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Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station TX Filter Data Sheet Filter B69843N3457A120 Application RF filter for WLL (Wireless Local Loop) Features SMD filter consisting of coupled resonators with stepped impedances MgTiO3-CaTiO3 (r = 21 / TCf =010 ppm/K) with a coating of copper (10m) and tin (>5m) Excellent reflow solderability, no migration effect due to copper/tin metallization ESD insensitivity and ESD protecting due to filter characteristics Index Page 2 Component drawing Footprint Page 3 Characteristics Maximum ratings Typical passband characteristic Page 4 Processing information Soldering requirements Delivery mode ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station TX Filter Data Sheet Filter B69843N3457A120 Component drawing View from below onto the solder terminals and view from beside Recommended Footprint solder pads ground area below solder resist with vias to second ground layer connected to lines with an impedance of 50 Ohm FR4 material permitivity : 4.4 preferred thickness : 0.3 Vias: O0.3mm / mm For other thickness correlation might be necessary ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station TX Filter Data Sheet Characteristics min. Center frequency Insertion loss Passband Amplitude ripple (peak - peak) at any 10MHz BW Standing wave ratio Impedance Power Attenuation at 2944 to 3044 MHz at 3800 to 4200 MHz Maximum ratings IEC climatic category (IEC 68-1) Operating temperature - 40/+ 90/56 Top -40 / + 85 fc IL B 120 SWR Z P 45 20 51 29 1.5 50 typ. Filter B69843N3457A120 max. 2.0 MHz dB MHz 0.4 2.0 1.0 W dB dB dB 3450.0 1.6 C Typical passband characteristic 2500 0 -10 attenuation [dB] -20 -30 -40 -50 -60 2700 2900 3100 3300 3500 3700 3900 4100 4300 4500 S11 S21 frequency [MHz] ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 3-Pole Filter for WLL Base Station TX Filter Data Sheet Processing information Wettability to IEC 68-2-58: 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) Recommended soldering conditions (infrared): Temp. [C] within 10 sec. Filter B69843N3457A120 Profile for leadfree solder paste reflow 260 (max. 2 sec.) C 250 (max. 10 sec.) C Temp. [C] within 10 sec. 215C10C 245C5C 20-40 sec. 40-80 sec. Time [sec.] 30 sec. 2.5 C/s 2-3 min. Time [sec.] > - 5 C/s Delivery mode Blister tape acc. to IEC 286-3, PS, grey Pieces/tape: 2000 EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 05.07.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 4/4 |
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