seconds 6C/second max. 6 minutes max. Lead-Free Solder 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds 260C 20-40 seconds 6C/second max 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 8 CLD-DS05.006 Notes Lumen Maintenance Projections Based on internal long-term reliability testing and standardized forecasting methods, Cree projects XLamp LEDs to maintain an average of 70% lumen maintenance after 50,000 hours, provided the LED junction temperature is maintained at or below 80C. Please read the XLamp Reliability application note for more details on Cree's lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity XLamp LEDs are shipped in sealed, moisture-barrier bags (MBB) designed for long shelf life. If XLamp LEDs are exposed to moist environments after opening the MBB packaging but before soldering, damage to the LED may occur during the soldering operation. The following derating table defines the maximum exposure time (in days) for an XLamp LED in the listed humidity and temperature conditions. LEDs with exposure time longer than the time specified below must be baked according to the baking conditions listed below. Temperature 30C 25C 20C Maximum Percent Relative Humidity 30% 9 12 17 40% 5 7 9 50% 4 5 7 60% 3 4 6 70% 1 2 2 80% 1 1 2 90% 1 1 1 Baking Conditions It is not necessary to bake all XLamp LEDs. Only the LEDs that meet all of the following criteria must be baked: 1. LEDs that have been removed from the original MBB packaging 2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above 3. LEDs that have not been soldered LEDs should be baked at 80C for 24 hours. LEDs may be baked on the original reels. Remove LEDs from MBB packaging before baking. Do not bake parts at temperatures higher than 80C. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. Storage Conditions XLamp LEDs that have been removed from original MBB packaging but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 5C and no greater than 10% RH (relative humidity). For LEDs stored in these conditions, storage time does not add to exposure time as defined in the Moisture Sensitivity section above. RoHS Compliance The levels of environmentally sensitive, persistent biologically toxic (PBT), persistent organic pollutants (POP), or otherwise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as amended through April 21, 2006. Vision Advisory Claim Users should be cautioned not to stare at the light of this LED product. The bright light can damage the eye. Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 9 CLD-DS05.006 Mechanical Dimensions (TA = 25C) All measurements are .1mm unless otherwise indicated. Lens Substrate Reflector Reflector Substrate Lens 6.8 mm 4.4 .2 mm Side View 9.0 mm 8.4 mm 5.6 mm 0.7 mm 6.46 mm 7.0 mm Top View 9.4 mm 7.0 mm 8.4 mm 5.6 mm 7.0 mm 5.6 mm Bottom View 1.2 mm 0.70 mm 7.4 mm 6.46 mm Recommended PC Board Solder Pad Recommended PC Board Solder Pad Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 0 CLD-DS05.006 Tape and Reel All dimensions in mm. 330.2 mm Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp CLD-DS05.006 Dry Packaging and Packaging Desiccant (inside vacuum bag) Cree Label with Customer P/N / Qty / Lot# Cree Bin Code and Barcode Label Humidity Indicator (inside vacuum bag) Vacuum-Sealed Bag Bin Label Cautionary Labels Patent Label Taped Edge Copyright (c) 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp 2 CLD-DS05.006 |
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