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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Gap DOMILED BL-PDx-GJS Series
*
Feature: 1. Surface mount LED. 2. 120 viewing angle. 3. Small package outline (LxWxH) of 3.2 x 2.8 x 1.8 mm. 4. Qualified according to JEDEC moisture sensitivity Level 2. 5. Compatible to both IR reflow soldering and TTW soldering.
*
Package Dimension:
Recommended Solder Pad
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Gap DOMILED BL-PDx-GJS Series
*
Optical Characteristics:
Chip Technology / Color GaP / Red, 625 nm Luminous Intensity @ If = 20mA Iv ( mcd ) 11.2 ... 28.5
11.2 ... 14.0 14.0 ... 18.0 18.0 ... 22.4 22.4 ... 28.5
Part Number BL-PDR-GJS-C10
* * * BIN L1 BIN L2 BIN M1 BIN M2
*
BL-PDR-GJS-C20
* * * BIN M1 BIN M2 BIN N1 BIN N2
28.5 ... 71.5
28.5 ... 35.5 35.5 ... 45.0 45.0 ... 56.0 56.0 ... 71.5
*
BL-PDO-GJS-C10
* * * BIN L1 BIN L2 BIN M1 BIN M2
GaP / Orange, 605 nm
11.2 ... 28.5
11.2 ... 14.0 14.0 ... 18.0 18.0 ... 22.4 22.4 ... 28.5
*
BL-PDY-GJS-C10
* * * BIN L1 BIN L2 BIN M1 BIN M2
GaP / Yellow, 587 nm
11.2 ... 28.5
11.2 ... 14.0 14.0 ... 18.0 18.0 ... 22.4 22.4 ... 28.5
*
BL-PDG-GJS-C20
* * * BIN L1 BIN L2 BIN M1 BIN M2
GaP / Green, 570 nm
11.2 ... 28.5
11.2 ... 14.0 14.0 ... 18.0 18.0 ... 22.4 22.4 ... 28.5
*
BL-PDG-GJS-C30
* * * BIN M1 BIN M2 BIN N1 BIN N2
18.0 ... 45.0
18.0 ... 22.4 22.4 ... 28.5 28.5 ... 35.5 35.5 ... 45.0
*
Forward voltage @ If=20 mA. 2.2 V (typ.); 2.6 V (max)
Chip Type GaP
Viewing angle at 50% Iv 120
Reverse current, IR @ VR = 5V, (max) 100 A
V.3 Page: 2 of 7
AMERICAN BRIGHT OPTOELECTRONICS CORP.
Gap DOMILED BL-PDx-GJS Series NOTE: 1. Other luminous intensity groups are also available upon request. 2. Luminous intensity is measured with an accuracy of 11%. 3. Wavelength binning is carried for all units as per the wavelength-binning table. Only one wavelength group is allowed for each reel. 4. An optional Vf binning is also available upon request. Binning scheme is as per following table.
*
Absolute Maximum Ratings:
Parameter DC forward current. Peak pulse current; (tp 10 s, Duty cycle = 0.005) Reverse voltage. LED junction temperature. Operating temperature. Storage temperature. Power dissipation ( at room temperature ) Maximum Value 30 500 5 100 -40 ... +100 -40 ... +100 75 Unit mA mA V C C C mW
*
Vf Binning: Vf Bin @ 20mA 01 02 03 04 Forward voltage (V) 1.55 ... 1.85 1.85 ... 2.15 2.15 ... 2.45 2.45 ... 2.60
V.3 Page: 3 of 7
AMERICAN BRIGHT OPTOELECTRONICS CORP.
Gap DOMILED BL-PDx-GJS Series
*
Wavelength Grouping: Color
BL-PDR; Red BL-PDA; Amber
Group
Full Full W X
Wavelength distribution (nm)
620 - 635 610 - 621 610 - 615 615 - 621 600 - 612 600 - 603 603 - 606 606 - 609 609 - 612 582 - 594 582 - 585 585 - 588 588 - 591 591 - 594 564.5 - 576.5 564.5 - 567.5 567.5 - 570.5 570.5 - 573.5 573.5 - 576.5
BL-PDO; Orange
Full W X Y Z
BL-PDY; Yellow
Full W X Y Z
BL-PDG; Green
Full W X Y Z
Wavelength is measured with an accuracy of 1 nm.
V.3 Page: 4 of 7
AMERICAN BRIGHT OPTOELECTRONICS CORP.
*
Gap DOMILED BL-PDx-GJS Series
Typical electro-optical characteristics curves:
Fig. 2 Forward current vs. forward voltage.
Forward Current vs. Forward Voltage
40
Fig. 1 Relative luminous intensity vs. forward current.
Intensity vs. DC Forw ard Current
Relative intensity. Normalized at 20 mA.
2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0 10 20 30 40 50 60 FORW ARD CURRENT (m A)
Forward Current (mA)
35 30 25 20 15 10 5 0 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
GaP
Forward Voltage (V)
Fig. 3 Radiation pattern.
30 20 10 0
1.0
Fig. 4 Maximum forward current vs. temperature.
35
30
40
0.8
25
50
0.6
Forward Current, If
20
15
60 70 80
0.4
10
0.2
5
0
90
0
0
10
20
30
40
50
60
70
80
90
100
Ambient Temperature
V.3 Page: 5 of 7
AMERICAN BRIGHT OPTOELECTRONICS CORP.
Gap DOMILED BL-PDx-GJS Series
Fig. 5 Recommended IR-reflow Soldering Profile (acc. to IPC 9501)
Fig. 6 Recommended TTW Soldering Profile (acc. to CECC 00802)
V.3 Page: 6 of 7
AMERICAN BRIGHT OPTOELECTRONICS CORP.
Gap DOMILED BL-PDx-GJS Series
*
Taping And Orientation:
Reels come in quantity of 2000 units. Reel diameters is 180 mm .
V.3 Page: 7 of 7

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