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TS1900
Ultra Low Quiescent Current Smart Load Switch
SOT-25
Pin Definition: 1. Output 2. Ground 3. Enable 4. Input 5. Input
General Description
TS1900 is a high side slew rate controlled smart load switch. The slew rate control in TS1900 can effectively avoid the large in-rush current which is commonly observed in normal power switches. Moreover, the level shift in TS1900 allows customers to control 1.8 to 6.5V system with 1.5V logic and without sacrificing leakage current. TS1900 has typical low R DS(on) at 100m, it allows large power handling capabilities. And very low quiescent current and fast load discharge make it ideal for power sensitive applications nowadays.
Features
1.8 to 6.5V Input Voltage Range Slew Rate Limited at 100uS Very Low R DS(ON), Typically 100m Less than 1uA Shutdown Current Very Low Quiescent Current, Typically 2uA Fast Shutdown Load Discharge Thermal Fault Protection TTL / CMOS Input Logic Level 2KV ESD Rating EMI Free Circuit
Ordering Information
Part No.
TS1900CX5 RF
Package
SOT-25
Packing
3Kpcs / 7" Reel
Pin Description
Pin 1 2 3 4,5 Name Out Gnd EN Vin Function Drain of P-CH Power MOSFET Gnd Pin. Connect directly to local ground plane. Enable Control Input Source of P-CH Power MOSFET
Applications
Cellular and Smart Phone Hot Swap Supplies Microprocessors and DSP Core Supplies PDAs MP3 Players Digital Still and Video Cameras Portable Instruments
Application Circuit
Absolute Maximum Rating
Parameter
Input Supply Voltage Enable to Ground Voltage Output to Ground Voltage Power Dissipation Maximum Continues Current Junction Temperature Range Storage Temperature Range ESD HBM / MM
Symbol
VIN to Gnd VEN to Gnd VO UT to Gnd PD ICONTINUE TJ TSTG
Limit
-0.3 to 6.5 -0.3 to 6.5 -0.3 to 6.5 Internally Limited 2.2 +150 -65 ~ +150 2 / 200
Unit
V V V A C C KV / V
1/5
Version: A07
TS1900
Ultra Low Quiescent Current Smart Load Switch
Recommended Operating Conditions (Note 2)
Parameter
Supply Voltage Operating Temperature Range
Symbol
VIN TOPR
Limit
-0.3 to 6.5 -40 to +85 220
Unit
V C
o
Junction to Ambient Thermal Resistance (PCB mounted) RJA Note: 1. Exceeding these ratings may damage the device. 2. The device is not guaranteed to function outside of its operating conditions.
C/W
Electrical Specifications (VIN=5V, VEN=1.5V, TA=25C, unless otherwise noted)
Parameter Input Voltage Quiescent Current Shutdown Current Off Switch Current Symbol VIN IQ ISD ISO RDS(ON) VIL VIH ISINK TD(ON) TON TD(OFF) RPD TSD TR Test Conditions VEN=1.5V VEN=0V, Out = Open VEN=0V, VOUT = 0 VIN=5V @ 100mA VIN=4.2V @ 100mA VIN=3V @ 100mA VIN=1.8V @ 100mA ROUT = 10 ROUT = 10 VEN=5.5V ROUT = 10 ROUT = 10 ROUT = 10 VEN=0V Min 1.8 --------1 -----140 120 TYP 5 2 0.05 0.05 100 110 130 200 --0.01 40 100 4 150 160 140 MAX 6.5 4 1 1 130 140 160 250 0.4 -1 80 150 10 250 180 160 Units V A A A
On Resistance
m
EN Input Logic Low EN Input Logic High EN Input Leakage Output Turn-On Delay Output Turn-On Rise Time Output Turn-Off Delay Output Pull-Down Resistance Thermal Shutdown Temperature Thermal Recovery Temperature
V V A uS uS uS C C
Block Diagram
2/5
Version: A07
TS1900
Ultra Low Quiescent Current Smart Load Switch
Application Information
The TS1900 featured very low quiescent current and very low RDS(ON) and making them ideal for battery-powered applications. The ENABLE control pin is TTL compatible and driven by 1.5V beyond making the TS1900 an ideal levelshifting load switch. Input Capacitor Selection A 1UF or larger input capacitor is recommended to prevent load transients from affecting upstream circuits. CIN should be located as close to the device VIN pin as practically. There is no specific requirement type of capacitor is recommended. However, for higher current operation, ceramic capacitors are recommended for CIN. L=[VOUT X (VIN-VOUT)] / [VIN X (IL X(FOSC] Where IL is the inductor ripple current. Larger inductance is recommended for better efficiency in light load condition. Output Capacitor Selection For proper slew operation, a 0.1uF or greater is recommended. The output capacitor has also no specific capacitor type requirement. If desired, COUT maybe increased without limit to accommodate any load transient Reverse Output-to-Input Voltage Conditions and Protection Under normal conditions, there is a parasitic diode between the output & input of the load switch. In case of VOUT exceeding VIN, this would forward bias the internal parasitic diode and allow excessive current flow into the VOUT pin and possibly damage the load switch. In applications, where there is a possibility of VOUT exceeding VIN for brief periods of time during operation, the use of larger value CIN capacitor is highly recommended. A larger value of CIN with respect to COUT will affect a slower CIN decay rate during shutdown, thus preventing VOUT from exceeding VIN. In case of extended period of time for VOUT exceeding VIN, it is recommended to place a Schottky diode from VIN to VOUT. Thermal Considerations The TS1900 is designed to deliver a continuous load current. The maximum limit is package power dissipation. At any given ambient temperature, the maximum package power dissipation can be determined by the following equation: PD(MAX) = [TJ(MAX) - TA] / JA Constraints for the TS1900 are maximum TJ(MAX) = 125C, and package thermal resistance, JA = 120C /W. The maximum continuous output current for TS1900 depends on package power dissipation and the R DS(ON) of MOSFET at TJ(MAX). Typical conditions are calculated under normal ambient condition where TA = 25C At 85C, PD(MAX) = 333mW. At TA = 25 , PD(MAX) = 833mW. The maximum current is calculated by the following equation: IOUT < (PD(MAX) / R DS(MAX))<(1/2) For example, if VIN = 5V, RDS(MAX) = 160m and TA = 25 , IOUT(MAX) = 2.2A. Thermal Shutdown is employed to protect the device damage when over temperature 160C. PCB Layout Consideration To maximize TS1900 performance, some board layout rules should be followed: VIN and VOUT should be routed using wider than normal traces, and GND should be connected to a ground plane. For best performance, CIN and COUT should be placed close to the package pins.
3/5
Version: A07
TS1900
Ultra Low Quiescent Current Smart Load Switch
SOT-25 Mechanical Drawing
DIM A+A1 B C D E E H L 1 S1
SOT-25 DIMENSION MILLIMETERS INCHES MIN MAX MIN MAX. 0.09 1.25 0.0354 0.0492 0.30 0.50 0.0118 0.0197 0.09 0.25 0.0035 0.0098 2.70 3.10 0.1063 0.1220 1.40 1.80 0.0551 0.0709 1.90 BSC 0.0748 BSC 2.40 3.00 0.09449 0.1181 0.35 BSC 0.0138 BSC 0 10 0 10 0.95 BSC 0.0374 BSC
4/5
Version: A07
TS1900
Ultra Low Quiescent Current Smart Load Switch
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale.
5/5
Version: A07

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