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| SP4T Antenna Switch for GSM/UMTS CXG1194XR Description The CXG1194XR is a high power SP4T antenna switch for GSM/UMTS applications. The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level. On chip logic reduces component count and simplifies the PCB layout by allowing direct connection of the switch to digital baseband control lines with CMOS logic levels. This switch is SP4T, one antenna can be routed to either of the 2Tx or 2Rx ports. It requires 2 CMOS control lines. The Sony GaAs JPHEMT MMIC process is used for low insertion loss. (Applications: GSM dual-band handsets, GSM/UMTS dual-mode handsets) Features Insertion loss (Tx) : 0.35dB (Typ.) at 34dBm (GSM900) 0.45dB (Typ.) at 32dBm (GSM1800) Package Small and Low height package size: 14-pin XQFN (2.5mm x 2.5mm x 0.35mm (Typ.)) Structure GaAs JPHEMT MMIC This IC is ESD sensitive device. Special handling precautions are required. The actual ESD test data will be available later. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E05X02-PS CXG1194XR Absolute Maximum Ratings (Ta = 25C) Bias Voltage Control Voltage Input power max. [ANT, RF1, RF4] Input power max. [RF2, RF3] Operating temperature Maximum power dissipation Topr PD VDD Vctl 7 5 35 13 -35 to +85 500 V V dBm dBm C (Duty cycle = 12.5 to 50%) mW *E Copper-clad lamination of glass board (4 layers) : 30mm square, t = 0.8mm, FR-4. Note) Use this product without exceeding the PD value specified in this specification. If it is used with exceeding the PD value even for a moment, the heat generated by the operation may cause the degradation or breakdown of the product. Block Diagram ANT F1 RF1 (Tx) F5 F6 F2 RF2 (Rx) F3 RF3 (Rx) F7 F8 F4 RF4 (Tx) Pin Configuration GND GND RF3 RF4 7 GND 8 RF2 9 GND 10 6 5 4 3 VDD 2 CTLA 1 CTLB 11 RF1 12 GND 13 ANT 14 GND Truth Table ON Path ANT - RF1 ANT - RF2 ANT - RF3 ANT - RF4 CTLA L H L H CTLB L L H H F1 ON OFF OFF OFF F2 OFF ON OFF OFF F3 OFF OFF ON OFF F4 OFF OFF OFF ON F5 OFF ON ON ON F6 ON OFF ON ON F7 ON ON OFF ON F8 ON ON ON OFF -2- CXG1194XR Electrical Characteristics (Ta = 25C) Item Symbol Port ANT - RF1 Condition 824 to 960MHz 1710 to 1990MHz 824 to 960MHz 1710 to 1990MHz 824 to 960MHz 1710 to 1990MHz 824 to 960MHz 1710 to 1990MHz 824 to 960MHz 1710 to 1990MHz 824 to 960MHz 1710 to 1990MHz 824 to 960MHz 1710 to 1990MHz 824 to 960MHz 1710 to 1990MHz 824 to 960MHz 1710 to 1990MHz *2 Min. Typ. 0.35 0.45 0.45 0.55 0.45 0.55 0.35 0.45 Max. 0.50 0.65 0.60 0.70 0.60 0.70 0.50 0.65 Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB -- -- ANT - RF2 Insertion loss IL ANT - RF3 ANT - RF4 ANT - RF1 25 22 30 25 30 25 30 25 30 26 35 30 35 30 35 30 1.2 1.2 -33 -34 -28 -28 -30 -33 -30 -30 -30 -34 ANT - RF2 Isolation ISO. ANT - RF3 ANT - RF4 VSWR VSWR 2fo 3fo 2fo ANT - RF1 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm A mA *3 -35 -37 Harmonics*1 3fo 2fo 3fo 2fo 3fo ANT - RF4 *3 *2 -34 -35 -35 -38 P1dB compression input power Control current Supply current P1dB Ictl IDD ANT - RF1, 4 ANT - RF1, 4 *2 *3 35 33 15 0.12 40 0.23 Vctl = 2.8V VDD = 2.8V Note) Electrical Characteristics are measured with all RF ports terminated in 50. *1 *2 *3 Harmonics measured with Tx inputs harmonically matched. The use of harmonic matching is recommended to ensure optimum performance. Power incident on Tx, Pin = 34dBm, 824 to 915MHz, VDD = 2.8V, RF1 or RF4 enabled Power incident on Tx, Pin = 32dBm, 1710 to 1910MHz, VDD = 2.8V, RF1 or RF4 enabled -3- CXG1194XR DC Bias Condition (Ta = 25C) Item Vctl (H) Vctl (L) VDD Min. 2.0 0 2.6 Typ. 2.8 -- 2.8 Max. 3.6 0.4 3.6 Unit V V V -4- CXG1194XR Recommended Circuit RF3 GND CRF 7 8 GND RF2 CRF 9 2 CTLA Cbypass 6 5 CRF 4 3 VDD Cbypass RF4 GND 10 GND 11 CRF GND RF1 ANT 12 13 CRF GND 14 1 CTLB Cbypass When using this IC, the following external components should be used: CRF: This capacitor is used for RF decoupling and must be used for all applications. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended. -5- CXG1194XR Package Outline (Unit: mm) 14PIN XQFN (PLASTIC) x4 0.05 2.5 10 11 8 7 2.5 A B 0.35 0.05 0.4 0.1 S C A-B C 14 1 3 4 8-C0.1 0.24 0.5 0.05 M S S A-B C PIN 1 INDEX MAX 0.02 S Solder Plating +0.09 0.24 -0.03 0.05 S TERMINAL SECTION Note:Cutting burr of lead are 0.05mm MAX. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.01g LEAD TREATMENT LEAD MATERIAL PACKAGE MASS SONY CODE EIAJ CODE JEDEC CODE XQFN-14P-01 LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18m -6- Sony Corporation |
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