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TD62783,784APG/AFG
TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic
TD62783APG,TD62783AFG,TD62784APG,TD62784AFG
8 ch High-Voltage Source Driver
The TD62783APG/AFG Series are comprised of eight source current Transistor Array. These drivers are specifically designed for fluorescent display applications. Applications include relay, hammer and lamp drivers. The suffix (G) appended to the part number represents a Lead (Pb)-Free product.
TD62783APG TD62784APG
Features
* * * * * * * High output voltage: VCC = 50 V (min) Output current (single output): IOUT = -500 mA (min) Output clamp diodes Single supply voltage Input compatible with various types of logic Package type-APG: DIP-18 pin Package type-AFG: SOP-18 pin
TD62783AFG TD62784AFG
Type TD62783APG/AFG TD62784APG/AFG
Designation TTL, 5V CMOS 6 to 15V PMOS, CMOS
Weight DIP18-P-300-2.54D: 1.47 g (typ.) SOP18-P-375-1.27: 0.41 g (typ.)
Pin Assignment (top view)
O1 18 O2 17 O3 16 O4 15 O5 14 O6 13 O7 12 O8 GND 11 10
1 I1
2 I2
3 I3
4 I4
5 I5
6 I6
7 I7
8 I8
9 VCC
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Schematics (each driver)
VCC
2.6 k
10 k
Input
10 k
20 k
5 k TD62783: n = 1 TD62784: n = 4
Output
n
GND
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Absolute Maximum Ratings (Ta = 25C)
Characteristics Supply voltage Output current Input voltage Clamp diode reverse voltage Clamp diode forward current Power dissipation Operating temperature Storage temperature APG AFG Symbol VCC IOUT VIN (Note 1) VIN (Note 2) VR IF PD (Note 3) Topr Tstg Rating 50 -500 15 30 50 500 1.47 0.96 -40 to 85 -55 to 150 C C V mA W Unit V mA/ch V
Note 1: Only TD62783APG/AFG Note 2: Only TD62784APG/AFG Note 3: Derated above 25C in the proportion of 11.7 W/C (APG type), 7.7 W/C (AFG type)
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Recommended Operating Conditions (Ta = -40 to 80C)
Characteristics Supply voltage Symbol VCC Ta = 85C, Tj = 120C, Tpw = 25 ms Test Condition Duty = 10% 8 circuits Output current AFG TD62783APG/AFG Input voltage TD62784APG/AFG Output TD62783APG/AFG ON TD62784APG/AFG Output TD62783APG/AFG OFF TD62784APG/AFG APG AFG VIN VIN (ON) IOUT Duty = 50% 8 circuits Duty = 10% 8 circuits Duty = 50% 8 circuits VIN (OFF) VR IF APG AFG PD Min 2.0 4.5 0 0 Typ. 5.0 12.0 Max 50 -260 -59 -180 -38 12 V 24 15 30 V 0.8 2.0 50 35 400 0.52 0.35 mA W V mA/ch Unit V
Input voltage
Clamp diode reverse voltage Clamp diode forward current Power dissipation
Electrical Characteristics (Ta = 25C)
Characteristics Output leakage current Symbol ICEX Test Circuit 1 Test Condition VCC = VCC max VIN = 0.4 V Ta = 25C VIN = VIN (ON), IOUT = -350 mA Output saturation voltage VCE (sat) 2 VIN = VIN (ON), IOUT = -225 mA VIN = VIN (ON), IOUT = -100 mA TD62783APG/AFG Input current TD62784APG/AFG TD62783APG/AFG TD62784APG/AFG Input voltage TD62783APG/AFG TD62784APG/AFG Supply current Clamp diode reverse current Clamp diode forward voltage Turn-ON delay Turn-OFF delay VIN (OFF) ICC (ON) IR VF tON tOFF 3 5 6 7 7 IIN (ON) 3 VIN = 2.4 V VIN = 3.85 V VIN = 5 V VIN = 12 V VIN (ON) 4 VCE = 2.0 V IOUT = -350 mA IOUT = -500 A VIN = VIN (ON), VCC = 50 V VR = 50 V IF = 350 mA VCC = VCC max RL = 125 CL = 15 pF, RL = 88 VCC = VCC max RL = 125 CL = 15 pF, RL = 88 Min 0.8 2.0 Typ. 36 180 92 790 0.15 1.8 Max 100 2.0 1.9 1.8 52 260 130 1130 2.0 4.5 2.5 50 2.0 mA/ch A V s s V A V Unit A
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Test Circuit
1. ICEX
VCC
2. VCE (sat)
VCC VCE (sat) IOUT
3. IIN (ON), ICC
VCC IIN (ON)
VIN
ICEX
VIN
VIN
4. VIN (ON), VIN (OFF)
VCC VCE
5. IR
VCC
6. VF
Open
VIN (ON), VIN (OFF)
IOUT
IR VR
VF
IF
7. tON, tOFF
Input VCC Input Pulse generator (Note 1) VIN RL CL (Note 2) Output 50% 50 s tON 50% tOFF VOH 50% VOL 50% 0 VIH
Note 1: Pulse Width 50 s, Duty Cycle 10% Output Impedance 50 , tr 5 ns, tf 10 ns Note 2: CL includes probe and jig capacitance.
Precautions for Using
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
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IOUT - VIN
500 TA62783APG/AFG Ta = 25C typ. 500 TA62784APG/AFG Ta = 25C
IOUT - VIN
(mA)
Output current IOUT
300
Output current IOUT
0.4 0.8 1.2 1.6 2.0
(mA)
400
400
300
200
200
100
100
0 0
0 0
1
2
3
4
5
Input voltage
VIN (V)
Input voltage
VIN (V)
IIN - VIN
1.6 TA62783APG/AFG Ta = 25C typ. 3.2 TA62784APG/AFG Ta = 25C typ.
IIN - VIN
(mA)
1.2
(mA) IIN Input current
2.4
IIN
0.8
Input current
1.6
0.4
0.8
0 0
4
8
12
16
0 0
8
16
24
32
Input voltage
VIN (V)
Input voltage
VIN (V)
IOUT - VCE (sat)
0.6 Ta = 25C |VCC - VEE| > 5 V 0.6 Ta = 25C typ.
IF - VF
(A)
IOUT
0.4
IF Diode forward current
0.8 1.6 2.4 3.2
(A)
0.4 0.2 0.2 0 0
Output current
0 0
0.4
0.8
1.2
1.6
Output saturation voltage
VCE (sat) (V)
Diode forward voltage
VF
(V)
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PD - Ta
2.0 (1) (2) Type-APG free air Type-AFG free air
PD (W)
1.5
(1)
Power dissipation
1.0 (2)
0.5
0 0
500
100
150
200
Ambient temperature
Ta
(C)
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Package Dimensions
Weight: 1.47 g (typ.)
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Package Dimensions
Weight: 0.41 g (typ.)
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
(2)
(3)
(4)
(5)
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Points to Remember on Handling of ICs
(1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
(2)
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About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
060116EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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