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  Datasheet File OCR Text:
 Model RFP-250250-4Z50-2 Surface Mount Terminations
16 Watts, 50
Surface Mount Terminations
General Specifications
Resistive Element: Substrate: Terminals: Thick film Beryllium oxide ceramic Thick film silver
Electrical Specifications Features
* DC - 3.0 GHz * 16 Watts * BeO Ceramic * Non-Nichrome Resistive Element * Low VSWR * 100% Tested
Resistance Value: Frequency Range: Power: V.S.W.R.: 50 ohms, 2% DC - 3.0 GHz 16 Watts 1.25:1
Notes: Tolerance is .010, unless otherwise specified. Operating temperature is -55C to +125C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice.
Outline Drawing
SIDE VIEW BOTTOM VIEW TOP VIEW
.040 RF PAD .070 .030
.250
RFP Z 50
.175
.065
.120
.037
HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING
VER. 12/5/01
Available on Tape and Reel for Pick and Place Manufacturing.
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
.250
1
Model RFP-250250-4Z50-2
% OF RATED POWER
Surface Mount Terminations
2
Typical Performance
Power Derating
Suggested Mounting Procedures
100 75 50 25 0 25 50 75 100 125
C
SOLDER PASTE SOLDER FILLED VIA
SCREW (2 PLS.)
PC BOARD HEATSINK
1. Solder part in place using 60/40 type solder with controlled temperature iron (700F). 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws.
P.C.B. SOLDER INTERFACE TEMPERATURE
Available on Tape and Reel for Pick and Place Manufacturing.
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369


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