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| MICROWAVE POWER GaAs FET MICROWAVE SEMICONDUCTOR TIM1414-30L TECHNICAL DATA FEATURES n HIGH POWER n BROAD BAND INTERNALLY MATCHED FET P1dB=45.0dBm at 14.0GHz to 14.5GHz n HIGH GAIN n HERMETICALLY SEALED PACKAGE G1dB=5.5dB at 14.0GHz to 14.5GHz n LOW INTERMODULATION DISTORTION IM3(Min.)=-25dBc at Po=38.0dBm Single Carrier Level RF PERFORMANCE SPECIFICATIONS ( Ta= 25C ) CHARACTERISTICS Output Power at 1dB Gain Compression Point Power Gain at 1dB Gain Compression Point Drain Current Power Added Efficiency 3rd Order Intermodulation Distortion Drain Current Channel Temperature Rise IDS2 Tch IDS1 G1dB SYMBOL P1dB VDS= 10V IDSset7.0A CONDITIONS UNIT dBm dB A % Two-Tone Test Po= 38.0dBm (Single Carrier Level) (VDS X IDS +Pin-P1dB) X Rth(c-c) MIN. 44.0 4.5 -25 TYP. MAX. 45.0 5.5 10.0 23 9.0 11.0 10.1 100 f = 14.0 to 14.5GHz add IM3 dBc A C Recommended gate resistance(Rg) : Rg= 28 (MAX.) ELECTRICAL CHARACTERISTICS ( Ta= 25C ) CHARACTERISTICS Transconductance Pinch-off Voltage Saturated Drain Current Gate-Source Breakdown Voltage Thermal Resistance SYMBOL CONDITIONS VDS= 3V IDS= 9.6A VDS= 3V IDS= 290mA VDS= 3V VGS= 0V IGS= -290A UNIT S V A V C/W MIN. -0.7 -5 TYP. MAX. 5.5 -2.0 20.0 -4.5 1.1 gm VGSoff IDSS VGSO Rth(c-c) Channel to Case u The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use, No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice. It is therefore advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. Rev. Jan. 2007 TIM1414-30L ABSOLUTE MAXIMUM RATINGS ( Ta= 25C ) CHARACTERISTICS Drain-Source Voltage Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 C) Channel Temperature Storage SYMBOL VDS VGS IDS PT Tch Tstg UNIT V V A W C C RATING 15 -5 20 136 175 -65 to +175 PACKAGE OUTLINE (7-AA03A) Unit in mm (1) (1) Gate (2) Source (2) (2) (3) Drain (3) HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260C. 2 |
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